JPH05206197A - Method of detecting center position of wire bonding section - Google Patents
Method of detecting center position of wire bonding sectionInfo
- Publication number
- JPH05206197A JPH05206197A JP4011737A JP1173792A JPH05206197A JP H05206197 A JPH05206197 A JP H05206197A JP 4011737 A JP4011737 A JP 4011737A JP 1173792 A JP1173792 A JP 1173792A JP H05206197 A JPH05206197 A JP H05206197A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- bonding
- edge
- wire
- center position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ワイヤボンデイング部
中心位置検出方法に関し、特に、ボールボンデイング後
のワイヤのボンデイング部の中心位置を検出して、ワイ
ヤボンダの認識精度の向上に寄与することの出来る技術
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for detecting a center position of a wire bonding portion, and more particularly, it can detect the center position of a bonding portion of a wire after ball bonding and contribute to improvement of recognition accuracy of a wire bonder. Regarding technology.
【０００２】[0002]
【従来の技術】半導体チップの内部配線を外部に取り出
すために、当該チップのパッドと外部リードとを、Ａｕ
線などのワイヤを用いて、ボールボンデイングなどの方
法で、ワイヤボンデイングすることが行われている。し
かし、従来、ワイヤボンデイング前のワイヤボンデイン
グするワイヤボンデイング部の位置認識については行わ
れているが、ワイヤボンディングした後のボール中心位
置認識をすることは行われていなかった。2. Description of the Related Art In order to take out the internal wiring of a semiconductor chip to the outside, the pads of the chip and the external leads are made of Au.
Wire bonding is performed using a wire such as a wire by a method such as ball bonding. However, conventionally, although the position of the wire bonding portion for wire bonding before wire bonding has been recognized, the center position of the ball after wire bonding has not been recognized.
【０００３】すなわち、ワイヤボンデイングを行うワイ
ヤボンダは予め登録しているボンディングデータによっ
てワイヤをボンディングする装置である。したがって、
このボンディングデータは、装置別にパッドとリードを
全ピン人が目で確認しながら登録しなければならないた
め、作業技術を必要とし、非常に時間がかかるという問
題がある。That is, a wire bonder for performing wire bonding is a device for bonding wires according to previously registered bonding data. Therefore,
Since this bonding data must be registered while visually confirming the pads and leads for each device by all pins, it requires a working technique and takes a very long time.
【０００４】また、キャピラリ交換等により位置ずれが
生じ、ワイヤボンデイングの際、目標位置へ正確にボン
ディングすることができず、従って、ボンディングする
前には、必ず作業者がキャピラリ補正をおこなわなけれ
ばならず、非常に手間がかかるという問題もある。本発
明はかかる従来技術の有する欠点を解消することを目的
としたものである。本発明の前記ならびにそのほかの目
的と新規な特徴は、本明細書の記述および添付図面から
あきらかになるであろう。In addition, since the displacement of the capillaries occurs due to the replacement of the capillaries and the like, it is not possible to perform accurate bonding to the target position during wire bonding. Therefore, before the bonding, the operator must always perform the capillary correction. There is also a problem that it takes a lot of time and effort. The present invention aims to eliminate the drawbacks of the prior art. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.
【０００５】[0005]
【課題を解決するための手段】本願において開示される
発明のうち代表的なものの概要を簡単に説明すれば、下
記のとおりである。すなわち、本発明では、２値化パタ
ーンマッチングによるマクロ認識により仮のボール中心
位置を検出する方式を取入れ、 また、この仮ボール中
心位置を基準に放射方向へ多値化処理したデータからボ
ールのエッジを検索する方式を取入れ、 さらに、ボー
ルエッジからボンディングされたボールの重心を検出す
る方式を取入れ、ワイヤボンデイング後のワイヤのボン
デイング部の中心位置を検出するようにしたものであ
る。The outline of a typical one of the inventions disclosed in the present application will be briefly described as follows. That is, the present invention incorporates a method of detecting a temporary ball center position by macro recognition by binarization pattern matching. Further, based on the temporary ball center position, the edge of the ball is extracted from the multi-valued data in the radial direction. In addition, a method of detecting the center of gravity of the ball bonded from the ball edge is adopted to detect the center position of the bonding portion of the wire after wire bonding.
【０００６】[0006]
【作用】上記した手段によれば、２値化パターンマッチ
ングによるマクロ認識をおこなって仮のボール中心位置
を検出し、この位置を基準に放射方向へ多値化でボール
のエッジを検索し、次いで、ボールエッジからボンディ
ングされたボールの重心を検出してワイヤボンデイング
後のワイヤのボンデイング部の中心位置を検出するよう
にすることにより、ワイヤボンデイング後のワイヤのボ
ンデイング部の中心位置を短時間で検出することがで
き、しかも、誤検出の少ない検出を可能とすることがで
きる。そして、このように、ワイヤボンデイング後のワ
イヤのボンデイング部の中心位置を検出できる結果、こ
れに基づき、目標ボンディング位置とのずれを求めるこ
とができるようになった。前述のように、従来、 ボン
ディングデータは通常同品種であってもパッドとリード
を全ピン装置ごとに登録しなければならないため、装置
台数が多ければ多いほどその作業負担は大きく、時間も
かかる。その場合、一度登録したボンディングデータを
他の装置に合うように自動倣い補正する機能を設けるこ
とによって、このような負担は軽減される。しかし、こ
の自動倣い補正機能の自動化と精度向上のためには、ボ
ール中心位置検出が必要となってくるが、上述のよう
に、本発明によれば、ワイヤボンデイング後のワイヤの
ボンデイング部の中心位置を検出できるので、この自動
倣い補正機能の自動化と精度向上に寄与することが出来
る。また、ワイヤボンデイングする際、キャピラリ位置
がずれていると目標位置へ正確にボンディングすること
ができないので、この補正作業をおこなわなければなら
ない。従来では、これを人手によりおこなっていたが、
本発明では、自動化により、ボール中心位置を検出する
ことができ、それにより目標位置とのずれを求め、キャ
ピラリ位置を自動補正することが可能となる。According to the above-mentioned means, the temporary ball center position is detected by performing the macro recognition by the binarization pattern matching, and the edge of the ball is searched by multivalued in the radial direction based on this position, and then the ball edge is searched. By detecting the center of gravity of the bonded ball from the ball edge and detecting the center position of the wire bonding part after wire bonding, the center position of the wire bonding part after wire bonding can be detected in a short time. In addition, it is possible to perform detection with less erroneous detection. As described above, as a result of being able to detect the center position of the bonding portion of the wire after wire bonding, it is possible to obtain the deviation from the target bonding position based on this. As described above, conventionally, even if bonding data is usually of the same type, pads and leads must be registered for all pin devices. Therefore, the greater the number of devices, the greater the work load and the time required. In that case, such a burden can be alleviated by providing a function of automatically copying and correcting the bonding data once registered so as to match with other devices. However, in order to automate and improve the accuracy of this automatic copying correction function, it is necessary to detect the ball center position. As described above, according to the present invention, the center of the bonding portion of the wire after the wire bonding is performed. Since the position can be detected, it is possible to contribute to automation of this automatic scanning correction function and improvement of accuracy. Further, when performing wire bonding, if the capillary position is deviated, it is not possible to perform accurate bonding to the target position, so this correction operation must be performed. In the past, this was done manually,
According to the present invention, the center position of the ball can be detected by automation, and thus the deviation from the target position can be obtained and the capillary position can be automatically corrected.
【０００７】[0007]
【実施例】以下、本発明の実施例を図１〜図４により説
明する。図１は、２値化のパターンマッチングを、図２
は、多値化したボールのエッジ検出をそれぞれ示してい
る。また、図３、図４は検出したエッジからボールの重
心を求めるまでの過程を示している。これら図におい
て、１はチップのパッド、２はワイヤ、３はボールであ
る。最初、おおよそのボール３の位置を把握するため
に、図１に示すように、２値化パターンマッチングによ
るマクロ認識を行い、仮のボール中心（８）座標の検出
をする。図１にて、４は、その際のマッチングパターン
を示す。次いで、図２に示すように、当該仮のボール中
心座標（８）を基準にして、８方向へエッジ検索を行
い、多値化したボールのエッジ（６ａ〜６ｈ）を検出す
る。図２にて、５はボールエッジ検索方向を示し、それ
ぞれ、５ａはエッジ検索方向０°、５ｂはエッジ検索方
向４５°、５ｃはエッジ検索方向９０°、５ｄはエッジ
検索方向１３５°、５ｅはエッジ検索方向１８０°、５
ｆはエッジ検索方向２２５°、５ｇはエッジ検索方向２
７０°、５ｈはエッジ検索方向３１５°を示す。また、
ボールエッジ位置６ａ〜６ｈは、それぞれ、当該５ａ〜
５ｈの検出エッジ位置に対応している。次いで、図３に
示すように、は当該検出したボールエッジを、６ａ−６
ｅ、６ｂ−６ｆ、６ｃ−６ｇ、６ｄ−６ｈと組分けし
て、それぞれの中心座標（中間位置）７ａ、７ｂ、７
ｃ、７ｄを算出する。次いで、図４に示すように、図３
に示すそれぞれのボールエッジ間の中心座標７ａ、７
ｂ、７ｃ、７ｄから垂直線を引き、おのおのの交点座標
からボール３の重心座標（９）を求める。上記におい
て、照明制御を取り入れることによりボール表面等の乱
反射を抑え、余分な明るさを取り除くことで、認識精度
を上げることができる。以上本発明者によってなされた
発明を実施例にもとずき具体的に説明したが、本発明は
上記実施例に限定されるものではなく、その要旨を逸脱
しない範囲で種々変更可能であることはいうまでもな
い。Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows the pattern matching for binarization.
Shows the edge detection of a multi-valued ball, respectively. 3 and 4 show the process from the detected edge to the determination of the center of gravity of the ball. In these figures, 1 is a chip pad, 2 is a wire, and 3 is a ball. First, in order to grasp the approximate position of the ball 3, as shown in FIG. 1, macro recognition by binarization pattern matching is performed to detect a temporary ball center (8) coordinate. In FIG. 1, 4 indicates a matching pattern in that case. Then, as shown in FIG. 2, edge search is performed in eight directions based on the provisional ball center coordinates (8) to detect the multi-valued ball edges (6a to 6h). In FIG. 2, 5 indicates a ball edge search direction, 5a indicates an edge search direction 0 °, 5b indicates an edge search direction 45 °, 5c indicates an edge search direction 90 °, 5d indicates an edge search direction 135 °, 5e indicates Edge search direction 180 °, 5
f is edge search direction 225 °, 5g is edge search direction 2
70 ° and 5h indicate the edge search direction 315 °. Also,
The ball edge positions 6a to 6h are respectively 5a to 6h.
This corresponds to the detected edge position of 5h. Then, as shown in FIG. 3, the detected ball edge is replaced by 6a-6
e, 6b-6f, 6c-6g, 6d-6h, and their respective center coordinates (intermediate positions) 7a, 7b, 7
Calculate c and 7d. Then, as shown in FIG.
Center coordinates 7a, 7 between the respective ball edges shown in
A vertical line is drawn from b, 7c, and 7d, and the barycentric coordinates (9) of the ball 3 are obtained from the coordinates of the intersections. In the above, by incorporating the illumination control, diffuse reflection on the ball surface or the like is suppressed, and unnecessary brightness is removed, whereby recognition accuracy can be improved. Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.
【０００８】[0008]
【発明の効果】本願において開示される発明のうち代表
的なものによって得られる効果を簡単に説明すれば、下
記のとおりである。すなわち、従来では、ボール中心検
出が行われていなかったため、実際にボンディングした
後の位置を把握することが不可能であった。しかし、本
発明によれば、このボンディング後のボール中心位置が
検出でき、目標ボンディング位置とのずれを求めること
ができるようになった。そして、この点から得られる効
果については下記に示す通りである。すなわち、ボンデ
ィングデータは通常同品種であってもパッドとリードを
全ピン装置ごとに登録しなければならないため、装置台
数が多ければ多いほどその作業負担は大きく、時間もか
かる。そこで、一度登録したボンディングデータを他の
装置に合うように自動倣い補正する機能を設けることに
よって、このような負担は軽減される。しかるに、この
自動倣い補正機能の自動化と精度向上のためには、ボー
ル中心位置検出が必要となる。本発明によれば、ボール
中心位置を検出することが出来る。また、ワイヤボンデ
イングする際キャピラリ位置がずれていると目標位置へ
正確にボンディングすることができないので、この補正
作業をおこなわなければならない。従来では、これを人
手によりおこなっていたが、本発明によれば、ボール中
心位置を検出することにより目標位置とのずれを求め、
キャピラリ位置を自動補正することが可能となる。The effects obtained by the representative ones of the inventions disclosed in this application will be briefly described as follows. That is, conventionally, the center of the ball has not been detected, so that it is impossible to grasp the position after the actual bonding. However, according to the present invention, the center position of the ball after the bonding can be detected, and the deviation from the target bonding position can be obtained. The effects obtained from this point are as follows. In other words, even if bonding data is normally the same type, pads and leads must be registered for all pin devices, so the greater the number of devices, the greater the work load and the time required. Therefore, such a burden can be reduced by providing a function of automatically copying and correcting the bonding data once registered so as to match with other devices. However, in order to automate and improve the accuracy of this automatic copying correction function, it is necessary to detect the center position of the ball. According to the present invention, the ball center position can be detected. Further, if the capillary position is displaced during wire bonding, accurate bonding cannot be performed to the target position, so this correction operation must be performed. Conventionally, this was done manually, but according to the present invention, the deviation from the target position is obtained by detecting the ball center position,
It is possible to automatically correct the capillary position.
【図１】２値化パターンマッチングによるボール仮中心
位置検出を示す図である。FIG. 1 is a diagram showing detection of a temporary ball center position by binary pattern matching.
【図２】多値化したボールのエッジ位置検出を示す図で
ある。FIG. 2 is a diagram showing edge position detection of a multi-valued ball.
【図３】図２により検出したエッジよりエッジ中間座標
を求める図である。FIG. 3 is a diagram for obtaining edge intermediate coordinates from the edges detected in FIG.
【図４】図３で求めた各中間座標よりボールの重心を求
める図である。FIG. 4 is a diagram for obtaining the center of gravity of a ball from each intermediate coordinate obtained in FIG.
１…パッド ２…ワイヤ ３…ボール ４…マッチングパターン ５ａ…エッジ検索方向０° ５ｂ…エッジ検索方向４５° ５ｃ…エッジ検索方向９０° ５ｄ…エッジ検索方向１３５° ５ｅ…エッジ検索方向１８０° ５ｆ…エッジ検索方向２２５° ５ｇ…エッジ検索方向２７０° ５ｈ…エッジ検索方向３１５° ６ａ…５ａの検出エッジ位置 ６ｂ…５ｂの検出エッジ位置 ６ｃ…５ｃの検出エッジ位置 ６ｄ…５ｄの検出エッジ位置 ６ｅ…５ｅの検出エッジ位置 ６ｆ…５ｆの検出エッジ位置 ６ｇ…５ｇの検出エッジ位置 ６ｈ…５ｈの検出エッジ位置 ７ａ…エッジ中間位置（６ａ−６ｅ間） ７ｂ…エッジ中間位置（６ｂ−６ｆ間） ７ｃ…エッジ中間位置（６ｃ−６ｇ間） ７ｄ…エッジ中間位置（６ｄ−６ｈ間） ８…仮ボール中心位置 ９…ボール重心位置 1 ... Pad 2 ... Wire 3 ... Ball 4 ... Matching pattern 5a ... Edge search direction 0 ° 5b ... Edge search direction 45 ° 5c ... Edge search direction 90 ° 5d ... Edge search direction 135 ° 5e ... Edge search direction 180 ° 5f ... Edge search direction 225 ° 5g ... Edge search direction 270 ° 5h ... Edge search direction 315 ° 6a ... 5a detected edge position 6b ... 5b detected edge position 6c ... 5c detected edge position 6d ... 5d detected edge position 6e ... 5e Detected edge position 6f ... 5f detected edge position 6g ... 5g detected edge position 6h ... 5h detected edge position 7a ... edge intermediate position (between 6a-6e) 7b ... edge intermediate position (between 6b-6f) 7c ... edge Intermediate position (between 6c and 6g) 7d ... Edge intermediate position (between 6d and 6h) 8 ... Temporary ball center position 9 ... Ball center of gravity Location
───────────────────────────────────────────────────── フロントページの続き (72)発明者 植松 俊英 東京都小平市上水本町５丁目20番１号 株 式会社日立製作所武蔵工場内 (72)発明者 和田 隆 東京都小平市上水本町５丁目20番１号 株 式会社日立製作所武蔵工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshihide Uematsu 5-20-1 Kamimizuhoncho, Kodaira-shi, Tokyo Inside the Musashi Factory, Hitachi, Ltd. (72) Inventor Takashi Wada 5 Mizumizumoto-cho, Kodaira-shi, Tokyo No. 20-1 Stock company Hitachi Ltd. Musashi factory
Claims (1)
イング部の中心位置を検出する方法であって、 ２値化
パターンマッチングによるマクロ認識を行い仮のボンデ
イング部中心を検出する第一段階と、当該仮ボンデイン
グ部中心位置を基準に放射方向へ多値化したボンデイン
グ部のエッジを検索する第二段階と、当該ボンデイング
部エッジからワイヤボンディングされたボンデイング部
の重心を検出する第三段階からなることを特徴とするワ
イヤボンデイング部中心位置検出方法。1. A method of detecting a center position of a bonding portion of a wire after wire bonding, comprising a first step of detecting a temporary bonding portion center by macro recognition by binarization pattern matching, and the temporary bonding. It is characterized by the second step of searching the edge of the bonding part that is multi-valued in the radial direction based on the center position of the part, and the third step of detecting the center of gravity of the bonding part wire-bonded from the edge of the bonding part. A method for detecting the center position of the wire bonding part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011737A JPH05206197A (en) | 1992-01-27 | 1992-01-27 | Method of detecting center position of wire bonding section |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4011737A JPH05206197A (en) | 1992-01-27 | 1992-01-27 | Method of detecting center position of wire bonding section |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05206197A true JPH05206197A (en) | 1993-08-13 |
Family
ID=11786347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4011737A Pending JPH05206197A (en) | 1992-01-27 | 1992-01-27 | Method of detecting center position of wire bonding section |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05206197A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5870489A (en) * | 1994-07-16 | 1999-02-09 | Kabushiki Kaisha Shinkawa | Ball detection method and apparatus for wire-bonded parts |
| WO2009122605A1 (en) * | 2008-03-31 | 2009-10-08 | 株式会社新川 | Bonding apparatus and bonding method |
-
1992
- 1992-01-27 JP JP4011737A patent/JPH05206197A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5870489A (en) * | 1994-07-16 | 1999-02-09 | Kabushiki Kaisha Shinkawa | Ball detection method and apparatus for wire-bonded parts |
| WO2009122605A1 (en) * | 2008-03-31 | 2009-10-08 | 株式会社新川 | Bonding apparatus and bonding method |
| US8091761B2 (en) | 2008-03-31 | 2012-01-10 | Shinkawa Ltd. | Bonding apparatus and bonding method |
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