JPH05198470A - Semiconductor aligner and cleaning of wafer chuck thereof - Google Patents

Abstract

PURPOSE:To provide a semiconductor aligner and a method of cleaning wafer chuck thereof for easily enabling cleaning of chuck without giving any damage on optical parts in the vicinity of chuck. CONSTITUTION:A fence 1 in such a height as projecting above a loading surface at the external circumference of the wafer loading surface of a wafer chuck 2 in a semiconductor exposure apparatus providing a wafer chuck 2 for loading and fixing the wafer to be exposed. Cleaning of the wafer chuck is carried out when it is rotated while pressing the cleaning plate toward the fence.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor exposure apparatus that uses a wafer chuck to print a fine pattern on a wafer with high accuracy and a method for cleaning the wafer chuck, and particularly, the workability and maintenance of the wafer chuck cleaning are improved. The present invention relates to a semiconductor exposure apparatus and a wafer chuck cleaning method.

[0002]

2. Description of the Related Art Conventionally, a semiconductor exposure apparatus, particularly a stepper, has been widely introduced in a production site for manufacturing VLSI and the like and has brought great results.

However, this type of device has a problem in that the workability is poor when cleaning the wafer chuck and the optical components around the wafer chuck are damaged.

The depth of focus has an important factor when exposing a reticle pattern on a wafer in a semiconductor manufacturing apparatus. In order to satisfy the depth of focus and reduce the in-plane distortion of the wafer, it is necessary to maintain the flatness of the wafer. If foreign matter adheres to the upper surface of the wafer chuck, the flatness of the wafer is deteriorated. Therefore, it is necessary to keep the upper surface of the wafer chuck always clean so that no foreign matter is present. Conventionally, when cleaning the wafer chuck of this type of apparatus, the workability of the cleaning operation is extremely poor because the wafer chuck is located at a position where it is difficult to clean.

The optical parts around the wafer chuck are located higher than the wafer holding surface of the wafer chuck, and when cleaning the wafer chuck, the operator should pay attention to the chuck cleaning because of the poor workability. There is.

[0006]

However, in the above-mentioned conventional example, no matter how much the operator pays attention, due to poor workability, the optical plate mounted around the wafer chuck may be damaged by the cleaning plate during cleaning. Therefore, it was pointed out that the maintainability was poor, and there was a demand for improved workability.

The present invention solves the above-mentioned drawbacks of the conventional example, and a semiconductor exposure apparatus and a chuck thereof having improved workability and maintenance so that chuck cleaning can be carried out without damaging optical components around the chuck. The purpose is to provide a cleaning method.

[0008]

In order to achieve the above object, according to the present invention, a ring-shaped fence higher than the wafer holding surface is provided on the outer side of the wafer chuck, and the cleaning plate is provided at the time of cleaning the chuck by the cleaning plate. The wafer chuck is prevented from jumping out, and cleaning is performed without damaging the optical components arranged around the chuck.

According to such a structure, the above problem can be solved only by providing the fence on the outer side of the wafer chuck, and therefore, no functional modification of the apparatus is required.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a cross-sectional view of an essential part of a wafer chuck section of a semiconductor exposure apparatus according to an embodiment of the present invention. In the figure, 1 is a ring fence provided outside the wafer chuck, 2 is a wafer chuck, 3 is a reflection mirror (bar mirror) used in a laser interferometer, 4 is an optical component, and 5 is a vertical direction with the wafer chuck attached. A stage that can be tilted in the θ direction and tilted, and 6 is an XY stage.

FIG. 2 is a plan view of the wafer chuck section according to the embodiment of the present invention. Reference numeral 7 is a cleaning plate made of a porous material and having a spiral groove 8 for removing foreign matters to the outside.

FIG. 3 is a detailed sectional view of the chuck fence portion according to the present invention. In the figure, 1 is a fence, 2
Is a wafer chuck, 7 is a cleaning plate using a porous material, and a spiral groove is provided on the surface that slides against the wafer chuck surface, 9 is a dust groove integrated with a fence to collect foreign matters, and 10 is polyurethane Etc. belt.

FIG. 4 shows a conventional chuck cleaning method. 2 is a chuck, which is manually operated by the operator
While rotating the cleaning plate 7, the adhering foreign matter is removed. According to such a conventional method, the cleaning plate may hit and damage the optical components arranged around the wafer chuck.

On the other hand, according to the present invention, the belt 10 having the cleaning plate 7 attached to the inside of the fence 1 is used.
Rotate while pressing against to repeat the planetary motion and perform chuck cleaning. Since the fence 1 limits the cleaning area of the wafer chuck 7, the reflection mirror 3 and other optical components 4 around the chuck are not damaged.

Since the cleaning plate 7 is made of a porous material, foreign matter attached to the wafer chuck 2 can be easily removed, and the effect of the spiral groove 8 allows foreign matter to enter the dust groove 9 provided in the fence 1. ..

[0017]

As described above, by providing the fence on the outer side of the wafer chuck, it is possible to prevent damage to the optical parts due to the cleaning plate at the time of chuck cleaning with a simple structure including the fence. The maintainability and workability of the device can be improved.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a main part of a wafer chuck unit including a ring-shaped chuck fence of a semiconductor exposure apparatus according to the present invention.

FIG. 2 is a plan view of an essential part of the wafer chuck section of FIG.

FIG. 3 is a detailed cross-sectional view of the ring-shaped fence portion in FIG.

FIG. 4 is an explanatory diagram of wafer chuck cleaning using a conventional cleaning plate.

[Explanation of symbols]

1: Ring chuck fence, 2: Wafer chuck, 3: Bar mirror, 4: Optical parts, 5: θ / Z / tilt stage, 6: XY stage, 7: Cleaning plate, 8: Spiral groove, 9: Chuck fence Integrated dust groove, 10: friction belt, 11: conventional cleaning plate.

Claims (5)

[Claims] 1. A semiconductor exposure apparatus having a wafer chuck for mounting and fixing a wafer to be exposed, wherein a fence having a height protruding from the mounting surface is provided on an outer periphery of a wafer mounting surface of the wafer chuck. Semiconductor exposure apparatus. 2. The semiconductor exposure apparatus according to claim 1, wherein a dust groove for collecting foreign matter is provided inside the fence. 3. A semiconductor exposure apparatus comprising: a wafer chuck for mounting and fixing a wafer to be exposed; and a fence provided on an outer periphery of a wafer mounting surface of the wafer chuck and having a height protruding from the mounting surface. A wafer chuck cleaning method characterized in that a belt made of polyurethane or the like is attached to an inner diameter portion of a fence, and chuck cleaning is performed by rotating a cleaning plate while pressing the cleaning plate against the belt. 4. The wafer chuck cleaning method according to claim 3, wherein the semiconductor exposure apparatus has a dust groove for collecting foreign matter inside the fence. 5. The cleaning plate is made of a porous material for facilitating the removal of foreign matter, and is provided with a spiral groove so that the foreign matter enters the dust groove along with the rotation of the cleaning plate. 5. The method of cleaning a wafer chuck according to claim 4, wherein the method is a wafer chuck cleaning method.