JPH05211215A - Probe card - Google Patents

Abstract

PURPOSE:To arrange probes at fine pitches by machining pads and wirings for mounting the probes to a probe card substrate through the same technique as for a chip following the fining, improvement in the degree of integration and increase of pins of a semiconductor integrated circuit. CONSTITUTION:A semiconductor chip 6 for increasing pitches, in which pads 3 for inspection in the same arrangement as a chip 1 to be inspected and large pitch pads 4 in the arrangement of large pitches on the outside to the pads 3 are mounted and the pads 3 and 4 are connected by wirings 5 in the chip by using the same manufacturing technique as for the chip 1 to be inspected, is prepared. Probes 7 are set up vertically to the pads 3 for inspection of the chips 6 and the chip 6 is fixed onto a probe card substrate 8, and the large pitch pads 4 of an outer circumferential section and metallic electrodes 9 on the substrate 8 are connected by bonding wires 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe card,
In particular, it relates to a high density, multi-pin probe card.

[0002]

2. Description of the Related Art In a conventional probe card for inspecting a semiconductor integrated circuit wafer, a chip wafer is inspected by a probe such as a tungsten needle or a palladium needle obliquely attached from a probe card substrate. Also,
A probe card having a structure in which probes such as fine pins and spring pins are vertically mounted on a probe card substrate is also used. An example of a probe card having this structure is the "probe card" disclosed in Japanese Patent Application Laid-Open No. 1-189932.

A probe card having a structure in which the probe is vertically attached to the probe card substrate has a metal electrode 9 on the surface of the probe card substrate 8 as shown in the sectional view of FIG.
The probe 7 having fine pins is vertically fixed to the metal electrode 9 by brazing or the like. Then, the vertically attached probe 7 is brought into contact with the pad 2 of the chip 1 to be inspected mounted on the stage 13 to perform the wafer inspection.

[0004]

In recent years, as semiconductor integrated circuits have become finer and the number of pins has increased, the pad pitch in a chip has tended to become narrower, and the probe card for inspecting a wafer of this chip has the same tendency. It is in. In a probe card in which fine pins are vertically attached to a probe card substrate as a probe, the same probe arrangement as the pad arrangement of the chip to be inspected is required, and the electrodes on the substrate for attaching the probe are also the same. Further, in order to transmit a signal from the electrode to the inspection device and to strengthen the power supply line by increasing the power consumption of the chip, it is indispensable to microfabricate the probe card substrate and make it multilayer.

However, with the current lithography processing technology for insulating substrates using glass, epoxy, etc., it is very difficult and possible to process the insulating substrate wiring at a fine pitch equivalent to that of LSI by semiconductor technology. Even if there is, there is a problem in that the cost will increase, leading to an increase in chip test cost.

Further, in a chip in which the number of pins is further increased and a pad is formed in the central portion of the chip, the density of the pad is further increased, and this problem becomes more serious.

[0007]

According to the probe card of the present invention, in the probe card in which the probe is mounted vertically, the insulating substrate constituting the probe card can be easily processed by the LSI processing technique from the pad pitch of the chip to be inspected. A semiconductor chip for expanding the pitch to the pitch,
It has a structure in which the semiconductor chip and the probe card substrate are connected by wire bonding.

[0008]

The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of the first embodiment of the present invention, and FIG. 2 is a bottom view of the probe card substrate thereof. The pitch enlarging chip 6 is composed of the pad 2 of the chip 1 to be inspected on the semiconductor chip.
The inspection pads 3 provided in the same arrangement as the above-mentioned arrangement and the pads 4 provided on the outer peripheral portion of the inspection pads 3 at a pitch larger than that of the inspection pads 3 are connected by the wiring 5 in the chip. The fine pins 7 are formed on the inspection pad 3 of the chip 6 as a probe and are vertically attached to the substrate by brazing or the like. The inspection pads 3 in the pitch enlarging chip 6 have the same pitch as the pads 2 of the inspected chip 1, and the pads 4 have a wider pitch than that.
The chip 6 can be easily manufactured by using the processing technique.

Next, the chip 6 in which the fine pins 7 are vertically attached to the substrate as a probe is attached and fixed to the probe card substrate 8, and the metal electrode 9 provided on the probe card substrate 8 and the outside of the chip 6 are provided. The pad 4 is connected by bonding with a wire 10. In addition, the wiring 11 is provided on the inner layer of the probe card substrate 8 and the metal electrode 9
And the metal electrode 12 on the opposite surface of the probe card substrate 8 are connected to each other, and an inspection device or the like is connected to the metal electrode 12.

FIG. 3 is a sectional view of the second embodiment of the present invention. The probe 7 of the fine pin is fixed to the fixed block 14 of the probe in the same arrangement as the arrangement of the pads 2 of the chip 1 to be inspected, and this block 14 is described in the first embodiment using the fixing member 15. By mounting the probe card substrate 8 on the probe 7, the probe 7 and the pitch enlargement inspection device are electrically connected. According to this embodiment, the probe 7
The mounting accuracy of the probe is improved, and the probe 7 and the inspection pad 3 of the chip 6 can be connected very easily.

[0011]

As described above, according to the present invention, a semiconductor chip for pitch expansion, which has the same pad arrangement as that of the chip to be inspected on the probe card substrate and is manufactured by the same technique as the chip to be inspected. , And the structure to mount the probe vertically on the pad of the chip,
This has an effect that a probe card in which probes are arranged at a fine pitch can be easily and inexpensively produced.

[Brief description of drawings]

FIG. 1 is a sectional view of a first embodiment of the present invention.

FIG. 2 is a bottom view of the first embodiment.

FIG. 3 is a sectional view of a second embodiment of the present invention.

FIG. 4 is a cross-sectional view of a conventional probe card.

[Explanation of symbols]

1 chip to be inspected 2 pad to be inspected 3 pad to be inspected in the same chip as the pad to be inspected in the chip for pitch expansion 4 wide pitch pad in the chip for pitch expansion 5 wiring in the chip for pitch expansion 6 pitch expansion Semiconductor chip 7 Probes with fine pins 8 Probe card substrate 9 Metal electrodes on probe card substrate 10 Bonding wires 11 Probe card substrate wiring 12 Metal electrodes for connecting inspection equipment 13 Prober stage 14 Prober fixing block 15 Probe block fixing member

Claims (4)

[Claims] 1. A probe card to be attached to a prober device for performing an electrical inspection in a wafer state, wherein a semiconductor chip is provided on a probe card substrate forming the probe card, with inspection pads having the same arrangement as the pad arrangement of the chips to be inspected. A probe card which is fixed and conducts electrical inspection by electrically connecting the semiconductor chip and the chip to be inspected via a probe. 2. The inspection pad of the semiconductor chip attached to the probe card substrate side is connected to a wide-pitch pad provided on the outer periphery of the semiconductor chip via a wiring in the semiconductor chip, and the wide-pitch pad The probe card according to claim 1, wherein the electrode and the electrode of the probe card substrate are connected by wire bonding. 3. The probe according to claim 1, wherein the probe is vertically fixed to an inspection pad of a semiconductor chip attached to the probe card substrate side, and electrically connected to the pad of the chip to be inspected. Probe card. 4. A block in which probes are arranged and fixed so as to form the same arrangement as the pad arrangement of the chip to be inspected is provided, and the probes in which the blocks are arranged in blocks and the inspection pads on the semiconductor chip are brought into contact with each other. The probe card according to claim 1, wherein the probe card is fixed to the probe card substrate to electrically connect the pad of the chip to be inspected and the probe.