JPH05170275A - Semiconductor device holding tray - Google Patents

Abstract

PURPOSE:To provide a tray which can hold a large quantity of thin packages for transfer and shipment and prevent IC products from damage such as bending of the lead. CONSTITUTION:Trays are arranged in a plurality of tiers, one upon another. A thin package 4 is placed in the cavity of the tray below and held down by a cushioning material 3 such as rubber attached to the lower surface of the cavity of the tray above, thereby hindering the vertical and horizontal movement of the package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor shipping tray, and more particularly to a tray structure capable of accommodating a plurality of thin packages containing semiconductor elements therein.

[0002]

2. Description of the Related Art For accommodating a semiconductor device having a surface mount type package, for example, a semiconductor integrated circuit device having a thin small outline package (TSOP) or a thin quad flat package (TQFP). As a storage container for
There is an electronic component protection tray described in Japanese Patent No. This tray is a tray that stores a large number of electronic component packages, in which a plurality of leads are drawn out on the side surface of a thin plate-shaped resin molded body, in a vertical and horizontal matrix, and is press-formed with a large number of recesses that store the electronic component packages. Resin pallet and a resin cover that covers the pallet, and the cover enters the concave portion of the pallet so that the convex portion that can come into contact with the upper surface of the electronic component package corresponds to the concave portion of the pallet. It is provided.

[0003]

In the electronic component protection tray having the above-mentioned structure, the package easily floats in the vertical and horizontal directions in the void in the recess, and it is not possible to sufficiently prevent it. In addition, when TSOP and TQFP are stored, the resin molded body of the package is thin, and there is little room for standing a body guide wall that keeps the free movement of the package in the recess. Therefore, a slight impact tends to cause lead deformation. An object of the present invention is to provide a multi-component storage container (tray) that can prevent damage such as lead deformation due to impact when a package is stored.

[0004]

The present invention is a tray for arranging and storing a plurality of semiconductor packages, which has an uneven portion for defining a planar position of a thin package and a means for vertically fixing the package. The package is sandwiched between the upper and lower trays to be housed in a plurality of stages. As a means for fixing the package in the vertical direction, a cushioning material such as rubber is provided on the package storage surface of the tray, and as another means, an adhesive or the like is applied to the package storage surface. Another way to secure the package is
A package is housed in a recess of a tray composed of a carrier tape and a cover tape, and a cover tape is superposed and fixed on the package.

According to the above-mentioned means, the package is sandwiched by the cushioning material on the package receiving surface of the concave portion and the tray which is laid on the package, and is supported by the elastic force. The action of blocking the movement occurs. In addition, the cushioning material absorbs mechanical shock to the package, and deformation of the leads is eliminated. It is also possible to prevent the package from moving due to the adhesive applied to the package. By stacking the cover tapes from above, the cover is in close contact with the package and its looseness can be suppressed.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an overall perspective view of an embodiment in which a plurality of TSOP and TQFP storage trays are stacked. Reference numeral 1 denotes a resin-molded tray main body (first stage), and 2 denotes a recess serving as a tray cavity, in which one IC (semiconductor package) is housed in one cavity. FIG. 2 is an embodiment of the tray of the present invention, and is a partially enlarged cross-sectional view showing a state in which a thin IC package (TSOP) 4 is sandwiched and housed between the cavities of the trays which are vertically stacked. It is a figure. In this example, the IC receiving portion 5 of the cavity 2 is thick and vertically protrudes, and the cushioning material 3, for example, soft rubber or resin sponge is installed on the lower surface side of the receiving portion. The IC package 4 accommodated in () is sandwiched between the lower surface of the cavity of the upper tray 11 and elastically pressed by the cushioning material 3 to prevent the looseness.

FIG. 3 is a partially enlarged sectional view showing another embodiment of the tray of the present invention. In this example, the tray is formed to have the same thickness as the IC receiving portion 6 of the cavity in the tray and other portions, and rubber serving as the cushioning material 3 is provided on each of the upper surface and the lower surface of the receiving portion. With such a structure, the IC package 4 housed in the cavity is elastically supported by the cushioning material at the top and bottom and does not move. Since the tray is formed to have a uniform thickness over the whole by pressing or the like, it is easy to manufacture and the material cost is low. The cushioning material sponge 4 is fixedly provided on both sides of the cavity (IC receiving portion) with an adhesive or the like.

In FIG. 4, the tray has a uniform thickness throughout, the IC receiving portion of the cavity is formed by bending so as to project upward, and the thicker cushioning material sponge 3 is fitted in the lower concave portion for adhesive fixing. It is an example in the case of doing. With such a structure, the tray itself can be easily manufactured by pressing, which is also advantageous for positioning and fixing the sponge on the tray.

In FIG. 5, by thickening a part of the tray in FIG. 2, a resin adhesive 8 is adhered or applied to the upper surface of the IC receiving portion 5 which is projected upward, and the IC package is placed thereon. This is an example in the case of fixing. In this case, the adhesive replaces the sponge or the like and prevents the package from moving vertically and horizontally. In this structure, a sponge or the like may be used together with the adhesive on the lower surface of the IC receiver.

FIG. 6 shows an embossed taping member for shipping, in which a thin IC package is housed in a cavity formed by a cover tape 13 and a carrier tape 14, and a soft rubber (or sponge) is provided on the cover tape 13 side. )
3 shows an embodiment in which the IC package 4 can be shipped by partially attaching 3 and adhering the upper and lower tapes by overlapping as shown in FIG. In this case, the soft rubber functions to prevent the package from moving.
The carrier tape 14 in this example is shown in FIGS.
The tray shown in can be used as it is.

[0011]

Since the present invention is constructed as described above, it has the following effects. By accommodating the thin packages in the cavities of the trays and stacking these trays in multiple stages, they are pressed by the rubber of the cushioning material attached to the bottom of the cavities or fixed with an adhesive so that the packages can be moved vertically or horizontally. It is possible to effectively prevent product damage such as lead bending without floating.

[Brief description of drawings]

FIG. 1 is an overall perspective view of an embodiment in which a plurality of trays for accommodating thin IC packages are stacked.

FIG. 2 is a partially enlarged sectional view showing an embodiment in which a sponge is used in the tray of the present invention.

FIG. 3 is a partially enlarged cross-sectional view showing another embodiment of the tray of the present invention.

FIG. 4 is a partially enlarged cross-sectional view showing another embodiment of the tray of the present invention.

FIG. 5 is a partially enlarged cross-sectional view showing an example in which an adhesive is used in the tray of the present invention.

FIG. 6 is a partially enlarged cross-sectional view of a state before assembly showing an embodiment when an embossed taping member is used in the present invention.

FIG. 7 is a partially enlarged cross-sectional view of a state after assembly in the embodiment of FIG.

[Explanation of symbols]

 1 Tray Main Body 2 Recessed Cavity 3 Cushioning Material (Soft Rubber, Sponge) 4 Thin Package (IC) 5 IC Package Receiving Part (With Convex Part) 6 IC Package Receiving Part (Uniform Thickness) 7 IC Package Receiving Part ( Bend with a uniform thickness) 8 Adhesive 11 Upper tray 12 Lower tray 13 Cover tape 14 Carrier tape

Claims (4)

[Claims] 1. A semiconductor element is built in a thin package,
A hard tray for arranging and housing semiconductor devices in which lead groups are drawn out to the side, and having a concavo-convex portion that defines the planar position of a thin package and means for fixing the package in the vertical direction. A storage tray for a semiconductor device, wherein a package is sandwiched between the trays and stored in a plurality of stages. 2. The semiconductor device storage tray according to claim 1, wherein a cushioning material is provided on the package storage surface of the tray as a means for fixing the package in the vertical direction. 3. The semiconductor device storage tray according to claim 1, wherein an adhesive is applied to the package storage surface as a means for fixing the package. 4. A storage tray for a semiconductor device comprising a carrier tape and a cover tape, wherein a thin package is stored in a cavity recess of the carrier tape, and the cover tape is closely adhered and fixed.