JPH05206430A - Clear molded solid state image sensor - Google Patents
Clear molded solid state image sensorInfo
- Publication number
- JPH05206430A JPH05206430A JP4013850A JP1385092A JPH05206430A JP H05206430 A JPH05206430 A JP H05206430A JP 4013850 A JP4013850 A JP 4013850A JP 1385092 A JP1385092 A JP 1385092A JP H05206430 A JPH05206430 A JP H05206430A
- Authority
- JP
- Japan
- Prior art keywords
- transparent material
- refractive index
- low
- state image
- microlens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007787 solid Substances 0.000 title abstract 4
- 239000012780 transparent material Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000003384 imaging method Methods 0.000 claims abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012858 packaging process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】 本発明はＣＣＤを用いた固体撮
像素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image sensor using a CCD.
【０００２】[0002]
【従来の技術】 ＣＣＤ固体撮像素子においては、近
年、マイクロレンズと称される微細レンズをその受光部
の上に形成し、入射光を集光して受光部に導くようにし
たものが多用されている。2. Description of the Related Art In recent years, a CCD solid-state image pickup device is often used in which a microlens called a microlens is formed on a light receiving portion thereof so that incident light is condensed and guided to the light receiving portion. ing.
【０００３】これは、光を集光することにより、ＣＣＤ
固体撮像素子の感度を向上させる目的であり、マイクロ
レンズの材料としては各企業において独自のものが開発
されているが、おおむね透明な樹脂が採用され、その屈
折率は１．５〜１．６程度である。This is a CCD that collects light.
For the purpose of improving the sensitivity of the solid-state image sensor, each company has developed a unique material for the microlens, but a transparent resin is generally used and its refractive index is 1.5 to 1.6. It is a degree.
【０００４】一方、近年、ＣＣＤ固体撮像素子のパッケ
ージ方法として、クリアモールドと呼ばれる方式が登場
してきている。このクリアモールドとは、エポキシ樹脂
等の透明な樹脂で固体撮像素子をパッケージングするも
のであり、従来のこの種の素子のパッケージがレイヤー
またはサーディップと呼ばれるセラミックのパッケージ
にガラスリッドをつけたものであったのに対し、クリア
モールドの採用によって素子の計量化と低コスト化の点
において有利となる。On the other hand, in recent years, a method called a clear mold has appeared as a packaging method for a CCD solid-state image pickup device. This clear mold is a package of a solid-state image sensor with a transparent resin such as epoxy resin. The conventional package of this type of element is a ceramic package called layer or sardip with a glass lid attached. On the other hand, the use of the clear mold is advantageous in terms of weighing the element and reducing the cost.
【０００５】[0005]
【発明が解決しようとする課題】 ところで、上記した
２つの技術を合体させ、マイクロレンズを有するＣＣＤ
固体撮像素子をクリアモールドによりパッケージングす
ると、マイクロレンズのレンズとしての機能が消失して
しまう。By the way, a CCD having a microlens by combining the above-mentioned two technologies is proposed.
When the solid-state image sensor is packaged by a clear mold, the function of the microlens as a lens is lost.
【０００６】これは、マイクロレンズ材料の屈折率とク
リアモールド用樹脂の屈折率とが、いずれも１．５〜
１．６とほぼ等しいことに起因する。本発明の目的は、
マイクロレンズを持つＣＣＤ固体撮像素子のクリアモー
ルドによるパッケージングを可能とし、もって高感度で
しかも計量、安価なＣＣＤ固体撮像素子を提供すること
にある。This is because the refractive index of the microlens material and that of the clear mold resin are both 1.5 to
Due to being approximately equal to 1.6. The purpose of the present invention is to
Another object of the present invention is to provide a CCD solid-state image pickup device having a microlens, which enables packaging by a clear mold, and thus has high sensitivity, weighing, and cost.
【０００７】[0007]
【課題を解決するための手段】 上記の目的を達成する
ため、本発明の固体撮像素子では、ＣＣＤの受光部に設
けられたマイクロレンズの上方を、当該マイクロレンズ
の材料よりも屈折率が低い低屈折率透明材で覆い、か
つ、その低屈折率透明材の上面および側面を、当該低屈
折率透明材よりも硬度が高い高硬度透明材によって覆う
とともに、その高硬度透明材料を介して素子全体を透明
樹脂によってモールドしている。In order to achieve the above object, in the solid-state imaging device of the present invention, the refractive index above the microlens provided in the light receiving portion of the CCD is lower than that of the material of the microlens. The low-refractive-index transparent material is covered, and the upper surface and the side surface of the low-refractive-index transparent material are covered with a high-hardness transparent material having a hardness higher than that of the low-refractive-index transparent material, and an element is provided through the high-hardness transparent material. The whole is molded with transparent resin.
【０００８】[0008]
【作用】 マイクロレンズの周辺がこのレンズ材料より
も低い屈折率を持つ透明材料により覆われているため、
両者の屈折率差によってマイクロレンズのレンズ機能が
消失することがない。[Function] Since the periphery of the microlens is covered with a transparent material having a lower refractive index than this lens material,
The lens function of the microlens will not be lost due to the difference in refractive index between the two.
【０００９】ここで、低屈折率の透明材料としては、例
えばフッ素樹脂等が挙げられるが、このような材料は一
般に軟らかく、変形に対する耐熱性も低いため、その上
から直接クリアモールド樹脂によってパッケージングす
ると、クリアモールドパッケージング工程においては百
数十°Ｃで１．５〜２気圧程度の圧力で樹脂を注入する
ため、低屈折率材が変形してその均一性が損なわれ、ム
ラ等が生じてしまうことが実験によって確かめられた。Here, examples of the transparent material having a low refractive index include, for example, a fluororesin. However, since such a material is generally soft and has low heat resistance against deformation, it is directly packaged by a clear mold resin. Then, in the clear mold packaging process, the resin is injected at a pressure of about 1.5 to 2 atm at a temperature of several hundred tens of degrees Celsius, so that the low refractive index material is deformed and its uniformity is impaired, resulting in unevenness. It was confirmed by experiment that it would happen.
【００１０】そこで、このような低屈折率材の上面およ
び側面を、この低屈折率材よりも高硬度の透明材料、例
えばアクリル樹脂等で更に覆って封止すると、クリアモ
ールドパッケージング工程における高温，高圧雰囲気下
でも低屈折率材の変形が生じず、所期の目的が達成でき
る。Therefore, if the upper surface and the side surface of such a low refractive index material are further covered with a transparent material having a hardness higher than that of the low refractive index material, such as acrylic resin, and sealed, high temperature in the clear mold packaging process is obtained. The deformation of the low refractive index material does not occur even in a high pressure atmosphere, and the intended purpose can be achieved.
【００１１】なお、低屈折率材の上面のみを高硬度透明
材で覆った場合には、低屈折率材がその側面部から変形
する場合があり、素子の歩留りが不良となることも確認
されている。If only the upper surface of the low-refractive index material is covered with the high-hardness transparent material, the low-refractive index material may be deformed from the side surface of the low-refractive index material, and it has been confirmed that the yield of the device becomes poor. ing.
【００１２】[0012]
【実施例】 図１は本発明実施例の構成を示す模式的断
面図である。ＣＣＤ固体撮像素子１には、複数の受光部
の上面それぞれにマイクロレンズ２・・２が形成されてい
る。EXAMPLE FIG. 1 is a schematic sectional view showing the structure of an example of the present invention. In the CCD solid-state image pickup device 1, microlenses 2 are formed on the respective upper surfaces of a plurality of light receiving portions.
【００１３】このマイクロレンズ２・・２は、例えばフェ
ノール樹脂あるいはポリスチレン等の、屈折率が１．６
〜１．７程度の透明樹脂材料によって形成されており、
その周囲は、フッ素樹脂等の屈折率１．３〜１．４程度
の低屈折率透明材３で覆われている。The microlenses 2 ... 2 are made of, for example, phenol resin or polystyrene and have a refractive index of 1.6.
It is made of transparent resin material of about 1.7.
The periphery thereof is covered with a low-refractive-index transparent material 3 such as a fluororesin having a refractive index of about 1.3 to 1.4.
【００１４】そしてこの低屈折率透明材３は、その上面
および側面全体が、アクリル樹脂等の高硬度透明材４に
よって覆われており、その周囲およびＣＣＤ固体撮像素
子１の底面部が、エポキシ樹脂等のクリアモールド樹脂
５によってパッケージングされている。なお、６は撮像
素子１のリードである。The low refractive index transparent material 3 has its upper surface and side surfaces entirely covered with a high hardness transparent material 4 such as acrylic resin, and its periphery and the bottom surface of the CCD solid-state image pickup device 1 are made of epoxy resin. And the like are packaged by a clear mold resin 5. Reference numeral 6 is a lead of the image sensor 1.
【００１５】以上の構造のＣＣＤ固体撮像素子の製造方
法は、まず、固体撮像素子１のマイクロレンズ２・・２の
周囲に、例えばホトエッチング技術を用いて低屈折率透
明材３を形成した後、その低屈折率透明材３の上からア
クリル等の高硬度透明材４を塗布して、低屈折率透明材
３の上面および全周側面を覆った状態で硬化させた後、
不要部分をホトエッチングする。In the method of manufacturing the CCD solid-state image pickup device having the above structure, first, the low refractive index transparent material 3 is formed around the microlenses 2 ... 2 of the solid-state image pickup device 1 by using, for example, a photoetching technique. After coating the high-hardness transparent material 4 such as acrylic on the low-refractive-index transparent material 3 and curing it while covering the upper surface and the entire circumferential side surface of the low-refractive-index transparent material 3,
Photo-etch unnecessary parts.
【００１６】その後、エポキシ樹脂等の通常のクリアモ
ールド樹脂５によってパッケージングして図１に示すよ
うな構造の素子を得る。このクリアモールドパッケージ
ング工程において、クリアモールド樹脂は百数十°Ｃで
１．５〜２気圧注入されるが、アクリル等の高硬度透明
材４の存在により、フッ素樹脂等の低屈折率透明材３に
は熱的および機械的影響が及ばず、この低屈折率透明材
３が変形等を生じることがない。Thereafter, the device is packaged with a normal clear mold resin 5 such as an epoxy resin to obtain an element having a structure as shown in FIG. In this clear mold packaging process, the clear mold resin is injected at 1.5 to 2 atmospheres at a temperature of several hundreds of tens of degrees Celsius, but due to the presence of the high hardness transparent material 4 such as acrylic resin, a low refractive index transparent material such as fluororesin is used. No thermal or mechanical influence is exerted on 3, so that the low-refractive-index transparent material 3 is not deformed.
【００１７】以上のような本発明実施例の素子では、屈
折率１．６〜１．７程度のマイクロレンズ２・・２の周囲
が、全域にわたってムラなく均一に形成された屈折率
１．３〜１．４程度の低屈折率透明材３によって覆われ
ているため、両者の屈折率の差によりマイクロレンズ２
・・２はレンズ機能を損なわず、入射光を有効に集光して
固体撮像素子１の受光面に導くことができる。In the element of the embodiment of the present invention as described above, the surroundings of the microlenses 2 ... 2 having a refractive index of about 1.6 to 1.7 are formed uniformly over the entire area with a refractive index of 1.3. Since it is covered with a low-refractive-index transparent material 3 having a refractive index of about 1.4, the microlens 2 has a difference in refractive index between the two.
.. 2 can effectively collect the incident light and guide it to the light receiving surface of the solid-state imaging device 1 without impairing the lens function.
【００１８】なお、本発明における各部の材料として
は、以上の実施例の説明で挙げたものに限られず、各部
の材料として本発明の思想を全うすべく必要とする機能
ないしは性質を有しているものであれば、公知の材料の
なかから任意のものを採用し得ることは勿論である。The material of each part in the present invention is not limited to the materials mentioned in the above description of the embodiments, and the material of each part has a function or a property necessary for fulfilling the idea of the present invention. As a matter of course, any known material can be adopted as long as it is present.
【００１９】[0019]
【発明の効果】 以上説明したように、本発明によれ
ば、マイクロレンズを備えたＣＣＤ固体撮像素子におい
て、そのマイクロレンズの周囲を低屈折率透明材で覆う
とともに、その低屈折率透明材の上面および側面を高硬
度透明材によって封止した状態で、その上からクリアモ
ールドによるパッケージングを施しているので、マイク
ロレンズはその周囲の低屈折率透明材との屈折率差によ
りレンズ機能を損なうことがなく、しかもパッケージン
グの際に低屈折率透明材が変形することなくマイクロレ
ンズを均一に覆った状態となることから、入射光を有効
に素子の受光面に集光することができ、高感度でしかも
計量かつ低コストの固体撮像素子が得られる。As described above, according to the present invention, in a CCD solid-state imaging device having a microlens, the periphery of the microlens is covered with a low refractive index transparent material, and the low refractive index transparent material is used. Since the top and side surfaces are sealed with a high-hardness transparent material, and the packaging is performed from above with a clear mold, the microlenses impair the lens function due to the difference in refractive index with the surrounding low refractive index transparent material. In addition, since the low-refractive-index transparent material does not deform during packaging and covers the microlenses uniformly, incident light can be effectively focused on the light-receiving surface of the element. It is possible to obtain a solid-state image sensor having high sensitivity, weighing and low cost.
【図１】 本発明実施例の構成を示す模式的断面図FIG. 1 is a schematic sectional view showing a configuration of an embodiment of the present invention.
１・・・・ＣＣＤ固体撮像素子 ２・・２・・・・マイクロレンズ ３・・・・低屈折率透明材 ４・・・・高硬度透明材 ５・・・・クリアモールド樹脂 1 ... CCD solid-state image sensor 2 ... 2 Microlens 3 ... Low transparent transparent material 4 High hardness transparent material 5 Clear resin
Claims (1)
ズが設けられた撮像素子において、上記マイクロレンズ
の上方が、当該マイクロレンズの材料よりも屈折率が低
い低屈折率透明材で覆われ、かつ、その低屈折率透明材
の上面および側面が、当該低屈折率透明材よりも硬度が
高い高硬度透明材によって覆われているとともに、その
高硬度透明材料を介して素子全体が透明樹脂によってモ
ールドされていることを特徴とするクリアモールド固体
撮像素子。1. An image pickup device having a microlens for condensing light in a light receiving portion of a CCD, wherein an upper part of the microlens is covered with a low refractive index transparent material having a refractive index lower than that of the material of the microlens. And, the upper surface and the side surface of the low-refractive-index transparent material are covered with a high-hardness transparent material having a higher hardness than the low-refractive-index transparent material, and the entire element is transparent resin through the high-hardness transparent material. A clear-molded solid-state imaging device characterized by being molded by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4013850A JP2823726B2 (en) | 1992-01-29 | 1992-01-29 | Clear molded solid-state imaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4013850A JP2823726B2 (en) | 1992-01-29 | 1992-01-29 | Clear molded solid-state imaging device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05206430A true JPH05206430A (en) | 1993-08-13 |
| JP2823726B2 JP2823726B2 (en) | 1998-11-11 |
Family
ID=11844759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4013850A Expired - Fee Related JP2823726B2 (en) | 1992-01-29 | 1992-01-29 | Clear molded solid-state imaging device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2823726B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7064405B2 (en) | 2003-08-26 | 2006-06-20 | Fuji Photo Film Co., Ltd. | Solid state imaging device with inner lens and manufacture thereof |
| KR100623344B1 (en) * | 2000-06-30 | 2006-09-11 | 매그나칩 반도체 유한회사 | Chip Scale Package of Image Sensor |
-
1992
- 1992-01-29 JP JP4013850A patent/JP2823726B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100623344B1 (en) * | 2000-06-30 | 2006-09-11 | 매그나칩 반도체 유한회사 | Chip Scale Package of Image Sensor |
| US7064405B2 (en) | 2003-08-26 | 2006-06-20 | Fuji Photo Film Co., Ltd. | Solid state imaging device with inner lens and manufacture thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2823726B2 (en) | 1998-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |