JPH05202497A - Plating method for metallic parts - Google Patents

Abstract

PURPOSE:To increase the productivity of plating treatment even if a plating speed is not increased. CONSTITUTION:Many parts 2 are longitudinally projected at a specified pitch on a hoop-shaped carrier body 1. Pilot holes 3 for transportation are provided at a pitch of 1/2 the pitch of parts on this carrier body 1. The two carrier bodies 1 are longitudinally shifted a pitch of 1/2 the pitch of the parts 2 and are disposed to face in proximity to each other. Pilot members for transportation are passed into the pilot holes 3 for transportation of the two carrier bodies 1 and while the two carrier bodies 1 are simultaneously transported, the carrier bodies are plated. The two carrier bodies 1 plated while these bodies are simultaneously transported in the proximate state.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for plating metal parts, and more particularly to a technique for plating a hoop-shaped carrier body having a large number of parts projecting at a constant pitch in the longitudinal direction. ..

[0002]

2. Description of the Related Art Conventionally, there has been known a method of continuously plating a hoop-shaped carrier body in which a large number of parts are projected at a constant pitch in the longitudinal direction.

[0003]

By the way, since the plating cost is determined by the feed rate of the material to be plated and the component pitch per 1 m, it is constant in the longitudinal direction on the hoop-shaped carrier body as in the above-mentioned conventional example. When a large number of protruding parts are plated continuously at a pitch, if the parts pitch is determined by the conditions of the assembly process, etc., the plating speed can be increased (current density increased by increasing the equipment density to reduce the plating processing cost). There was only a means to increase the size and increase the transportation speed.
In addition, there is a problem that the equipment becomes large in size to increase the plating speed, which causes a cost increase.

The present invention has been made in view of the above-mentioned problems of the conventional example, and an object thereof is to reduce the cost of plating by a simple method without increasing the plating speed, An object of the present invention is to provide a plating method for metal parts, which can increase the productivity of plating.

[0005]

In order to solve the problems of the above-mentioned conventional examples and to achieve the object of the present invention, the method for plating a metal component of the present invention is such that the hoop-shaped carrier body 1 has a constant lengthwise direction. A large number of parts 2 are projected at a pitch, and carrier pilot holes 3 are provided in the carrier body 1 at a pitch of ½ of the part pitch, and the two carrier bodies 1 are arranged in the longitudinal direction of the parts 2.
The pitch is shifted by ½ of the above to be closely opposed to each other, and the carrier pilot member is passed through the carrier pilot hole 3 of the two carrier bodies 1 to plate the two carrier bodies 1 at the same time. Is.

Further, a large number of components 2 are projected on the hoop-shaped carrier body 1 at a constant pitch in the longitudinal direction, and carrier pilot holes 3 are provided on the carrier body 1 at a pitch of 1/2 of the component pitch, and at least one of them is provided. A protrusion 4 is provided on the side surface of the carrier body 1 so that the two carrier bodies 1 are shifted in the longitudinal direction by 1/2 the pitch of the components so as to face each other, and the protrusions are brought into contact with the side surface of the adjacent carrier body 1 for conveyance. It is also possible to pass the pilot member of (1) through the carrier pilot holes 3 of the two carrier bodies 1 to carry out plating while simultaneously carrying the two carrier bodies 1.

[0007]

According to the present invention as described above, a large number of components 2 are projected on the carrier body 1 having a hoop shape at a constant pitch in the longitudinal direction, and the carrier pilot 1 is transported to the carrier body 1 at a pitch of ½ of the component pitch. Two carrier bodies 1 provided with holes 3
Are shifted in the longitudinal direction by 1/2 the pitch of the component 2 so as to face each other, and the pilot members for transportation are provided to the two carrier bodies 1.
Through the carrier pilot holes 3 of the two carrier bodies 1
Since the two carrier bodies 1 are plated at the same time while being simultaneously transported, it is possible to reliably carry out the plating while the two carrier bodies 1 are simultaneously transported and the parts 2 protruding at a constant pitch do not overlap each carrier body 1. It is now possible.

At least one carrier body 1
A protrusion 4 on the side surface of the carrier, the two carrier bodies 1 are displaced in the longitudinal direction by a half pitch of the components so as to face each other, and the protrusion 4 is brought into contact with the side surface of the adjacent carrier body 1 to convey the pilot. In the case where the members are passed through the carrier pilot holes 3 of the two carrier bodies 1 to plate the two carrier bodies 1 at the same time, the gap 5 can be formed between the carrier bodies 1 to ensure reliable plating. It came to be like this.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in the accompanying drawings. 1 and 2 show one embodiment of the present invention. A metal hoop material is continuously punched by a press to form a hoop-shaped carrier body 1 and a large number of parts 2 projectingly formed on the carrier body 1 at a constant pitch in the longitudinal direction.
Examples of the component 2 include various components 2 to be plated such as a terminal plate, a contact plate, and a post used in electric equipment. In the embodiment shown in the accompanying drawings, an example of a post is shown as the component 2 to be plated. In the punching step of continuously punching out the metal hoop material to form the hoop-shaped carrier body 1 and a large number of components 2 projecting on the carrier body 1 at a constant pitch in the longitudinal direction, at the same time, The transport pilot holes 3 are continuously punched and formed at a pitch of ½. Here, the carrier pilot hole 3 is the carrier body 1
It is formed with a pitch of ½ of the above-mentioned component pitch so as to be located at a position directly below each component 2 and a position immediately below the component 2.

As described above, a large number of components 2 are projected in the hoop-shaped carrier body 1 at a constant pitch in the longitudinal direction, and carrier pilot holes 3 are provided in the carrier body 1 at a pitch of 1/2 of the component pitch. After that, the component 2 is plated, and the plating is performed as follows. That is, as shown in FIG. 2, the two carrier main bodies 1 are shifted in the longitudinal direction by 1/2 the pitch of the components 2 so as to face each other, so that the carrier pilot holes 3 provided in the longitudinal direction of both carrier main bodies 1 are separated from each other. Since they communicate with each other with a pitch shift of 2, the carrier pilot member (not shown) is passed through the carrier pilot holes 3 of both carrier bodies 1 communicating with each other with a pitch shift of 1/2, together with the carrier pilot member. Both carrier bodies 1 are transported and sent to a plating tank (not shown), and thus the carrier pilot members are passed through the carrier pilot holes 3 of the two carrier bodies 1 to simultaneously transport the two carrier bodies 1. While plating. By doing so, twice the plating productivity can be obtained without increasing the plating rate (increasing the current density, increasing the size of the equipment and increasing the transfer rate). When the plating process is completed, the two hoop-shaped carrier bodies 1 that have been conveyed at the same time while closely facing each other are separated as shown by the arrows in FIG. 2 and moved to their respective winding steps. In FIG. 2, a indicates a plating process. In this way, the coil-shaped one obtained by winding the hoop-shaped carrier body 1 which is continuously plated on the component 2 is taken to the next assembly line, where it is unwound and the hoop-shaped carrier body 1 is sequentially ordered. The component 2 plated on is cut off by a cutting means and incorporated into the body of the electric appliance or other parts by a robot or the like. In punching the metal hoop material so that a large number of parts 2 are projected on the carrier body 1 having a hoop shape at a constant pitch, the pitch of the parts 2 may be, for example, the step of cutting the parts 2 in the assembly line of the electrical equipment described above. It is set according to various conditions such as a robot assembling process.

Next, another embodiment of the present invention will be described with reference to FIGS. In this embodiment, the basic method is the same as in FIGS. 1 and 2 above, except that a protrusion 4 is provided on one or both side surfaces of the carrier body 1 so that the two carrier bodies 1 are longitudinally separated. This is different from the method shown in FIGS. 1 and 2 in that the protrusions 4 are brought into contact with the side surfaces of the adjacent carrier body 1 when they are made to face each other with a pitch shift of 1/2. In this way, the protrusions 4 are provided on the side surfaces of the carrier body 1, and when the two carrier bodies 1 are shifted toward each other by a pitch of ½ of the parts in the longitudinal direction and face each other, the protrusions 4 are adjacent to the side surface of the adjacent carrier body 1. When it comes into contact with, the gap 5 can be formed between the carrier bodies 1 and the plating can be reliably performed. In FIG. 4, a indicates a plating process. In this embodiment, the protrusions 4 are formed when the metal hoop material is continuously punched out by a press to form a hoop-shaped carrier body 1 and a large number of parts 2 projecting from the carrier body 1 at a constant pitch in the longitudinal direction. At the same time, it may be formed by pressing.

[0012]

As described above, according to the present invention, a large number of parts are projected on the hoop-shaped carrier body in the longitudinal direction at a constant pitch, and the carrier body is conveyed at a pitch of ½ of the component pitch. Pilot holes are provided so that the two carrier bodies are closely opposed to each other with a pitch of ½ of the component in the longitudinal direction, and the carrier pilot member is passed through the carrier pilot holes of the two carrier bodies to simultaneously mount the two carrier bodies. Since the plating is carried out while the carrier is being carried, the two carrier bodies can be carried at the same time at the same time, but the parts protruding at a constant pitch do not overlap each carrier body, and plating can be performed reliably. As a result, there is an advantage that the plating processing productivity can be doubled as compared with the conventional method without changing the plating speed, and the plating processing cost can be halved.

Further, a large number of components are projected in the hoop-shaped carrier main body at a constant pitch in the longitudinal direction, and carrier pilot holes are provided in the carrier main body at a pitch of ½ of the component pitch, and at least one side surface of the carrier main body. Protrusions are provided on the two carrier bodies, and the two carrier bodies are shifted in the longitudinal direction by 1/2 the pitch of the components so as to face each other, and the projections are brought into contact with the side surfaces of the adjacent carrier bodies. In the case of plating while simultaneously transporting two carrier bodies through the transport pilot holes, the plating productivity is doubled as compared with the conventional method without changing the plating speed as described above, and the plating cost is reduced. 1 /
In addition to the advantage that the number can be two, a gap can be formed between the carrier bodies that are being conveyed at the same time as the plating process, so that the components can be reliably plated.

[Brief description of drawings]

FIG. 1 is a perspective view of a carrier body in which parts used in the present invention are provided so as to project at a constant pitch.

FIG. 2 is a plan view for explaining that the above two carrier bodies are combined together and simultaneously plated.

FIG. 3 is a perspective view of a carrier body in which parts used in another embodiment of the present invention are provided so as to project at a constant pitch.

FIG. 4 is a plan view for explaining that the two carrier bodies of the same as above are plated together while being simultaneously conveyed.

[Explanation of symbols]

 1 Carrier body 2 Parts 3 Pilot hole for transportation 4 Protrusion

Claims (2)

[Claims] 1. A hoop-shaped carrier main body is provided with a number of parts protruding in the longitudinal direction at a constant pitch, and carrier pilot holes are provided in the carrier main body at a pitch of ½ of the part pitch.
The two carrier bodies are shifted in the longitudinal direction by 1/2 the pitch of the parts so as to face each other closely, and the carrier pilot member is passed through the carrier pilot holes of the two carrier bodies to plate the two carrier bodies while simultaneously carrying them. A method for plating a metal part, which is characterized by the above. 2. A hoop-shaped carrier main body is provided with a large number of parts protruding in the longitudinal direction at a constant pitch, and carrier pilot holes are provided in the carrier main body at a pitch ½ of the part pitch.
A protrusion is provided on the side surface of at least one carrier body,
The two carrier bodies are shifted in the longitudinal direction by 1/2 the pitch of the parts so as to face each other closely and the protrusions are brought into contact with the side surfaces of the adjacent carrier bodies, and the carrier pilot member is passed through the carrier pilot holes of the two carrier bodies. And a method of plating a metal part, wherein the two carrier bodies are simultaneously transported and plated.