JPH051910Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a fixing mechanism for a connector such as an IC socket when surface mounting is performed by welding a connector such as an IC socket to the surface of a wiring pattern of a wiring board using solder.

Prior Art In surface mounting, as shown in FIG. This is a mounting technology in which the pattern 5 is preliminarily mounted on the surface of the pattern 5 via solder paste, and then subjected to a heating process and fused with the solder 6 to secure the connection and connector. It is difficult to align the solder paste, and vibrations during pre-mounting or after pre-mounting may cause misalignment.Also, before solder fusion, the surface simply adheres through the solder paste. , there is a risk that the contact may float up. Especially in surface mounting, there is a weakness in the mounting strength after solder fusion.
Because it relies only on soldering between the surface of the wiring pattern in a limited area and the surface of the contact, it has the disadvantage that the pull-out strength when inserting and removing the IC is significantly inferior to the mounting method that inserts the contact into the through hole of the wiring board and dips it with solder. .

For example, as shown in FIG.
A plurality of positioning pins 7 are provided on the wiring board 4.
A possible method is to press-fit the mounting piece 3 of the contact into the positioning hole 8 of the contact and mount it on the surface of the wiring pattern 5 to which solder paste has been applied. Although a one-to-one correspondence between the contact and the wiring pattern can be obtained approximately properly, this hardly contributes to reinforcing the pull-out strength, which is the weak point of surface mounting after soldering, and is not an effective solution.

Problems to be solved by the invention This invention solves the above-mentioned problems in surface mounting of connectors, and solves the problem of alignment of contacts and wiring patterns during pre-mounting via solder paste, as well as floating and vibration after pre-mounting. It is an effective and simple means to effectively solve the problem of misalignment caused by such factors, as well as to strengthen the mounting strength after solder fusion, which is the weak point of surface mounting, especially the pull-out strength and lateral load when inserting and removing ICs, etc. We aim to provide the following.

Means for Solving the Problems As a means for solving the above-mentioned problems, the present invention forms a fastener in which an insertion portion and a solder stop portion are arranged side by side via a connecting piece, and the insertion stop portions are arranged in parallel. The connector body is configured to be inserted into a mounting groove provided at the center of a connecting frame that connects both ends of the extending connector main body and press-fitted into a mounting hole of a wiring board, and the solder stop portion is attached to an inner surface of the connecting frame. The connection frame is made to protrude downward while being aligned with the connection frame, and a soldering mounting piece curved at the lower end thereof is made to protrude toward the inner space side of the connection frame to be used for soldering to the metal pad of the wiring board. It is.

Function As described above, the present invention has an insertion stop part where the stopper provided on the connector is press-fitted into the mounting hole of the wiring board, and a solder stop part where it is soldered to the metal pad provided on the surface of the wiring board. The above-mentioned problems in surface mounting can be effectively solved by cooperation between the two.

In other words, the surface mount connector uses the insertion stopper to prevent problems such as misalignment and floating of the contacts and wiring patterns during preliminary mounting via solder paste. In addition, by providing a two-point support with a solder stop part that is fixed by soldering, for example, in response to the pull-out load of an IC, the insertion stop part that is press-fitted and fixed will not peel off at the solder stop part. It prevents concentrated force from being applied, reduces the peeling force on the solder stop part, fully demonstrates the connector fixing effect of the solder stop part, and prevents lateral loads from being applied to the connector. A good reinforcing effect can be expected through cooperation between the two.

In addition, unlike the wiring pattern to which contacts are soldered, the mounting metal pads used to solder the solder stops do not have the constraints of parallel pitch, ensuring a sufficient soldering area and increasing the mounting strength. In the surface mounting heating process, the soldering part of the stopper and the metal mounting pad can be simultaneously fused, making it easy to fix the connector.

In addition, the present invention utilizes a connector structure consisting of a connector main body extending in parallel with a large number of sockets arranged in parallel, and a connecting frame that connects both ends of the connector body, and the insertion stop portion is provided in the center of the connecting frame. While inserting it into the mounting groove and protruding downward, align the solder stopper part of the stopper along the inner surface of the connection frame, and point the soldering mounting piece toward the inner space of the connection frame and attach it to the metal pad of the wiring board. Since the structure is designed to be used for soldering, the above-mentioned stop has a structure in which the insertion stop part and the solder stop part are arranged side by side. As a result, the desired fixing purpose can be effectively achieved while achieving high-density mounting without causing an increase in the size of the connector and therefore an increase in the connector mounting area. Furthermore, the soldering state of the soldering mounting piece curved at the lower end of the solder stop portion can be easily recognized from the space inside the connection frame. Also, since it is soldered inside the connecting frame,
Compared to the case where the mounting piece is soldered to the outside of the frame, the strength against the peeling force applied to the connector can be further increased.

Embodiments Embodiments of the present invention will be described in detail below with reference to FIGS. 2 to 7.

In FIGS. 2 to 4, reference numeral 11 indicates a connector for mounting an IC. The connector 11 has sockets 12 arranged in parallel on a connector body extending parallel to each other, and holds contacts 13 in the sockets 12 .
The contact 13 has a female terminal portion 14 that contacts a male terminal of an IC or the like inserted into the socket 12 with a predetermined contact pressure, and a mounting contact piece 15 bent outward of the connector 11 at the lower end. has.

In detail, the contact 13 has an inverted U shape as shown in the figure.
The part bent into a substantially folded state is used as an implanted part and is arranged on one inner wall of the socket 12 to serve as one fixed clamping piece 14a of the female terminal part 14,
The lower end of the inner side of the fixed clamping piece 14a is further bent into a U-shape to form a rising branch along the other inner wall of the socket 12, and the tip of the rising branch is further bent inward in an inverted U-shape. Then, the tip thereof is bent toward the upright support piece, and the bent portion is brought into contact with or close to the fixed clamping piece to form the other elastic clamping piece 14b of the female terminal portion 14. On the other hand, the lower end of the outer side of the fixed clamping piece 14a is bent sideways to form a mounting piece 15. The male terminal is inserted between the fixed clamping piece 14a and the elastic clamping piece 14b to obtain the contact pressure, and is soldered to the surface of the wiring pattern 17 of the wiring board 16 using the contact piece 15 as shown in FIG. and implement it.

Both ends of the surface mount connector 11 are provided with fasteners 18 for attaching and fixing the connector 11 to the wiring board 16. As shown in FIGS. 1 to 4, the connector has a connector body 11' extending in parallel and having a large number of sockets 12 arranged therein.
1' are connected by connecting frames 24, and the stop 18 is disposed at the center of each connecting frame 24. The stopper 18 has a mounting hole 19 formed through the wiring board 16 as shown in FIGS. 4 to 6.
It has a single-piece structure including an insertion stopper part 20 that is press-fitted into the wiring board 16, and a solder stopper part 22 that is placed on and soldered to the surface of a metal mounting pad 21 provided on the surface of the wiring board 16.

As a specific example of the above-mentioned stop 18, as shown in the figure,
A plate material is bent into a substantially horseshoe shape, and the insertion stop portion 20 is formed on one bent plate portion, and the solder stop portion 22 is formed on the other bent plate portion, and the two are connected into a connecting piece 20c.
It is connected in a form.

To be more specific, the insertion stop portion 20 has a middle portion 20a extending substantially over the entire insertion margin, and has press-fit protrusions 20b on both sides of the plate thickness. Furthermore, the insertion stop portion 20 has an implanted claw 20d at its base. On the other hand, the solder stop portion 22
has a mounting piece 22a formed by bending the lower end into a substantially L shape.

As shown in FIGS. 5 and 6, the stopper 18 penetrates the insertion stop portion 20 into the mounting groove 23 provided in the center of both ends of the connector 11, that is, in the center of the connection frame 24. The insertion claw 20d is fixed by biting into the opening edge or inner wall of the mounting groove 23, and the insertion stop portion 20 and solder stop portion 22 are made to protrude below the connector, and both are connected to the connecting frame 2.
4 via the connecting piece 20c. To be more specific, the insertion stop portion 20 is inserted into the mounting groove 23 provided in the center of the connection frame 24 to project downward from the connection frame, and at the same time, the solder stop portion 22 is attached to the inner surface of the connection frame 24 and connected. The above mounting piece 2 protrudes downward from the frame and is curved at its lower end.
2a is made to protrude toward the inner space between the connecting frames 24, 24, and is used for soldering to the metal pad 21 of the wiring board 4.

In this way, insertion stop portions 20 are provided at both ends of the connector 11.
A pair of fasteners 18 having a solder stopper portion 22 and a solder stopper portion 22 are provided.

As described above, the insertion stop portion 20 is press-fitted into the mounting hole 19 when the connector is preliminarily mounted on the wiring board 16 via solder paste, and positions the contacts 13 and the wiring pattern 17. At this time, the insertion stop portion 20 is inserted into the press-fit protrusion 2 as shown in FIGS. 7A and 7B.
0b into the mounting hole 19, and while being elastically deformed in the contraction direction by the intermediate portion 20a, the press-fit protrusion 20b is tightly fitted into the inner wall of the mounting hole 19 by its restoring force. At the same time, the mounting piece 22a of the solder stop portion 22 is
is placed on the surface of the mounting metal pad 21 of the wiring board 16 via solder paste. Thereafter, by subjecting it to a heating process, the mounting piece 15 of the contact 13 and the wiring pattern 17 are fused by the solder 25, and at the same time, the mounting piece 22 of the solder stop portion 22 is fused.
A and the metal mounting pad 21 are fused together.

Effects of the Invention As explained above, according to the present invention, the insertion stop part is press-fitted into the mounting hole of the wiring board in the stopper provided on the connector, and the solder stop part is soldered to the metal pad provided on the surface of the wiring board. By combining the two, problems such as misalignment and pull-out strength in surface mounting can be effectively solved through the cooperation of the two.

In other words, the surface mount connector effectively prevents the insertion stop part of the stopper from causing problems such as misalignment of contacts and wiring patterns during preliminary mounting via solder paste, and problems such as floating. By providing two-point support by providing a solder stop part that is fixed by soldering in addition to the solder stop part, for example, when the removal load of IC etc. It prevents the concentrated application of force, reduces the peeling force on the solder stop part, ensures the connector fixing effect by the solder stop part, and prevents lateral loads added to the connector. A good reinforcing effect can be expected through cooperation between the two.

In addition, unlike the wiring pattern to which contacts are soldered, the mounting metal pads used to solder the solder stops do not have the constraints of parallel pitch, ensuring a sufficient soldering area and increasing the mounting strength. In the surface mounting heating process, the soldering part of the stopper and the metal mounting pad can be simultaneously fused, making it easy to fix the connector.

Further, the present invention includes a connector body extending in parallel,
Utilizing a connector structure consisting of a frame that connects both ends, the insertion stop portion is projected downward from the connection frame, and the solder stop portion of the stop is aligned with the inner surface of the connection frame, and the soldering mounting piece is The structure is such that it protrudes toward the inner space side of the connection frame and is used for soldering to the metal pad of the wiring board. By mounting, the connector can be used for its intended purpose without creating an outwardly protruding part. This allows for high-density mounting without increasing the size of the connector and therefore the connector mounting area. This makes it possible to effectively achieve the intended fixing purpose of the stop. Furthermore, the soldering state of the soldering mounting piece curved at the lower end of the solder stop portion can be easily recognized from the space inside the connection frame. Furthermore, since the soldering is performed inside the connection frame, the strength against the peeling force applied to the connector can be further increased compared to the case where the mounting pieces are soldered outside the frame.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing a conventional surface mount connector, and FIGS. 2 to 7 show embodiments of the present invention.
Figure 2 is a plan view of the surface mount connector, Figure 3 is the same A
- A cross-sectional view, Figure 4 is a B-B cross-sectional view, Figure 5.
The figure is an enlarged perspective view showing the stopper, connector, and wiring board disassembled, Figure 6 is an enlarged cross-sectional view of the assembly of the three parts, Figure 7A is a sectional view of the insertion stop part of the stopper, and Figure B is the installation. FIG. 3 is a partial sectional view of the insertion stop showing a state of insertion into a hole. 11... IC mounting connector, 13... Contact, 15... Mounting piece, 16... Wiring board, 17
... Wiring pattern, 18 ... Stopper, 19 ... Mounting hole, 20 ... Insertion stop part, 21 ... Metal pad for mounting, 22 ... Solder stop part.

Claims (1)

[Scope of utility model registration request] The surface mount connector 11 is provided with a stopper 18 for fixing the connector 11 to the wiring board 16,
The stopper is equipped with an insertion stop part 20 that is press-fitted into the mounting hole 19 of the wiring board, and a solder stop part 22 that is soldered to the surface of the metal pad for mounting provided on the wiring board 16. In a fixing mechanism for a surface mount connector, in which a plurality of sockets 12 are arranged in parallel and a connector main body 11' extending in parallel has a plurality of sockets 12 arranged in parallel, the center of a connecting frame 24 connects both ends of the connector body 11'. The insertion stop portion 20 is inserted into the mounting groove 23 provided in the connecting frame 24, and the solder stop portion 22 is aligned with the inner surface of the connection frame 24 while projecting downward from the frame, and the metal pad is bent at the lower end of the solder stop portion 22. A fixing mechanism for a surface mount connector, characterized in that a mounting piece 22a for soldering to the connector is made to protrude toward the inner space side of the connection frame 24.