JPH05164818A - Measuring method for semiconductor and measuring equipment for semiconductor - Google Patents

Abstract

PURPOSE:To prevent mixing of defectives into non-defectives or mixing of selected devices of different characteristics into each other at the time of measurement of semiconductor devices. CONSTITUTION:A tray 4 especially used for defectives is provided on a semiconductor measuring equipment or an enclosing section of trays for selected devices is provided on a characteristic rank selecting equipment, and an interlock circuit for a start switch 7 on a test deck 3 is provided, for instance, on an interface box 2 of the semiconductor measuring equipment. After completion of a measurement of a semiconductor device 6 by a host tester 1, a defective semiconductor device 6 is placed on the tray 4 or a characteristic selected semiconductor device 6 is placed on the enclosing section of the trays, then a sensor 5 detects that a semiconductor device 6 is placed on the tray 4 especially used for defectives or on the enclosing section of the trays to release the interlock of the start switch 7 on the test deck 3, and the measurement of the next semiconductor device 6 is started.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device measuring apparatus, and more particularly to preventing defective products from mixing into non-defective products or mixed products having different characteristics when manually measuring semiconductor devices. There are features.

[0002]

2. Description of the Related Art Conventionally, when a defective product is generated when a semiconductor device of a product is manually measured, the operator is informed of the defective product as shown in FIG. It is displayed on the CRT display 21 of the semiconductor measuring device to inform the operator. B. The semiconductor measuring device gives a sound with a buzzer 22 or the like to notify the operator. C. The operator is notified by light such as lighting and blinking of the LED 23 and lamp. Various methods have been adopted depending on the measurement and display method of the semiconductor measuring device. Regarding the processing of defective semiconductor devices, a defective semiconductor device is put in a defective tray or the like to be discriminated from a non-defective semiconductor device according to the operator's judgment.

[0003]

However, in the case of sorting defective semiconductor devices that rely on the operator's judgment as described above, mixing of defective products and non-defective products due to human error cannot be avoided.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a semiconductor measuring device with a dedicated defective product mounting portion or sorted product mounting portion, By installing a circuit that interlocks the starter and placing a defective semiconductor device on the defective product placement section or by placing a sorted semiconductor device on the sorted product placement section, the semiconductor device cannot be used exclusively by the sensor. It is possible to detect that the product is placed on the non-defective product placement unit or the sorted product placement unit and release the circuit for interlocking the starter to start the measurement of the next semiconductor device.

[0005]

Therefore, according to the present invention, the interlock of the starting device is not released unless the defective or sorted semiconductor device is placed on the dedicated defective product placement portion or the sorted product placement portion. It is not possible to start, and defective semiconductor devices are not mixed into non-defective products or sorted semiconductor devices having different characteristics are not mixed.

[0006]

Embodiments of the semiconductor measuring apparatus of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram illustrating a basic configuration of a semiconductor measuring device of the present invention, FIG. 2 is a flowchart illustrating a measuring operation of the semiconductor measuring device of the present invention, and FIG.
Is a circuit diagram showing an example of a control circuit of the semiconductor measuring device of the present invention, and FIG. 4 is a timing chart explaining the operation of the control circuit of the semiconductor measuring device of the present invention.

The configuration of the semiconductor measuring device of the present invention will be described with reference to FIG. As shown in FIG. 1, the semiconductor measuring apparatus of the present invention comprises a host tester 1, an interface box 2, a test deck 3 and a tray 4 exclusively for defective products. A sensor 5 is attached to detect that the sheet has been placed on the defective article dedicated tray 4. In addition, test deck 3
Is provided with a start switch 7 and a socket or a jig (not shown) for mounting the semiconductor device 6 and connecting it to the test deck 3 when measuring the semiconductor device 6.

The host tester 1, the interface box 2, the test deck 3 and the defective product dedicated tray 4 of the semiconductor measuring apparatus of the present invention are connected by signal lines, and various signals for measurement are input and output between the signal lines. The measurement of the semiconductor device 6 is started by the various signals, the quality is judged, and when a defective semiconductor device 6 is generated, an interlock is performed and the defective semiconductor device 6 is replaced with the defective product dedicated tray 4 The semiconductor device 6 of the defective product by the sensor 5
Is detected, the interlock is released, and the next semiconductor device 6
The measurement is started. Next, each signal will be described. Test start signal This signal is a measurement start signal to the host tester 1 (computer), which is generated by setting the semiconductor device 6 on the test deck 3 and pressing the start switch 7, and via the interface box 2 to the host tester. Input to 1. PASS / NG signal This signal is a determination signal of the measurement result of the semiconductor device 6 after the host tester 1 starts measuring the semiconductor device 6 and after the measurement. Sensor signal This signal indicates the defective semiconductor device 6 to the defective product dedicated tray 4
It is a signal for detecting that it has been placed on it and inputting it to the interface box 2 to release the interlock.

A method of measuring the semiconductor device 6 by the semiconductor measuring device of the present invention will be described with reference to FIG. First, set the semiconductor device 6, which is the object to be measured, in the socket of the test deck 3 (or a jig, which will hereinafter be unified as a socket), press the start switch 7 of the test deck 3 and send a test start signal via the interface box 2. Send to host tester 1 and start measurement. When the measurement is completed and the semiconductor device 6 is non-defective, the PASS signal is output from the host tester 1 to the interface box 2, and the non-defective counter (not shown) is incremented by one count. Then, the semiconductor device 6 is removed from the socket of the test deck 3 and a non-defective tray (not shown)
Then, the measurement of the next semiconductor device 6 is started. If the semiconductor device 6 is defective, the host tester 1 outputs an NG signal to the interface box 2 to perform interlock. When the interlock is performed, it is necessary to inform the operator that the interlock is performed. Therefore, a buzzer (not shown) is sounded to place the defective semiconductor device 6 on the defective product dedicated tray 4. Encourage. Then, when the defective semiconductor device 6 is removed from the socket of the test deck 3 and placed on the defective product tray 4, the sensor 5 detects that the semiconductor device 6 is placed, and a sensor signal is output to the interface box 2. The interlock is released, the buzzer is stopped, and the next semiconductor device 6 can be measured.

The control circuit of the semiconductor measuring apparatus of the present invention and its operation will be described with reference to FIGS. 3 and 4. FIG. 3 shows an example of a control circuit of the semiconductor measuring device according to the present invention, which includes a start signal input terminal 8, a start signal output terminal 9, and P.
An ASS / NG signal input terminal 10 and a sensor signal input terminal 11 are provided. The start signal input terminal 8 is connected to the start switch 7 of the test deck 3, the start signal output terminal 9 is connected to the host tester 1 via the interface box 10, and PASS
The / NG signal input terminal 10 is connected to the host tester 1,
The sensor signal input terminal 11 is connected to the sensor 5.
The operation of this control circuit will be described with reference to the timing chart of FIG. 1. When the first semiconductor device 6 is set in the socket of the test deck 3 and the start switch 7 is pressed, the start signal terminal 8 goes from high (henceforth, H) to low (henceforth, L)
Switch to and output the SW ₁ signal. 2. When the SW ₁ signal is output, the start signal output terminal 9
Also switches from H to L, the ST ₁ start signal is output from the start signal output terminal 9 to the host tester 1, and the host tester 1 starts measurement. 3. Whether the semiconductor device 6 is good or bad is determined t ₁ hours after the measurement is started, the PASS signal (H) is output from the host tester 1 in the case of a good product, and the NG signal (L) is output in the case of a defective product.
It is input to the PASS / NG signal input terminal 10. 4. When the PASS signal is input, the PASS / NG signal remains H, so that the NG latch signal at the fifth terminal of IC001 (LS74) in FIG. 3 does not change and the next measurement is started. 5. When the NG signal is input, the PASS / NG signal switches from H to L, resulting in IC001 (LS74)
The NG latch signal of the No. 5 terminal is switched from L to H to notify the operator that the interlock is being performed at the same time as the interlock is being performed by the buzzer (BZ). 6. The interlock is performed for a time t ₂ until the defective semiconductor device 6 is removed from the socket of the test deck 3 and placed on the defective product tray 4, and the buzzer continues to ring. 7. Even if the start switch 7 is pressed by mistake during this time t ₂ , the start signal SW ₂ is output, but the NG latch signal keeps the H state, so the start signal ST ₂
Is not output. 8. After t ₂ hours, the semiconductor device 6 is placed on the defective product dedicated tray 4, and when detected by the sensor 5, the sensor signal is input to the sensor signal input terminal 11, and the sensor signal input terminal 11 switches from H to L. As a result, the NG latch signal is switched from H to L (clears the NG latch signal), the interlock is released, and the buzzer also stops. 9. The start signal SW ₃ by the start switch 7 pressed after the NG latch signal is cleared becomes a valid start signal, and the start signal ST _{3 is} supplied to the start output terminal 9.
Is output. If the semiconductor device 6 is a good product and the interlock is not performed, that is, the NG latch signal is cleared, if a good semiconductor device 6 is erroneously placed on the defective product dedicated tray 4, The sensor 5 detects the semiconductor device 6 and a sensor signal is output, and a buzzer sounds for a time t ₃ when the good semiconductor device 6 is placed on the defective product dedicated tray 4 to inform the operator of the error. Since the semiconductor measuring device of the present invention operates as described above, it is possible to avoid mixing of the good semiconductor device 6 and the defective semiconductor device 6 due to an operator's erroneous judgment.

FIG. 5 is a first modification of the embodiment of the semiconductor measuring apparatus according to the present invention, which is a semiconductor measuring apparatus in which not only the determination of the quality but also the rank selection of the characteristics can be performed at the same time in the measurement of the semiconductor apparatus. It is a perspective view of a characteristic rank selection device. A first modification of the semiconductor measuring device of the present invention will be described with reference to FIG. As shown in FIG. 5, the characteristic rank selecting device 12 of the semiconductor measuring device of the present invention has a tray accommodating portion 13 capable of accommodating a plurality of trays, and the sensors 5 are respectively accommodated in the tray accommodating portion on the front surface of the tray accommodating portion 13. It is attached according to the part 13. In the case of the characteristic rank selection device 12, the sensor 5 detects the semiconductor device 6 or the hand 14 of the worker and outputs a sensor signal. The host tester 1 of the semiconductor measuring device according to the present embodiment is replaced with a PASS / NG signal,
Output the RANK / NG signal. In the case of the defective semiconductor device 6, the worker places the defective semiconductor device 6 on the tray of the tray accommodating section 13 dedicated to the defective product in accordance with the NG signal. Further, in the case of the semiconductor device 6 of the characteristic rank selection product, the semiconductor device 6 is placed on the tray of the tray accommodating section 13 according to the rank according to the RANK signal.
Put. It goes without saying that if the tray is accidentally placed on another tray, the interlock is not released and the buzzer continues to ring.

FIG. 6 is a second modification of the embodiment of the semiconductor measuring apparatus according to the present invention, and is a perspective view showing a method and apparatus for transferring a semiconductor device to a predetermined semiconductor storage space by a transfer conveyor instead of a tray dedicated to defective products. It is a figure. A second modification of the semiconductor measuring device of the present invention will be described with reference to FIG. As shown in FIG. 6, the sensors 5 are provided on both sides of the conveyor 15 of the semiconductor measuring apparatus of the present invention so that the semiconductor device 6 can be detected when the semiconductor device 6 is conveyed by the conveyor 15. Is provided. The robot 16 or the chute 1 is provided at the end of the conveyor 15.
7 is provided. When the robot 16 is provided, the semiconductor measuring device can be used not only for judging the quality of the semiconductor device 6 but also for selecting the rank of the characteristic, and the semiconductor device 6 carried by the carrying conveyor 15 is the robot 1
When the semiconductor measuring device is determined by the suction nozzle at the tip of the manipulator 6 to determine whether the semiconductor device 6 is good or bad, the defective semiconductor device 6 is moved to a predetermined defective product storage (not shown). Then, when the semiconductor measuring device performs rank selection of the characteristics of the semiconductor device 6, the rank-selected semiconductor devices 6 are transferred to a rank-specific tray (not shown).
When the chute 17 is provided, the semiconductor measuring device is limited to the determination of the quality of the semiconductor device 6, and the defective semiconductor device 6 falls on the chute 17 at the end of the defective product conveyer 15 and the chute 17 is provided. Is slipped off and stored in the defective box 18.

[0013]

As described above, according to the semiconductor measuring method and the semiconductor measuring apparatus of the present invention, a defective or sorted semiconductor device is not placed on the dedicated defective product placement portion or sorted product placement portion. As long as the interlock of the starter is not released, the next measurement cannot be started, and defective semiconductor devices will not be mixed in with good ones or sorted semiconductor devices with different characteristics will not be mixed in. It becomes possible not only to judge but also to manage rank selection reliably. In addition, it is also possible to manage the quantity of non-defective semiconductor devices with a non-defective counter.

[Brief description of drawings]

FIG. 1 is a configuration diagram illustrating a basic configuration of a semiconductor measuring device of the present invention.

FIG. 2 is a flowchart illustrating a measuring operation of the semiconductor measuring device of the present invention.

FIG. 3 is a circuit diagram showing an example of a control circuit of the semiconductor measuring device of the present invention.

FIG. 4 is a timing chart explaining the operation of the control circuit of the semiconductor measuring device of the present invention.

FIG. 5 is a perspective view of a characteristic rank selection device according to a first modification of the embodiment of the semiconductor measuring device of the present invention.

FIG. 6 is a perspective view showing a method of carrying a semiconductor measuring apparatus to a predetermined semiconductor storage space by a carrying conveyor according to a second modification of the embodiment.

FIG. 7 is a display diagram of a situation of notifying a worker of occurrence of a defective product when manually measuring a semiconductor device of a product of a conventional example.

[Explanation of symbols]

 1 Host Tester 2 Interface Box 3 Test Deck 4 Dedicated Tray 5 Sensor 6 Semiconductor Device 7 Start Switch 8 Start Signal Input Terminal 9 Start Signal Output Terminal 10 PASS / NG Signal Input Terminal 11 Sensor Signal Input Terminal 12 Characteristic Rank Sorting Device 13 Tray container 14 Worker's hand 15 Conveyor 16 Robot 17 Chute 18 Defective box

Claims (3)

[Claims] 1. A semiconductor measuring device for measuring a semiconductor device to determine whether the semiconductor device is defective or not. When a defect occurs in the semiconductor device, the semiconductor measuring device interlocks a starter to determine a defective semiconductor device. The semiconductor measuring method according to claim 1, wherein the interlock of the starting device is released and the measurement of the next semiconductor device is started by placing the defective device on the mounting part for defective products. 2. A semiconductor measuring device for measuring a semiconductor device and selecting a characteristic thereof, wherein the starting device is interlocked by the semiconductor measuring device every time the characteristic of the semiconductor device is selected, and the characteristic selection is completed. A semiconductor measuring method comprising placing a semiconductor device on a predetermined sorting product exclusive use mounting portion to release the interlock of the starting device and start measurement of the next semiconductor device. 3. A sensor for detecting a semiconductor device is provided on the defective product dedicated mounting section according to claim 1 or the sorted product dedicated mounting section according to claim 2, and the mounting of the semiconductor device is detected by the sensor. A semiconductor measuring device, wherein the interlock of the starting device is released.