JPH0520256Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a temperature sensing device for a cooker used in a general household.

BACKGROUND TECHNOLOGY Conventionally, the temperature sensing device of this type of cooker has a third
The configuration was as shown in the figure. That is, in FIG. 3, 1 is a sensor contact, 2 is an insulating plate, 3 is a heat-sensitive element, 4 is a sensor stand, 5 is a heat-sensitive case, 6 is a sensor case, 7 is a lead wire of the heat-sensitive element 3, and 8 is a sensor. This is the lead wire.

Problems to be Solved by the Invention In such a conventional configuration, the heat of the sensor lead wire 8, which is heated by the heat of the heater, is transferred to the heat-sensitive element 3.
The temperature of the heat-sensitive element 3 may increase through the lead wire of the pan, preventing accurate sensing of the actual temperature.In addition, at low temperatures, the heat transferred from the bottom of the pot to the heat-sensitive element 3 through the sensor contact 1 may increase the temperature of the heat-sensitive element 3. There was a problem that heat was radiated from the sensor lead wire 8 and the bottom temperature of the pot was sensed at a low temperature.

This invention solves these problems,
It is an object of the present invention to provide a temperature sensing device for a cooker that accurately senses the bottom temperature of a pot.

Means for Solving the Problems In order to solve the above problems, the present invention is to wire the lead wires of the heat-sensitive element around the heat-sensitive element case, and then pull them out from the hole provided in the sensor stand, and connect them to the outside of the sensor stand. The diameter of the sensor lead wire located therein is made smaller than the diameter of the lead wire of the heat-sensitive element inside the sensor stand.

Effect With the above configuration, a thick sensor lead wire with good heat receiving effect is placed near the sensor contact which is important for sensing the temperature at the bottom of the pot, and a thin sensor lead wire with good heat receiving effect is placed inside the sensor support stand which is easily affected by the heat of the heater. Since the lead wire of the heat-sensitive element is arranged, the heat-sensitive element can easily sense the temperature of the bottom of the pot.

Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In the figure, 10 is a sheathed heater on which a pot is removably placed, 11 is a temperature sensing part that appears from the center of the sheathed heater 10, and this temperature sensing part 11 is a sensor contact 1.
2. Insulating plate 13, heat-sensitive element 14, heat-sensitive element case 15, hole 16a through which lead wire 24 of heat-sensitive element 4 passes
A sensor stand 16 provided with a sensor presser spring 1
7. Consists of a sensor case 18. 1
Reference numeral 9 denotes a spring 2 that urges the temperature sensing portion 11 toward the bottom of the pot.
A heat shield cylinder 21 is attached to a stopper 22 provided on the support base 19 via a support spring 23. Reference numeral 24 denotes a lead wire of the heat-sensitive element 14 that runs halfway around the side of the heat-sensitive element case 15, and the lead wire 24 of the heat-sensitive element 14 is connected to a sensor lead wire 25 within a hole 16a provided in the sensor stand 16. . 26 and 27 are insulating pipes that insulate each lead wire 24 and 25.

In the above configuration, when the temperature around the temperature sensor 11 is still low immediately after the start of cooking, the heat transmitted from the bottom of the pot to the sensor contact 12 is transferred to the heat sensitive element 14 by the heat sensitive element case 15 and the lead wire 24 of the heat sensitive element 14. However, since the diameter of the lead wire 24 of the heat-sensitive element 14 is made larger than the diameter of the sensor lead wire 25 and is made of a relatively thick wire, heat is easily transmitted, and as a result, the heat-sensitive element 14 The temperature will rise according to the temperature at the bottom of the pot. The outside of the sensor stand 16 is
Since the sensor lead wire 25 is thin, less heat is radiated, and the temperature drop of the heat-sensitive element 14 is also reduced.

Even if the temperature around the temperature sensor 11 rises as cooking progresses, the sensor lead wire 25 has poor heat conduction, so little heat is transferred to the heat-sensitive element 14, and the transferred heat is also transferred to the lead wire of the heat-sensitive element 14. Since the heat is radiated to the sensor contact 12, which has a lower temperature, through the sensor contact 24, the heat-sensitive element 14 accurately senses the bottom temperature of the pot.

Effects of the Invention As is clear from the description of the above embodiments, according to the present invention, after the lead wire of the heat-sensitive element is wired around the heat-sensitive element case, it is pulled out from the hole provided in the sensor stand and is then routed outside the sensor stand. The diameter of the sensor lead wire is made smaller than the diameter of the lead wire of the heat-sensitive element inside the sensor stand, so heat conduction is good in the areas that are important for receiving heat from the bottom of the pot, and the parts that are susceptible to external influences are It is possible to reduce heat conduction, and as a result, it is possible to obtain the effect that accurate temperature sensing is possible.

[Brief explanation of drawings]

Fig. 1 is a partial vertical cross-sectional view of a temperature sensing device for a cooking device showing an embodiment of the present invention, Fig. 2 is an exploded perspective view of the same essential parts, and Fig. 3 shows a conventional temperature sensing device for a cooking device. FIG. 10... Heater, 11... Temperature sensing section, 12...
...Sensor contact, 13...Insulating plate, 14...
Heat sensitive element, 15...sensing element case, 16...sensor stand, 16a...hole, 18...sensor case,
19... Support stand, 20... Spring, 21... Heat shield tube, 22... Stopper, 23... Support spring, 24
...Heat-sensitive element lead wire, 25...Sensor lead wire.

Claims (1)

[Scope of utility model registration request] a heater on which a pot is removably placed; a sensor contact that protrudes and retracts from the center of the heater;
Insulating plate, thermal element, thermal element case, sensor stand,
The thermosensor has a temperature sensing section consisting of a sensor case, a support stand that supports the temperature sensing section via a spring, and a heat shield tube that is attached to a stopper provided on the support stand via a support spring. After wiring the lead wire of the element around the heat-sensitive element case, pull it out from the hole provided in the sensor stand and set the diameter of the sensor lead wire located outside the sensor stand to the same diameter as that of the lead wire of the heat-sensitive element inside the sensor stand. A temperature sensing device for a cooker that is thinner than its diameter.