JPH05190714A - Semiconductor cooler and its assembling method - Google Patents

Abstract

PURPOSE:To improve the cooling capacity by improving the gas/liquid of a refrigerant and making it easy for liquid to return into a cooling vessel. CONSTITUTION:Semiconductor elements 1 and cooling vessels 2 are stacked alternately, and cooling liquid is filed up in a cooling vessel 1, and they are cooled by the boiling of it. The cooling vessel communicates with a condenser by a communication pipe 4, and the produced cooling gas is liquefied in the condenser 3, and returns to the cooling vessel. A steam chamber 18 is provided above the cooling vessel, and the cooling element 16 is made rectangular, and the inner tube of the communication pipe is inserted into the chimney 17 at the position far from the communication pipe, and the inner tube is arranged aslant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor cooling device and a method for assembling the same, and more particularly to a semiconductor cooling device and a method for assembling the same in which a cooling liquid is enclosed in a cooling device to cool an element by its boiling phenomenon.

[0002]

2. Description of the Related Art An example of a conventional apparatus for cooling a semiconductor element is a liquid in which a cooling apparatus and semiconductor elements are stacked in a stack and the same is boiled as described in Japanese Patent Publication No. 61-22626. Is placed in a container in which is enclosed. The device for condensing the boiling refrigerant gas is
It may be attached to the outside of the container as in the above-mentioned known example, or as described in JP-B-61-38865, the container of the boiling portion and the condenser may be connected by a connecting pipe.

On the other hand, Japanese Utility Model Publication No. 61-30294, Japanese Utility Model Publication No. 61-30295, or Japanese Utility Model Publication No. 61-2.
As described in Japanese Patent Publication No. 0778, Japanese Patent Publication No. 61-37793, etc., a semiconductor element and a container having a cooling fin on its inner wall and containing a coolant liquid are stacked in a stack, and each container is Communicated with the condenser. 4 above
In one known example, there is one condenser,
In the examples disclosed in Japanese Patent Publication No. 61780 and Japanese Patent Publication No. 63-38864, the condenser and the cooling container have a one-to-one correspondence. As in the latter known example, when the semiconductor element and the boiling portion container are separately configured, there is an advantage that the maintenance of the semiconductor element becomes easier.

FIG. 16 shows a typical example of a conventional boiling cooling apparatus for a large-capacity semiconductor element. A plurality of semiconductor elements 1 are stacked, a cooling container 2 is stacked between them, and the plurality of semiconductor elements 1 and the cooling container 2 are pressed against each other. The cooling container 2 is connected to the condenser 3 via a connecting pipe 4. The condenser 3 includes a heat transfer tube 5, a cooling fin 6, and left and right headers 7 and 8. The connecting pipe 4 is a double pipe, and the outer pipe 9 is the upper side of the cooling container 2 and the condenser 3
Please contact with the header 7 of. The inner tube 10 has one end inserted into the header 7 and the other end inserted near the bottom of the cooling container 2. A heat transfer surface suitable for boiling heat transfer is inserted into the inner wall of the cooling container 2. Boiling refrigerant liquid 1
1 is enclosed in a cooling container 2.

When the semiconductor element 1 is activated and begins to generate heat, the heat is transmitted to the cooling container 2 side, and the refrigerant liquid 11 starts to boil. The generated bubbles rise in the cooling container 2, flow between the inner pipe 10 and the outer pipe 9 of the communication pipe 4, and move to the condenser 5 side. In the condenser 5, the bubbles are condensed and liquefied. The liquefied refrigerant liquid 12 flows through the heat transfer pipe 5 in the lowermost direction, returns to the header 7, passes through the inside of the inner pipe 10, and is again guided to the bottom side of the cooling container 2.

In this way, the heat generated in the semiconductor element 1 is carried to the condenser 3 side by the boiling of the refrigerant liquid 11, and finally flows between the cooling fins 6 attached to the condenser 3. Heat is transferred to the side of the air (there may be the case where a fan is attached to force the air to flow or the case where the air is naturally circulated without a fan), and the semiconductor element 1 is operated at a predetermined temperature (for example, 100 ° C.). It is as follows.

[0007]

In the power semiconductor element, the electric input to the semiconductor element tends to increase in order to reduce noise or in an LSI element such as a computer to improve the operation speed. Therefore, the amount of heat generated by the element increases. As a countermeasure, it is necessary to improve the cooling efficiency of the semiconductor cooling device.

In the present invention, heat is transferred by boiling of the refrigerant liquid, but if the refrigerant liquid to be boiled does not return from the condenser 3 side to the cooling container 2 side, the heat transfer performance will deteriorate.
The principle of returning the refrigerant liquid is as follows. That is, header 7
Since the head 13 of the refrigerant liquid accumulated inside and the flow resistance of the bubbles flowing from the cooling container 2 to the condenser 3 are balanced, if the flow resistance is too large, it becomes difficult for the refrigerant liquid to return. Moreover, in order to improve the boiling performance, the area of the heat transfer surface must be increased. Furthermore, the boiling heat transfer surface in the cooling container must be structured to reduce the flow resistance of the refrigerant bubbles. For this purpose, it is sufficient to make the steam pipe 14 large, but it is not necessary to make it large unnecessarily, and since the width dimension of the cooling container 2 is limited, the cooling performance is not significantly deteriorated. Must have optimal dimensions.

On the other hand, with respect to the inner pipe 10 as well, if the outer diameter is increased to reduce the pressure loss of the liquid flow, the liquid return can be improved, but this too cannot be increased unnecessarily. If only the inner pipe is enlarged, the area of the steam passage portion formed between the steam pipe 14 and the inner pipe 10 becomes narrow.
The size of the inner pipe 10 also needs to be set to an optimum value. Furthermore, although the liquid returns to the cooling container 2 side through the inner pipe 10, the inner pipe 1
If the end of the cooling container on the side of 0 is not arranged, the refrigerant liquid is not evenly guided to the entire area of the evaporation portion, so that the heat transfer performance deteriorates.

The object of the present invention has been made in view of the above-mentioned problems, in which the flow of the refrigerant liquid is improved and the refrigerant liquid is sufficiently supplied into the cooling container to increase the flow cross-sectional area of the refrigerant gas. The liquid flow resistance is minimized to promote heat transfer,
An object of the present invention is to provide a semiconductor cooling device having a reduced size as a whole and improved cooling performance.

[0011]

In order to achieve the above object, the present invention provides a cooling vessel laminated on a semiconductor device and a condenser connected by a connecting pipe, and the cooling element is arranged inside the cooling vessel. In a semiconductor cooling device in which a coolant liquid is sealed and the semiconductor element is cooled by boiling of the coolant liquid, a vapor chamber is provided above the cooling container.

Further, the cooling container laminated on the semiconductor element and the condenser are connected to each other by a connecting pipe, the cooling element is arranged inside the cooling container to fill the refrigerant liquid, and the semiconductor element is boiled by boiling the refrigerant liquid. In a semiconductor cooling device that cools, a steam chamber is provided above the cooling container,
A plurality of the cooling vessels and the semiconductor elements are laminated, and a vapor separation tube is arranged between the cooling vessel and the condenser, and the vapor separation tube and the cooling vessel are composed of an inner tube and an outer tube. It is characterized in that they are connected by a connecting pipe having a double pipe structure, and that the vapor separation pipe and the condenser are connected by a vapor passage pipe and a liquid passage pipe.

Further, the cooling container laminated on the semiconductor element and the condenser are connected to each other by a connecting pipe, the cooling element is arranged inside the cooling container to enclose the refrigerant liquid, and the semiconductor element is caused by boiling of the refrigerant liquid. In a method for assembling a semiconductor cooling device for cooling a cooling container, a steam chamber is provided above the cooling container, and a cooling element to be inserted into the cooling container is constituted by a chimney row, and a cross-sectional shape of the cooling element. With a rectangular shape, the cooling container is provided with two openings,
The cooling element is inserted from one opening, the cooling element is projected to the other opening side and the opening is welded, so that the chimney row can be arranged in the cooling container.

[0014]

According to the above construction, when the refrigerant liquid and the refrigerant gas in the cooling container flow and the refrigerant liquid returns to the inside of the cooling container through the liquid return pipe, a certain amount of the refrigerant liquid remains in the cooling container. When held and boiling on the heat transfer surface, the refrigerant liquid is carried upward as the generated bubbles rise. Then, since the vapor bubbles flow to the inner pipe side, the refrigerant liquid also tends to be guided to the inner pipe side. Therefore, when the upper part of the cooling container is narrow, and the volume part occupied by the refrigerant on the upper side of the boiling heat transfer surface is small, in the upper part of the cooling container, there is much refrigerant liquid on the side where the steam pipe is attached, On the opposite side, there is less refrigerant liquid.
In this case, when the vapor chamber is provided in the cooling container, the refrigerant liquid is not suddenly bent to the inner pipe side, and the refrigerant liquid is easily guided to the side opposite to the side to which the inner pipe is attached.

On the other hand, when the end of the liquid return pipe on the side of the cooling container is installed in a direction away from the liquid return pipe, the amount of refrigerant liquid increases on the liquid return pipe side, so that the refrigerant liquid is introduced to the side opposite to the side on which the inner pipe is attached. It becomes easy to be hurt.

Further, if the inner pipe and the steam pipe are too narrow, the flow resistance increases respectively, so that the refrigerant liquid on the inner pipe side and the gas-liquid two-phase flow on the steam pipe side hardly flow. As a result, it becomes difficult for the refrigerant liquid to return to the cooling container side, but by optimizing the sizes of the inner pipe and the steam pipe, without forcibly increasing the pipe diameter, the refrigerant liquid to the cooling container side The return can be facilitated.

Also in boiling heat transfer, the heat transfer amount increases as the heat transfer area increases, similar to the general heat transfer phenomenon. Therefore, when the boiling heat transfer surface is provided in the rectangular cooling container, the heat transfer area is also made rectangular and the useless area is reduced,
Use space effectively. When the chimney structure is used as the heat transfer surface structure, the refrigerant gas boiling on the wall surface inside the chimney rises inside the chimney, so that the refrigerant liquid is carried to the upper side. Therefore, since the chimney lengths are equal on the rectangular heat transfer surface, the refrigerant liquid is uniformly carried to the upper side of the heat transfer surface.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Some embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 shows an embodiment of the present invention. The semiconductor element 1 and the cooling container 2 in which the refrigerant liquid 11 (perfluorocarbon liquid is used in this embodiment) is enclosed are alternately laminated. Both sides of the semiconductor element 1 and both sides of the cooling container are finished to be smooth, and although not shown in FIG. 1, the semiconductor elements 1 are pressed by a considerable force from both ends (in the direction of arrow 15) that are alternately stacked, The element 1 and the cooling container 2 are in close contact with each other. The cooling container 2 has a rectangular parallelepiped shape, and a cooling element 16 is arranged inside. The cooling element 16 also has the shape of a rectangular parallelepiped, and the arrow 1 under pressure of the cooling element 16
Two surfaces in the direction of 5 are integrated with the cooling container 2 or joined by soldering, welding, or the like.

As shown in FIG. 2, the cooling element 16 has a structure in which several chimneys 17 each having a rectangular cross section are arranged in the vertical direction. Each chimney 17 is provided with an opening 17a in the vertical direction of the cooling element 16.

The cooling container 2 is provided with a steam chamber 18 above the cooling element 16. A connecting pipe 4 is attached from the steam chamber 18 toward the condenser 3 side. The connecting pipe 4 is composed of an outer pipe 9 and an inner pipe 10. A vapor separation pipe 19 is arranged between the cooling container 2 and the condenser 3, and a plurality of connecting pipes 4 (four in FIG. 1) are connected to the side surface side (the left surface side in FIG. 1) of the vapor separation pipe 19. I am in touch. On the other hand, from the upper end side of the vapor separation pipe 19, a plurality of vapor passage pipes 19a communicate with the upper side of the condenser header 7. In the example of FIG. 1, the number of the connecting pipes 4 and the number of the steam passage pipes 19a are the same, but the number is not limited to this. A plurality of liquid passage pipes 20 are provided from the lower side of the condenser header 7 to the other side face side (the right face side in FIG. 1) of the vapor separation pipe 19.

FIG. 3 shows a cross section of the condenser 3. Headers 7 and 8 are attached to the left and right of the condenser 3, and the heat transfer tubes 5 are arranged in multiple stages (four stages in FIG. 3). A large number of cooling fins 6 are arranged in the vertical direction, and are joined to the heat transfer tubes 5 by soldering or pressure bonding. Although not shown in FIG. 3, a fan is provided on the front side of FIG. 3 so that an air flow can flow between the fins 6, and the condenser is cooled by forced air cooling. When there is no fan, air flows between the fans 6 by natural air cooling, and the condenser is cooled in the same manner.

FIG. 4 shows the structure of the vapor separation pipe 19. The vapor separation pipe 19 is divided into two left and right chambers by a partition plate 23. The inner pipe 10 is inserted into the end plate 23. The vapor passage pipe 19a communicates with the left chamber divided by the divider plate, and the liquid passage pipe 20 communicates with the right chamber. Further, a communication hole 24 is provided below the partition plate 23, and the left and right chambers partially partitioned by the partition plate 23 are connected to each other.

Next, the operation will be described. Semiconductor element 1
When is activated to generate heat, the heat is first transferred to the cooling container 2, and then the refrigerant liquid 11 in the cooling container 2 boils via the cooling element 6. The generated refrigerant gas 21 flows through a large number of chimneys 17 forming the cooling element and rises, and the vapor chamber 1
You are led to 8. At this time, a part of the refrigerant liquid may be carried at the same time. Further, it flows through a steam pipe 14 composed of an outer pipe 9 and an inner pipe 10, a vapor phase and a liquid phase are separated in a vapor separation pipe 19, and only a refrigerant gas flows into a vapor passage pipe 19a and a condenser is formed. 3 to header 7. Further, this refrigerant gas flows into many heat transfer tubes 5.

On the other hand, since the heat transfer tube 5 and the cooling fins 6 are cooled by the air flow outside the condenser 3, the refrigerant gas in the heat transfer tube 5 is also cooled and liquefied to become a condensed liquid. The condensate in the heat transfer tube 5 flows down to the header 7 or 8, but under the influence of the flow of the refrigerant gas, most of it flows to the header 8 side and to the lower side of the header 8 in the case of FIG. Accumulates as condensate 12. Therefore, the lowermost heat transfer tube among the heat transfer tubes 5 arranged in multiple stages plays a role of flowing the refrigerant liquid from the header 8 side to the header 7 side (arrow 22).

Further, the refrigerant liquid is guided to the vapor separation pipe 19 through the liquid passage pipe 20, and then flows from the vapor separation pipe into the cooling container 2 through the inner pipe 10 and one of the inner pipes 10 The refrigerant liquid is discharged to the lower side of the cooling element 16 which is the tip side,
A circulation cycle of the refrigerant liquid and the refrigerant gas is formed.

That is, the heat generated in the semiconductor element 1 is guided to the condenser 3 side by the flow of the liquid and the gas of the refrigerant, and finally transmitted to the air side flowing between the cooling fins 6 of the condenser. is there.

The driving of the refrigerant liquid is caused by the following principle. That is, since the vertical height of the refrigerant liquid 12 flowing downward in the headers 7 and 8 of the condenser 3 is higher than the position of the cooling container 2, the difference in the heights (head difference) causes It flows from the 7 side to the cooling container 2 side.
Since the refrigerant gas is generated and pressurized in the cooling container 2, this may serve as a driving force and may contain a part of the refrigerant liquid. However, the refrigerant gas passes through the steam pipe 14 and, conversely, from the cooling container 2 side. Drive to the condenser 3 side.

FIG. 5 shows another embodiment of the present invention. In this, the inner pipe 10 is inserted into the chimney 17 that constitutes the cooling element 16, but the position of the chimney into which the inner pipe 10 is inserted is set as far as possible from the side where the connecting pipe 4 is arranged. Is. As a result, it is possible to reduce the amount of dryness of the upper portion of the cooling element 16 and improve the cooling performance of the semiconductor element 1.

FIG. 6 shows another embodiment of the present invention. This is one in which the inner pipe 10 is attached with an inclination. The inner pipe 10 is arranged inside the outer pipe 9, but the inner pipe 10 is arranged so that its height increases from the cooling container 2 side toward the vapor separation pipe 19. This is the limit plate 23 in the vapor separation pipe 19.
It can be constructed by raising the position where the inner tube 10 is inserted into. This prevents the refrigerant gas from being trapped in the inner pipe 10 and improves the cooling performance.

FIG. 7 shows another embodiment of the present invention. This is the one in which the shape of the outer tube 9 is elliptical or rectangular. The cooling container 2 and the semiconductor element 1 are alternately laminated, but it is desirable to reduce the thickness of the cooling container 2 as much as possible to make the entire device small. However, if the outer pipe 9 is made too small, the flow resistance of the refrigerant gas flowing from the cooling container 2 side to the condenser 3 side becomes large, and the circulation cycle of the refrigerant is interrupted, resulting in deterioration of the cooling performance. Therefore, the outer tube 9 is formed into an elliptical shape or a rectangular shape so that the cooling container 2
The outer tube 9 through which the refrigerant gas flows can have a wide cross-sectional area without increasing the thickness of the.

FIG. 8 shows another embodiment of the present invention. This relates to a method of assembling the cooling container 2 and the cooling element 16. An opening 25 is provided on both sides of the cooling container 2, and a cooling element 16 having a large number of chimneys 17 arranged in a row is inserted from one opening side and protrudes to the other opening side, and the chimney 17 of the chimney 17 is placed in the cooling container 2. It is configured so that rows are formed. Then, the two openings 25 are welded with silver solder or the like to provide the cooling container 2 having a sealed structure in which the refrigerant is not enclosed.

9 and 10 show another embodiment of the present invention. These figures show the relationship between the inner diameters of the outer tube 9 and the inner tube 10 and the maximum heat radiation amount. That is, as described above, if the inner pipe or the outer pipe is too small, the circulation cycle of the refrigerant liquid and the refrigerant gas is interrupted, the refrigerant liquid is not returned to the cooling container 2, and finally the refrigerant liquid is provided above the cooling element 16. Dry parts that are not supplied will be generated,
Cooling performance will decrease. As shown in FIGS. 9 and 10, when the inner pipe diameter is about 6 mm or less and the outer pipe diameter is about 20 mm or less, the maximum heat radiation amount is drastically reduced by the above principle. To prevent this, the inner pipe diameter should be 6 mm or more and the outer pipe diameter should be 2 mm.
Must be 0 mm or more.

FIG. 11 and FIG. 12 are operation explanatory views showing the effect of providing the steam chamber 18. The operation state of the refrigerant liquid and the refrigerant gas in the cooling container 2 is shown. 11 shows the case where there is no steam chamber, and FIG. 12 shows the case where there is a steam chamber.

First, the case of FIG. 11 will be described. Here, a circular cooling element is illustrated as an example. When the semiconductor element operates and heat is generated, the cooling element is heated, the refrigerant liquid 26 in the chimney 17 starts to boil, and bubbles 27 are formed. Although a large number of these bubbles are present, they are merged as they go up above the cooling container 2, and the volume occupied by the vapor phase 28 of the refrigerant gas increases.

Then, it is bent in the direction of the connecting pipe 4 as the flow direction. Therefore, in FIG. 11, the gas phase portion expands on the left side, that is, on the side opposite to the direction in which the connecting pipe is attached. When there is no steam chamber, the vapor phase region extends to the upper left part of the cooling element as shown in FIG. 11, and the upper part of the cooling element is dried, resulting in a significant decrease in cooling performance.

On the other hand, FIG. 12 shows the case where the steam chamber 17 is provided, but even if the vapor phase region occupies a considerable portion, the cooling element is in a wet state and high cooling performance can be maintained. In an actual example, if the height of the steam chamber is 3 to 4 cm, high cooling performance can be maintained.

FIG. 13 shows the flow of gas and liquid in one chimney 17. FIG. 13A shows a case where the heat load is small, and the heat load becomes larger as it goes to FIGS. 13B and 13C. In the case of FIG. 13A, the bubbles 2
7 occurs, but the number is relatively small. As shown in FIG. 13B, the number of bubbles 27 increases, and a plurality of bubbles coalesce in the upper part. In FIG. 13C, the gas phase occupies a considerable portion inside the chimney 17, a liquid film 29 is formed on the inner surface of the chimney 17, and heat is transferred by evaporation of this liquid film. That is, the liquid in the chimney is carried upward by the driving force of the bubbles rising in the chimney. Therefore, as in the case of FIG. 13 (c) in particular, when the heat load becomes large, the evaporation is severe, so that it is necessary to supply the refrigerant liquid to the inner surface of the chimney. Promotes the supply of liquid to the inner surface of the chimney.

The effect of making the cooling element 16 rectangular is that the chimney effect is maximized. When the cooling element 16 has a circular shape, the chimney in the central portion is long,
The chimney length becomes shorter toward the edge and the chimney effect disappears. Therefore, the cooling performance is enhanced by making the length of all chimneys rectangular so that the refrigerant liquid is quickly supplied to the inner surface of the chimneys over the entire area. Of course, as described above, when inserting the cooling element into the cooling container of the same size, it is possible to make the heat transfer area larger by making the rectangular shape larger than the round shape, which further improves the cooling performance. improves.

14 and 15 are operation explanatory views showing the operation when the inner pipe 10 is inclined and arranged. FIG. 14 shows the case where the inner pipe is horizontal, and FIG. 15 shows the case where the inner pipe is inclined.

As shown in FIG. 14, the inner pipe 10 is inserted into one chimney 17, but when bubbles 30 are generated in the inner pipe, it rises and stays in the horizontal portion of the inner pipe 10. Will end up. It is added and becomes larger, and is trapped in the horizontal portion to form the vapor phase portion 31. Once the vapor phase portion 31 is formed, it is not removed, so that it becomes difficult for the refrigerant liquid to flow in the inner tube, causing liquid stagnation in the cooling container 2 and lowering the cooling performance.

As shown in FIG. 15, when the inner pipe 10 is arranged so as to be inclined, even if bubbles 30 are generated in the inner pipe 10,
Since bubbles 30 flow to the vapor separation pipe 19 (arrow 3
2), the flow of the refrigerant liquid in the inner pipe 10 is smoothly performed (arrow 33).

[0043]

As described above, the present invention has the following effects. By providing the steam chamber in the upper part of the cooling container, the cooling element part is prevented from being dried, so that the cooling performance can be improved.

By making the shape of the cooling element rectangular, the chimney effect is effectively exerted over the entire area, so that the supply of the refrigerant liquid to the inner surface of the chimney can be promoted.
At the same time, the area occupied by the cooling elements in the cooling container can be maximized to promote heat transfer.

The inner tube is inserted into the chimney,
By making the chimney position away from the connecting pipe, the refrigerant liquid can be made to flow as easily as possible in the region where the gas phase portion is likely to be occupied in the cooling container.

By arranging the inner pipe in an inclined manner, a structure in which the gas phase is not trapped in the inner pipe is formed. As a result, the flow of the refrigerant liquid in the inner pipe is improved, and the refrigerant liquid is sufficiently supplied into the cooling container.

The cooling container is provided with two openings, and a cooling element is inserted into the openings to form a hermetically sealed structure. This makes it possible to arrange the cooling elements in the cooling container in the form of chimney rows.

Since the outer tube has an elliptical shape or a rectangular shape, the entire apparatus can be made compact without increasing the thickness of the cooling container, and the flow cross section of the refrigerant gas can be increased.

The inner and outer pipes have dimensions of 6 mm and 20 mm.
By the above, the gas-liquid flow resistance of the refrigerant can be minimized.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective sectional view showing an embodiment of the present invention.

FIG. 3 is a sectional view showing an embodiment of the present invention.

FIG. 4 is a sectional view showing an embodiment of the present invention.

FIG. 5 is a perspective view showing another embodiment of the present invention.

FIG. 6 is a sectional view showing another embodiment of the present invention.

FIG. 7 is a perspective view showing another embodiment of the present invention.

FIG. 8 is a sectional view showing another embodiment of the present invention.

FIG. 9 is a graph showing another embodiment of the present invention.

FIG. 10 is a graph showing another embodiment of the present invention.

FIG. 11 is an explanatory diagram showing the operating principle of the present invention.

FIG. 12 is an explanatory diagram showing the operating principle of the present invention.

FIG. 13 is an explanatory diagram showing the operating principle of the present invention.

FIG. 14 is an explanatory diagram showing the operating principle of the present invention.

FIG. 15 is an explanatory diagram showing the operating principle of the present invention.

FIG. 16 is a perspective view showing a conventional technique.

[Explanation of symbols]

 1 Semiconductor Element 2 Cooling Container 3 Condenser 4 Communication Tube 5 Heat Transfer Tube 6 Cooling Fin 7,8 Condenser Header 9 Outer Tube 10 Inner Tube 11 Refrigerant Liquid 12 Condensate 14 Steam Pipe 15 Both Ends 16 Cooling Element 17 Chimney 17a Opening 18 Vapor chamber 19 Vapor separation pipe 19a Vapor passage pipe 20 Liquid passage pipe 21 Refrigerant gas 22 Arrow 23 Stopper plate 24 Communication hole 25 Opening 26 Refrigerant liquid 27 Bubble 28 Gas phase 29 Liquid film 30 Bubble 31 Gas phase part 32, 33 Arrow

Claims (11)

[Claims] 1. A cooling container laminated on a semiconductor device and a condenser are connected by a connecting pipe, a cooling device is disposed inside the cooling container to seal a refrigerant liquid, and the semiconductor device is boiled by boiling the cooling liquid. In a semiconductor cooling device for cooling
A semiconductor cooling device, wherein a vapor chamber is provided above the cooling container. 2. The semiconductor cooling device according to claim 1, wherein the refrigerant liquid is a perfluorocarbon liquid. 3. The semiconductor cooling device according to claim 1, wherein the cooling element to be inserted into the cooling container has a structure composed of chimney rows, and the cooling element has a rectangular cross-sectional shape. Semiconductor cooling device. 4. The semiconductor cooling device according to claim 3, wherein the cooling container is provided with two openings, the cooling element is inserted from one opening, and the cooling element is projected toward the other opening side to form an opening portion. Is welded so that the chimney rows can be arranged in the cooling container. 5. A cooling container laminated on a semiconductor element and a condenser are connected to each other by a connecting pipe, a cooling element is disposed inside the cooling container to enclose a refrigerant liquid, and the semiconductor element is caused by boiling of the refrigerant liquid. In a semiconductor cooling device for cooling
A vapor chamber is provided in the upper part of the cooling container, and a plurality of the cooling container and the semiconductor element are laminated,
A vapor separation tube is arranged between the cooling container and the condenser,
The vapor separation tube and the cooling container are composed of an inner tube and an outer tube 2
A semiconductor cooling device, characterized in that they are connected by a connecting pipe having a heavy pipe structure, and the vapor separation pipe and the condenser are connected by a vapor passage pipe and a liquid passage pipe. 6. The semiconductor cooling device according to claim 5, wherein the tip of the inner pipe is mounted in a cooling element in a direction away from the connecting pipe. 7. The semiconductor cooling device according to claim 5, wherein the inner pipe is inclined from the cooling container toward the vapor separation pipe so that the height of the inner pipe is increased. .. 8. The semiconductor cooling device according to claim 5, wherein the outer tube has an elliptical shape or a rectangular shape. 9. The semiconductor cooling device according to claim 5, wherein the inner diameter of the inner pipe is 6 mm or more. 10. The semiconductor cooling device according to claim 5, wherein the outer tube has an inner diameter of 20 mm or more. 11. A cooling container laminated on a semiconductor device and a condenser are connected by a connecting pipe, a cooling device is arranged inside the cooling container to seal a refrigerant liquid, and the semiconductor device is heated by boiling the refrigerant liquid. In the method for assembling a semiconductor cooling device for cooling a cooling chamber, a steam chamber is provided above the cooling container,
Further, the cooling element to be inserted into the cooling container has a structure composed of a chimney array, the cooling element has a rectangular cross-sectional shape, and the cooling container is provided with two openings, and the cooling is performed from one opening. A method for assembling a semiconductor cooling device, wherein an element is inserted, the cooling element is projected to the other opening side and the opening is welded so that the chimney row can be arranged in a cooling container.