JPH05185596A - Ink jet recording head and manufacturing method therefor, and ink jet recording apparatus - Google Patents

Abstract

PURPOSE:To provide a highly reliable ink jet recording head which is manufacturable by mass production method through simple and less processes at low costs and provide manufacturing method therefor. CONSTITUTION:A solid body layer made of removable material is provided to a position that is to form a lower end part for ejection ports 29a, liquid passages 29b and a liquid chamber 29c on a substrate 21 on which energy- generating elements and electrodes 22 are provided, and a structural member 29 is stuck to the substrate 21 no sooner than the structural member is formed by transfer molding. Then an ink jet recording head is completed after the solid body layer is removed. The material of synthetic resin for constructing the structural member 29 must be selected so that at least one of the following two requirements can be met. Shearing adhesion of the synthetic resin forming the structural member 29 to the substrate 21 is bigger than: A) the stress arising from the difference between the coefficients of thermal expansion of the synthetic resin and the substrate 21, or B) the stress arising from the synthetic resin on occasion of molding the structural member 29.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink flow path communicating with an ejection port for ejecting ink, and energy provided along the ink flow channel for ejecting ink from the ejection port. The present invention relates to an inkjet recording head including an energy generating unit that generates energy, a method for manufacturing the inkjet recording head, and an inkjet recording apparatus including the inkjet recording head.

[0002]

2. Description of the Related Art Ink jet recording heads are generally
Fine ejection ports for ejecting ink, ink channels provided for each ejection port and communicating with the ejection ports, energy provided for each part of each ink channel to generate energy for ejecting ink And means. In many cases, one ink jet recording head is provided with a large number of ejection ports, and a common liquid chamber is provided in each ink flow path for stably supplying ink to each ink flow path. An element that converts electric energy into ejection energy, such as an electrothermal converter or a piezoelectric element, is used as the energy generating means.

Typical methods of manufacturing an ink jet recording head are as follows.

Using a first substrate provided with an energy generating means and a second substrate made of glass or metal,
The second substrate is provided with a discharge port, a recess for forming the ink flow path and the liquid chamber, and a supply port for communicating the liquid chamber with the outside by a processing means such as cutting or etching. A method of bonding the second substrate to the first substrate with an adhesive while aligning the position with the ink flow path.

By attaching a dry film of, for example, a positive type photosensitive resin to a substrate provided with an energy generating means and made of glass, and exposing and developing the photosensitive dry film using a photolithography technique,
A solid layer having a pattern corresponding to the ejection port, the ink flow path, and the liquid chamber is provided on this substrate. Next, a liquid curable material in which a curing agent is mixed is applied on the solid layer and the substrate to an appropriate thickness and left at a predetermined temperature for a long time to cure the curable material. After that, the substrate is cut at the position where the ejection port is formed to expose the end face of the solid layer, the substrate is immersed in a solution that dissolves the solid layer, the solid layer is dissolved and removed from the substrate, and the ink flows inside. A method of providing a space for forming a passage and a liquid chamber (see JP-A-61-154947).

By attaching a photosensitive dry film to the first substrate provided with energy generating means and exposing and developing the photosensitive dry film, a pattern corresponding to a part of the ejection port, the ink flow path and the liquid chamber is formed. Is provided on the first substrate. On the solid layer and the first substrate, an active energy ray curable material that is cured by an active energy ray such as ultraviolet ray or electron beam is applied to an appropriate thickness. A second substrate is provided which is provided with a recess and a supply port for forming another part of the liquid chamber and which transmits the active energy rays.
The second substrate is attached on the active energy ray-curable material so that the concave portion of the substrate is aligned with the position where the liquid chamber is to be formed to form a laminate. Next, the second substrate is masked so as to hide the portion where the liquid chamber is to be formed, and active energy rays are radiated through the second substrate to cure the active energy ray curable material, and then the laminated layer. The body is cut at the position where the ejection port is formed to expose the end face of the solid layer, and the solid layer and the uncured active energy ray-curable material are dissolved and removed from the laminate to form an ink flow path and a liquid chamber inside. A method of providing a space (see JP-A-62-253457).

[0007]

In the case of manufacturing the above-mentioned ink jet recording head, the manufacturing method of can manufacture the one having a large liquid chamber suitable for high speed recording. Energy generation means and second
It is necessary to precisely align the minute ink flow paths of the substrate with each other and bond the both substrates, which makes the device complicated and expensive, lacks mass productivity, and causes an increase in product cost. There is a problem. Does not require precise alignment, but the volume of the liquid chamber is limited by the thickness of the patterned solid layer,
There is a problem that a large liquid chamber cannot be formed, the process is complicated and time-consuming, and the number of processes is large, resulting in lack of mass productivity and an increase in product cost. In the manufacturing method of, the liquid chamber can be enlarged by enlarging the recess for forming the other part of the liquid chamber, and precise alignment is unnecessary, but similar to the above manufacturing method. In addition, the process is complicated and time-consuming, and since the number of processes is even larger, mass productivity is lacking, which causes an increase in product cost.

In order to solve such a problem, a substrate provided with an energy generating means is used, and a solid layer having a pattern corresponding to a part of a discharge port, an ink flow path and a liquid chamber is provided on the substrate. A method has been devised in which a discharge port, an ink flow path, and a liquid chamber are formed on this substrate by integral molding of synthetic resin, and then the solid layer is dissolved and removed. in this case,
The solid layer substantially acts as a part of the mold at the time of integral molding, and contributes to the formation of the ink flow path that is the undercut portion. However, in the ink jet recording head manufactured by this method, the integrally molded synthetic resin may peel off or float up from the substrate due to the temperature difference between the time of manufacture and the time of use. There is a problem such as that sometimes occurs.

An object of the present invention is to provide an ink jet recording head having a large liquid chamber, manufactured by a simple and small process, suitable for mass production, inexpensive and highly reliable, and a manufacturing method thereof. Especially.

[0010]

The ink jet recording head of the present invention comprises a substrate on which energy generating means is arranged,
A resin member provided with a recess for forming an ink flow path is adhered to each other with the recess inside, whereby the ink flow path is formed, and the shear adhesive force between the resin member and the substrate is increased. The stress is greater than the stress generated due to the difference between the coefficient of thermal expansion of the resin member and the coefficient of thermal expansion of the substrate, or a substrate on which energy generating means is arranged and an ink flow path. A resin member provided with a recess for forming is adhered to each other with the recess inside, whereby the ink flow path is formed, and the shear adhesive force between the resin member and the substrate is the resin member. It is characterized in that it is larger than the stress generated in the resin member at the time of molding.

The method of manufacturing an ink jet recording head of the present invention is based on the step of providing a solid layer made of a removable material on a portion to be an ink flow path on a substrate and the difference in the coefficient of thermal expansion from the substrate. A resin having a shear adhesive strength to the substrate larger than the stress generated by transfer molding by transfer molding so as to cover the solid layer, and removing the solid layer. And a step of forming the ink liquid path, or a step of providing a solid layer made of a removable material in a portion to be an ink flow path on a substrate, and by transfer molding, A step of providing a resin having a shear adhesive force larger than that of the stress generated during the transfer molding on the substrate so as to cover the solid layer on the substrate provided with the solid layer; It is characterized in that a step of forming the ink passage and removing the solid layer.

The ink jet recording apparatus of the present invention comprises the ink jet recording head of the present invention in which the ink ejection ports are arranged so as to face the recording surface of the recording medium, and a member for mounting the head. It is equipped with at least.

The substrate on which the energy generating means is arranged and the resin member for integrally forming the discharge port and the ink flow path generally have different coefficients of thermal expansion, but the shear adhesive force between the resin member and the substrate is If the stress caused by the difference in expansion coefficient is made larger than the stress caused by the difference between the temperature at the time of manufacturing and the stress at the time of use, there will be no separation or gap between the bonding surface between the substrate and the resin member.

The resin member for molding generally shrinks in volume during curing (or cross-linking) during molding to generate stress. The stress on the substrate and the resin member is greater than the stress during molding. If the shearing adhesive force between the substrate and the resin member is increased, this stress does not cause separation of the bonding surface between the substrate and the resin member.

In any of the above cases, the stress of the resin member is reduced or the shear adhesive force between the substrate and the resin member is improved. As a method of reducing the stress of the resin member, for example, a resin is used. There are methods such as adding a plasticizer or the like into a member, mixing a pigment or the like into a resin member to reduce heat shrinkage of the resin member. As a method of improving the shear adhesive force, for example, there is a method of subjecting the substrate to a surface treatment with a silane coupling agent or the like, or a treatment such as etching on the substrate surface. Better results can be obtained by combining various methods for reducing the stress or improving the shear adhesive force.

Further, in the method for manufacturing an ink jet recording head of the present invention, a solid layer made of a removable material is formed on a portion of an ink flow path on a substrate,
Since the resin is provided by transfer molding so as to cover the solid layer and then the solid layer is removed to form the ink flow path, the ink flow path can be accurately positioned with respect to the substrate in a small number of steps.

[0017]

Embodiments of the present invention will now be described with reference to the drawings.

First, an embodiment of the ink jet recording head will be described. FIG. 1 is a fragmentary perspective view showing the structure of an inkjet recording head according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a method for measuring the shear adhesive force.

In FIG. 1, a heat generating portion (HfB ₂ ) 2a of an electrothermal converter and a plurality of Al electrodes 2 are etched on one surface of a substrate 1 made of glass, a silicon wafer or the like.
It is formed into a film by a known semiconductor manufacturing process such as vapor deposition and sputtering, and is lined up at a predetermined interval.
This one surface is the element surface 1a. On the element surface 1a,
The structural member 3 made of one member is fused at the same time as molding by integral molding such as transfer molding. Further, although not shown, various elements such as a protective film such as a SiO ₂ film and a Ta film are formed on the element surface 1a including each electrode 2 and the heating portion 2a of each electrothermal converter for the purpose of improving durability. It is common to provide such a functional layer. The present embodiment exerts its effect regardless of the presence or absence of these functional layers and the material.

A plurality of groove portions are formed on the surface of the structural member 3, which is a resin member, facing the element surface 1a, corresponding to the positions of the heat generating portions 2a of the electrothermal converters. A space surrounded by 1a constitutes a liquid flow path 3b which is an ink flow path, and an opening opened to the outside of each space constitutes a discharge port 3a. Further, in the structural member 3, a cavity is formed which communicates with each groove (liquid channel 3b) and has an element surface 1a as a bottom wall to form a liquid chamber 3c. 3c) has an opening for communicating the outside (such as a connector 4 described later) with the element surface 1
The supply port 3 is formed so as to be open in the same direction as a facing a.
It is d. A supply pipe 5 connected to an ink tank or the like (not shown) is connected to the supply port 3d via a connector 4, and ink is supplied from the ink tank to the supply pipe 3d.
The liquid is supplied to the liquid chamber 3c through d.

Here, the material of the structural member 3 which is a resin member will be described. The structural member 3 is a liquid or a solid that becomes a liquid at the time of molding and is room temperature cured, heat cured,
A synthetic resin having properties such as ultraviolet curing can be used, and examples thereof include epoxy resin, silicone resin, acrylic resin, diglycol dialkyl carbonate resin, unsaturated polyester resin, polyurethane resin, polyimide resin, melamine resin, phenol resin, urea. Resin etc. are mentioned.

The shear adhesive force between the synthetic resin forming the structural member 3 and the substrate 1 is generated due to the shear adhesive force due to the difference between the thermal expansion coefficient of the synthetic resin and the thermal expansion coefficient of the substrate 1. At least one of the condition that the shear adhesive force is larger than the stress and the shear adhesive force is larger than the stress generated in the synthetic resin when the structural member 3 is molded is satisfied. In order to satisfy at least one of these two conditions, for example,
A plasticizer is added to the synthetic resin forming the structural member 3 to reduce the stress generated in the synthetic resin, and a pigment is added to the synthetic resin forming the structural member 3 so that the synthetic resin does not easily shrink due to heat. The element surface 1 of the substrate 1 in which both the plasticizer and the pigment are added to the synthetic resin to reduce the stress in the synthetic resin and prevent the synthetic resin from thermal contraction
a Surface treatment with a silane coupling agent and addition of both plasticizer and pigment to the synthetic resin improve the shear adhesive strength itself, reduce the stress generated in the synthetic resin, and heat shrink the synthetic resin. And so on.

The shear adhesive force between the synthetic resin forming the structural member 3 and the substrate 1 can be measured, for example, by the configuration shown in FIG. In FIG. 2, the same synthetic resin 12 as that constituting the structural member 3 is fused at the same time as molding to the surface of one end of the test substrate 11 having the same configuration as the substrate 1. One end of the support plate 13 is fixed to the surface of the synthetic resin 12 that does not face the test substrate 11. The test substrate 11 and the support plate 13 are arranged so as to extend in mutually opposite directions. The other end of the test substrate 11 and the other end of the support plate 13 were attached to a tensile tester (not shown), and the tensile tester was used to pull in the direction of the arrow shown in the figure to separate the test substrate 11 and the synthetic resin 12. Shear adhesion is measured by determining the tensile force as it is sheared.

The operation when ink is ejected from each ejection port 3a will now be described. The ink supplied to the liquid chamber 3c enters the liquid flow path 3b by a capillary phenomenon, forms a meniscus at the ejection port 3a, and keeps the liquid flow path 3b filled. At this time, when the heat generating portion 2a of the electrothermal converter is energized via the electrode 2 to generate heat, the ink on the heat generating portion 2a of the electrothermal converter is rapidly heated and bubbles are generated in the liquid flow path 3b. Then, based on the expansion of the bubbles, ink is ejected from the outlet 3a.

In the present embodiment, an example in which an electrothermal converter is provided as the energy generating means for generating energy for ejecting ink is shown, but the present invention is not limited to this, and ejection pressure is instantaneously applied to ink. You may use the piezoelectric element etc. which generate | occur | produce mechanical energy. The discharge port 3a has 16
128 or 256 pieces can be formed at a high density such as pieces / mm, and a full line type can be formed by forming as many as the entire width of the recording area of the recording medium.

In the ink jet recording head of this embodiment, a phenomenon such as peeling or floating of the structural member 3 from the substrate 1 which occurs at the time of manufacture is prevented, and not only printing defects due to such peeling are prevented, but also The same kind of peeling and floating that occurs after long-term use is prevented. Generally, the structural member peels from the substrate during long-term use.
It is considered that the internal stress remaining in the structural member acts on some defect in the structural member through the thermal cycle. As described above, the shear adhesive force between the synthetic resin forming the structural member and the substrate is larger than the stress generated due to the difference between the thermal expansion coefficient of the synthetic resin and the thermal expansion coefficient of the substrate. By satisfying at least one of the conditions that it is larger than the stress generated in the synthetic resin during molding, the residual internal stress in the synthetic resin is relatively reduced compared to the shear adhesive force, and therefore It is considered that peeling does not occur even during use for a period of time.

Next, a method for manufacturing the ink jet recording head of the present invention will be described. Here, the case of manufacturing the inkjet recording head shown in FIG. 3 will be described. FIG. 3 is a perspective view showing the structure of the ink jet recording head, and FIG. 4 is a view for explaining this manufacturing method.
(A) is a schematic perspective view showing a substrate, (b) is a schematic perspective view showing a solid layer, (c) is a cross-sectional view of a main part of a mold used for molding a structural member, and FIG. 5 is a diagram illustrating this manufacturing method. And
(A) is a schematic plan view showing the structural member after release, (b) is a cross-sectional view taken along the line AA of (a), and (c) is the line A- after the solid layer is removed.
FIG. 6A is a cross-sectional view of FIG.
(B) is a schematic perspective view showing a solid layer, (c) is a cross-sectional view of a main part of a mold used for molding a structural member, and (d) is a schematic cross-sectional view showing the structural member after release.

First, the ink jet recording head shown in FIG. 3 will be described. This inkjet recording head is the same as the inkjet recording head shown in FIG.
Each of the discharge ports 29a is individually provided with a liquid flow path 29b and an energy generating means. It goes without saying that the number of the energy generating means and the corresponding liquid flow paths and discharge ports are not limited to the above three.

FIG. 4 (a) shows the structure of the substrate 21 of the ink jet recording head. The element surface 21a of the substrate 21 made of glass, silicon wafer or the like has the heating portions (of the three electrothermal converters). HfB ₂ ) 22a and three Al electrodes 22 connected to one end of each heat generating portion 22a.
And an Al common electrode 30 which is provided in common to all the heat generating portions 22a and is connected to the other end of these heat generating portions 22a are formed into a film by a semiconductor manufacturing process such as etching, vapor deposition, sputtering, etc. They are placed side by side. The electrothermal converter is an energy generating unit that generates thermal energy for ejecting ink, but is not limited to this, and uses a piezoelectric element or the like that generates mechanical energy that instantaneously applies ejection pressure to ink. Good. Electrode 22
The side that is not joined to the heat generating portion 22a is the electrical connecting portion 22b, and when a voltage is applied between this electrical connecting portion 22b and the common electrode 30, the corresponding heat generating portion 22a comes to generate heat. There is.

First, on the element surface 21a of the substrate 21, as shown in FIG.
As shown in (b), the ejection port 29a through which ink is ejected
(FIG. 3), a part of the liquid chamber 29c (FIG. 3) that stores ink to be supplied to the ejection port 29a, and a liquid flow path 29b (FIG. 3) that connects the ejection port 29a and the liquid chamber 29c. A solid layer 26 having a corresponding pattern is formed. As a result, the solid layer 2
Three liquid flow path corresponding portions 2 corresponding to the liquid flow paths 29b of 6
6b will cover each electrode 22 and each heating part 22a, respectively.

As a means for forming the solid layer 26 on the element surface 21a, for example, a positive type or negative type photosensitive dry film having an appropriate thickness is attached to the element surface 21a, and an ejection port of this photosensitive dry film, The pattern corresponding to the liquid flow path 29b and the liquid chamber 29c is masked or exposed and exposed and developed to form the solid layer 26 having the pattern corresponding to the discharge port 29a, the liquid flow path 29b and the liquid chamber 29c on the element surface 21a. It is possible to use a photolithography means such as the above. In this case, the photosensitive dry film may be made of any material as long as it can be dissolved and removed by a solvent in the step described later. Further, the use of the positive type photosensitive dry film is superior to the negative type in the removability of the patterned solid layer 26 to be dissolved and removed in the step described later, and the cross-sectional shape is formed closer to a rectangle. Therefore, it is preferable. In addition to the photolithography means, the patterned solid layer 26 can be provided in an appropriate thickness by a printing means such as screen printing or intaglio printing using an intaglio prepared by etching a metal substrate (for example, NiCu). Examples of the material of the solid layer that can be used for this printing means include water-soluble polyvinyl alcohol-based resin, solvent-soluble vinyl chloride-based, vinyl acetate-based, vinyl chloride-vinyl acetate copolymer-based, and styrene-based resins. ..

Next, the substrate 21 is formed by transfer molding.
Of the structural member 2 on the element surface 21a on which the solid layer 26 of
9 (FIG. 3) is fused at the same time as molding. The mold used for this transfer molding is composed of a first mold 27 and a second mold 28, as shown in FIG. The first mold 27 has
A recess having a depth equivalent to the thickness of the substrate 21 for inserting and fixing the substrate 21 is formed. When the substrate 21 is inserted into this recess, the element surface 21a of the substrate 21 is a parting surface. It is configured to be flush with.

On the other hand, the second mold 28 has discharge ports 29a,
Structural member 29 constituting the liquid flow path 29b and the liquid chamber 29c
A cavity portion 28a for molding (FIG. 3) is formed, and a part of the inner wall of the cavity portion 28a is
At the time of mold clamping, the solid layer 26 comes into contact with the three ejection port-equivalent surfaces 26a, which are the surfaces corresponding to the ejection ports 29a. Further, the second mold 28 is provided with a hollow portion serving as a liquid chamber 29c and a protrusion portion 28b for forming a supply port for supplying ink to the liquid chamber from the outside in the structural member 29 inside the cavity portion 28a. Therefore, the tip end surface of the protruding portion 28b abuts the illustrated upper surface of the liquid chamber part corresponding portion 26c corresponding to a part of the liquid chamber 29c of the solid layer 26 during mold clamping. Further, a part of the element surface 21a of the substrate 21 including the electrical connection portion 22b of each electrode 22 is configured to protrude from the cavity portion 28a to the parting surface side of the second die 28 during mold clamping.

The mold opening direction of the first mold 27 and the second mold 28 is perpendicular to the element surface 21a of the substrate 21. Transfer molding is performed by clamping the mold and injecting the molding material into the cavity 28a through a pot and a runner (not shown). When molding the structural member 29, the surface 26a corresponding to each discharge port of the solid layer 26 that contacts the inner wall of the cavity 28a of the second mold 28 and the part 26c corresponding to part of the liquid chamber that contacts the tip surface of the protrusion 28b.
Is slightly melted by the heat at the time of molding and the cavity 28a
It prevents the molding material from entering by closely contacting the inner wall and the tip surface of the protrusion 28b. Further, a flexible member such as silicon rubber may be attached to the tip end surface of the protruding portion 28b.

By carrying out the transfer molding as described above, as shown in FIGS. 5A and 5B, the structural member 29 is simultaneously formed on the element surface 21a of the substrate 21 on which the solid layer 26 is formed. It will be fused. The structural member 29 exposes the electrical connection portion 22b of each electrode 22, and the portion 2 of the surface of the solid layer 26 corresponding to a part of the liquid chamber.
The surface of the second mold 28 of 6c which is in contact with the protruding portion 28b and the surface 26a corresponding to the ejection port are exposed, and the other surfaces are covered.

In the transfer molding, a thermosetting epoxy resin is used as the material of the structural member 29, and the resin preheating temperature 6
It can be performed according to general molding conditions of 0 to 90 ° C., injection pressure of 20 to 140 kgf / cm ² , mold temperature of 100 to 180 ° C., curing time of 1 to 10 minutes, and post cure after molding. As the other material of the structural member 29, as described above, a liquid or a solid that becomes a liquid at the time of molding and a material such as room temperature curing, heat curing, and ultraviolet curing can be used. For example, epoxy resin, Examples thereof include acrylic resin, diglycol dialkyl carbonate resin, unsaturated polyester resin, polyurethane resin, polyimide resin, melamine resin, phenol resin, urea resin and the like. In this case, the shear adhesive force between the synthetic resin forming the structural member 3 and the substrate 1 is larger than the stress generated due to the difference between the thermal expansion coefficient of the synthetic resin and the thermal expansion coefficient of the substrate 1. The material of the structural member 29 is selected so as to satisfy at least one of the conditions that it is larger than the stress generated in the synthetic resin at the time of molding 3. In order to satisfy at least one of these two conditions, for example,
A plasticizer is added to the synthetic resin forming the structural member 29, a pigment is added to the synthetic resin forming the structural member 29, both a plasticizer and a pigment are added to the synthetic resin, and the surface of the element surface 21a of the substrate 21 is Surface treatment with a silane coupling agent and addition of both a plasticizer and a pigment to the synthetic resin may be performed.

Next, the solid layer 26 is removed from the substrate 21 on which the structural member 29 is fused at the same time as molding. As a means for removing the solid layer 26, an optimum means is selected according to the material forming the solid layer 26, but generally, the solid layer 2
6 in a solution of a solvent that dissolves, swells, and peels 6
A means for immersing and removing the fused substrate 21 at the same time as molding is used. At this time, if necessary, a means for promoting removal of ultrasonic treatment, spraying, heating, stirring, etc. may be added. When a positive photosensitive resin is used for the solid layer 26, a solvent used for the removal may be an aqueous solution containing ketones such as acetone, ester, alcohol, and alkali. In FIG. 5C, the solid layer 2 is formed from the substrate 21 on which the structural member 29 is fused at the same time as molding.
6 shows that 6 was removed. A space is formed inside the structural member 29 after the solid layer 26 is removed, and the space has three discharge ports 29a, three liquid flow paths 29b, and a liquid chamber 29.
c and the supply port 29d.

As described above, the ink jet recording head shown in FIG. 3 can be manufactured. Element surface 21
The alignment of each liquid flow path 29b with respect to the heat generating portion 22 of each electrothermal converter provided in a is performed by the solid layer 2 on the element surface 21a.
Since it is performed when forming 6, the fine energy generating means of the first substrate and the fine liquid flow path of the second substrate, which are found in the conventional method, are precisely aligned and bonded. No need for complicated and expensive equipment.

In the step of providing the structural member 29 for forming each discharge port 29a, each liquid flow path 29b and the liquid chamber 29c, the structural member 29 is formed on the element surface 21a on which the solid layer 26 is formed by transfer molding. Since it is fused at the same time, it is possible to apply the curable material mixed with the curing agent found in the conventional method and leave it for a long time, or apply the active energy ray curable material and irradiate the active energy ray. It is simple and time-consuming as compared with the complicated and labor-intensive process of providing a structural member. Further, when the structural member 29 is formed, the supply port 29d can be formed at the same time. Further, the volume of the liquid chamber 29c is the solid layer 26
It is possible to freely form a large size without being limited by the thickness.

Next, another embodiment of the method of manufacturing the ink jet recording head of the present invention will be described. In this embodiment, the ink jet recording head shown in FIG.
This is an example of individual production (so-called two-cavity production), in which two inkjet recording heads are arranged in a positional relationship in which ejection ports face each other.
It is intended to obtain two inkjet recording heads by forming them in a batch and cutting them at the central portion. 6A to 6D are views for explaining this manufacturing method.

As shown in FIG. 6A, the heat generating portion 42a, the electrode 42, and the common electrode 40 are formed on the element surface 41a of the substrate 41 by the amount corresponding to two ink jet recording heads. In this case, the heat generating parts 42a are arranged symmetrically with respect to the cutting position (the ejection port forming position 50 shown in the figure) in the subsequent cutting step. By doing so, the corresponding liquid flow paths of the two ink jet recording heads are connected in a straight line, which is convenient. Next, as shown in FIG. 6B, the solid layer 46 is laminated on the portion that will be the liquid flow path and the portion that will be the lower end of the liquid chamber. Since the heat generating portions 42a are arranged symmetrically with respect to the discharge port forming position 50, a portion which is to be the lower end portion of one liquid chamber, that is, the liquid chamber portion corresponding portion 46c to the other liquid chamber portion corresponding portion 4 is formed.
Toward 6c, the portion that will be the liquid flow path, that is, the liquid flow path equivalent portion 46b is provided continuously in a straight line.

Next, as in the above-described embodiment, the structural members 49 corresponding to the two ink jet recording heads are formed integrally by transfer molding. The synthetic resin forming the structural member 49 is the same as the synthetic resin forming the structural member 29 in the above-described embodiment. After that, a plane including the ejection port forming position 50 and perpendicular to the substrate 41 is cut as a cutting plane. As a result, the portions that are to be the liquid flow paths of both ink jet recording heads are continuous in a straight line, so that ejection ports appear on this cut surface and two ink jet recording heads are formed. It will be. After that, the cut surface is polished,
By removing the solid layer 46, two inkjet recording heads similar to those described above are obtained.

Next, the mold used in the above transfer molding will be described. FIG. 6C is a cross-sectional view showing a state in which the substrate 41 in which the formation of the solid layer 46 is completed is mounted on this mold. The first die (lower die) 47 is provided with a recess having the same shape as the substrate 41, and the substrate 41 fits in this recess. The second die (upper die) 48 is provided with a cavity portion 48a corresponding to the concave portion of the first die 47, as in the above-described embodiment. Two protrusions 48b are provided in the cavity 48a corresponding to the liquid chambers of the two inkjet recording heads.
The tip of the protruding portion 48b comes into contact with the portion 46c corresponding to a portion of the liquid chamber, as in the above-described embodiment,
In this state, the molding material is injected into the cavity portion 48a through a pot and runner (not shown) and cured to
The structural member 49 having a structure in which the individual ink jet recording heads are integrated can be collectively formed on the substrate 41.

In this embodiment, there is an advantage that two recording heads can be obtained at the same time with almost the same trouble as in the above-mentioned embodiments. Furthermore, the molds in this embodiment are connected in the lateral direction (that is, the direction in which the straight line including the ejection port forming position 50 extends), and a plurality of sets facing each other are arranged side by side. It is also possible to manufacture the inkjet recording head.

FIG. 7 is a partial cross-sectional view of another embodiment of the ink jet recording head of the present invention in the ejection direction.

In this ink jet recording head, a substrate 61 made of a silicon wafer and, for example, a heating element as a plurality of energy generators 66 provided on the substrate 61,
Groove top plate 62, a plurality of springs 63 that press the grooved top plate 62 against the substrate 61, and a support portion 6 that supports the bias of the springs 63.
7 and. In this example, the grooved top plate 62 is entirely made of a rubber-like elastic body, and the grooves 64 of the grooved top plate 62 are made slightly narrower than the pitch of the arrangement of the energy generators. When mounted on the substrate 61, the grooved top plate 6 is adjusted so that the grooves 64 match the pitch of the array of energy generators.
Extend 2 and fix. The amount of this stretching is set larger than the change in the coefficient of thermal expansion of the rubber-like elastic body used at 50 ° C. The grooved top plate 62 is
The both sides are fixed by fitting so that both sides of the substrate 61 are held, thereby ensuring the alignment and the prevention of displacement. Further, the grooved top plate 62 is pressed against the substrate 61 by the spring 63, and the protruding portion of the rubber-like elastic body forming the groove 64 is biased and closely adhered to the substrate 61 so that the groove has a sealing effect. Mixed flow between the ink flow paths formed by 64, so-called crosstalk, is completely prevented. The tensile stress of the rubber-like elastic body is preferably 10 to 450 kgf / cm ² in terms of tensile stress specified in JIS K6301.

FIG. 8 is a partial cross-sectional view of the ink jet recording head of the present invention with respect to the ejection direction of another embodiment.

This ink jet recording head comprises a substrate 7
1, a hard channel wall 75 provided on the substrate 71, a groove 74 formed between adjacent channel walls 75, and a channel wall 75.
Has an orifice plate 72 disposed on its free end and an energy generator 76 arranged at the bottom of the groove 74. The orifice plate 72 is made of a rubber-like elastic material, and is bonded onto the free end of the flow path wall 75 without applying tension. In this way, the orifice plate 72
Is a rubber-like elastic body, the orifice plate 72 expands and contracts in accordance with the expansion and contraction of the flow path wall 75 even if there is a temperature change, so that no peeling or warpage of members occurs in the structure of the groove 74. The tensile stress of the rubber-like elastic material is preferably within the same numerical range as described above.

In these embodiments, since at least the wall surface of the ink flow path wall and the orifice plate facing the substrate is a rubber-like elastic body, stress due to thermal expansion does not occur and the following main effects are obtained.

That is, even in an ink jet recording head provided with a plurality of, in particular, a large number of energy generators, the occurrence of peeling, warpage, etc. is eliminated, and printing inconveniences such as ejection failure and ejection deviation are largely eliminated.

Further, by using a rubber-like elastic body for at least the wall surface of the ink flow path wall and the orifice plate facing the substrate, the ink flow path wall and the orifice plate also expand and contract in response to the change due to the heat of the substrate. It is possible to prevent the positional deviation between the energy generator and the ejection port or the ink flow path.

Example 1 (Example in which a plasticizer was added to the synthetic resin constituting the structural member 3 to reduce the stress generated in the synthetic resin) Polyether polyol was used as the synthetic resin constituting the structural member 3. .. 20 parts of polyisocyanate was added as a plasticizer to 80 parts of the polyether polyol and transfer molding was carried out to manufacture an inkjet head according to the above-mentioned manufacturing method. It was confirmed that the structural member 3 of this head is a rubber-like material having a Young's modulus of 400 g / mm ² , and that this head satisfies the features of the present invention regarding the shear adhesive force.

When ink was actually ejected using this head, better results could be obtained as compared with the conventional case.

Example 2 (Example in which a pigment is added to the synthetic resin constituting the structural member 3 so that the synthetic resin is less likely to undergo thermal shrinkage) As the synthetic resin constituting the structural member 3, "Epicoat 828" (trade name) , Shell Chemical Co., Ltd., liquid and solventless epoxy resin at room temperature) and "Epicoat 1001" (trade name, Shell Chemical Co., solid epoxy resin at room temperature) and "ADEKA HARDNER" (trade name, Asahi Denka Co., Ltd.) And a polyamide resin) were mixed at a ratio described below. Ultrafine barium sulfate "BF-1" (trade name, manufactured by Sakai Denka Co., Ltd.) was added as an inorganic pigment to the mixture at a ratio described below to perform transfer molding, and the inkjet head was manufactured according to the manufacturing method described above. Was manufactured. "Epicoat 828": 25 copies "Epicoat 1001": 5 copies "Adeka Hardener": 10 copies "BF-1": 60 copies

The structural member 3 of this head has the following values. Curing shrinkage rate: 1.25% Linear expansion coefficient: 6.5 × 10 ⁻⁵ / ° C. Elastic modulus: 330 kg / mm ²

From this, it was confirmed that this head satisfies the features of the present invention regarding the shear adhesive strength.

When ink was actually ejected using this head, better results could be obtained as compared with the conventional case.

Example 3 (Example in which both a plasticizer and a pigment were added to the synthetic resin constituting the structural member 3 to reduce the stress generated in the synthetic resin and to prevent the synthetic resin from easily shrinking by heat) Polyether polyol was used as the synthetic resin constituting the structural member 3. 15 parts of polyisocyanate as a plasticizer and 40 parts of carbon black manufactured by Degusa Co. as an inorganic pigment were added to 45 parts of the polyether polyol, and transfer molding was carried out to manufacture an inkjet head according to the manufacturing method described above. The structural member 3 of this head is a rubber-like material having a Young's modulus of 1000 g / mm ^{2 and} a linear expansion coefficient of 4.5 × 10 ⁻⁵ / ° C., and this head satisfies the characteristic feature of the present invention regarding shear adhesive strength. It was confirmed that there is.

When ink was actually ejected using this head, better results could be obtained as compared with the conventional case.

Example 4 (The element surface 1a of the substrate 1 was surface-treated with a silane coupling agent, and both the plasticizer and the pigment were added to the synthetic resin constituting the structural member 3 to improve the shear adhesive strength itself. In addition, the stress generated in the synthetic resin is reduced and the thermal contraction of the synthetic resin is made difficult. Example) The element surface 1a of the substrate 1 is surface-treated with the following treatment agent to form a thin film of the treatment agent of about 1 μm. Example 1 described above except that a step of forming
An inkjet head was manufactured in the same manner as in. "ESREC" (trade name, Sekisui Chemical Co., butyral resin): 20 parts Polyisocyanate: 1 part Solvent consisting of alcohol and xylene: 78 parts Silane coupling agent: 1 part This head is also a book on shear adhesive strength It was confirmed that the features of the invention were satisfied.

When ink was actually ejected using this head, better results could be obtained as compared with the conventional case.

FIG. 9 is an external perspective view showing an example of an ink jet recording apparatus (IJRA) in which the recording head obtained by the present invention is mounted as an ink jet head cartridge (IJC).

In FIG. 9, an ink jet head cartridge (IJC) 120 is provided with ejection port groups for ejecting ink in opposition to the recording surface of the recording paper fed onto the platen 124. The carriage HC 116 holding the IJC 120 is connected to a part of the drive belt 118 that transmits the driving force of the drive motor 117, and 12 guide shafts 119A and 119 arranged in parallel with each other.
By being slidable with respect to B, the reciprocating movement of the recording paper of the JIS 120 can be carried out over the entire width.

The head recovery device 126 is arranged at one end of the movement path of the IJC 120, for example, at a position facing the home position. Motor 122 via transmission mechanism 123
The head recovery device 126 is operated by the driving force of (1) to cap the IJC 120. IJC by the capping unit 126A of the head recovery device 126
In association with the capping to 120, ink is sucked by an appropriate suction means provided in the head recovery device 126 or ink is pressure-fed by an appropriate pressure means provided in the ink supply path to the IJC 120, and the ink is discharged from the ejection port. Ejection recovery processing such as removing the thickened ink in the ejection port by forcibly ejecting is performed. Also, the IJC 120 is protected by capping at the end of recording or the like.

The blade 131 is a wiping member disposed on the side surface of the head recovery device 126 and made of silicon rubber. The blade 131 is a blade holding member 131
Head recovery device 1 held in A in cantilever form
Similar to 26, the motor 122 and the transmission mechanism 123 operate to enable engagement with the ejection surface of the IJC 120. As a result, the blade 131 is projected into the movement path of the JIC 120 at an appropriate timing in the recording operation of the IJC 120 or after the ejection recovery process using the head recovery device 126, and the ejection surface of the JIC 120 is moved along with the movement operation of the JIC 120. It wipes off condensation, wetness, dust, etc.

The present invention brings excellent effects particularly in a recording head and a recording apparatus of the ink jet recording system which ejects ink by utilizing thermal energy.

With regard to its typical structure and principle, see, for example, US Pat. No. 4,723,129 and US Pat.
What is done using the basic principles disclosed in 740,796 is preferred. This method can be applied to both the so-called on-demand type and the continuous type. In particular, in the case of the on-demand type, it is arranged corresponding to the sheet or liquid path holding the liquid (ink). A thermal energy is generated in the electrothermal converter by applying at least one drive signal to the electrothermal converter, which corresponds to the recorded information and causes a rapid temperature rise exceeding nucleate boiling, to thereby generate a recording head. It is effective because the film is boiled on the heat-acting surface, and as a result, bubbles can be formed in the liquid (ink) in a one-to-one correspondence with this drive signal. Liquid (ink) is ejected through the ejection openings by the growth and contraction of the bubbles to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the liquid (ink) with excellent responsiveness can be achieved. As this pulse-shaped drive signal, U.S. Pat. No. 4,463,359 is used.
Nos. 4,345,262 are suitable. It should be noted that U.S. Pat. No. 4,313,12 of the invention relating to the rate of temperature rise of the above-mentioned heat acting surface.
If the conditions described in the specification No. 4 are adopted, more excellent recording can be performed.

As the constitution of the recording head, in addition to the combination constitution of the ejection port, the liquid passage, and the electrothermal converter (the linear liquid passage or the right-angled liquid passage) as disclosed in the above-mentioned respective specifications, The present invention also includes configurations using US Pat. No. 4,558,333 and US Pat. No. 4,459,600, which disclose configurations in which a heat acting portion is arranged in a bending region. Is. In addition, Japanese Laid-Open Patent Publication No. 123670/1984 discloses a configuration in which a common slit is used as a discharge portion of the electrothermal converter for a plurality of electrothermal converters, and an opening for absorbing a pressure wave of thermal energy is provided. The present invention is also effective as a configuration based on JP-A-59-138461, which discloses a configuration corresponding to the ejection portion.

Further, as a full-line type recording head having a length corresponding to the width of the maximum recording medium which can be recorded by the recording device, a combination of a plurality of recording heads as disclosed in the above-mentioned specification is used. The present invention can exert the above-mentioned effects more effectively, although it may have a configuration satisfying the length or a configuration as one recording head integrally formed.

In addition, by being attached to the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means for the recording head, preliminary auxiliary means, etc., which are provided as a constitution of the recording apparatus of the present invention, because the effects of the present invention can be further stabilized. .. Specific examples thereof include capping means, cleaning means, pressurizing or sucking means, an electrothermal converter or a heating element other than this, or a preheating means for the recording head, and recording for the recording head. It is also effective to perform a preliminary ejection mode in which another ejection is performed for stable recording.

Further, the recording mode of the recording apparatus is not limited to the recording mode only for the mainstream color such as black, but the recording head may be integrally formed or a plurality of combinations may be used. The present invention is also extremely effective for a device provided with at least one of full color by color mixing.

In the embodiments of the present invention described above, the ink is described as a liquid, but it is an ink that solidifies at room temperature or below, and is softened or liquid at room temperature, or the ink itself is 30 Generally, the temperature is controlled in the range of ℃ to 70 ℃ to control the temperature of the ink so that the viscosity of the ink is within the stable ejection range. Good. In addition, the temperature rise due to thermal energy is positively prevented by using it as the energy for the state change of the ink from the solid state to the liquid state, or
By using ink that solidifies when left standing for the purpose of preventing evaporation of the ink, the ink is liquefied by applying heat energy according to the recording signal and reaches the recording medium or the one that is ejected as an ink liquid. The use of inks that have the property of only liquefying by thermal energy, such as those that have already begun to solidify at this point, is also applicable to the present invention. In such a case, the ink is disclosed in JP-A-54-56.
No. 847 or Japanese Patent Application Laid-Open No. 60-71260, such that it faces the electrothermal converter while being held as a liquid or solid in the recesses or through holes of the porous sheet. May be In the present invention, the most effective ones for the above inks are
The film boiling method described above is executed.

[0074]

As described above, in the ink jet recording head of the present invention, the shear adhesive force between the resin member in which the ejection port and the ink flow path are formed and the substrate is determined by the coefficient of thermal expansion of the resin member and the heat of the substrate. At the time of manufacturing an inkjet recording head, by satisfying at least one of a stress larger than the stress generated due to the difference with the expansion coefficient and a stress larger than the stress generated in the resin member during molding. The synthetic resin can be prevented from peeling off or floating from the substrate due to the temperature difference at the time, and a large liquid chamber and a highly reliable inkjet recording head can be obtained.

Further, according to the method of manufacturing an ink jet recording head of the present invention, a solid layer made of a removable material is formed on a portion of an ink flow path on a substrate, and the resin member is covered by transfer molding to cover the solid layer. By forming the ink flow path by removing the solid layer after that,
The ink flow path can be positioned with high accuracy with respect to the substrate in a small number of steps, mass production is possible, and an inkjet recording head having high reliability can be manufactured at low cost.

[Brief description of drawings]

FIG. 1 is a fragmentary perspective view showing the configuration of an inkjet recording head according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for measuring shear adhesive force.

FIG. 3 is a perspective view showing the configuration of another inkjet recording head according to the present invention.

4A and 4B are diagrams illustrating a method of manufacturing an inkjet recording head according to an embodiment of the present invention, in which FIG. 4A is a schematic perspective view showing a substrate, FIG. 4B is a schematic perspective view showing a solid layer, and FIG. )
FIG. 4 is a cross-sectional view of a main part of a mold used for molding a structural member.

5A and 5B are diagrams illustrating a method of manufacturing an inkjet recording head according to an embodiment of the present invention, in which FIG. 5A is a schematic plan view showing a structural member after release, and FIG. -A sectional view, (c) is an AA sectional view after removing the solid layer.

6A and 6B are diagrams illustrating another embodiment of the method for manufacturing an inkjet recording head of the present invention, in which FIG. 6A is a schematic perspective view showing a substrate, and FIG. 6B is a schematic perspective view showing a solid layer;
(C) is a cross-sectional view of a main part of a mold used for molding a structural member,
(D) is a schematic cross-sectional view showing the structural member after release.

FIG. 7 is a partial cross-sectional view of another embodiment of the inkjet recording head of the present invention with respect to the ejection direction.

FIG. 8 is a partial cross-sectional view in the ejection direction of still another embodiment of the inkjet recording head of the present invention.

FIG. 9 is an external perspective view showing an example of an inkjet recording apparatus in which the inkjet recording head according to the present invention is mounted as an inkjet cartridge.

[Explanation of symbols]

 1, 21, 41 Substrate 1a, 21a, 41a Element surface 2, 22, 42 Electrode 2a, 22a, 42a Electrothermal converter 3, 29, 49 Structural member 3a, 29a Discharge port 3b, 29b Liquid flow path 3c, 29c Liquid Chamber 3d, 29d Supply port 26, 46 Solid layer 26a Surface equivalent to discharge port 26b, 46b Liquid flow path equivalent part 26c, 46c Liquid chamber partial equivalent part 27, 47 First mold 28, 48 Second mold 28a, 48a Cavity 28b, 48b Projection 30, 40 Common electrode 50 Discharge port forming position

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Masatsune Kobayashi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Ryuichi Arai 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Within the corporation

Claims (20)

[Claims] 1. An ink flow path communicating with an ejection port for ejecting ink, and an energy generating unit arranged along the ink flow channel for generating energy used for ejecting ink from the ejection port. In an inkjet recording head comprising: a substrate on which the energy generating means is arranged; and a resin member provided with a recess for forming the ink flow path,
The ink flow path is formed by adhering the recesses inside to each other, and the shear adhesive force between the resin member and the substrate is the difference between the thermal expansion coefficient of the resin member and the thermal expansion coefficient of the substrate. An ink jet recording head characterized by having a stress larger than that generated due to. 2. The ink jet recording head according to claim 1, wherein the energy generating means is an electrothermal converter that generates thermal energy as the energy. 3. The ink jet recording head according to claim 1, wherein the ejection port is a full-line type in which the ejection port is provided over the entire width of the recording area of the recording medium. 4. The ink jet recording head according to claim 1, wherein the ink ejection port is arranged so as to face the recording surface of the recording medium, and a member for mounting the head. Inkjet recording device. 5. An ink flow path communicating with an ejection port for ejecting ink, and an energy generating unit arranged along the ink flow channel for generating energy used for ejecting ink from the ejection port. In an inkjet recording head comprising: a substrate on which the energy generating means is arranged; and a resin member provided with a recess for forming the ink flow path,
The ink flow paths are formed by adhering the recesses to each other inside, and the shear adhesive force between the resin member and the substrate is larger than the stress generated in the resin member when the resin member is molded. An inkjet recording head characterized by the above. 6. The ink jet recording head according to claim 5, wherein the energy generating means is an electrothermal converter that generates thermal energy as the energy. 7. The ink jet recording head according to claim 5, wherein the ejection port is a full line type which is provided over the entire width of a region of the recording medium on which recording is performed. 8. The inkjet recording head according to claim 5, wherein the ink ejection port is arranged so as to face the recording surface of the recording medium, and a member for mounting the head. Inkjet recording device. 9. A portion to be an ink flow path on a substrate,
A step of providing a solid layer made of a removable material, and transfer molding a resin having a shear adhesive force to the substrate larger than a stress generated due to a difference in coefficient of thermal expansion from the substrate, thereby forming the solid layer A method for manufacturing an inkjet recording head, comprising: a step of providing the solid layer on a substrate provided with the step of removing the solid layer; and a step of forming the ink flow path by removing the solid layer. 10. A step of providing a solid layer made of a removable material on a portion of the substrate, which is to be an ink flow channel, and a shear adhesive force to the substrate is higher than a stress generated during the transfer molding by the transfer molding. A larger resin is provided on the substrate on which the solid layer is provided so as to cover the solid layer, and a step of removing the solid layer to form the ink flow path. Method for manufacturing an ink jet recording head. 11. A substrate provided with a plurality of energy generators that generate energy used for ejecting ink from the ejection ports, and communicates with the ejection ports corresponding to the respective energy generators. In an inkjet recording head provided with an ink flow path wall for arranging an ink flow path, at least a wall surface of the ink flow path wall facing the substrate is formed by using a rubber-like elastic body. Inkjet recording head. 12. The tensile stress of the rubber-like elastic body is JISK.
10-450 kgf with tensile stress specified in 6301
The ink jet recording head according to claim 11, which is / cm ² . 13. The ink jet recording head according to claim 11, wherein the energy generator is an electrothermal converter that generates heat energy as the energy. 14. The ink jet recording head according to claim 11, which is of a full line type in which a plurality of ejection openings are provided over the entire width of the recording area of the recording medium. 15. An ink jet recording apparatus comprising at least an ink jet recording head according to claim 11, wherein an ejection port is provided facing a recording surface of a recording medium, and a member for mounting the head. 16. A substrate provided with a plurality of energy generators that generate energy used for ejecting ink from the ejection ports, and communicates with the ejection ports corresponding to the respective energy generation units. An ink jet recording head in which an ink flow path wall is provided for arranging an ink flow path, and an orifice plate provided with the ejection port is provided on the ink flow path wall, at least the substrate of the orifice plate An ink jet recording head, characterized in that a wall surface opposed to is formed by using a rubber-like elastic body. 17. The tensile stress of the rubber-like elastic body is JISK.
10-450 kgf with tensile stress specified in 6301
The ink jet recording head according to claim 16, wherein the ink jet recording head has a density of / cm ² . 18. The ink jet recording head according to claim 16, wherein the energy generator is an electrothermal converter that generates heat energy as the energy. 19. The inkjet recording head according to claim 16, wherein the inkjet recording head is a full line type in which a plurality of ejection openings are provided over the entire width of the recording area of the recording medium. 20. An ink jet recording apparatus comprising at least an ink jet recording head according to claim 16, wherein an ejection port is provided facing a recording surface of a recording medium, and a member for mounting the head.