JPH05199258A - Digital communication equipment - Google Patents

Abstract

PURPOSE:To configure the communication equipment economically while ensuring the required performance of the equipment handling lots of high speed communication data by devising a connector for external connection, a high speed switch circuit section and its direct peripheral circuit section to be surface mount form. CONSTITUTION:A multi-tip module 22 of a high speed switch circuit section 11, a direct peripheral circuit 23, and a connector 24 used for external connection are mounted on a flat board 21. Moreover, an optical or electric drive circuit package 25 used for the connection of the circuit sections is connected to the connector 24, from which an optical cable 26 or an electric cable 27 is led out. Through the constitution above, each circuit section of one communication equipment is configured by plural kinds of mount forms, the equipment handling lots of high speed communication data is configured economically while ensuring the required performance from a small scale equipment to a large scale equipment. Furthermore, since each circuit section being a component of the equipment is placed at a remote location as required, the equipment copes flexibility with various installation conditions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a switching / multiplexing apparatus for handling high-speed communication data, and a direct peripheral circuit including a switch / control LSI of a high-speed switch circuit section, a multi-chip module, their interfaces and a short-distance drive circuit. And a high-speed switch circuit section and a connector for external connection of its direct peripheral circuit section, and other circuit sections, and to a digital communication device improved in their mounting form.

[0002]

2. Description of the Related Art A conventional switching / multiplexing device has a mounting configuration of
It is a three-dimensional bookshelf mounting form consisting of a circuit package and a back wiring board, and communication data is transmitted / received bidirectionally through the circuit package, the package connector, the back wiring board, the cable, etc., and exchange / multiplexing processing is performed. It was

FIG. 8 is a diagram for explaining a mounting form of a three-dimensional bookshelf. In the figure, a plurality of circuit packages 81 _{1 to} 81 _n are connected to a back wiring board 83 via package connectors 82, respectively. Here, the cable 84 connected to the circuit package 81 ₃
An example of a data passage path from the cable to the cable 85 connected to the circuit package 81 _n will be described. The communication data from the cable 84 is the electronic circuit 8 of the circuit package 81 _3.
6 is amplified via 6 and is sent to the wiring 87 on the back wiring board via the package connector 82. The communication data transmitted on the back wiring board 83 is received by the electronic circuit 88 via the package connector 82 of the circuit package 81 _n and sent to the cable 85.

[0004]

By the way, in the three-dimensional bookshelf mounting form, an increase in the propagation delay due to the length of the entire passage of the communication data passing through the circuit package and the package connector, and between the circuit package and the package connector. And various noise generation due to impedance mismatch between package connector and back wiring board,
Due to other factors, high-speed communication data exceeding tens to hundreds of Mbps could not be handled. Further, for example, even if circuits are integrated, the package density is reduced due to lack of terminals of the package connector, and depending on the degree of integration, lack of terminals makes it difficult to mount many LSIs.

On the other hand, in the planar mounting mode in which all circuits are mounted on a large planar substrate, the number of connection points of circuit packages, package connectors, cables, etc. on the path through which signals pass can be reduced, and a large number of connectors can be mounted. This has made it possible to secure the number of signal terminals and shorten the wiring length. However, when the terminal interface circuit section, control circuit section, etc., which do not require high speed, are mounted on a flat surface, the replacement unit becomes larger as the area of the flat board becomes larger, resulting in lower maintainability and mounting efficiency. As a result, the device is expensive and has many restrictions on installation.

As described above, in the three-dimensional bookshelf mounting form, there is a disadvantage for increasing the speed and density of the device, and in the planar mounting form for solving this, it is uneconomical for a low speed and low density circuit section. Met.

According to the present invention, required performance is ensured from a small-scale device to a large-scale device in a device that handles a large number of high-speed communication data such as an ATM switch in an asynchronous transfer mode (ATM) in the switching field and an ATM multiplexer. However, it is an object of the present invention to provide a digital communication device which can be economically constructed and can flexibly cope with various installation conditions.

[0008]

According to a first aspect of the present invention, a high-speed switch circuit section for switching high-speed communication data and a high-speed line interface circuit for transmitting and receiving the high-speed communication data to and from a long-distance high-speed line. A high-speed operation among the high-speed switch circuit units, in a digital communication device including a unit, a terminal interface circuit unit that transmits and receives the high-speed communication data to and from a terminal device, and a central control unit that controls each circuit unit. , A direct peripheral circuit section including those interfaces and a short-distance drive circuit, and a connector for connecting to the outside are mounted on a flat board, and the connector installed on the flat board is used. It is characterized in that it is connected to other circuit parts via a drive circuit or directly by a cable.

According to a second aspect of the present invention, in the digital communication device according to the first aspect, a high-speed switch circuit unit which is planarly mounted on a flat substrate is divided into a plurality of basic switch circuit blocks, and a single flat plate is provided. It is characterized in that the respective basic switch circuit blocks are connected to each other through the connectors on the board.

According to a third aspect of the present invention, in the digital communication device according to the first or second aspect, a drive circuit for connecting a high-speed switch circuit section which is planarly mounted on a flat substrate and another circuit section. Alternatively, it is characterized in that the cable is selected according to the connection distance.

According to a fourth aspect of the present invention, in the digital communication device according to any one of the first to third aspects, a structure for holding a plane substrate is provided with a wiring and a connector for communication data, control signals and power supply. Is installed, and the high-speed switch circuit portion which is planarly mounted on the flat substrate is connected to the drive circuit or the cable via the wiring and the connector.

According to a fifth aspect of the present invention, in the digital communication device according to any one of the first to fourth aspects, each circuit unit is divided into a plurality of cabinets or chassis and mounted, and they are connected by a cable. It is characterized in that they are connected to each other via the.

[0013]

According to the invention described in claim 1, a switch / control LSI or a multi-chip module of a high-speed switch circuit portion of a device requiring high-speed operation (for example, an ATM switch), a direct interface including an interface thereof and a short-distance drive circuit. The peripheral circuit section and the connector for external connection of the high-speed switch circuit section and its direct peripheral circuit section are in a planar mounting form suitable for high-speed operation. On the other hand, for the other circuit parts, each circuit part of one device can be configured by a plurality of types of mounting forms by adopting various economical conventional mounting forms (for example, three-dimensional bookshelf mounting form).

According to a second aspect of the present invention, the high-speed switch circuit section is divided into a plurality of basic switch circuit blocks, and these are interconnected to improve the expandability from a small-scale device to a large-scale device. You can

According to the present invention as set forth in claims 3 to 5, each circuit portion is configured to connect by appropriately selecting the connection method of each mounting form while considering the connection distance and the cost, and each distributed arrangement. It is possible to adapt to a wide range of terminal equipment distribution conditions and equipment installation environments by, for example, selecting electrical connection or optical connection method for each cabinet or chassis that accommodates the circuit section according to each situation and interconnecting them. it can.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram showing a connection configuration example of each circuit section in a digital communication apparatus of the present invention.

In the figure, the high speed switch circuit section 11 is
It has a high-speed switch, its own control unit, and a drive circuit. The terminal interface circuit section 14 connected to the high-speed switch circuit section 11 via the cable 12 for carrying communication / control data, and on the other hand connected to the external terminal 13 also has its own control section. Similarly, the high-speed line interface circuit unit 1 is connected to the high-speed switch circuit unit 11 via the cable 12 and is connected to the external long-distance high-speed line 15 on the other hand.
6 also has its own controller. The central control unit 17 controls each circuit unit.

In the structure of this embodiment, in order to shorten the signal propagation distance and reduce the number of communication data passing through the connector so that high speed data such as ATM cells can be handled, the high speed switch circuit section 11 is provided with a drive circuit. Except for mounting on a flat board. Further, in connection with other circuit parts in order to reduce restrictions on installation location, connection by a drive circuit or cable 12 removed from the flat substrate in the high-speed switch circuit part 11 according to the distance between both circuit parts. The method is selectable so that each circuit can be connected remotely.

FIG. 2 is a diagram showing the configuration of an embodiment of the high speed switch circuit section 11. (a) shows the front morphology, and (b) shows the top morphology. In the figure, the circuit components and mechanical components mounted on the flat substrate 21 are here a multi-chip module 22 composed of a switch / control LSI or a plurality of LSIs, a direct peripheral circuit 23, and a connector 24 for connecting to the outside. Is. The connector 24 includes an optical or electric drive circuit package 25 used for connection between circuit parts.
Are connected, and the optical cable 26 or the electric cable 27 is pulled out, respectively.

Here, the direct peripheral circuit 23 is the flat substrate 2
1, a drive circuit for signal transmission, a drive / interface circuit for transmitting and receiving signals between the multi-chip module 22 and the drive circuit package 25 via the connector 24, and the like. These circuits can be easily realized by a known technique using a CMOS circuit format or an ECL or other bipolar circuit format.

The drive circuit package 25 transmits / receives communication / control data to / from other circuit units via the cable 12 for connecting the respective circuit units shown in FIG. A package with functionality is selected,
It is connected to the flat substrate 21 via the connector 24. The drive circuit package 25 can be easily realized by using known electric transmission circuit technology and optical transmission circuit technology. Communication is performed using the optical cable 26 or the electric cable 27 according to the selected transmission method, and remote connection between a plurality of circuit units according to the transmission method capability becomes possible. The optical cable 26 or the electric cable 27
The drive circuit package 25 may be connected to the drive circuit package 25 via a connector 28, or a cable may be directly connected to the drive circuit package 25 to be integrated.

Although not shown in FIG. 2, the flat substrate 2
1. Drive circuit package 25, structure supporting optical cable 26 or electric cable 27, and further multi-chip module 22 and drive circuit package 25
There are provided electronic circuits mounted on, a means for directly cooling the peripheral circuit 23, a means for supplying electric power to each electronic circuit and the like.

FIG. 3 is a diagram showing the configuration of another embodiment of the high speed switch circuit section 11. (a) shows the front morphology, (b)
Indicates a top surface morphology. Note that the basic structure is the same as that of the embodiment shown in FIG.

FIG. 4 is a diagram showing a high speed switch circuit section 11 constructed by combining a plurality of basic switch circuit blocks. Note that (a) shows the front surface form of the basic switch circuit block, (b) shows the front surface form of the high-speed switch circuit unit 11, and (c) shows the upper surface form of the high-speed switch circuit unit 11.

In the figure, a plurality of basic switch circuit blocks 41 are connected to a connector 24 by an inter-block connecting cable 42.
And the high-speed switch circuit unit 11 having a functionally required scale. Note that the basic structure is the same as that of the embodiment shown in FIG. In the configuration of this embodiment, by using the required number of basic switch circuit blocks 41, it is possible to realize from a small scale device to a large scale device with the same basic structure.

FIG. 5 is a diagram showing an embodiment configuration of a high speed switch circuit section using a flat substrate holding plate. (a) shows the front morphology, and (b) shows the top morphology. In the figure, a flat board holding plate 51 holds the flat board 21 (or the basic switch circuit block 41) using communication data, control signals, wiring for power feeding or a connector 52, and also connects them. Therefore, the drive circuit package 25, the optical cable 26, or the electric cable 27 can be arranged in a wider area than the flat substrate 21, and the operability at the time of cabling or inserting / removing the drive circuit package 25 can be improved. Further, even when the flat substrate 21 (or the basic switch circuit block 41) is removed due to a failure of the mounted circuit group, the drive circuit package 25 does not need to be inserted or removed, and thus the operability is improved. Although the drawing shows the insertion / removal mechanism 53 for inserting / removing the flat substrate 21, this can be easily realized by a known technique.

FIG. 6 is a diagram showing the configuration of an embodiment of the terminal interface circuit section 14. In the figure, an interface circuit package 61 includes an optical cable 26, an electric cable 27 or a terminal connecting cable 6 for connecting between circuit parts.
2 is used as an electrical / physical interface for transmitting / receiving a signal to / from another circuit unit or a terminal.
The logic circuit package 63 realizes logic functions of multiplexing conversion, protocol conversion, and various control functions. The back wiring board 64 accommodates bus wiring for communication data or control signals, and has an interface circuit package 61 and a logic circuit package 63 via a connector mounted therein.
And connect.

The connection with the high-speed switch circuit section is performed according to the distance, such as the interface circuit package 61, the drive circuit package 25, the optical cable 26, and the electric cable 2.
7 will be selected as a set. At this time, if the logical interface is the same, it is not necessary to change the corresponding logic circuit package 63. If the logical interface is different, the logic circuit package 63 has the same function even if the interface circuit package 61 is the same. It needs to be what you did.

With the configuration shown in this embodiment, the electrical / physical interface for connection and the logical interface can be independently selected. Although the structure for holding the packages and the back wiring board, cooling, power supply, and other means are omitted in the drawing, these can be easily realized by known techniques. Similarly, the high-speed line interface circuit section 16 and the central control section 17 can be easily realized by known techniques.

FIG. 7 is a diagram showing an example of the installation form of the digital communication device of the present invention. In FIG. 1, a high speed switch circuit unit 11, a cable 12, a terminal interface circuit unit 14 connected to a terminal 13, a high speed line interface circuit unit 16 connected to a long distance high speed line 15 and a central control unit 17 are shown in FIG. It is similar to the one. Each circuit part is remotely located on another floor of the same building or another building, and the cable 12 and each package are selected according to the distance.

[0031]

As described above, according to the present invention, in a digital communication device such as a switching / multiplexing device that handles high-speed communication data, it is economical and easy to operate from a small-scale device to a large-scale device while ensuring necessary performance. Can be realized.
In addition, since each circuit unit constituting the device can be remotely installed as needed, it is possible to flexibly cope with various installation conditions.

[Brief description of drawings]

FIG. 1 is a block diagram showing a connection configuration example of each circuit unit in a digital communication device of the present invention.

FIG. 2 is a diagram showing an example configuration of a high-speed switch circuit section 11.

FIG. 3 is a diagram showing the configuration of another embodiment of the high-speed switch circuit section 11.

FIG. 4 is a diagram showing a high-speed switch circuit unit 11 configured by combining a plurality of basic switch circuit blocks.

FIG. 5 is a diagram showing an example configuration of a high-speed switch circuit unit using a flat substrate holding plate.

FIG. 6 is a diagram showing a configuration of an embodiment of a terminal interface circuit section 14.

FIG. 7 is a diagram showing an example of an installation form of the digital communication device of the present invention.

FIG. 8 is a diagram illustrating a mounting form of a three-dimensional bookshelf.

[Explanation of symbols]

 11 High-speed switch circuit part 12 Cable 13 Terminal 14 Terminal interface circuit part 15 Long distance high-speed line 16 High-speed line interface circuit part 17 Central control part 21 Flat board 22 Match chip module 23 Direct peripheral circuit 24 Connector 25 Drive circuit package 26 Optical cable 27 Electric Cable 28 Connector 41 Basic switch circuit block 42 Inter-block connection cable 51 Flat board holding plate 52 Connector 53 Insertion / extraction mechanism 61 Interface circuit package 62 Terminal connection cable 63 Logic circuit package 64 Back wiring board 81 Circuit package 82 Package connector 83 Back wiring board 84 , 85 Cable 86, 88 Electronic circuit 87 Wiring

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Tetsuro Mikazuki 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation

Claims (5)

[Claims] 1. A high-speed switch circuit section for switching high-speed communication data, a high-speed line interface circuit section for transmitting and receiving the high-speed communication data to and from a long-distance high-speed line, and the high-speed communication data between a terminal device. In a digital communication device comprising a terminal interface circuit section for transmitting and receiving by a terminal and a central control section for controlling each circuit section, among the high-speed switch circuit sections, circuits that require high-speed operation, their interfaces, and a short-distance drive A direct peripheral circuit unit including a circuit and a connector for connecting to the outside are mounted on a flat substrate, and connection with other circuit units is performed via a drive circuit or via the connector installed on the flat substrate. A digital communication device characterized in that it is directly configured by a cable. 2. The digital communication device according to claim 1, wherein the high-speed switch circuit unit which is planarly mounted on a flat substrate is divided into a plurality of basic switch circuit blocks, and each basic switch circuit is provided on one flat substrate. A digital communication device characterized in that blocks are mutually connected via their connectors. 3. The digital communication device according to claim 1 or 2, wherein a drive circuit or a cable for connecting a high-speed switch circuit section mounted on a flat board to another circuit section according to a connection distance. A digital communication device having a configuration of selecting by selecting. 4. The digital communication device according to claim 1, wherein wirings and connectors for communication data, control signals, and power supply are installed on the structure holding the flat substrate, and the wirings and A digital communication device having a structure in which a high-speed switch circuit unit which is planarly mounted on the flat substrate and a drive circuit or a cable are connected via a connector. 5. The digital communication device according to claim 1, wherein each circuit unit is divided and mounted in a plurality of cabinets or chassis, and these are connected to each other via a cable. Is a digital communication device.