JPH05169425A - Cutting method of ceramic material - Google Patents

Abstract

PURPOSE:To provide an efficient cutting method of a ceramic material by removing operation such as washing of an adhesive agent along with a reduction of a cutting time. CONSTITUTION:The title method is constituted so that a piled up ceramic materials (ceramic sheet) 2 which are to be cut off are coated with a heat- shrinkable tube 4, the same is fixed to a base 10 with an adhesive agent 12 and the ceramic material 2 is cut off in the lump along with the base 10 on the heat-shrinkable tube 4 by a cutting device (cutter edge) 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a ceramic material used for a piezoelectric conversion element or the like.

[0002]

2. Description of the Related Art FIG. 8 shows a ceramic plate 2 having a rectangular shape as a ceramic material which is a basic material used for a piezoelectric conversion element or the like. This ceramic plate 2 has a thickness of 1
In order to cut such a so-called thin material to a constant size, the ceramic plate 2 is bonded one by one to a glass plate (not shown), then cut together with the glass plate by a cutter, and an adhesive is applied from the cut ceramic piece. The method of removing the solvent by washing with a solvent is used.

[0003]

However, such a cutting method requires a lot of time and labor for cutting one by one, and it takes a long time to cut the adhesive. However, it is not possible to say that the residual adhesive remains even if the adhesive is washed with a solvent, and this does not affect the final product.

Therefore, an object of the present invention is to provide a method of cutting a ceramic material, which shortens the cutting time and improves the efficiency of the cutting work excluding the work of cleaning the adhesive.

[0005]

According to the method for cutting a ceramic material of the present invention, ceramic materials to be cut (ceramic plate 2) are superposed on each other, covered with a heat-shrinkable tube (4), and then adhered to a substrate (10). It is characterized in that it is fixed with an agent (12), and the ceramic material is collectively cut from above the heat-shrinkable tube together with the substrate by a cutting means (cutter blade 14).

[0006]

The ceramic materials to be cut are stacked and bundled together by a heat shrink tube. A ceramic material bundled with a heat-shrinkable tube for positioning or the like is fixed to the substrate with an adhesive from above the heat-shrinkable tube. Then, the heat-shrinkable tube is cut together with the substrate by the cutting means. By removing the heat-shrinkable tube from the ceramic material cut in this way, a piece of ceramic material cut into a predetermined size is obtained. Since the adhesive is applied from above the heat-shrinkable tube, the cut ceramic material pieces do not have the adhesive adhered thereto, and the conventional cleaning is unnecessary. Further, since the bundles are collectively cut, the cutting time is greatly shortened as compared with the conventional case of cutting one by one.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The ceramic material cutting method of the present invention will be described in detail below with reference to the embodiments shown in the drawings.

1 to 6 show one embodiment of a method for cutting a ceramic material according to the present invention in the order of steps.
For this method of cutting the ceramic material, the ceramic material as the material to be cut and the ceramic plate 2 shown in FIG. 8 are used. Several to several tens of the ceramic plates 2 are superposed on each other, placed in a cylindrical heat-shrinkable tube 4, and heat-treated to form a block 6 bundled with the heat-shrinkable tube 4 as shown in FIG. To The heat-shrinkable tube 4 is a hose-shaped film made of vinyl chloride.

Next, as shown in FIGS. 3 and 4, the block body 6 is fixed on a substrate 10 made of a glass plate laminated on the metal plate 8. An adhesive 12 is used for this fixing means, and the adhesive 12 is applied while avoiding the ceramic plate 2. By applying the adhesive 12 from above the heat-shrinkable tube 4, the block body 6 is applied to the substrate 10 with the adhesive 12. Stick firmly on top.

Next, as shown in FIG. 5, as a cutting means, for example, a cutter blade 14 is rotated to move in the direction of the block body 6 (arrow A), and the block body 6 is predetermined together with the metal plate 8 and the substrate 10. Cut to the size of. FIG. 6 shows a cutting block piece 60 obtained by cutting.

Next, when the heat shrinkable tube 4 is removed from the cutting block piece 60, the necessary ceramic piece 20 is obtained as shown in FIG. In this case, the heat-shrinkable tube 4 can be easily removed by making a slight scratch with a cutter or the like, and the bundled ceramic pieces 20 are
It can be separated into individual sheets.

According to such a cutting method, since a plurality of ceramic plates 2 are bundled by the heat-shrinkable tubes 4 and cut in a batch, a large number of ceramic pieces 20 can be formed in a short time, and moreover, the heat-shrinkable tubes 4 can be formed. Since the adhesive 12 is applied from above, it is not necessary to remove the adhesive 12, that is, washing with a solvent when the resin is adhered, and the resin does not contaminate the ceramic piece 20 with the solvent.
There are advantages such as simplification of cutting work and easy quality control.

In the embodiment, the plate-shaped ceramic material has been described as an example, but the present invention can also be applied to the case of collectively cutting the rod-shaped ceramic material.

[0014]

As described above, according to the present invention,
Since multiple ceramic materials are bundled and cut all at once, the cutting time can be greatly reduced, and since the adhesive is applied from above the heat-shrinkable tube, there is no contamination on the cut ceramic materials, As described above, it is not necessary to wash with a solvent, and the cutting process can be made efficient.

[Brief description of drawings]

FIG. 1 is a perspective view showing a process of attaching a heat-shrinkable tube in an embodiment of a method for cutting a ceramic material according to the present invention.

FIG. 2 is a perspective view showing a ceramic material covered with a heat-shrinkable tube in an embodiment of the method for cutting a ceramic material according to the present invention.

FIG. 3 is a perspective view showing a state in which a ceramic material covered with a heat-shrinkable tube is fixed to a substrate in an embodiment of the method for cutting a ceramic material according to the present invention.

FIG. 4 is a front view of a ceramic material fixed to the substrate shown in FIG. 3 with a heat shrinkable tube.

FIG. 5 is a diagram showing a cutting step in an example of the method for cutting a ceramic material according to the present invention.

6 is a perspective view showing the ceramic material after cutting obtained in the cutting step shown in FIG.

FIG. 7 is a perspective view showing a cut ceramic piece.

FIG. 8 is a perspective view showing a ceramic material to be cut.

[Explanation of symbols]

 2 Ceramic Plate (Ceramic Material) 4 Heat Shrink Tube 10 Substrate 12 Adhesive 14 Cutter Blade (Cutting Means)

Claims (1)

[Claims] 1. A ceramic material to be cut is superposed and covered with a heat-shrinkable tube, which is then fixed to the substrate with an adhesive, and the ceramic material is collected together with the substrate from above the heat-shrinkable tube by cutting means. A method for cutting a ceramic material, which comprises cutting.