JPH05162319A - Ink jet recording head, production thereof and ink jet recording apparatus equipped with the same head - Google Patents

Abstract

PURPOSE:To enhance yield and durability, in an ink jet recording head produced by the transfer molding of a resin collectively forming a plurality of elements, by integrating the resin layers formed to both surfaces of a substrate through the holes piercing the surfaces of the elements provided to the substrate and the rear of the substrate. CONSTITUTION:A plurality of rows of energy generating elements and electrode elements opposed to each other are formed on a substrate 1 by a film forming method. Holes 14 piercing the surface having the rows of the elements 6 formed thereto of the substrate 1 and the rear of the substrate 1 are formed on the dividing and cutting line of the substrate. A solid layer for forming liquid passages and a liquid chamber 16 so as to form the passages just above the energy elements is provided to the surfaces of the elements 6 of the substrate 1 and, thereafter, a resin is poured in the holes 14 from the surface on the side of the elements 6 of the substrate 1 by transfer molding to form the resin layers 17, 17 on both surfaces of the substrate 1 through the holes 14 piercing both surfaces of the substrate 1. Next, the substrate is cut at parts becoming emitting orifices 20 along the dividing and cutting line and the solid layer is removed by a solvent.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet recording head manufactured by using a transfer molding method, a method for manufacturing the same, and an ink jet recording apparatus equipped with the head.

[0002]

2. Description of the Related Art Conventionally, in a method of collectively molding a substrate on which a plurality of elements have been formed into a film by a transfer molding method, first, a liquid flow path, a discharge port,
Also, a solid layer is provided in the portion that will become the liquid chamber, and then resin is molded, and it is used as a structural member, and then the removable material is removed to form the liquid flow path, the discharge port, and the liquid chamber. Although it was formed, in the case of a resin having a large curing shrinkage and a large thermal expansion coefficient (large stress), if the resin is molded only on the element surface, the stress of the resin causes the substrate to warp,
There is a problem that peeling occurs in a portion where the contact surface between the structural member and the substrate is small, and when forming the discharge port by cutting, it is difficult to fix the method at the time of cutting due to the warp of the substrate. There is a problem that occurs.

Therefore, transfer molding is performed so that both surfaces are covered with resin. In this method, since the resin on both the front and back surfaces is connected at both ends of each element row, when the board is separated into one element, about 60% of the elements in the board are There was a problem that peeling occurred in the part.

[0004]

When mass-producing ink jet recording heads by the transfer molding method, it is better to mold a substrate on which a plurality of elements are formed than to mold a single element. The efficiency is high, whether considering the step of forming the element film or the cutting step of cutting the ejection port of the element.

Therefore, the problem to be solved by the present invention is to prevent warpage of the entire substrate, which occurs when transfer molding is performed on a substrate on which a plurality of elements are formed, and to prevent peeling of each element. is there.

[0006]

This object is achieved by the following means. That is, according to the present invention, in an inkjet recording head in which a discharge port, a liquid flow path, and a liquid chamber are formed on a substrate by a resin transfer molding method for collectively forming a plurality of elements, an element surface provided on the substrate And the resin layer molded on both sides of the substrate through the hole penetrating the back surface,
An inkjet recording head characterized by being integrated, and the inkjet recording head provided with an ejection port for ejecting ink facing a recording surface of a recording medium, and mounting the head. An ink jet recording apparatus comprising at least a member for

Further, the present invention is a method of manufacturing an ink jet recording head in which a discharge port, a liquid flow path, and a liquid chamber are formed on a substrate by a resin transfer molding method for collectively forming a plurality of elements A method for manufacturing an ink jet recording head, characterized in that holes are formed through the front surface and the back surface, resin layers are formed on both surfaces of the substrate, and the resin layers are integrated by the through holes.

By forming the resin layer formed by transfer molding on each element of the substrate by double-sided molding of the element surface and the back surface, it is possible to reduce the warp of the substrate and the peeling thereof. it can.

The present invention is particularly effective in the ink jet recording type recording head and recording apparatus for recording by forming flying droplets by utilizing thermal energy among the ink jet recording methods.

With regard to its typical structure and principle, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796, the present invention is preferably carried out using these basic principles. This recording method can be applied to both so-called on-demand type and continuous type.

To briefly explain this recording method, an electrothermal converter arranged corresponding to a sheet or a liquid path holding a liquid (ink) is changed to a liquid (ink) corresponding to recording information. Heat energy is generated by applying at least one driving signal for giving a rapid temperature rise that causes the film boiling phenomenon beyond the nucleate boiling phenomenon, and causes the film boiling on the heat acting surface of the recording head. .. In this way, it is possible to form bubbles that correspond one-to-one to the drive signal applied from the liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. The liquid (ink) is ejected through the ejection holes by the growth and contraction of the bubbles to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the liquid (ink) with excellent responsiveness can be achieved. As the pulse-shaped drive signal, U.S. Pat. Nos. 4,463,359 and 43,
Those as described in 45262 are suitable. If the conditions described in US Pat. No. 4,313,124 of the invention relating to the rate of temperature rise on the heat acting surface are adopted, more excellent recording can be performed.

The structure of the recording head is a combination of a discharge hole, a liquid flow path, and an electrothermal converter as disclosed in the above-mentioned specifications (straight liquid flow path or right-angled liquid flow path). In addition, as disclosed in U.S. Pat. No. 4,558,333 and U.S. Pat. No. 4,459,600, the present invention includes those having a configuration in which a heat acting portion is arranged in a bending region.

In addition, Japanese Patent Laid-Open No. 123670/1984, which discloses a structure in which a common slit is used as a discharge hole of an electrothermal converter for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective in a configuration based on Japanese Patent Laid-Open No. 138461 of 1984, which discloses a configuration in which the corresponding opening corresponds to the ejection portion.

Further, as a recording head in which the present invention can be effectively used, there is a full line type recording head having a length corresponding to the maximum width of a recording medium which can be recorded by a recording device. The full line head may be a full line configuration formed by combining a plurality of print heads as disclosed in the above-mentioned specification, or may be a single full line print head integrally formed.

In addition, by being attached to the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means for the recording head, preliminary auxiliary means, etc. to the recording apparatus of the present invention because the recording apparatus of the present invention can be made more stable. Specific examples thereof include capping means, cleaning means, pressure or suction means, an electrothermal converter or a heating element other than this, preheating means for the recording head, recording means for the recording head, and recording means. It is also effective to perform stable recording by adding a means for performing a preliminary ejection mode for performing ejection different from the above.

Further, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, and either the recording head is integrally formed or a plurality of recording heads are combined. However, the present invention is also extremely effective for an apparatus provided with at least one of a multicolor of different colors or a full color by color mixing.

In the embodiments of the present invention described above, the liquid ink is used for explanation. However, in the present invention, either an ink which is solid at room temperature or an ink which is in a softened state at room temperature is used. Can be used. In the above-mentioned inkjet device, the temperature of the ink itself is generally adjusted within the range of 30 ° C. or higher and 70 ° C. or lower to control the temperature of the ink so that the viscosity of the ink is within the stable ejection range. Any liquid may be used as long as the ink is liquid.

In addition, the excessive temperature rise of the head or ink due to thermal energy is positively prevented by using it as the energy of the state change of the ink from the solid state to the liquid state, or the evaporation of the ink is prevented. It is also possible to use an ink that solidifies when left as it is. In any case, liquefaction occurs only when heat energy is applied, such as when the ink is liquefied by applying heat energy according to the recording signal and ejected as an ink liquid, or when it begins to solidify when it reaches the recording medium. The use of an ink having the property of applying is also applicable to the present invention.

Such an ink is disclosed in JP-A-54-568.
No. 47 or Japanese Patent Laid-Open No. 60-71260, facing the electrothermal converter in the state of being held as a liquid or solid in the recesses or through holes of the porous sheet. It may be in the form.

In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

FIG. 12 is an external perspective view showing an example of an ink jet recording apparatus (IJRA) in which the recording head obtained by the present invention is mounted as an ink jet head cartridge (IJC).

In FIG. 12, 120 is a platen 124.
An inkjet head cartridge (IJC) including a nozzle group that ejects ink in opposition to a recording surface of a recording sheet that has been fed above. Reference numeral 116 denotes a carriage HC that holds the IJC 120, which is connected to a part of a drive belt 118 that transmits the driving force of the drive motor 117, and has two guide shafts 119A and 1A arranged in parallel with each other.
By making it slidable with 19B, reciprocating movement over the entire width of the recording paper of the IJC 120 becomes possible.

Reference numeral 126 is a head recovery device, which is IJC1.
It is arranged at one end of the movement path of 20, for example, a position facing the home position. The head recovery device 126 is operated by the driving force of the motor 122 via the transmission mechanism 123, and the IJC 120 is capped. IJC1 by the cap portion 126A of the head recovery device 126
Head recovery device 1 in connection with capping to 20
Ink is sucked by an appropriate suction means provided inside the nozzle 26 or ink is pressure-fed by an appropriate pressurizing means provided at the ink supply path to the IJC 120, and the ink is forcibly discharged from the ejection port to increase the viscosity inside the nozzle. Ejection recovery processing such as ink removal is performed. Further, the IJC is protected by capping at the end of recording or the like.

Reference numeral 130 denotes a blade as a wiping member which is disposed on the side surface of the head recovery device 126 and is made of silicon rubber. The blade 130 is held by the blade holding member 130A in a cantilever form, and like the head recovery device 126, the motor 122 and the transmission mechanism 123.
It is possible to engage with the ejection surface of the IJC 120. This allows the blade 130 to move to the IJC 12 at an appropriate timing in the recording operation of the IJC 120 or after the ejection recovery process using the head recovery device 126.
It is projected in the movement path of 0 and wipes out dew condensation, wetting, dust or the like on the ejection surface of the IJC 120 as the IJC 120 moves.

[0026]

EXAMPLES The present invention will be specifically described below with reference to examples.

1 to 6 show a method of penetrating a hole in a substrate by an ultrasonic method, and show respective steps of forming the hole in this order.

Here, the substrate material may be silicon, glass, ceramics, metal, resin, etc., and may be used without particular limitation.

In FIG. 1, a row of 6 elements facing each other by film formation is provided on one substrate, 2 is a cutting line at a discharge port forming position, and 3 is an element for separating the elements. A cutting line shows an enlarged view of the element surface facing the right side drawing, and each element is provided with 5 energy generating elements and 4 electrodes connected thereto.

FIG. 2 shows a step of forming a hole for penetrating from the front surface of the substrate on which the element rows are formed to the back surface thereof in the substrate described in FIG. 1, and 8 is the main body of the apparatus for that purpose. The ultrasonic wave generated from the horn of 9 is transmitted to a tool for transmitting the ultrasonic wave of 10 to form a hole therethrough, and the substrate of FIG. Is fixed, and while the polishing liquid and the cutting liquid of 11 are poured, the vibration of the tool and the polishing liquid and the cutting liquid are supplied together with water to form a through hole. Reference numeral 12 is an alignment mark on the substrate.

In FIG. 3, after forming holes penetrating the element surface and the back surface of the substrate, 14 holes are formed on the separation cutting line to reduce the number of holes, but it functions as an ink jet recording head. The position of the through-hole can be arbitrarily determined as long as the element portion for this is not substantially affected. Further, the size and shape of the hole can be changed in any way depending on the shape and size of the jig (an example in which the hole shape is changed is shown in FIG. 10 described later). If the holes are too large, the penetration of the resin is hindered, but if they are too large, the effect cannot be further improved, and the strength of the substrate itself may be affected due to the formation of a plurality of holes. Therefore, the size of the hole is preferably about 0.1 to 2 mm.

Other means for forming the through hole may include a cutting drill (described later), laser, etching, plast, etc., and may be selected without limitation in consideration of workability, accuracy and the like.

FIG. 4 ((a) is a plan view and (b) is a front view) shows a removable material on the element surface 6 of the substrate of FIG. 3, just above the energy generating element. 19 layers for forming the liquid flow path and the liquid chamber are provided so that the resin can be poured from the element side surface of the substrate by transfer molding, and the element side surface and the back side can be formed. Resin is poured through holes (14) penetrating both sides of the surface of the substrate, and a resin layer is formed on both sides of the substrate. Reference numeral 16 in the drawing indicates a necessary for forming an ink supply port and a liquid chamber. In the shape, 15 is an air bleeding portion for bleeding air in the resin at the time of molding, and 18 is a main runner for flowing the resin to every corner of the shape.

In the steps up to this point, the substrate is not warped and the element is not peeled off.

The resin used for transfer molding is
What is usually used can be applied, for example, epoxy type, acrylic type, etc., and the transfer molding conditions may be those usually adopted. The solid layer can be used without limitation as long as it is a material that exhibits its function, and examples thereof include metals and resins.

FIG. 5 shows the substrate prepared up to FIG.
The side surface separation cutting line and the element facing each other are cut at a portion (cutting line 2 in FIG. 1) which is to be a discharge port, and the removable solid layer (solid layer 19 in FIG. 4) is cut,
After removing with a solvent etc., the element is viewed in a frontal oblique view, and even after being separated into each element, the resin is molded through 14 holes, and the resin is formed on both sides of the resin layer. , Integrated.

As an example of inspecting the element on the substrate after the separation, 85/88 has no peeling, which is about 35.0 in the steps up to this point in comparison with the yield by the conventional structure.
It became a non-defective product with an increase of%.

FIG. 6 shows a second embodiment, in which the head structure is the same as that of FIG. 1 and the method of forming holes penetrating the element surface and the back surface is changed. The description is omitted because it is the same except for the step of forming the through hole.

Reference numeral 21 denotes a drill, and a substrate similar to that shown in FIG. 1 is fixed to a jig 22 by a method such as vacuuming or adhering, and positioning with high accuracy is not necessary. It is possible to align the position of the board by a method that allows easy alignment, and then form a hole through it by cutting with a drill.Because the cutting speed is fast and fine positioning is not required, It is easy and the device is simple.

FIGS. 7 to 9 show a third embodiment. In order to reduce the load of the blade used when separating the elements, the positions of the holes penetrating the element surface and the back surface are separated and cut. By moving the mold from above and changing the mold accordingly, almost all of the structural member on the cutting and separating line has been removed. The method of forming a film on the element surface and the method of forming a through hole are the same as in FIGS.

FIG. 7 shows the substrate after forming holes (23) penetrating the element surface and the back surface outside the separation cutting line, and forming holes penetrating on both sides of the element, respectively.

FIG. 8 (a) shows that the substrate of FIG. 7 is provided with a solid layer 19 made of a removable material for forming a flow path and a liquid chamber, and then transferred by transfer molding to the element side of the substrate. The resin is formed by pouring resin through holes that penetrate both sides of the surface and its back side, and forming resin layers on both sides of the substrate. It is a saplanner (24) that becomes a passage through which

In FIG. 9, the substrate prepared up to FIG. 8 is cut at a side cutting line and a portion of the element facing each other, which is to be a discharge port, and the removable solid layer is cut with a solvent or the like. The element after removal is viewed in a frontal oblique view, and the process of forming through holes is
Although it becomes a little complicated, since the resin on the cutting line is greatly reduced, the load on the blade for separation and cutting is reduced, and the life of the blade is greatly extended. Even in the actual durability test, the life of the blade was considerably extended.

10 to 11 show the through holes cut using the same ultrasonic method as in FIG.

FIG. 10 (a) shows a part of the same substrate as that described with reference to FIG. 1 after forming a through hole and forming the solid layer.

Reference numeral 25 denotes a hole penetrating the element surface and the back surface. By using a tool having a rectangular tip, it is possible to form a hole having such a shape. Further, by providing the positions of the holes at the positions where the separation lines intersect, the number of holes formed can be further reduced.

10 (b) and 10 (c) are obtained by transfer molding the substrate explained in FIG. 10 (a), and the manufacturing method is the same as in FIG.

FIG. 11 shows that the removable solid layer is formed by cutting the substrate prepared up to FIG. 10 at the side surface cutting line and at the portions of the elements facing each other which are to be discharge ports.
This is a frontal oblique view of the element after it has been removed with a solvent, etc. By preventing the resin from wrapping around on both sides of the liquid flow path, it is possible to prevent peeling in the vicinity of the discharge port where peeling is most likely to occur. Will be strengthened. Even in the actual peeling test, almost no element was peeled.

[0049]

As described above, when an ink jet recording head is to be formed by using the transfer molding method on a substrate having a plurality of elements, it is necessary to perform the transfer molding by using the structure method of the present invention. Then, as compared with the conventional method, the warp of the substrate is significantly reduced, the phenomenon of peeling between the resin and the substrate hardly occurs, and the yield and durability are greatly improved.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an example of a substrate used in the present invention and a partially enlarged view thereof.

FIG. 2 is a schematic front view showing an example of a method of forming a penetrating hole in a substrate by ultrasonic waves.

FIG. 3 is a schematic plan view showing a structure in which a position of a through hole is on a separation cutting line of a substrate.

4A and 4B are schematic views showing an example in which a resin layer is formed on the substrate shown in FIG. 3 by transfer molding, in which FIG. 4A is a plan view and FIG. 4B is a front sectional view.

5 is a schematic perspective view showing a structure in which elements are formed by cutting the element array shown in FIG.

FIG. 6 is a schematic front view showing an example of a method of forming a through hole with a drill.

FIG. 7 is a schematic plan view showing an aspect in which the position of a hole penetrating the substrate is inside the element.

8A and 8B are part of a schematic view showing an example in which a resin layer is formed on the substrate of FIG. 7 by transfer molding, in which FIG. 8A is a plan view and FIG. 8B is a front sectional view.

9 is a schematic perspective view showing a structure in which elements are formed by cutting the element array shown in FIG.

10A and 10B are schematic views showing a structure in which a through hole is located at a position where a separation cutting line and a discharge opening cutting line intersect with each other, FIG. 10A is a plan view before a resin layer is formed, and FIG. A plan view of the resin layer formed by molding,
(C) is a front sectional view of (b).

11 is a schematic perspective view showing a structure in which elements are formed by cutting the element array shown in FIG.

FIG. 12 is a perspective view showing an example of a recording apparatus including an inkjet recording head according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate 2 Cutting line used as discharge port surface 3 Element separation cutting line 4 Electrode 5 Thermal energy generating element 6 Element surface 7 Adhesive layer for fixing to table 8 Ultrasonic cutting machine 9 Horn 10 Ultrasonic waves from the horn are transmitted, Tool for penetrating holes in substrate 11 Polishing liquid or cutting liquid 12 Alignment mark 13 Table 14 Through hole formed on separation and cutting line 15 Air bleeding part 16 Forming liquid chamber and ink supply port 17 Transfer molding Formed resin 18 Main runner 19 Solid layer made of removable material 20 Liquid channel and discharge port after removing solid layer of 19 21 Drill 22 Fixing substrate 23 Avoid on cutting line Two through holes formed in one element 24 Sub-runner of resin 25 Separation cutting line Discharge port Cutting line intersecting position Through holes 116 carriage 117 drive motor 118 drive belts 119A, 119B guide shaft 120 inkjet head cartridge 122 cleaning motor 123 transmission mechanism 124 platen 126 cap member 130 blade 130A blade holding member

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuji Koyama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Yukio Kawajiri 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Co., Ltd. (72) Inventor Suzuki Kou 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Makoto Shibata 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc.

Claims (5)

[Claims] 1. An ink jet recording head having a discharge port, a liquid flow path, and a liquid chamber formed on a substrate by a resin transfer molding method for collectively forming a plurality of elements,
An ink jet recording head, characterized in that resin layers formed on both surfaces of the substrate through holes penetrating the element surface and the back surface provided on the substrate are integrated. 2. The ink jet recording head according to claim 1, further comprising an electrothermal converter that generates thermal energy used to eject ink. 3. The inkjet recording head according to claim 1, wherein the inkjet recording head is a full-line type in which a plurality of ejection openings are provided over the entire width of the recording area of the recording medium. 4. A method of manufacturing an ink jet recording head in which a discharge port, a liquid flow path, and a liquid chamber are formed on a substrate by a resin transfer molding method for collectively forming a plurality of elements. A method for manufacturing an ink jet recording head, wherein a through hole is provided, a resin layer is formed on both surfaces of the substrate, and the resin layer is integrated by the through hole. 5. The ink jet recording head according to claim 1, wherein an ejection port for ejecting ink is provided facing the recording surface of the recording medium, and a member for mounting the head. An ink jet recording apparatus characterized by: