JPH05172850A - Tested ic mounting board for ic tester and ic socket - Google Patents

Abstract

PURPOSE:To constitute an IC tester so that an IC socket can be easily mounted and demounted for a board on which a tested IC is mounted. CONSTITUTION:A plurality of board pins 30a are erected and arranged at the center part of a DUT board 30 forming the interface between an IC tester and an IC. A plurality of board pin holes for the insertion of board pins 30a are formed on the undersurface of a socket 32. An IC 34 is installed on the upper surface of the socket 32. When an IC pin clamp lever 36 is turned down, the IC pin hole 30a of the socket 32 is narrowed partially, and IC pin 34a is clamped, while. if a board clamp lever 40 is turned down, the board pin hole is narrowed partially, and the board pin 30a is clamped by the socket 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board for mounting an IC to be inspected in an IC tester and a socket to which the IC to be inspected is mounted.

[0002]

2. Description of the Related Art An IC tester is known as a device for inspecting an IC (semiconductor integrated circuit) after manufacturing.

FIG. 3 conceptually shows an example of a conventional IC tester. This IC tester includes an IC tester main body 10 and a test unit 14 connected to the IC tester main body 10 by a cable 12. Where I
The C tester main body 10 outputs and inputs a test signal and performs a functional test of the IC, and includes, for example, a microcomputer. Test unit 1
4 includes, for example, a signal driver, a signal level comparator, and the like, and the test unit 14 has a board (Device-Under-T) on which an IC to be inspected is mounted.
est board. Hereinafter, a DUT board) 16 is arranged. This DUT board 16 has a socket 1 at the center.
8 has a plurality of socket holes for mounting the IC.
It mainly forms an interface between the test unit 20 and the test unit 14. The DUT board 16 is provided with a switching device for selecting signals, a power supply section for supplying power to the IC 20, and the like. Although the DUT board 16 is detachable from the test unit 14 in this conventional example, some DUT boards may be incorporated in the test unit 14 in other testers, or the IC tester body, the test unit, and the DUT board. There is also an IC tester that integrates the.

FIG. 4 is a perspective view showing the central portion of the DUT board 16. At the center of the DUT board 16,
A plurality of socket pin holes 16a are formed, and a plurality of socket pins 18a standing upright on the lower surface of the socket 18 are inserted into the socket pin holes 16a.

Here, conventionally, the connection between the socket pin hole 16a and the socket pin 18a has been performed by soldering. That is, the socket pin 18a was inserted into each socket pin hole 16a, and then the inspector soldered.

A plurality of IC pin holes 18a into which the IC pins 20a are inserted are formed in the socket 18, and for example, the slide plate 22 is moved in one direction with the IC pins 20a inserted into the respective IC pin holes 18a. By doing so, each IC pin 20a is fixed in each IC pin hole 18a. This is a mechanism similar to that of a conventional socket, and its specific configuration is omitted in the drawing.

[0007]

As described above, the conventional socket is directly soldered and fixed to the DUT board 16.

Therefore, there is a possibility that adjacent pins may be short-circuited during soldering, or contact failure may occur when so-called soldering failure occurs. If the socket is fixed to the DUT board by soldering as described above, if the socket is damaged,
Solder must be removed when replacing the socket, which is extremely complicated and may damage the DUT board.

Further, the IC tester has different types of ICs.
Although there is a request to inspect the IC, the socket is fixed in the conventional IC tester, so the IC that does not fit the socket
When inspecting, it is necessary to dispose another socket between the socket and the IC, which is very complicated.

The present invention has been made in view of the above conventional problems, and an object thereof is to allow the socket to be freely replaced without fixing the socket to the DUT board, and to easily and quickly inspect the IC. An object is to provide an inspected IC mounting board and an IC socket that can be manufactured.

[0011]

In order to achieve the above object, an inspected IC mounting board according to the present invention has an inspected IC mounting board on which an inspected IC is mounted via an IC socket. In an IC tester for inspecting, a plurality of test pins for inputting and outputting a test signal are erected on the socket mounting surface of the IC mounting board to be inspected,
An IC socket is attached to the plurality of test pins.

An IC socket according to the present invention is an IC socket mounted on an inspected IC mounting board according to claim 1, wherein a plurality of IC pin holes for receiving respective pins of the inspected IC are provided on an upper surface. A plurality of test pins that are formed and arranged in the same arrangement as the plurality of test pins arranged on the inspected IC mounting board are formed on the lower surface, and the test pins that are inserted into the test pin holes are further formed. It is characterized in that a mechanism for clamping the pin is provided.

[0013]

According to the above IC mounting board and IC socket, the IC mounting board (DUT board) is
A plurality of test pins to which the sockets are mounted are arranged upright, while a mechanism for clamping the test pins is provided on the IC sockets, so that the IC sockets can be easily mounted on and removed from the IC mounting board to be inspected. It can be done easily.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a preferred embodiment of an IC mounting board and an IC socket of an IC tester according to the present invention.

In FIG. 1, a plurality of board pins 30a in this embodiment are erected and aligned in the center of the DUT board 30.

On the other hand, although not shown in FIG. 1, the socket 32 has a plurality of board pin holes formed in the lower surface thereof in the same arrangement as the arrangement of the board pins 30a.

On the upper surface of the socket 32, an IC
A plurality of IC pin holes 3 for receiving the IC pins 34a of 34
2a is formed in the same manner as the conventional one, and the IC pin clamp lever 3
By tilting 6, the first slide plate 38 slides in one direction, and the IC pin 34 a is clamped and fixed to the socket 32. This is the same mechanism as the conventional one.

Further, the socket 32 of this embodiment is provided with a mechanism for clamping the board pin 30a in a state where the board pin 30a is inserted into the board pin hole formed on the lower surface of the socket 32. Specifically, the second slide plate 40 is moved in one direction by tilting the board pin clamp lever 40, and as a result, each board pin 30a is clamped and fixed to the socket 32. That is, a part of the board pin 30a inserted into the board pin hole is clamped and fixed as a result.

Therefore, when the board pin clamp lever 40 is pulled up, the board pin 30a is released from the board pin hole, so that the socket 32 can be easily detached from the DUT board 30.

FIG. 2 shows a partial sectional view of the socket 32. Board pins 30a are arranged upright on the DUT board 30, and the board pins 30a are arranged in the board pin holes 3
It is inserted in 2b. On the other hand, IC pin 3 of IC34
4a is inserted in the IC pin hole 32a.

In this state, if the IC pin clamp lever 36 shown in FIG. 1 is tilted, the first slide plate 38 slides in the direction of the arrow in the figure, and the IC pin 34a is partially held.

Similarly, by tilting the board pin clamp lever 40, the second slide plate 40 slides in the direction of the arrow in the figure, and the board pin 30a is partially held.

It is possible to form a socket pin hole in the DUT board 30 as in the prior art without arranging the board pin 30a as in the present embodiment, and to provide a mechanism for clamping the socket pin together with the socket pin hole. In case DU
As the thickness of the T-board 30 increases, the mechanism thereof becomes complicated, which may impair the original function of the DUT board. Therefore, it is understood that it is preferable to arrange the board pins 30a on the DUT board 30.

In the present embodiment shown in FIG. 1, each pin is clamped by the slide plate mechanism, but naturally it is not limited to this and various types can be adopted. Note that the specific electrical wiring in FIGS. 1 and 2 is omitted in the drawing.

[0026]

As described above, the IC according to the present invention
According to the inspected IC mounting board and the IC socket of the tester, the conventional problems caused by the soldering of the socket can be solved, and the IC socket can be detachably mounted on the inspected IC mounting board. Therefore, the socket can be easily replaced, and the IC test can be speeded up.

[Brief description of drawings]

FIG. 1 is a perspective view showing an IC mounting board (DUT board) and an IC socket according to the present invention.

FIG. 2 is a partial cross-sectional view of the socket shown in FIG.

FIG. 3 is a schematic perspective view showing an example of a conventional IC tester.

FIG. 4 is a perspective view showing a main part of the configuration shown in FIG.

[Explanation of symbols]

 30 DUT board 30a Board pin 32 Socket 32a IC pin hole 34 IC 38, 40 Slide plate

Claims (2)

[Claims] 1. An IC tester for inspecting an IC, comprising an inspected IC mounting board on which an inspected IC is mounted via an IC socket, wherein a test signal is provided on a socket mounting surface of the inspected IC mounting board. A test IC mounted board of an IC tester, wherein a plurality of test pins for inputting and outputting are erected and an IC socket is mounted on the plurality of test pins. 2. The IC socket mounted on the IC mounting board according to claim 1, wherein a plurality of IC pin holes for receiving respective pins of the IC to be tested are formed on the upper surface, and the IC to be mounted is tested. A plurality of test pin holes are formed on the lower surface in the same arrangement as the plurality of test pins arranged on the board to receive the test pins, and a mechanism for clamping the test pins inserted in the test pin holes is provided. IC characterized by
socket.