JPH05198718A - Plating jig for pga type package - Google Patents

Abstract

PURPOSE:To provide a plating jig for PGA type package, in which lead pins, etc., can be plated easily and surely. CONSTITUTION:In a plating jig for PGA type package which applies power between lead pins 14 for the purpose of plating the lead pins 14, etc., of the PGA type package 12 for semiconductor device, the plating jig is composed of thin metal sheets and provided with small holes a little smaller in diameter than the corresponding lead pins 14 according to the arrangement of those lead pins 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PGA type package plating jig.

[0002]

2. Description of the Related Art A PGA (pin grid array) type package for a semiconductor device has a structure in which a large number of lead pins are erected on a package body of ceramic or the like. This lead pin is generally plated with gold in order to improve electrical continuity with a socket or the like into which it is inserted. Further, the conductor portion exposed to the outside of the package body is also plated with gold or the like. The conventional PGA type ceramic package is subjected to the above-mentioned gold plating, etc., by forming a conductor portion connected to the internal wiring pattern on the side surface of the package body made of ceramic by printing or the like to establish continuity with the internal wiring pattern and the lead pin, and by electrolytic plating. A predetermined gold plating or the like is applied to the lead pin or the like.

[0003]

By the way, the conductor portion formed on the side surface of the package body must be removed after plating. Conventionally, this removal has been performed by polishing, and there is a problem that workability is extremely poor. It was In addition, an unnecessary conductor pattern remains inside the package body from the internal wiring pattern to the conductor portion on the side surface of the package body, causing crosstalk with the multilayer internal wiring pattern and deteriorating electrical characteristics. There was a point.

Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to provide a PG which can easily and surely plate lead pins and the like.
An object is to provide a plating jig for an A type package.

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in order to perform plating on the lead pins of a PGA type package for semiconductor devices, a PGA type package plating jig that conducts between the lead pins is made of a thin metal sheet and has a diameter slightly smaller than the diameter of the corresponding lead pin. It is characterized in that the holes are provided according to the arrangement of the lead pins.
Further, the PGA type package has a mounting spring for tensioning the above-mentioned metal sheet with a predetermined tension, and a lead pin tip is applied to the small hole of the metal sheet stretched on the attachment spring. It is characterized by comprising a pressing body for contacting and holding the PGA type package by pressing it relative to the metal sheet.

[0006]

The PGA type package 12 is sandwiched between the metal sheet 10 and the pressing body 32 in a sandwiched state, whereby the lead pin 14 enters the small hole 16 and the edge of the small hole 16 as shown in FIG. Since the leading ends of the lead pins are received in a raised state, the PGA type package 12 is mounted on the plating jig with all the lead pins 14 firmly attached to the metal sheet 10. By applying a predetermined plating in this state, the lead pin 14 can be surely electrically conducted, and the lead pin 14 and other exposed wiring pattern portions, heat sinks, etc. can be plated easily and reliably.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows a metal sheet 10.
The metal sheet 10 is made of stainless steel and has a thickness of about 30 μ.
The sheet is made of a thin sheet of about m, and a large number of small holes 16 are formed on the surface thereof in accordance with the arrangement of the lead pins 14 of the PGA type package 12 shown in FIG. Holes 17 for hooking are formed at four corners of the metal sheet 10. The PGA type package 12 includes the lead pin 1 on the package body 18 in which a multilayer internal wiring pattern is formed.
4 are connected to the internal wiring pattern and formed upright. A cavity 20 in which a semiconductor element is mounted is recessed in the package body 18, and a part of an internal wiring pattern that electrically connects the semiconductor element with a wire is exposed in the cavity 20. 22 is a heat sink.

The small holes 16 provided in the metal sheet 10.
Is formed to be slightly smaller than the diameter of the lead pin 14. In the embodiment, the lead pin 12 has a diameter of 0.46 mm and the small hole 16 has a diameter of 0.40 mm. In addition, a through hole 24 is formed in the central portion of the metal sheet 10 corresponding to the cavity 20 so that the plating solution can circulate well.
It is preferable to appropriately provide through holes (not shown) in the portions other than the through holes 24 in order to ensure the circulation of the plating solution. In FIG. 2, reference numeral 26 is a hooking jig. Hooking jig 2
Reference numeral 6 denotes a conductor rod 28 attached to an electrode of a plating device (not shown), and four mounting springs 3 connected to the conductor rod 28.
0 and a pressing body 32 connected to the conductor rod 28 at the central position of the four mounting springs 30.

With the above construction, the metal sheet 10 can be stretched between the mounting springs 30 by inserting the tips of the mounting springs 30 into the four holes 17. As shown in FIG. 2, in the PGA type package 12, the lead pin 14 is applied so that the tip of the lead pin 14 is inserted into the small hole 16 of the metal sheet 10, and the heat sink 22 is brought into contact with the pressing body 32. It is inserted between the pressing body 32. That is, the PGA package 12 is the metal sheet 1
0 and the pressing body 32, the lead pin 12 is inserted into the small hole 16 as shown in FIG. 3, and the tip of the lead pin is received when the edge of the small hole 16 is raised. Therefore, all the lead pins 14 are firmly attached to the metal sheet 10, and the PGA type package 12
Is mounted on the plating jig. By applying a predetermined plating in this state, the lead pin 14 is surely electrically connected, and therefore the lead pin 14 and other exposed wiring pattern portions, heat sinks, etc. can be plated easily and reliably. it can.

The material of the metal sheet 10 is not particularly limited, and when the PGA type package 12 is mounted, the edge of the small hole 16 is slightly deformed as shown in FIG.
It is sufficient that the tip of the lead pin enters and the electrical connection with the lead pin 14 is surely obtained. By thus deforming the edges of the small holes 16, even if the lead pins 14 vary in length, electrical continuity can be ensured with all the lead pins 14. In the above embodiment, the cavity-down type PGA type package 12 has been described, but it goes without saying that it can be applied to a cavity-up type package, a package without a heat sink, and the like.

Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and many modifications can be made without departing from the spirit of the invention. Of course.

[0012]

According to the plating jig for a PGA type package according to the present invention, a thin metal sheet formed according to the arrangement of the lead pins of the PGA type package to be plated and having small holes having a slightly smaller diameter than the lead pins is used. Since it is used, when the lead pin is applied to the metal sheet so as to correspond to the small hole, the edge of the small hole deforms and the tip of the lead pin enters into the small hole, which causes the lead pin to vary in length. Even if there is, there is a remarkable effect that all lead pins can be surely electrically connected and plating can be performed easily and surely.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a metal sheet.

FIG. 2 is an explanatory diagram showing a state in which a PGA type package is mounted on a hooking jig.

FIG. 3 is an explanatory diagram showing a state in which a lead pin has entered a small hole.

[Explanation of symbols]

 10 Metal Sheet 12 PGA Type Package 14 Lead Pin 16 Small Hole 18 Ceramic Body 20 Cavity 30 Mounting Spring 32 Pressing Body

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[Procedure amendment]

[Submission date] May 27, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

[0005]

The present invention has the following constitution in order to achieve the above object. That is, in order to perform plating on the lead pins of a PGA type package for semiconductor devices, a PGA type package plating jig that conducts between the lead pins is made of a thin metal sheet and has a diameter slightly smaller than the diameter of the corresponding lead pin. It is characterized in that the holes are provided according to the arrangement of the lead pins.
Also comprising a mounting spring which stretched with the metal sheet a predetermined tension, those in the package body of the small holes in the PGA-type packages an assigned lead pins leading end of the metal sheet is stretched in the mounting spring It is characterized in that it is provided with a pressing body for contacting and holding the PGA type package relative to the metal sheet.

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

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Claims (2)

[Claims] 1. A plating jig for a PGA type package, in which lead pins of a PGA type package for a semiconductor device are plated so that there is conduction between the lead pins, which is made of a thin metal sheet and slightly smaller than the diameter of the corresponding lead pin. A PGA-type package plating jig, characterized in that small holes having a small diameter are provided in accordance with the arrangement of the lead pins. 2. A PGA-type package plating jig that conducts between the lead pins for plating the lead pins of a PGA-type package for a semiconductor device, and the metal sheet according to claim 1 is stretched with a predetermined tension. The PGA type package is provided with a mounting spring, and the PGA type package having the lead pin tip applied to the small hole of the metal sheet stretched over the mounting spring is brought into contact with the PGA type package so that the PGA type package and the metal sheet face each other. A PGA package plating jig, which is provided with a pressing body for mechanically pressing and holding it.