JPH0516957B2 - - Google Patents
Info
- Publication number
- JPH0516957B2 JPH0516957B2 JP7204486A JP7204486A JPH0516957B2 JP H0516957 B2 JPH0516957 B2 JP H0516957B2 JP 7204486 A JP7204486 A JP 7204486A JP 7204486 A JP7204486 A JP 7204486A JP H0516957 B2 JPH0516957 B2 JP H0516957B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- rosin
- lead
- tin
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 80
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 78
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 78
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 58
- 150000003839 salts Chemical class 0.000 claims description 29
- 229910000679 solder Inorganic materials 0.000 description 100
- 229910052751 metal Inorganic materials 0.000 description 67
- 239000002184 metal Substances 0.000 description 67
- 239000007864 aqueous solution Substances 0.000 description 35
- 229910045601 alloy Inorganic materials 0.000 description 28
- 239000000956 alloy Substances 0.000 description 28
- 238000003756 stirring Methods 0.000 description 27
- 239000002245 particle Substances 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 21
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 20
- 239000000843 powder Substances 0.000 description 12
- 238000007127 saponification reaction Methods 0.000 description 12
- 230000004907 flux Effects 0.000 description 11
- 150000002739 metals Chemical class 0.000 description 11
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 10
- 238000000354 decomposition reaction Methods 0.000 description 10
- 229940046892 lead acetate Drugs 0.000 description 10
- 239000001119 stannous chloride Substances 0.000 description 10
- 235000011150 stannous chloride Nutrition 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 239000007787 solid Substances 0.000 description 8
- 239000003784 tall oil Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 7
- 238000005649 metathesis reaction Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 6
- 239000003518 caustics Substances 0.000 description 6
- 229910052700 potassium Inorganic materials 0.000 description 6
- 239000011591 potassium Substances 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000012266 salt solution Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000018044 dehydration Effects 0.000 description 4
- 238000006297 dehydration reaction Methods 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 229910052500 inorganic mineral Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011707 mineral Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- ZVUVJTQITHFYHV-UHFFFAOYSA-M potassium;naphthalene-1-carboxylate Chemical compound [K+].C1=CC=C2C(C(=O)[O-])=CC=CC2=C1 ZVUVJTQITHFYHV-UHFFFAOYSA-M 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 235000015096 spirit Nutrition 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- MHVJRKBZMUDEEV-APQLOABGSA-N (+)-Pimaric acid Chemical compound [C@H]1([C@](CCC2)(C)C(O)=O)[C@@]2(C)[C@H]2CC[C@](C=C)(C)C=C2CC1 MHVJRKBZMUDEEV-APQLOABGSA-N 0.000 description 2
- MHVJRKBZMUDEEV-UHFFFAOYSA-N (-)-ent-pimara-8(14),15-dien-19-oic acid Natural products C1CCC(C(O)=O)(C)C2C1(C)C1CCC(C=C)(C)C=C1CC2 MHVJRKBZMUDEEV-UHFFFAOYSA-N 0.000 description 2
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 2
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000001447 alkali salts Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- -1 tin with solder Chemical class 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000004135 Bone phosphate Substances 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N lead(II) oxide Inorganic materials [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- CJGYQECZUAUFSN-UHFFFAOYSA-N oxygen(2-);tin(2+) Chemical compound [O-2].[Sn+2] CJGYQECZUAUFSN-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(II) oxide Inorganic materials [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、金属半田の成分である錫及び鉛をロ
ジン誘導体に結合させ、熱により金属成分を遊離
させて半田として作用させると共に、有機成分が
接合助剤として作用する有機半田に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention binds tin and lead, which are components of metal solder, to a rosin derivative, and uses heat to liberate the metal components to act as solder, while the organic components bond together. It concerns an organic solder that acts as an auxiliary agent.
従来の技術
従来一般に使用されている半田は、金属錫と金
属鉛との合金である。そしてこの半田合金を熱で
熔融し、ロジン等のフラツクスの存在下で金属を
接合する。半田で錫等の金属を接合する場合に
は、半田合金中の錫が被着金属である銅中に溶解
して銅と錫との合金層を形成し、該合金層の間を
残余の錫と鉛との合金が架橋して、被着金属同士
を接合する。而して半田合金中の鉛は、半田合金
の融点を低下させると共に、半田の強度を高める
作用をする。Prior Art Solder commonly used in the past is an alloy of metallic tin and metallic lead. This solder alloy is then melted with heat, and the metals are joined in the presence of a flux such as rosin. When joining metals such as tin with solder, the tin in the solder alloy is dissolved in the copper, which is the deposited metal, to form an alloy layer of copper and tin, and the remaining tin is passed between the alloy layers. The alloy of lead and lead crosslinks and joins the deposited metals together. Thus, lead in the solder alloy has the effect of lowering the melting point of the solder alloy and increasing the strength of the solder.
かつては半田合金を棒状又は針金状に成型し、
これを半田ごて等で熔融して被着金属に接触させ
て、これを接合することが行われていた。しかし
ながら近年電子回路の組立てのために、多数のし
かも微細な接合箇所において半田付けする必要が
生じ、ペースト状半田が多く使用されるようにな
つている。 In the past, solder alloy was molded into rods or wires,
This was melted with a soldering iron or the like and brought into contact with the adhered metal to join them. However, in recent years, in order to assemble electronic circuits, it has become necessary to solder many and minute joints, and paste solder has come to be used more and more.
ペースト状半田は、半田合金の粉末とフラツク
スとを粘度調整用のミネラルスピリツト等の高沸
点溶剤に分散し、一定の粘度を有するペースト状
としたものである。而してこのペースト状半田を
使用して電子回路を組立てる際には、ペースト状
半田をスクリーン印刷又はデイスペンサーで、電
子部品搭載基板上に所定の形状に塗布し、その上
に被着電子部品を載置し、これを加熱して前記半
田合金の粉末を熔融させ、フラツクスの補助作用
の下で、前記熔融半田合金で基板と被着部品とを
接合している。 Paste solder is made by dispersing solder alloy powder and flux in a high boiling point solvent such as mineral spirits for viscosity adjustment to form a paste having a constant viscosity. When assembling an electronic circuit using this paste-like solder, the paste-like solder is applied to a predetermined shape on the electronic component mounting board by screen printing or a dispenser, and then the electronic components are placed on top of the paste-like solder. is placed, heated to melt the powder of the solder alloy, and the molten solder alloy is used to join the substrate and the adhered component under the auxiliary action of flux.
ペースト状半田を加熱すると、前記半田合金の
粉末粒子が熔融し、前記フラツクスによつて熔融
半田粒子の表面の酸化物が還元されて純半田熔融
粒子となると共に、被着金属表面も還元されて清
浄な表面を形成する。而して熔融半田粒子の凝集
力と、半田粒子の被着金属に対する濡れ性とによ
り、被着金属間に半田合金による架橋を形成し、
接合されるのである。 When the paste-like solder is heated, the powder particles of the solder alloy are melted, and the oxides on the surface of the molten solder particles are reduced by the flux to become pure solder molten particles, and the surface of the adhered metal is also reduced. Forms a clean surface. Then, due to the cohesive force of the molten solder particles and the wettability of the solder particles to the deposited metal, a bridge is formed between the deposited metals by the solder alloy,
They are joined together.
発明が解決しようとする問題点
しかしながら前記ペースト状半田においては、
そのペースト中における半田合金は、フラツクス
や溶剤とは分離された遊離の金属粒子であり、そ
の粒子は微細なものであるとは言つても、フラツ
クスや溶剤と均一な組成物を構成しているもので
はない。半田合金の粒子を小さくする試みがなさ
れてはいるが、現在では200μ程度が限界とされ
ている。Problems to be Solved by the Invention However, in the paste solder,
The solder alloy in the paste is free metal particles separated from the flux and solvent, and although the particles are fine, they form a uniform composition with the flux and solvent. It's not a thing. Although attempts have been made to reduce the size of solder alloy particles, the current limit is about 200μ.
一方近年電子回路の集積度が高くなり、基板上
の回路パターンも細い線で高密度に構成されるよ
うになつている。最近では百〜数百μ程度の線を
同程度の間隔で描いて回路パターンを構成するよ
うにもなつており、それに伴つて当該基板上にペ
ースト状半田を供給する場合においても、回路パ
ターンの高密度化に伴い、極めて高精度で供給す
る必要がある。従つてスクリーン印刷でペースト
状半田を供給する場合においては、よりメツシユ
の細かいスクリーンを使用しなければならず、ま
たデイスペンサーを使用する場合においても、よ
り細い吐出穴径のものを使用する必要が生じてき
ている。 On the other hand, in recent years, the degree of integration of electronic circuits has increased, and circuit patterns on substrates have become densely composed of thin lines. Recently, circuit patterns have been constructed by drawing lines of about 100 to several 100 micrometers at similar intervals, and accordingly, even when applying paste solder onto the board, it is difficult to form circuit patterns. As density increases, it is necessary to supply with extremely high precision. Therefore, when supplying paste solder by screen printing, it is necessary to use a screen with a finer mesh, and when using a dispenser, it is necessary to use one with a narrower discharge hole diameter. It's starting to happen.
然るに、前述のようにペースト状半田中に半田
合金の固体粉末粒子が含まれているので、これを
スクリーン印刷やデイスペンサーにより基板上に
供給する際、半田合金の粒子の大きさを事実上無
視することができなくなつてくる。スクリーン印
刷により供給する場合においては、半田合金の粉
末粒子がスクリーンに目詰まりを生じさせ、半田
合金を所定の形状に均一に印刷して供給すること
が困難である。また半田粉末とスクリーンとの摩
擦により、マスクに傷をつけたり破損したりする
ことがあり、スクリーンの寿命が短いものとなつ
ている。またデイスペンサーを使用する場合にお
いても、細い吐出穴に半田粉末が詰まり、詰まつ
た半田粉末がそれに続くペーストを濾過して、接
合助剤や溶剤のみを吐出することがあり、半田合
金の粉末を均一に含むペーストとして吐出するこ
とが極めて困難である。 However, as mentioned above, the paste-like solder contains solid powder particles of the solder alloy, so when supplying it onto the board by screen printing or a dispenser, the size of the solder alloy particles is virtually ignored. I'm getting to the point where I can't do it anymore. When supplying by screen printing, the solder alloy powder particles clog the screen, making it difficult to uniformly print and supply the solder alloy in a predetermined shape. Furthermore, the friction between the solder powder and the screen may scratch or damage the mask, shortening the lifespan of the screen. Also, when using a dispenser, the narrow discharge hole may become clogged with solder powder, and the clogged solder powder may filter the following paste, discharging only the bonding aid or solvent, and the solder alloy powder may become clogged with solder powder. It is extremely difficult to discharge the paste as a paste that evenly contains it.
また前述のように、熔融半田の粒子同士の凝集
力と被着金属に対する濡れ性とによつて被着金属
間の接合を行うが、個々の熔融半田粒子の表面張
力は大きいものであつて、全ての半田粒子を接合
に寄与させることは困難であり、接合に寄与しな
い半田粒子が基板状に残留し、これらは回路の間
を短絡させる可能性がある。 Furthermore, as mentioned above, bonding between deposited metals is achieved by the cohesive force between the particles of molten solder and the wettability of the deposited metal, but the surface tension of each individual molten solder particle is large. It is difficult to make all the solder particles contribute to bonding, and solder particles that do not contribute to bonding remain on the substrate, which may cause a short circuit between circuits.
特に先に述べたように集積度の高い電子回路に
おいては、回路を構成する線の間隔が半田粒子の
径にほゞ匹敵する大きさになり、単一の半田粒子
によつても簡単に短絡が生じ、直ちに致命的な欠
陥を生じることになり兼ねない。このような事態
を避けるために、接合完了等に当該電子回路を有
機溶剤で洗浄して残存半田粒子を除去することが
行われるが、それでも完全に除去することは困難
である。 In particular, as mentioned earlier, in highly integrated electronic circuits, the spacing between the wires that make up the circuit is comparable to the diameter of a solder particle, and even a single solder particle can easily cause a short circuit. This can quickly lead to fatal defects. In order to avoid such a situation, residual solder particles are removed by cleaning the electronic circuit with an organic solvent after bonding is completed, but it is still difficult to completely remove the remaining solder particles.
半田合金の粉末粒子の径をさらに小さいものと
することによりこれらの問題点は多少は改善され
るが、高価になると共に、熔融半田の粒子が安定
なものとなつて凝集が起りにくくなり、必ずしも
好ましいものと言えない。 These problems can be alleviated to some extent by making the diameter of the solder alloy powder particles even smaller, but it also increases the cost and makes the molten solder particles more stable and less likely to agglomerate. I can't say it's favorable.
本発明はかかる事情に鑑みなされたものであつ
て、半田を構成する金属をフラツクスに対して化
学的に結合することにより均一な組成物となし、
スクリーン印刷やデイスペンサーによる供給を容
易ならしめると共に、精密なパターンを容易に形
成することを可能にし、さらに接合後における残
存半田粒子による電子回路の短絡を防止すること
を目的とするものである。 The present invention was made in view of the above circumstances, and consists of chemically bonding the metal constituting the solder to the flux to form a uniform composition.
The purpose is to facilitate supply by screen printing or dispenser, to easily form precise patterns, and to prevent short circuits in electronic circuits due to residual solder particles after bonding.
問題点を解決する手段
而して本発明の有機半田は、マレイン化ロジン
又はフマル化ロジンと、錫及び鉛との塩よりな
り、該塩中の錫含有量が12〜24重量％であり、鉛
含有量が４〜23重量％であることを特徴とする。Means for Solving the Problems The organic solder of the present invention is made of a salt of maleated rosin or fumarated rosin and tin and lead, and the tin content in the salt is 12 to 24% by weight, It is characterized by a lead content of 4 to 23% by weight.
本発明は、有機成分としてのロジン誘導体中の
カルボン酸を、錫及び鉛の塩としたものである。
ロジンは半田のフラツクスとして優れた性能を有
するものであり、このロジンの誘導体に錫及び鉛
を化学的に結合することにより、半田とフラツク
スとを一体の物質とし、必要に応じて加熱するこ
とにより金属成分と有機成分とを分離し、それぞ
れ半田及びフラツクスとして作用させようとする
ものである。 In the present invention, the carboxylic acid in the rosin derivative as an organic component is a salt of tin and lead.
Rosin has excellent performance as a solder flux, and by chemically bonding tin and lead to a derivative of this rosin, the solder and flux are made into a single substance, and if necessary, by heating. The idea is to separate the metal component and the organic component and make them act as solder and flux, respectively.
本発明の有機半田における有機成分としては、
マレイン化ロジン又はフマル化ロジンが使用され
る。ロジンの主成分であるアビエチン酸やピマー
ル酸はカルボン酸を一つしか有していないので、
これに錫及び鉛を結合しても、充分な量の金属を
導入することはできず、金属の含有量が少ない。
そこで本発明においては、ロジンをマレイン化又
はフマル化することによりカルボン酸を導入して
三塩基性の誘導体とし、そのロジン誘導体の三つ
のカルボン酸を錫塩及び鉛塩とすることにより、
半田として作用するに充分な量の金属を導入する
ことができるのである。 The organic components in the organic solder of the present invention include:
Maleated or fumarated rosins are used. Abietic acid and pimaric acid, which are the main components of rosin, have only one carboxylic acid, so
Even if tin and lead are combined with this, a sufficient amount of metal cannot be introduced, and the metal content is low.
Therefore, in the present invention, a carboxylic acid is introduced into a tribasic derivative by maleating or fumarizing the rosin, and the three carboxylic acids of the rosin derivative are converted into a tin salt and a lead salt.
A sufficient amount of metal can be introduced to act as a solder.
本発明におけるロジンとしては、トール油ロジ
ン、ガムロジン、ウツドロジン等を使用すること
ができ、またこれらのロジンの主成分であるアビ
エチン酸やピマール酸を単独で使用することも可
能である。 As the rosin in the present invention, tall oil rosin, gum rosin, udon rosin, etc. can be used, and abietic acid and pimaric acid, which are the main components of these rosins, can also be used alone.
マレイン化ロジン又はフマル化ロジンに対する
金属の導入は、これらのロジン誘導体のアルカリ
塩に錫及び鉛の塩を添加し、複分解反応によりロ
ジン誘導体の錫及び鉛の塩を得る。ロジン誘導体
アルカリ塩に添加する錫の塩としては、塩化第一
錫が適当であり、また鉛の塩としては、酢酸鉛が
適当である。 To introduce metals into maleated rosin or fumarized rosin, tin and lead salts are added to the alkali salts of these rosin derivatives, and tin and lead salts of the rosin derivatives are obtained by metathesis reaction. As the tin salt added to the rosin derivative alkali salt, stannous chloride is suitable, and as the lead salt, lead acetate is suitable.
またミネラルスピリツト等の有機溶剤中で前記
ロジン誘導体に錫及び鉛の酸化物を反応させるこ
とにより、前記ロジン誘導体の錫及び鉛の塩を得
ることもできる。 The tin and lead salts of the rosin derivative can also be obtained by reacting the rosin derivative with tin and lead oxides in an organic solvent such as mineral spirits.
本発明の有機半田は、マレイン化ロジン又はフ
マル化ロジンに、錫と鉛とを混合して導入した、
ロジン誘導体の錫・鉛塩であつても良く、また前
記ロジン誘導体の錫塩と鉛塩とをそれぞれ別個に
合成し、これらを所定の割合で混合したものであ
つても良い。ただし後者の有機半田の方が、被着
金属を接合した場合に形成される半田層の膜厚が
厚く、接合強度が大きい傾向であり、また用途に
応じて錫と鉛との含有量の異なる有機半田を自由
に調製することができるという利点を有している
ので好ましい。 The organic solder of the present invention is prepared by introducing a mixture of tin and lead into maleated rosin or fumarized rosin.
It may be a tin/lead salt of a rosin derivative, or a tin salt and a lead salt of the rosin derivative may be synthesized separately and mixed in a predetermined ratio. However, the latter organic solder tends to have a thicker solder layer and greater bonding strength when bonding deposited metals, and the content of tin and lead varies depending on the application. This is preferred because it has the advantage that organic solder can be prepared freely.
本発明の有機半田においては、ロジン誘導体の
金属塩における錫の含有量は12〜24重量％、鉛の
含有量は４〜23重量％とするべきである。錫の含
有量は、少なくとも12重量％以上であることが必
要であり、さらに15重量％以上であることが好ま
しい。錫の含有量が少ないと、被着金属表面にお
ける被着金属と錫との合金層の厚みが不足し、接
合強度が充分でない。また有機半田中における鉛
の含有量は、４重量％以上であることが必要であ
り、全金属総含有量の35重量％以上が鉛であるこ
とが好ましい。錫に対して鉛の含有量が少ない
と、接合した状態における半田合金の強度が不足
し、また鉛が過度に多い場合においても、接合強
度が充分でない。なお前記錫及び鉛の含有量の上
限は、ロジン誘導体におけるカルボン酸が全て金
属塩を構成したときの理論上の上限であつて、そ
れ以上錫及び鉛を含有させることは理論的に不可
能である。 In the organic solder of the present invention, the tin content in the metal salt of the rosin derivative should be 12 to 24% by weight, and the lead content should be 4 to 23% by weight. The tin content needs to be at least 12% by weight or more, and preferably 15% by weight or more. If the tin content is low, the thickness of the alloy layer of the deposited metal and tin on the surface of the deposited metal will be insufficient, resulting in insufficient bonding strength. The lead content in the organic solder must be 4% by weight or more, and preferably 35% by weight or more of the total metal content is lead. If the content of lead is small relative to tin, the strength of the solder alloy in the bonded state will be insufficient, and if the lead content is excessively large, the bonding strength will not be sufficient. The upper limits of the contents of tin and lead mentioned above are the theoretical upper limits when all the carboxylic acids in the rosin derivative constitute metal salts, and it is theoretically impossible to contain more tin and lead. be.
作 用
本発明の有機半田を使用して被着金属を接合す
るには、本発明の有機半田に分解促進剤としてヒ
ドラジン−１塩酸塩を添加し、これを粘度調整用
の有機溶剤に溶解する。これを回路基板上に塗布
し、その上に前記回路基板に接合すべき電子部品
を載置する。而してこれを約300〜400℃に加熱す
る。Function: To join deposited metals using the organic solder of the present invention, hydrazine-1 hydrochloride is added to the organic solder of the present invention as a decomposition accelerator, and this is dissolved in an organic solvent for viscosity adjustment. . This is applied onto a circuit board, and electronic components to be bonded to the circuit board are placed thereon. This is then heated to approximately 300-400°C.
これによりマレイン化ロジン又はフマル化ロジ
ンの錫塩及び鉛塩が分解し、金属錫及び鉛が遊離
して熔融した半田合金を生じ、被着金属を接合す
るのである。 As a result, the tin salt and lead salt of the maleated rosin or fumarized rosin decompose, and metallic tin and lead are liberated to form a molten solder alloy, which joins the deposited metals.
本発明の有機半田が金属を接合する機構につい
ては必ずしも明らかではないが、次のようなプロ
セスによるものと思われる。すなわち、有機半田
が分解する際には、被着金属の表面の銅が触媒作
用をし、それによつて被着金属の表面において有
機半田の分解反応が生じ、遊離した金属中の錫が
被着金属の銅中に溶解する。さらに未分解の有機
半田が被着金属の表面に移行して分解を重ねて金
属を遊離し、銅−錫合金の表面に半田合金層を形
成し、遂には被着金属間を半田合金で架橋し、被
着金属を接合するのである。 Although the mechanism by which the organic solder of the present invention joins metals is not necessarily clear, it is thought to be due to the following process. In other words, when the organic solder decomposes, the copper on the surface of the deposited metal acts as a catalyst, causing a decomposition reaction of the organic solder on the surface of the deposited metal, and the free tin in the metal decomposes. Dissolves in copper metal. Furthermore, the undecomposed organic solder migrates to the surface of the deposited metal, decomposes repeatedly, and releases the metal, forming a solder alloy layer on the surface of the copper-tin alloy, and finally bridges the deposited metal with the solder alloy. Then, the deposited metals are joined.
また被着金属の表面から離れた部分においても
有機半田の分解反応が生じて金属が遊離するよう
であるが、その遊離した金属も被着金属の表面に
移行して、接合に寄与しているようである。また
有機半田の分解によつて生じた有機成分であるロ
ジン誘導体はフラツクスとして作用し、被着金属
表面を還元して接合を促進する。 Furthermore, it appears that the decomposition reaction of the organic solder occurs in areas far from the surface of the deposited metal and metal is liberated, but the liberated metal also migrates to the surface of the deposited metal and contributes to the bonding. It seems so. Further, the rosin derivative, which is an organic component produced by the decomposition of the organic solder, acts as a flux, reducing the surface of the deposited metal and promoting bonding.
有機半田の分解が完了したならば、被着金属を
冷却して熔融している半田合金を凝固させ、有機
溶剤で洗浄してロジン誘導体成分を除去し、被着
金属の接合を完了する。 When the decomposition of the organic solder is completed, the deposited metal is cooled to solidify the molten solder alloy, and the rosin derivative component is removed by cleaning with an organic solvent, thereby completing the bonding of the deposited metal.
発明の効果
本発明によれば、金属成分である錫及び鉛は、
有機成分であるマレイン化ロジン又はフマル化ロ
ジンに化学的に結合しており、遊離の金属粒子を
含有しない。従つてこれを回路基板上に供給する
場合に、スクリーンに目詰まりを生じたり、デイ
スペンサーの吐出穴を詰まらせることがなく、精
密な回路パターンに従つて均一に供給することが
できる。また半田合金粉末粒子の径による制約を
受けないので、スクリーンメツシユを極めて細か
いものとすることができ、またデイスペンサーの
穴径も細いものとすることが可能であるので、さ
らに細密なパターンに従つて供給することも可能
となる。Effects of the Invention According to the present invention, the metal components tin and lead are
It is chemically bonded to the organic component maleated rosin or fumarated rosin and does not contain free metal particles. Therefore, when it is supplied onto a circuit board, it can be uniformly supplied according to a precise circuit pattern without clogging the screen or clogging the discharge hole of the dispenser. In addition, since it is not limited by the diameter of the solder alloy powder particles, the screen mesh can be made extremely fine, and the diameter of the dispenser hole can also be made small, making it possible to create even finer patterns. Therefore, it is also possible to supply
また本発明の有機半田においては、先に述べた
ように有機半田が被着金属の表面に移行し、該被
着金属表面において分解し、生じた金属錫は被着
金属中に溶解する。また被着金属の表面外で有機
半田が分解して遊離金属を生じた場合において
も、その遊離金属は被着金属の表面に移行して接
合に寄与する。従つて従来のペースト状半田のよ
うに接合過程において熔融半田の粒子が存在する
ことがない。それ故接合に寄与しない半田粒子が
残存することがなく、回路パターンを短絡させる
恐れがない。 Further, in the organic solder of the present invention, as described above, the organic solder migrates to the surface of the deposited metal, decomposes on the surface of the deposited metal, and the generated metallic tin is dissolved in the deposited metal. Further, even when the organic solder decomposes outside the surface of the deposited metal to generate free metal, the free metal migrates to the surface of the deposited metal and contributes to bonding. Therefore, particles of molten solder do not exist during the bonding process unlike in conventional paste solder. Therefore, there are no remaining solder particles that do not contribute to bonding, and there is no risk of short circuiting the circuit pattern.
さらに本発明の有機半田は、前述のように全て
の遊離金属が被着金属の表面に移行するので、回
路基板表面における回路パターンの形状に拘ら
ず、回路基板表面全体に本発明の有機半田を塗布
することが可能である。回路基板の表面は回路パ
ターンに従つて金属の部分と非金属の部分とが存
在するが、有機半田は金属部分に移行してそこで
分解し、金属成分を遊離する。それ故回路基板の
非金属部分に有機半田を塗布した場合において
も、その有機半田は回路基板の金属部分に移行し
て金属成分を遊離することとなり、金属部分にの
み選択的に半田層を形成する。 Furthermore, as mentioned above, in the organic solder of the present invention, all free metal is transferred to the surface of the deposited metal, so the organic solder of the present invention can be applied to the entire surface of the circuit board, regardless of the shape of the circuit pattern on the surface of the circuit board. It is possible to apply it. The surface of the circuit board has metal parts and non-metal parts according to the circuit pattern, and the organic solder migrates to the metal parts and decomposes there, liberating the metal components. Therefore, even when organic solder is applied to the non-metallic parts of the circuit board, the organic solder migrates to the metal parts of the circuit board and releases the metal components, forming a solder layer selectively only on the metal parts. do.
従つて、複雑な回路パターンに従つてスクリー
ン印刷やデイスペンサーにより精密に半田を供給
する必要がなく、回路パターンの形状に係わりな
く回路基板の全面に極めて簡単に半田を供給する
ことが可能であり、電子回路の製作が極めて簡単
になる。 Therefore, there is no need to precisely apply solder using screen printing or a dispenser according to a complicated circuit pattern, and it is possible to extremely easily apply solder to the entire surface of the circuit board regardless of the shape of the circuit pattern. , the production of electronic circuits becomes extremely simple.
さらに本発明においては、有機半田は均質なも
のであつて遊離の金属粒子を含まず、また前述の
ようにパターンの形状に係わりなく塗布しても必
要部分に半田を供給することができるので、電子
回路に対する部品の接合だけでなく、ICやLSI等
の製造についても適用可能であり、これらにリー
ド線を接合する場合等についても使用することが
できる。 Furthermore, in the present invention, the organic solder is homogeneous and does not contain free metal particles, and as mentioned above, the solder can be applied to the necessary parts regardless of the shape of the pattern. It can be applied not only to joining parts to electronic circuits, but also to manufacturing ICs, LSIs, etc., and can also be used to join lead wires to these products.
実施例
実施例 １
コンデンサー、水抜き管、温度計及び撹拌機を
付した内容量500mlの四つ口フラスコに、トール
油ロジン（酸価168、色調×級、軟化点76℃）300
ｇを仕込み、マントルヒーター上で撹拌しながら
加熱して熔融した。熔融後180℃まで冷却し、無
水マレイン酸57ｇを添加し、190〜200℃で２時間
加熱してマレイン化反応を行い、鹸化価324のマ
レイン化ロジン350ｇを得た。Examples Example 1 Into a 500 ml four-necked flask equipped with a condenser, drain tube, thermometer, and stirrer, add tall oil rosin (acid value 168, color grade ×, softening point 76°C) 300 ml.
g was charged and heated on a mantle heater while stirring to melt. After melting, the mixture was cooled to 180° C., 57 g of maleic anhydride was added, and the mixture was heated at 190 to 200° C. for 2 hours to carry out a maleation reaction to obtain 350 g of maleated rosin having a saponification value of 324.
次に、コンデンサー及び撹拌機を付した内容量
１の四つ口フラスコに、先の工程で得られたマ
レイン化ロジン175ｇ、48％か性カリ水溶液120ｇ
及び水318ｇを加えて、90℃で３時間撹拌しなが
ら鹸化反応を行い、PH10.3、固形分30％のマレイ
ン化ロジンのカリウム塩水溶液を得た。 Next, in a four-necked flask with a capacity of 1 equipped with a condenser and a stirrer, 175 g of the maleated rosin obtained in the previous step and 120 g of the 48% caustic potassium aqueous solution were added.
and 318 g of water were added, and a saponification reaction was carried out with stirring at 90° C. for 3 hours to obtain an aqueous potassium salt solution of maleated rosin having a pH of 10.3 and a solid content of 30%.
撹拌機を付した内容量２のビーカーに、先の
工程で得られたマレイン化ロジンのカリウム塩水
溶液600ｇと、水850ｇとを仕込み、撹拌しながら
稀釈した。一方、内容量500mlのビーカーに塩化
第一錫69ｇ、酢酸鉛45ｇ及び水200ｇを入れて、
撹拌しながら溶解する。当該金属塩水溶液を前記
マレイン化ロジンカリウム塩の稀釈水溶液に添加
し、30℃で１時間複分解反応を行い、脱水、乾燥
して、錫含有量17重量％、鉛含有量12重量％のマ
レイン化ロジンの錫・鉛塩を得た。 In a beaker with a capacity of 2 and equipped with a stirrer, 600 g of the potassium salt aqueous solution of the maleated rosin obtained in the previous step and 850 g of water were charged and diluted with stirring. On the other hand, put 69 g of stannous chloride, 45 g of lead acetate, and 200 g of water in a 500 ml beaker.
Dissolve while stirring. The metal salt aqueous solution was added to the diluted aqueous solution of maleated rosin potassium salt, a double decomposition reaction was carried out at 30°C for 1 hour, dehydrated and dried to form a maleate with a tin content of 17% by weight and a lead content of 12% by weight. Obtained tin-lead salt of rosin.
実施例 ２
内容量500mlのビーカーに塩化第一錫97ｇ及び
水200ｇを入れて撹拌しながら溶解する。当該錫
塩水溶液を、実施例１と同様にして得られたマレ
イン化ロジンカリウム塩の稀釈水溶液に添加し、
30℃で１時間複分解反応を行い、脱水、乾燥し
て、錫含有量26重量％のマレイン化ロジンの錫塩
を得た。Example 2 Put 97 g of stannous chloride and 200 g of water into a 500 ml beaker and dissolve while stirring. Adding the tin salt aqueous solution to a diluted aqueous solution of maleated rosin potassium salt obtained in the same manner as in Example 1,
A metathesis reaction was carried out at 30° C. for 1 hour, followed by dehydration and drying to obtain a tin salt of maleated rosin having a tin content of 26% by weight.
一方、内容量500mlのビーカーに酢酸鉛162ｇ及
び水200ｇを入れて撹拌しながら溶解する。当該
鉛塩水溶液を、実施例１と同様のして得られた前
記マレイン化ロジンカリウム塩の稀釈水溶液に添
加し、30℃で１時間複分解反応を行い、脱水、乾
燥して、鉛含有量37重量％のマレイン化ロジンの
鉛塩を得た。 Meanwhile, put 162 g of lead acetate and 200 g of water into a 500 ml beaker and dissolve while stirring. The lead salt aqueous solution was added to the diluted aqueous solution of the maleated rosin potassium salt obtained in the same manner as in Example 1, and subjected to metathesis reaction at 30°C for 1 hour, dehydrated and dried to reduce the lead content to 37. A weight percent maleated rosin lead salt was obtained.
マレイン化ロジンの錫塩及び鉛塩を、それぞれ
の金属成分の重量比が50：50となるように混合し
た。 Tin salt and lead salt of maleated rosin were mixed such that the weight ratio of each metal component was 50:50.
実施例 ３
コンデンサー、水抜き管、温度計及び撹拌機を
付した内容量500mlの四つ口フラスコに、トール
油ロジン（酸価168、色調Ｘ級、軟化点76℃）300
ｇを仕込み、マントルヒーター上で撹拌しながら
熔融した。熔融後180℃まで冷却し、フマル酸68
ｇを添加し、220℃で２時間加熱してフマル化反
応を行い、鹸化価315のフマル化ロジン362ｇを得
た。Example 3 Into a 500 ml four-necked flask equipped with a condenser, water drain tube, thermometer, and stirrer, tall oil rosin (acid value 168, color X class, softening point 76°C) 300
g was charged and melted while stirring on a mantle heater. After melting, cool to 180℃ and add fumaric acid 68
g was added thereto and heated at 220° C. for 2 hours to carry out a fumarization reaction to obtain 362 g of fumarated rosin with a saponification value of 315.
次に、コンデンサー及び撹拌機を付した内容量
１の四つ口フラスコに、先の工程で得られたフ
マル化ロジン175ｇ、48％か性カリ水溶液115ｇ及
び水323ｇを加えて、90℃で３時間撹拌しながら
鹸化反応を行い、PH10.5、固形分30.3％のフマル
化ロジンのカリウム塩水溶液600ｇを得た。 Next, 175 g of the fumarized rosin obtained in the previous step, 115 g of a 48% caustic potassium aqueous solution, and 323 g of water were added to a four-necked flask with an inner capacity of 1 equipped with a condenser and a stirrer, and the mixture was heated at 90°C for 30 minutes. A saponification reaction was carried out while stirring for hours to obtain 600 g of a potassium salt aqueous solution of fumarated rosin having a pH of 10.5 and a solid content of 30.3%.
撹拌機を付した内容量２のビーカーに、先の
工程で得られた得られたフマル化ロジンのカリウ
ム塩水溶液600ｇと水850ｇとを仕込み、撹拌しな
がら稀釈した。一方、内容量500mlのビーカーに
塩化第一錫67ｇ、酢酸鉛43ｇ及び水200ｇを入れ
て撹拌しながら溶解する。当該金属塩水溶液を、
前記フマル化ロジンカリウム塩の稀釈水溶液に添
加し、30℃で１時間複分解反応を行い、脱水、乾
燥して、錫含有量16.3重量％、鉛含有量11重量％
のフマル化ロジンの錫・鉛塩を得た。 In a beaker with an inner capacity of 2 and equipped with a stirrer, 600 g of the aqueous potassium salt solution of the fumarized rosin obtained in the previous step and 850 g of water were charged and diluted with stirring. Meanwhile, put 67 g of stannous chloride, 43 g of lead acetate, and 200 g of water into a 500 ml beaker and dissolve while stirring. The metal salt aqueous solution,
It was added to the diluted aqueous solution of fumarized rosin potassium salt, subjected to double decomposition reaction at 30°C for 1 hour, dehydrated and dried to obtain a tin content of 16.3% by weight and a lead content of 11% by weight.
The tin-lead salt of fumarized rosin was obtained.
実施例 ４
内容量500mlのビーカーに塩化第一錫95ｇ及び
水200ｇを入れて、撹拌しながら溶解する。当該
錫塩水溶液を、実施例３と同様にして得られたフ
マル化ロジンカリウム塩の稀釈水溶液に添加し、
30℃で１時間複分解反応を行い、脱水、乾燥し
て、錫含有量25.5重量％のフマル化ロジンの錫塩
を得た。Example 4 Put 95 g of stannous chloride and 200 g of water into a 500 ml beaker and dissolve while stirring. Adding the tin salt aqueous solution to a diluted aqueous solution of fumarated rosin potassium salt obtained in the same manner as in Example 3,
A metathesis reaction was carried out at 30° C. for 1 hour, followed by dehydration and drying to obtain a tin salt of fumarated rosin having a tin content of 25.5% by weight.
一方、内容量500mlのビーカーに酢酸鉛157ｇ及
び水200ｇを入れて、撹拌しながら溶解する。当
該鉛塩水溶液を、実施例３と同様にして得られた
前記フマル化ロジンカリウム塩の稀釈水溶液に添
加し、30℃で１時間複分解反応を行い、脱水、乾
燥して、鉛含有量36.5重量％のフマル化ロジンの
鉛塩を得た。 Meanwhile, put 157 g of lead acetate and 200 g of water in a 500 ml beaker and dissolve while stirring. The lead salt aqueous solution was added to the diluted aqueous solution of the fumarized rosin potassium salt obtained in the same manner as in Example 3, and a double decomposition reaction was carried out at 30°C for 1 hour, followed by dehydration and drying, resulting in a lead content of 36.5 weight. % of lead salt of fumarated rosin was obtained.
フマル化ロジンの錫塩及び鉛塩を、それぞれの
金属成分の重量比が50：50となるように混合し
た。 The tin salt and lead salt of fumarized rosin were mixed such that the weight ratio of each metal component was 50:50.
実施例 ５
実施例１において、トール油ロジンに代えてウ
ツドロジン（酸価167.5、色調WW級、軟化点75
℃）を使用した他は、実施例１と同様に操作し
て、錫含有率17.3重量％、鉛含有率12.2重量％の
マレイン化ロジンの錫・鉛塩を得た。Example 5 In Example 1, Utdrosin (acid value 167.5, color WW grade, softening point 75) was used instead of tall oil rosin.
A tin/lead salt of maleated rosin having a tin content of 17.3% by weight and a lead content of 12.2% by weight was obtained in the same manner as in Example 1, except that the following procedure was performed.
実施例 ６
実施例１において、トール油ロジンに代えて中
国産ガムロジン（酸価169.0、色調Ｘ級、軟化点
79℃）を使用した他は、実施例１と同様に操作し
て、錫含有率17.5重量％、鉛含有率11.5重量％の
マレイン化ロジンの錫・鉛塩を得た。Example 6 In Example 1, Chinese gum rosin (acid value 169.0, color tone class X, softening point
A tin/lead salt of maleated rosin having a tin content of 17.5% by weight and a lead content of 11.5% by weight was obtained by the same operation as in Example 1, except that a temperature of 79°C) was used.
実施例 ７
コンデンサー及び撹拌機を付した内容量１の
四つ口フラスコに、マレオピマレート（純度90
％、鹸化価395）175ｇ、48％か性カリ水溶液145
ｇ及び水290ｇを加えて、90℃で３時間撹拌しな
がら鹸化反応を行い、PH10.0、固形分31.0％のマ
レオピマレートのカリウム塩水溶液を得た。Example 7 Maleopimalate (purity 90
%, saponification value 395) 175g, 48% caustic potassium aqueous solution 145
g and 290 g of water were added thereto, and a saponification reaction was carried out with stirring at 90° C. for 3 hours to obtain an aqueous potassium salt solution of maleopimalate having a pH of 10.0 and a solid content of 31.0%.
撹拌機を付した内容量２のビーカーに、先の
工程で得られたマレオピマレートのカリウム塩水
溶液600ｇと水850ｇとを仕込み、撹拌しながら稀
釈した。一方、内容量500mlのビーカーに塩化第
一錫84ｇ、酢酸鉛54ｇ及び水200ｇを入れて撹拌
しながら溶解する。当該金属塩水溶液を前記マレ
オピマレートカリウム塩の稀釈水溶液に添加し、
30℃で１時間複分解反応を行い、脱水、乾燥し
て、錫含有量20.5重量％、鉛含有量13.5重量％の
マレオピマレートの錫・鉛塩を得た。 In a beaker with a capacity of 2 and equipped with a stirrer, 600 g of the potassium salt aqueous solution of maleopimalate obtained in the previous step and 850 g of water were charged and diluted with stirring. Meanwhile, put 84 g of stannous chloride, 54 g of lead acetate, and 200 g of water into a 500 ml beaker and dissolve while stirring. Adding the metal salt aqueous solution to the diluted aqueous solution of maleopimalate potassium salt,
A double decomposition reaction was carried out at 30° C. for 1 hour, followed by dehydration and drying to obtain a tin-lead salt of maleopimalate having a tin content of 20.5% by weight and a lead content of 13.5% by weight.
実施例 ８
水抜き管、コンデンサー、温度計及び撹拌機を
付した内容量300mlの四つ口フラスコに、実施例
１と同様に操作して得られたマレイン化ロジン
（鹸化価324）50ｇ、ミネラルスピリツト30ｇ及び
トルエン10ｇを仕込み、マントルヒーター上で撹
拌しながら140℃に昇温して溶解した。140℃で酸
化第一錫12ｇ、一酸化鉛13ｇ及びミネラルスピリ
ツト40ｇを添加して、220℃で１時間反応させた
後、同温度で脱溶剤を行い、錫含有量14重量％、
鉛含有量15重量％のマレイン化ロジンの錫・鉛塩
を得た。Example 8 Into a 300 ml four-necked flask equipped with a drain tube, condenser, thermometer and stirrer, 50 g of maleated rosin (saponification value 324) obtained by the same procedure as in Example 1, and minerals were added. 30 g of spirit and 10 g of toluene were charged, and the temperature was raised to 140° C. while stirring on a mantle heater to dissolve. 12 g of stannous oxide, 13 g of lead monoxide and 40 g of mineral spirits were added at 140°C and reacted at 220°C for 1 hour, then the solvent was removed at the same temperature to obtain a tin content of 14% by weight.
A tin-lead salt of maleated rosin with a lead content of 15% by weight was obtained.
実施例 ９
実施例８において、マレイン化ロジンに代えて
実施例３と同様に操作して得られたフマル化ロジ
ン（鹸化価319）を使用した点の他は、実施例８
と同様に操作して、錫含有率13.8重量％、鉛含有
率15重量％のフマル化ロジンの錫・鉛塩を得た。Example 9 Same as Example 8 except that fumarated rosin (saponification value 319) obtained by the same operation as Example 3 was used instead of maleated rosin.
In the same manner as above, a tin-lead salt of fumarated rosin having a tin content of 13.8% by weight and a lead content of 15% by weight was obtained.
比較例 １
コンデンサー及び撹拌機を付した内容量１の
四つ口フラスコに、ナフテン酸（酸価230）175
ｇ、48％か性カリ水溶液84ｇ及び水353ｇを仕込
み、40℃で１時間撹拌しながら鹸化反応を行い、
PH10.0、固形分29.5％のナフテン酸カリウム水溶
液を得た。Comparative Example 1 Naphthenic acid (acid value 230) 175 was placed in a four-necked flask with a capacity of 1 and equipped with a condenser and a stirrer.
g, 84 g of a 48% caustic potassium aqueous solution and 353 g of water were charged, and a saponification reaction was carried out with stirring at 40°C for 1 hour.
An aqueous potassium naphthenate solution with a pH of 10.0 and a solid content of 29.5% was obtained.
撹拌機を付した内容量２のビーカーに、先の
工程で得られたナフテン酸カリウム水溶液600ｇ
と水850ｇとを仕込み、撹拌しながら稀釈した。
一方、内容量500mlのビーカーに塩化第一錫49ｇ、
酢酸鉛32ｇ及び水200ｇを入れて撹拌しながら溶
解する。当該金属塩の水溶液を前記ナフテン酸カ
リウムの稀釈水溶液に添加し、30℃で１時間複分
解反応を行い、脱水、乾燥して、錫含有量13重量
％、鉛含有量8.5重量％のナフテン酸の錫・鉛塩
を得た。 In a beaker with a capacity of 2 and equipped with a stirrer, add 600 g of the potassium naphthenate aqueous solution obtained in the previous step.
and 850 g of water and diluted with stirring.
On the other hand, 49 g of stannous chloride was placed in a beaker with a content of 500 ml.
Add 32g of lead acetate and 200g of water and dissolve while stirring. The aqueous solution of the metal salt was added to the diluted aqueous solution of potassium naphthenate, subjected to metathesis reaction at 30°C for 1 hour, dehydrated and dried to obtain naphthenic acid with a tin content of 13% by weight and a lead content of 8.5% by weight. Obtained tin and lead salts.
比較例 ２
コンデンサー及び撹拌機を付した内容量３の
四つ口フラスコに、トール油脂肪酸（酸価193.5）
175ｇ、48％か性カリ水溶液71ｇ及び水1600ｇを
仕込み、40℃で１時間撹拌しながら鹸化反応を行
い、PH10.3、固形分9.1％のトール油脂肪酸のカ
リウム塩水溶液を得た。一方、内容量500mlのビ
ーカーに塩化第一錫42ｇ、酢酸鉛27ｇ及び水200
ｇを入れて撹拌しながら溶解する。当該金属塩の
水溶液を前記トール油脂肪酸カリウム塩の水溶液
に添加し、30℃で１時間複分解反応を行い、脱
水、乾燥して、錫含有量9.5重量％、鉛含有量７
重量％のトール油脂肪酸の錫・鉛塩を得た。Comparative Example 2 Tall oil fatty acid (acid value 193.5) was placed in a four-necked flask with a capacity of 3 equipped with a condenser and a stirrer.
175 g of a 48% caustic potassium aqueous solution and 1600 g of water were charged, and a saponification reaction was carried out with stirring at 40° C. for 1 hour to obtain an aqueous potassium salt solution of tall oil fatty acids with a pH of 10.3 and a solid content of 9.1%. Meanwhile, in a beaker with a content of 500 ml, 42 g of stannous chloride, 27 g of lead acetate, and 200 g of water.
Add g and dissolve while stirring. The aqueous solution of the metal salt was added to the aqueous solution of the tall oil fatty acid potassium salt, a double decomposition reaction was carried out at 30°C for 1 hour, dehydrated and dried, and the tin content was 9.5% by weight and the lead content was 7%.
A tin-lead salt of tall oil fatty acids was obtained in weight percent.
比較例 ３
コンデンサー及び撹拌機を付した内容量１の
四つ口フラスコに、中国産ガムロジン（酸価
169.0、色調Ｘ級、軟化点78℃）175ｇ、48％か性
カリ水溶液63ｇ及び水374ｇを仕込み、90℃で３
時間撹拌しながら鹸化反応を行いPHPH10.5、固形
分30.5％のガム化ロジンのカリウム塩水溶液を得
た。Comparative Example 3 Chinese gum rosin (acid value
169.0, color tone grade
A saponification reaction was carried out while stirring for hours to obtain a potassium salt aqueous solution of gummy rosin with a pH of 10.5 and a solid content of 30.5%.
撹拌機を付した内容量２のビーカーに、先の
工程で得られたガムロジンカリウム塩水溶液600
ｇと水850ｇとを仕込み、撹拌しながら稀釈した。
一方、内容量500mlのビーカーに塩化第一錫38ｇ、
酢酸鉛26ｇ及び水200ｇを入れて撹拌しながら溶
解する。当該金属塩水溶液を前記ガムロジンカリ
ウム塩の稀釈水溶液に添加し、30℃で１時間複分
解反応を行い、脱水、乾燥して、錫含有量９重量
％、鉛含有量5.8重量％のガムロジンの錫・鉛塩
を得た。 In a beaker with a capacity of 2 and equipped with a stirrer, add 600 g of the gum rosin potassium salt aqueous solution obtained in the previous step.
g and 850 g of water were added and diluted with stirring.
Meanwhile, 38 g of stannous chloride was placed in a beaker with a content of 500 ml.
Add 26g of lead acetate and 200g of water and dissolve while stirring. The metal salt aqueous solution was added to the diluted aqueous solution of the gum rosin potassium salt, subjected to metathesis reaction at 30°C for 1 hour, dehydrated and dried to form tin gum rosin with a tin content of 9% by weight and a lead content of 5.8% by weight. - Obtained lead salt.
比較例 ４
コンデンサー及び撹拌機を付した内容量１の
四つ口フラスコに、不均斉化ロジン（酸価157.0、
色調Ｘ級、軟化点80℃）175ｇ、48％か性カリ水
溶液58ｇ及び水367ｇを仕込み、90℃で３時間撹
拌しながら鹸化反応を行い、PH10.2、固形分29.5
％の不均斉化ロジンのカリウム塩水溶液を得た。Comparative Example 4 Asymmetric rosin (acid value 157.0,
Pour 175g of 48% caustic potassium aqueous solution and 367g of water, and perform saponification reaction with stirring at 90°C for 3 hours, resulting in a pH of 10.2 and a solid content of 29.5.
% of aqueous potassium salt solution of disproportionated rosin was obtained.
撹拌機を付した内容量２のビーカーに、先の
工程で得られた不均斉化ロジンのカリウム塩の水
溶液600ｇと水850ｇとを仕込み、撹拌しながら稀
釈した。一方、内容量500mlのビーカーに塩化第
一錫35ｇ、酢酸鉛23ｇ及び水200ｇを入れて、撹
拌しながら溶解する。当該金属塩の水溶液を、前
記不斉化ロジンカリウム塩の稀釈水溶液に添加
し、30℃で１時間複分解反応を行い、脱水、乾燥
して、錫含有量8.5重量％、鉛含有量５重量％の
不均斉化ロジンの錫・鉛塩を得た。 In a beaker with a capacity of 2 and equipped with a stirrer, 600 g of the aqueous solution of the potassium salt of the disproportionated rosin obtained in the previous step and 850 g of water were charged and diluted with stirring. Meanwhile, put 35 g of stannous chloride, 23 g of lead acetate, and 200 g of water into a 500 ml beaker and dissolve while stirring. The aqueous solution of the metal salt was added to the diluted aqueous solution of the asymmetric rosin potassium salt, a metathesis reaction was carried out at 30°C for 1 hour, dehydrated and dried to obtain a tin content of 8.5% by weight and a lead content of 5% by weight. A tin-lead salt of disproportionated rosin was obtained.
性能試験
膜厚試験
先の各実施例及び比較例で合成された有機半田
１モルに対して、ヒドラジン１−塩酸塩0.2モル
を加えて混合し、この混合物１ｇをトリエタノー
ルアミン１ｇに溶解する。30mm×30mm×50μ厚の
銅箔をプラスして、内法15mm×15mm×1.0mm深の
ボート型を成型し、該ボート型内に前記有機半田
の溶液を入れ、電気炉で350℃で30秒間加熱し、
その後冷却して半田層の膜厚を測定した。Performance Test Film Thickness Test 0.2 mole of hydrazine 1-hydrochloride is added and mixed to 1 mole of the organic solder synthesized in each of the above Examples and Comparative Examples, and 1 g of this mixture is dissolved in 1 g of triethanolamine. Add a 30mm x 30mm x 50μ thick copper foil to form a boat mold with an inner diameter of 15mm x 15mm x 1.0mm deep, pour the organic solder solution into the boat mold, and heat it in an electric furnace at 350°C for 30 minutes. Heat for seconds,
Thereafter, it was cooled and the thickness of the solder layer was measured.
接合強度試験
30mm長×２mm幅×50μｍ厚の銅箔を中央で略Ｌ
字状に曲げて、その一辺を30mm×30mm×50μ高の
銅箔の中央に載置し、その接触面に先の膜厚試験
と同様に調製した各有機半田の溶液を塗布し、
350℃のホツトプレート上で１分間加熱する。冷
却後引張り剥離試験を行い、接合強度を測定し
た。Bonding strength test 30mm long x 2mm wide x 50μm thick copper foil approximately L in the center
Bend it into a letter shape, place one side of it in the center of a 30 mm x 30 mm x 50 μ high copper foil, and apply each organic solder solution prepared in the same way as the previous film thickness test to the contact surface.
Heat on a hot plate at 350°C for 1 minute. After cooling, a tensile peel test was conducted to measure the bonding strength.
試験結果 例 膜厚試験（μ） 接合強度試験（Kg） 実施例１ 3.5 0.3 実施例２ 8.2 1.1 実施例３ 3.4 0.3 実施例４ 7.4 1.3 実施例５ 3.3 0.4 実施例６ 3.3 0.3 実施例７ 3.0 0.5 実施例８ 2.1 0.3 実施例９ 2.1 0.3 比較例１ 0.8 接合せず 比較例２ 0.6 接合せず 比較例３ 測定不能 接合せず 比較例４ 測定不能 接合せずTest results Example Film thickness test (μ) Bonding strength test (Kg) Example 1 3.5 0.3 Example 2 8.2 1.1 Example 3 3.4 0.3 Example 4 7.4 1.3 Example 5 3.3 0.4 Example 6 3.3 0.3 Example 7 3.0 0.5 Example 8 2.1 0.3 Example 9 2.1 0.3 Comparative example 1 0.8 Not joined Comparative example 2 0.6 Not joined Comparative example 3 Unmeasurable Not joined Comparative example 4 Unmeasurable Not joined
Claims (1)
及び鉛との塩よりなり、該塩中の錫含有量が12〜
24重量％であり、鉛含有量が４〜23重量％である
ことを特徴とする、有機半田。1 Consisting of a salt of maleated rosin or fumarated rosin, tin and lead, and the tin content in the salt is 12 to 12.
24% by weight, and the lead content is from 4 to 23% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7204486A JPS62227593A (en) | 1986-03-28 | 1986-03-28 | Organic solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7204486A JPS62227593A (en) | 1986-03-28 | 1986-03-28 | Organic solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62227593A JPS62227593A (en) | 1987-10-06 |
| JPH0516957B2 true JPH0516957B2 (en) | 1993-03-05 |
Family
ID=13478001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7204486A Granted JPS62227593A (en) | 1986-03-28 | 1986-03-28 | Organic solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62227593A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0747233B2 (en) * | 1987-09-14 | 1995-05-24 | 古河電気工業株式会社 | Solder deposition composition and solder deposition method |
| US5118029A (en) * | 1989-11-30 | 1992-06-02 | The Furukawa Electric Co., Ltd. | Method of forming a solder layer on pads of a circuit board and method of mounting an electronic part on a circuit board |
| JP3390245B2 (en) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | Cleaning liquid and cleaning method |
| EP4112587A1 (en) * | 2021-06-29 | 2023-01-04 | Heraeus Deutschland GmbH & Co. KG | Method for producing a metal-ceramic substrate though rapid heating |
-
1986
- 1986-03-28 JP JP7204486A patent/JPS62227593A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62227593A (en) | 1987-10-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5145532A (en) | Solder precipitating composition | |
| JP2010120089A (en) | Lead-free solder paste | |
| JP2000094179A (en) | Solder paste and manufacture of the same and method for solder precoating | |
| US4509994A (en) | Solder composition for high-density circuits | |
| JP2013193097A (en) | Solder composition and method of forming solder bump by using the same | |
| US20190132961A1 (en) | Electroconductive Paste, Electronic Substrate, and Method for Manufacturing Said Substrate | |
| JPH0564997B2 (en) | ||
| JPH0661641A (en) | Low-bridging soldering method | |
| JPH0516957B2 (en) | ||
| JP4920401B2 (en) | Method for manufacturing conductive circuit board | |
| KR101923965B1 (en) | A flux composition and method of soldering | |
| US4531986A (en) | Solder composition | |
| JP3998536B2 (en) | Bonding material and manufacturing method thereof, supplying method of bonding material, and electronic circuit board | |
| JP2604593B2 (en) | Method of forming solder coating on metal surface | |
| CZ304297A3 (en) | System and process for producing electrically-conducting connecting structures, as well as process for producing circuits and fitted circuits | |
| JP3648697B2 (en) | Solder paste composition, method for producing printed wiring board having solder pads, and method for producing electronic component mounting circuit board | |
| JP5652689B2 (en) | Manufacturing method of electronic component bonded structure and electronic component bonded structure obtained by the manufacturing method | |
| US4728023A (en) | Rosin-free solder composition | |
| JP3362079B2 (en) | Solder powder fixing method | |
| US4673532A (en) | Rosin-free solder composition | |
| JPH0955578A (en) | Sheet applied with powder solder and formation of solder circuit | |
| JP2987227B2 (en) | Low melting point solder deposition composition and method for producing low melting point solder precoated circuit board | |
| CN110653516A (en) | Special soldering paste for welding multistage packaging patch elements | |
| JPH0417994A (en) | Solder composition | |
| JP7584114B2 (en) | Manufacturing method for electronic component mounting board |