JPH05177854A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH05177854A JPH05177854A JP33605191A JP33605191A JPH05177854A JP H05177854 A JPH05177854 A JP H05177854A JP 33605191 A JP33605191 A JP 33605191A JP 33605191 A JP33605191 A JP 33605191A JP H05177854 A JPH05177854 A JP H05177854A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- height
- thermal head
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、感熱記録あるいは熱転
写記録に使用されるサーマルヘッドに係り、特に、券売
機、プリペードカード、バーコードプリンタ等に用いる
場合に好適なサーマルヘッドに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used for thermal recording or thermal transfer recording, and more particularly to a thermal head suitable for use in ticket vending machines, prepaid cards, bar code printers and the like.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】事務
用機器や通信用機器等に使用される従来のサーマルヘッ
ドのうち、平面ヘッドは、図３（Ａ）の側面図に示すよ
うに、発熱体列および発熱体駆動用ＩＣ２を表面に設け
たアルミナ等からなる基板３と、前記ＩＣ２と外部回路
とを接続するための印刷配線基板４とを、アルミニウム
板等でなるヒートシンク５上に固着し、ＩＣ２保護用の
カバー６をヒートシンク５上に固定した構造を有してい
た。しかし、この平面型のサーマルヘッドにおいては、
カード７等の硬いものに印刷する場合、カバー６にカー
ド７等がつかえて印刷や送りに支障を来たすことがある
という問題点があった。2. Description of the Related Art Among conventional thermal heads used in office equipment, communication equipment, etc., a flat head is a type of heat generating device as shown in the side view of FIG. A substrate 3 made of alumina or the like having a body row and a heating element driving IC 2 provided on the surface thereof, and a printed wiring board 4 for connecting the IC 2 and an external circuit are fixed on a heat sink 5 made of an aluminum plate or the like. The cover 6 for protecting the IC 2 is fixed on the heat sink 5. However, in this flat type thermal head,
When printing on a hard material such as the card 7, there is a problem that the card 7 or the like may be caught on the cover 6 and may interfere with printing or feeding.
【０００３】このような問題点は、図３（Ｂ）に示すよ
うに、ヒートシンク５の端面に発熱体用の基板３を固定
する構造のサーマルヘッドにおいても同様に起きる。す
なわち、図３（Ｂ）の構造のものにおいても、基板３上
の配線端部とＩＣ２を搭載したフィルムキャリア８との
接続部９（１０はその接続部を固定する接着剤と保護膜
を示す）を保護するため、カバー６の端部を延び出させ
て基板３の端面まで覆う構造とする必要がある。そのた
め、やはりカバー６がヒートシンク５の端面より基板３
の高さより高く突出し、カード７等の送りの邪魔になる
という問題が起きる。なお、図中、１１はコネクタであ
る。Such a problem also occurs in a thermal head having a structure in which the substrate 3 for the heating element is fixed to the end surface of the heat sink 5, as shown in FIG. 3 (B). That is, also in the structure of FIG. 3B, the connection portion 9 (10 indicates the adhesive and the protective film for fixing the connection portion) between the wiring end portion on the substrate 3 and the film carrier 8 on which the IC 2 is mounted. ), It is necessary to extend the end of the cover 6 to cover the end face of the substrate 3. Therefore, the cover 6 is still closer to the substrate 3 than the end surface of the heat sink 5.
There is a problem that it protrudes higher than the height of the card and interferes with the feeding of the card 7 or the like. In the figure, 11 is a connector.
【０００４】そこで硬いものに印刷可能なサーマルヘッ
ドとして、図３（Ｃ）の側面図に示す曲面型端面ヘッド
が用いられて来た。この端面ヘッドは、アルミナ等でな
る基板１２の端面を弧状面に形成してその頂部に発熱体
列を形成してなるものである。Therefore, a curved end face head shown in the side view of FIG. 3 (C) has been used as a thermal head capable of printing on a hard material. This end face head is formed by forming an end face of a substrate 12 made of alumina or the like into an arc face and forming a heating element array on the top thereof.
【０００５】しかし、この端面ヘッドにおいては、基板
１２の端面を弧状面に加工してその上に発熱体列を形成
する構造であるため、基板１２の作製を個別に行わなけ
ればならず、そのため生産性が悪く、また、発熱体列か
らヒートシンク５に至る伝熱経路１３が基板１２の幅方
向となるので、伝熱断面積が狭く、かつ伝熱経路が長く
なり、放熱性が悪いという問題点があった。However, in this end face head, since the end face of the substrate 12 is processed into an arcuate face and the heating element array is formed on the end face, the substrate 12 must be manufactured individually. The productivity is poor, and the heat transfer path 13 from the heating element array to the heat sink 5 is in the width direction of the substrate 12. Therefore, the heat transfer cross section is narrow and the heat transfer path is long, resulting in poor heat dissipation. There was a point.
【０００６】本発明は、上記の問題点に鑑み、カード等
の硬いものでも円滑に印刷でき、かつ生産性、放熱性の
面でも優れたサーマルヘッドを提供することを目的とす
る。In view of the above problems, it is an object of the present invention to provide a thermal head capable of smoothly printing even a hard material such as a card and having excellent productivity and heat dissipation.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記目的を達
成するため、ヒートシンクの表面または端面に発熱体形
成基板を固定したサーマルヘッドにおいて、前記発熱体
形成基板に凸状部を設けて該凸状部の頂部に発熱体列を
形成すると共に、該凸状部の高さを駆動回路部の実装部
の高さ以上に設定したことを特徴とする。In order to achieve the above-mentioned object, the present invention provides a thermal head in which a heating element forming substrate is fixed to a surface or an end surface of a heat sink, wherein the heating element forming substrate is provided with a convex portion. The heating element row is formed on the top of the convex portion, and the height of the convex portion is set to be equal to or higher than the height of the mounting portion of the drive circuit unit.
【０００８】[0008]
【作用】本発明は、上記構成を有するので、発熱体駆動
用ＩＣ等を保護する前記カバー等がカード等の硬い被印
刷物の送りを妨げない。Since the present invention has the above-mentioned structure, the cover or the like for protecting the heating element driving IC does not prevent the feeding of a hard printed material such as a card.
【０００９】[0009]
【実施例】図１（Ａ）は本発明によるサーマルヘッドの
一実施例を示す側面図、同（Ｂ）はその発熱体形成基板
を示す斜視図である。図１（Ａ）、（Ｂ）において、図
３と同じ符号は等価機能を発揮する部品または部分を示
す。１５は前記ヒートシンク５上に接着により、あるい
はビスもしくはリベット等の適宜の固定具を用いて取付
けられた発熱体形成基板である。該発熱体形成基板１５
としては、アルミナ等のセラミック板あるいは金属板に
絶縁膜を施したものが用いられる。該基板１５はその長
手方向に凸状部１５ａが形成されており、凸状部１５ａ
の頂部に発熱体列が蒸着等の膜形成技術により形成され
ている。図１（Ｃ）に示すように、該発熱体列１は基板
１５上に形成されたグレーズ層２０、その上に形成され
た発熱抵抗体層２１、その上に線状に多数形成された電
極２２および保護層２３とからなる。1A is a side view showing an embodiment of a thermal head according to the present invention, and FIG. 1B is a perspective view showing a heating element forming substrate thereof. 1 (A) and 1 (B), the same reference numerals as those in FIG. 3 indicate parts or portions exhibiting equivalent functions. Reference numeral 15 is a heating element forming substrate mounted on the heat sink 5 by adhesion or by using an appropriate fixing tool such as a screw or a rivet. The heating element forming substrate 15
As the material, a ceramic plate made of alumina or the like or a metal plate provided with an insulating film is used. The substrate 15 has a convex portion 15a formed in the longitudinal direction thereof.
A heating element row is formed on the top of the substrate by a film forming technique such as vapor deposition. As shown in FIG. 1C, the heating element array 1 includes a glaze layer 20 formed on a substrate 15, a heating resistor layer 21 formed thereon, and a large number of linear electrodes formed thereon. 22 and a protective layer 23.
【００１０】前記凸状部１５ａの発熱体列１を含めた頂
部のヒートシンク５の表面からの高さＨ1（図１（Ａ）
参照）は駆動回路部の実装部（本実施例においてはカバ
ー６）の高さＨ2以上に設定される。具体的な数値例を
述べると、基板１５の厚みは約１mm程度、凸状部１５ａ
の基板１５の表面からの高さＨ3を０．８mm以上とし、
カバー６の高さＨ2をそれ以下に設定した。The height H 1 from the surface of the heat sink 5 at the top including the heating element array 1 of the convex portion 15a (FIG. 1 (A))
(See) is set to a height H 2 or more of the mounting portion (the cover 6 in this embodiment) of the drive circuit portion. To give a specific numerical example, the thickness of the substrate 15 is about 1 mm, and the convex portion 15a
The height H 3 from the surface of the substrate 15 of 0.8 mm or more,
The height H 2 of the cover 6 is set to be less than that.
【００１１】このように、基板１５に凸状部１５ａを設
けてその頂部の発熱体列１の高さを駆動回路部の実装部
の高さ以上に設定すれば、駆動回路部の実装部がカード
７のような硬い被印刷物の送りの障害となることはな
く、硬いものでも印刷できる。As described above, when the convex portion 15a is provided on the substrate 15 and the height of the heating element array 1 on the top is set to be equal to or higher than the height of the mounting portion of the driving circuit portion, the mounting portion of the driving circuit portion is It does not hinder the feeding of a hard printed material such as the card 7, and can print even a hard material.
【００１２】なお、本発明において、駆動回路部の実装
部とは、カバーがある場合はカバー上面であり、カバー
が無い場合は発熱体駆動用ＩＣ２上に設けた保護樹脂１
６（図１（Ａ）参照）の表面およびコネクタ等の電子部
品である。In the present invention, the mounting portion of the driving circuit portion is the upper surface of the cover when there is a cover, and the protective resin 1 provided on the heating element driving IC 2 when there is no cover.
6 (see FIG. 1A) and electronic components such as a connector.
【００１３】また、この基板１５は、例えばアルミナ等
のセラミック基板を例にとると、アルミナ基板となるグ
リーンシートを積層後、機械削り加工して焼成するか、
あるいは焼成後のアルミナ基板を削ることにより、図１
（Ｄ）に示すように、複数枚の基板１５に相当する素材
１５Ａを作り、これに発熱体列１や配線さらには保護膜
等の形成を膜形成技術により行った後、線１８で示す位
置で各個別の基板１５に切断することにより、一度に複
数枚の基板１５が作製できる。For example, when the substrate 15 is, for example, a ceramic substrate made of alumina or the like, after laminating green sheets to be an alumina substrate, it is machined and fired.
Alternatively, by shaving the alumina substrate after firing, as shown in FIG.
As shown in (D), a material 15A corresponding to a plurality of substrates 15 is made, and the heating element rows 1, wirings, and a protective film are formed on the material 15A by a film forming technique, and then the position shown by a line 18 is formed. A plurality of substrates 15 can be manufactured at a time by cutting into individual substrates 15 at.
【００１４】図１（Ａ）の例ではＩＣ２を剛性のある例
えば印刷配線基板４上に搭載した例を示したが、図２
（Ａ）の側面図に示すように、これをフレキシブル印刷
配線基板１９とし、ＩＣ２にフリップチップを用いてこ
れを発熱体形成基板１５上に搭載しても良い。In the example shown in FIG. 1A, the IC 2 is mounted on the rigid printed wiring board 4, for example.
As shown in the side view of (A), this may be used as the flexible printed wiring board 19, and the IC 2 may be mounted on the heating element forming substrate 15 by using a flip chip.
【００１５】また、本発明は、図２（Ｂ）の側面図に示
すように、端面ヘッドに適用できる。すなわち、図２
（Ｂ）の例は、ヒートシンク５の端面に前記凸状部１５
ａを有する基板１５を接着剤等により固定し、凸状部１
５ａの頂部の基板端面からの高さＨ1をカバー６の高さ
Ｈ2以上に設定したものである。本実施例によってもカ
バー６がカード７の送りの邪魔にならず、印字または印
画が可能となる。また、基板１５はヒートシンク５の端
面に全面で接しており、熱伝導が基板１５の厚み方向に
行われるので、伝熱経路が短く、放熱性が良好である。
また、この基板１５は、図１（Ａ）に示した基板１５と
同様に、図１（Ｄ）で説明した製法により作製でき、生
産性が良く、平面ヘッドと生産ラインの共用化が図れ
る。Further, the present invention can be applied to an end face head as shown in the side view of FIG. 2 (B). That is, FIG.
In the example of (B), the convex portion 15 is formed on the end surface of the heat sink 5.
The substrate 15 having a is fixed with an adhesive or the like, and the convex portion 1
The height H 1 of the top of the cover 5a from the substrate end surface is set to be equal to or higher than the height H 2 of the cover 6. Also in this embodiment, the cover 6 does not interfere with the feeding of the card 7 and printing or printing is possible. Further, since the substrate 15 is in contact with the end surface of the heat sink 5 over the entire surface and heat conduction is performed in the thickness direction of the substrate 15, the heat transfer path is short and the heat dissipation is good.
Further, like the substrate 15 shown in FIG. 1A, the substrate 15 can be manufactured by the manufacturing method described with reference to FIG. 1D, the productivity is good, and the flat head and the production line can be shared.
【００１６】[0016]
【発明の効果】本発明によれば、発熱体形成基板に凸状
部を設けてその凸状部の頂部に発熱体列を形成すると共
に、凸状部の高さを駆動回路部の実装部の高さ以上にし
たので、カードのような硬い被印刷物にも実装部が邪魔
になることなく印字または印画できる。According to the present invention, a convex portion is provided on the heating element forming substrate, the heating element row is formed on the top of the convex portion, and the height of the convex portion is set to the mounting portion of the drive circuit section. Since the height is equal to or higher than the height, it is possible to print or print on a hard printed material such as a card without the mounting portion interfering.
【００１７】また、本発明により端面ヘッドを構成する
場合、熱が基板の厚み方向に伝わるので、従来の曲面型
端面ヘッドに比較して放熱性が良好となる。Further, in the case of forming the end face head according to the present invention, heat is transferred in the thickness direction of the substrate, so that the heat radiation property is better than that of the conventional curved type end face head.
【００１８】また、従来の曲面型端面ヘッドのように個
別に作製されるのではなく、一枚の素材から凸構造をな
す多数の基板が作製できるので、量産性があり、生産性
が良好となり、低コスト化が可能となる。また、端面ヘ
ッドを作製する場合も、平面ヘッドを作るラインで作製
でき、従来の曲面型端面ヘッドに比較して生産ラインの
共用化が図れ、このことも生産性の向上と低コスト化に
寄与する。Further, since a large number of substrates having a convex structure can be manufactured from a single material instead of being manufactured individually as in the conventional curved type end face head, mass productivity and productivity are improved. It is possible to reduce the cost. Also, when manufacturing the end face head, it can be manufactured on the line for making the flat head, and the production line can be shared as compared with the conventional curved type end face head, which also contributes to improvement in productivity and cost reduction. To do.
【図１】（Ａ）は本発明によるサーマルヘッドの一実施
例を示す側面図、（Ｂ）はその発熱体形成基板の斜視
図、（Ｃ）は本実施例の基板を発熱体列に垂直な切断面
で切断した場合の断面図、（Ｄ）は該実施例の基板の素
材の正面図である。FIG. 1A is a side view showing an embodiment of a thermal head according to the present invention, FIG. 1B is a perspective view of a substrate on which a heating element is formed, and FIG. Sectional drawing when it cut | disconnects by a different cut surface, (D) is a front view of the raw material of the board | substrate of the said Example.
【図２】（Ａ）、（Ｂ）はそれぞれ本発明のサーマルヘ
ッドの他の実施例を示す側面図である。2A and 2B are side views showing another embodiment of the thermal head of the present invention.
【図３】（Ａ）、（Ｂ）、（Ｃ）はそれぞれ従来のサー
マルヘッドの各例を示す側面図である。3A, 3B, and 3C are side views showing examples of conventional thermal heads.
１ 発熱体列 ２ ＩＣ ４ 印刷配線基板 ５ ヒートシンク ６ カバー ７ カード １５ 発熱体形成基板 １５ａ 凸状部 １８ 切断線 １９ フレキシブル印刷配線基板 DESCRIPTION OF SYMBOLS 1 Heat generating element array 2 IC 4 Printed wiring board 5 Heat sink 6 Cover 7 Card 15 Heating element forming substrate 15a Convex portion 18 Cutting line 19 Flexible printed wiring board
【手続補正書】[Procedure amendment]
【提出日】平成５年２月２０日[Submission date] February 20, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１０[Correction target item name] 0010
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１０】 前記凸状部１５ａの発熱体列１を含めた頂
部のヒートシンク５の表面からの高さＨ１（図１（Ａ）
参照）は駆動回路部の実装部（本実施例においてはカバ
ー６）の高さＨ２以上に設定される。具体的な数値例を
述べると、基板１５の厚みは約１mm程度、凸状部１５ａ
の基板１５の表面からの高さＨ３を０．６mm以上とし、
カバー６の高さＨ２をそれ以下に設定した。ここで、
０．６mm以上とは、図１（Ｅ）において、ＩＣ２の厚さ
Ｈa＝２５０〜５００μｍ、ワイヤ３０のループハイト
Ｈb＝１００〜２００μｍ、ワイヤ３０からの樹脂１６
の厚さＨc＝２５０〜４００μｍであり、これらを合わ
せた最小の高さＨminでも、Ｈmin＝Ｈa＋Ｈb＋Ｈc＝２
５０μｍ＋１００μｍ＋２５０μｍ＝６００μｍ（０．
６mm）必要だからである。 [0010] The top including the heating element row 1 of the convex portion 15a
Height H from the surface of the heat sink 51(Fig. 1 (A)
Refer to the mounting section of the drive circuit section (cover in this embodiment).
-6) height HTwoThe above is set. Specific numerical example
To describe, the thickness of the substrate 15 is about 1 mm, and the convex portion 15a
Height H from the surface of the substrate 15 ofThreeTo0.6mm or more,
Height H of cover 6TwoWas set below that.here,
0.6mm or more means the thickness of IC2 in Fig. 1 (E)
H a = 250~500μm, loop height of the wire 30
H b = 100-200 μm, resin 16 from wire 30
Has a thickness H c = 250 to 400 μm, and these are combined.
Even with the minimum height H min , H min = H a + H b + H c = 2
50 μm + 100 μm + 250 μm = 600 μm (0.
6mm) is necessary.
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１２[Correction target item name] 0012
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１２】 なお、本発明において、駆動回路部の実装
部とは、カバーがある場合はカバー上面であり、カバー
が無い場合は発熱体駆動用ＩＣ２上に設けた保護樹脂１
６（図１（Ａ）参照）の表面、電気的接続部の保護膜の
表面およびコネクタ等の電子部品である。 [0012] In the present invention, the mounting of the drive circuit unit
The part is the upper surface of the cover if there is a cover,
If there is no protective resin 1 provided on the heating element driving IC 2
6 (see FIG. 1 (A)) surface, Of the protective film of the electrical connection
surfaceAnd electronic parts such as connectors.
【手続補正３】[Procedure 3]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１４[Correction target item name] 0014
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１４】図１（Ａ）の例ではＩＣ２を剛性のある例
えば印刷配線基板４上に搭載した例を示したが、図２
（Ａ）の側面図に示すように、これをフレキシブル印刷
配線基板１９とし、ＩＣ２にフリップチップを用いてこ
れを発熱体形成基板１５上に搭載しても良い。この場合
も図２（Ｃ）に示すように、実装面の高さは、ＩＣ２の
厚さＨa＝２５０〜５００μｍ、半田バンプ３１の高さ
Ｈb＝５０〜６０μｍ、ＩＣ２上の樹脂１６の厚さＨc＝
３００〜４００μｍの合計となり、これらを合わせた最
小の高さＨminでも、 Ｈmin＝Ｈa＋Ｈb＋Ｈc＝２５０μｍ＋５０μｍ＋３００
μｍ＝６００μｍ（０．６ｍｍ）必要である。 In the example shown in FIG. 1A, the IC 2 is mounted on the rigid printed wiring board 4, for example.
As shown in the side view of (A), this may be used as the flexible printed wiring board 19, and the IC 2 may be mounted on the heating element forming substrate 15 by using a flip chip. in this case
Also, as shown in FIG. 2C, the height of the mounting surface is
The thickness H a = 250~500μm, height of the solder bumps 31
H b = 50-60, the resin 16 on IC2 thickness H c =
The total is 300 to 400 μm.
Even at a small height H min , H min = H a + H b + H c = 250 μm + 50 μm + 300
μm = 600 μm (0.6 mm) is required.
【手続補正４】[Procedure amendment 4]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図１[Name of item to be corrected] Figure 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１】 （Ａ）は本発明によるサーマルヘッドの一実施
例を示す側面図、（Ｂ）はその発熱体形成基板の斜視
図、（Ｃ）は本実施例の基板を発熱体列に垂直な切断面
で切断した場合の断面図、（Ｄ）は該実施例の基板の素
材の正面図、（Ｅ）は（Ａ）の実装部の拡大図である。 [Figure 1] (A) is an implementation of the thermal head according to the present invention
A side view showing an example, (B) is a perspective view of the heating element forming substrate
FIG. 1C is a sectional view of the substrate of this embodiment perpendicular to the heating element array.
A cross-sectional view of the substrate of FIG.
Front view of wood, (E) is an enlarged view of the mounting part of (A)Is.
【手続補正５】[Procedure Amendment 5]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図２[Name of item to be corrected] Figure 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図２】 （Ａ）、（Ｂ）はそれぞれ本発明のサーマルヘ
ッドの他の実施例を示す側面図、（Ｃ）は（Ａ）の実装
部の拡大図である。 [Fig. 2] (A) and (B) are the thermal contacts of the present invention.
Side view showing another embodiment of the head, (C) is the implementation of (A)
Enlarged view of partIs.
【手続補正６】[Procedure correction 6]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図１[Name of item to be corrected] Figure 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１】 [Figure 1]
【手続補正７】[Procedure Amendment 7]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】図２[Name of item to be corrected] Figure 2
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図２】 [Fig. 2]
Claims (2)
成基板を固定したサーマルヘッドにおいて、前記発熱体
形成基板に凸状部を設けて該凸状部の頂部に発熱体列を
形成すると共に、該凸状部の高さを駆動回路部の実装部
の高さ以上に設定したことを特徴とするサーマルヘッ
ド。1. A thermal head having a heating element forming substrate fixed to a surface or an end face of a heat sink, wherein a convex portion is provided on the heating element forming substrate to form a heating element row on the top of the convex portion, and The thermal head is characterized in that the height of the convex portion is set to be equal to or higher than the height of the mounting portion of the drive circuit portion.
熱体駆動用ＩＣを覆うカバーの高さ以上に設定したこと
を特徴とするサーマルヘッド。2. The thermal head according to claim 1, wherein the height of the convex portion is set to be equal to or higher than the height of a cover for covering the heating element driving IC.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33605191A JPH05177854A (en) | 1991-11-26 | 1991-11-26 | Thermal head |
| EP19920460031 EP0544607A3 (en) | 1991-11-26 | 1992-11-24 | Thermal recording head and method of manufacturing the same |
| US07/981,013 US5428373A (en) | 1991-11-26 | 1992-11-24 | Thermal head for thermal recording or thermal transfer recording and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33605191A JPH05177854A (en) | 1991-11-26 | 1991-11-26 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05177854A true JPH05177854A (en) | 1993-07-20 |
Family
ID=18295197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33605191A Withdrawn JPH05177854A (en) | 1991-11-26 | 1991-11-26 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05177854A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949465A (en) * | 1994-06-21 | 1999-09-07 | Rohm Co., Ltd. | Thermal printhead, substrate for the same and method for making the substrate |
| JP2017114056A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
-
1991
- 1991-11-26 JP JP33605191A patent/JPH05177854A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5949465A (en) * | 1994-06-21 | 1999-09-07 | Rohm Co., Ltd. | Thermal printhead, substrate for the same and method for making the substrate |
| JP2017114056A (en) * | 2015-12-25 | 2017-06-29 | ローム株式会社 | Thermal print head |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990204 |