JPH05192786A - Cream solder - Google Patents
Cream solderInfo
- Publication number
- JPH05192786A JPH05192786A JP4006685A JP668592A JPH05192786A JP H05192786 A JPH05192786 A JP H05192786A JP 4006685 A JP4006685 A JP 4006685A JP 668592 A JP668592 A JP 668592A JP H05192786 A JPH05192786 A JP H05192786A
- Authority
- JP
- Japan
- Prior art keywords
- solder powder
- solder
- film
- rosin
- cream solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品の実装などに
使用するクリーム半田に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cream solder used for mounting electronic parts.
【０００２】[0002]
【従来の技術】従来のクリーム半田は、半田粉末とロジ
ンと活性助剤と有機溶媒からなっている有機溶媒洗浄型
と、半田粉末と水溶性樹脂と水溶性活性助剤からなって
いる水洗浄型がある。2. Description of the Related Art Conventional cream solder is an organic solvent cleaning type consisting of solder powder, rosin, an active aid and an organic solvent, and a water cleaning consisting of solder powder, a water-soluble resin and a water-soluble active aid. There is a mold.
【０００３】[0003]
【発明が解決しようとする課題】しかし、従来のクリー
ム半田は、有機溶媒洗浄型、水洗浄型ともにクリーム半
田中に半田粉末と活性助剤が一緒に混合している為に、
半田粉末と活性助剤が化学反応を起こし、その反応生成
物によりクリーム半田の粘度が増加し経時変化が起こる
といった問題点があった。However, in the conventional cream solder, the solder powder and the activation aid are mixed together in the cream solder in both the organic solvent cleaning type and the water cleaning type.
There is a problem that the solder powder and the activation aid chemically react with each other, and the reaction product increases the viscosity of the cream solder and causes a change over time.
【０００４】そこで、本発明の目的は、従来のこのよう
な課題を解決するため、粘度の増加の少ない経時変化の
少ないクリーム半田を提供することである。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a cream solder having a small increase in viscosity and a small change with time in order to solve the above problems.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記課題を解
決する為に、水溶性樹脂、水溶性活性助剤及び半田粉末
からなるクリーム半田において、半田粉末にロジンの皮
膜を被覆すること又は、さらにその上に昇華型活性助剤
皮膜を被覆することにより、活性助剤と半田粉末の反応
を防ぎ、クリーム半田の粘度の増加を少なくし、経時変
化を少なくして安定したクリーム半田の塗布ができるよ
うにした。In order to solve the above-mentioned problems, the present invention provides a solder paste comprising a water-soluble resin, a water-soluble activator and a solder powder, in which the solder powder is coated with a rosin film, or By further coating a sublimation type active auxiliary agent film on it, the reaction between the active auxiliary agent and the solder powder is prevented, the increase in the viscosity of the cream solder is reduced, the change over time is reduced, and the stable application of cream solder is suppressed. I was able to do it.
【０００６】[0006]
【実施例】半田粉末を有機溶媒に溶かしたロジンに入
れ、約１０分間ボールミルで混合した後乾燥し、ロジン
の皮膜で被覆された半田粉末を得、この得られた半田粉
末を水溶性活性助剤を含む水溶性樹脂と混練してクリー
ム半田を作製した。この作製されたクリーム半田の初期
粘土を測定した結果、粘土５００００ＣＰＳであった。
そしてこれを室温約２５℃に１カ月保管後粘土を測定し
た結果、粘土の変化はみられなかった。また、このクリ
ーム半田をプリント基板上に印刷し、リフローさせたと
ころ従来のものと同等の半田付け性を示し、さらに温水
で洗浄してもフラックス残は従来のものと同程度に取り
除くことができた。[Examples] Solder powder was placed in rosin dissolved in an organic solvent, mixed in a ball mill for about 10 minutes and then dried to obtain a solder powder coated with a rosin film. A cream solder was prepared by kneading with a water-soluble resin containing an agent. As a result of measuring the initial clay of the cream solder thus prepared, the clay was 50,000 CPS.
The clay was measured after it was stored at room temperature of about 25 ° C. for one month, and no change was observed in the clay. In addition, when this cream solder was printed on a printed circuit board and reflowed, it showed the same solderability as the conventional one, and even if washed with warm water, the flux residue can be removed to the same extent as the conventional one. It was
【０００７】一方、半田粉末を有機溶媒に溶かしたロジ
ンに入れ、約１０分間ボールミルで混合した後乾燥し、
ロジンの皮膜で被覆された半田粉末を得、この得られた
半田粉末にさらに昇華型活性助剤を乾式混合し、前記ロ
ジンの皮膜の上に昇華型活性助剤の皮膜を被覆して半田
粉末を得、この得られた半田粉末と水溶性樹脂とを混練
してクリーム半田を作製した。この作製されたクリーム
半田の初期粘土を測定した結果、粘土６００００ＣＰＳ
であった。そしてこれを室温約２５℃に１カ月保管後粘
土を測定した結果、粘土の変化はみられなかった。ま
た、このクリーム半田をプリント基板上に印刷し、リフ
ローさせたところ従来のものと同等の半田付け性を示
し、さらに温水で洗浄してもフラックス残は従来のもの
と同程度に取り除くことができた。On the other hand, the solder powder is put in rosin dissolved in an organic solvent, mixed in a ball mill for about 10 minutes, and then dried.
A solder powder coated with a rosin film is obtained, and the obtained solder powder is further dry-mixed with a sublimation type active auxiliary agent, and the sublimation type active auxiliary agent film is coated on the rosin film to form a solder powder. To obtain a cream solder by kneading the obtained solder powder and a water-soluble resin. As a result of measuring the initial clay of the cream solder thus produced, clay 60000 CPS
Met. The clay was measured after it was stored at room temperature of about 25 ° C. for one month, and no change was observed in the clay. In addition, when this cream solder was printed on a printed circuit board and reflowed, it showed the same solderability as the conventional one, and even if washed with warm water, the flux residue can be removed to the same extent as the conventional one. It was
【０００８】[0008]
【発明の効果】本発明は、以上述べたように半田粉末と
活性助剤の反応を防ぐことが出来るため、経時変化を少
なくして安定してクリーム半田の塗布を行うことが出来
る。As described above, according to the present invention, the reaction between the solder powder and the activating aid can be prevented, so that the cream solder can be applied stably with less change over time.
Claims (2)
末からなるクリーム半田において、半田粉末にロジンの
皮膜を被覆したことを特徴とするクリーム半田。1. A cream solder comprising a water-soluble resin, a water-soluble activator and a solder powder, wherein the solder powder is coated with a rosin film.
半田において、半田粉末にロジンの皮膜を被覆し、その
上に昇華型活性助剤の皮膜を被覆したことを特徴とする
請求項１記載のクリーム半田。2. A cream solder comprising a water-soluble resin and solder powder, wherein the solder powder is coated with a rosin film, and the sublimation-type activator film is further coated thereon. Cream solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4006685A JPH05192786A (en) | 1992-01-17 | 1992-01-17 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4006685A JPH05192786A (en) | 1992-01-17 | 1992-01-17 | Cream solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05192786A true JPH05192786A (en) | 1993-08-03 |
Family
ID=11645217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4006685A Pending JPH05192786A (en) | 1992-01-17 | 1992-01-17 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05192786A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006038376A1 (en) * | 2004-09-30 | 2006-04-13 | Tamura Corporation | Solder composition and solder layer forming method using the same |
| US7601228B2 (en) * | 2001-06-29 | 2009-10-13 | Fuji Electric Holdings Co., Ltd | Solder composition |
-
1992
- 1992-01-17 JP JP4006685A patent/JPH05192786A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7601228B2 (en) * | 2001-06-29 | 2009-10-13 | Fuji Electric Holdings Co., Ltd | Solder composition |
| US8206515B2 (en) | 2001-06-29 | 2012-06-26 | Fuji Electric Co., Ltd. | Lead-free solder composition including microcapsules |
| WO2006038376A1 (en) * | 2004-09-30 | 2006-04-13 | Tamura Corporation | Solder composition and solder layer forming method using the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |