JPH05159501A - Magnetic head - Google Patents
Magnetic headInfo
- Publication number
- JPH05159501A JPH05159501A JP3322866A JP32286691A JPH05159501A JP H05159501 A JPH05159501 A JP H05159501A JP 3322866 A JP3322866 A JP 3322866A JP 32286691 A JP32286691 A JP 32286691A JP H05159501 A JPH05159501 A JP H05159501A
- Authority
- JP
- Japan
- Prior art keywords
- spring
- spring force
- head
- magnetic head
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Springs (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、磁気ヘッドのばね力調
整方法及び磁気ヘッド構造に係り、特にレーザを用いて
容易に且つ精密にばね力を調整して、信頼性向上を図っ
た磁気ヘッドを具備した磁気ディスク装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of adjusting a spring force of a magnetic head and a structure of the magnetic head, and more particularly to a magnetic head which easily and precisely adjusts the spring force by using a laser to improve reliability. The present invention relates to a magnetic disk device equipped with.
【０００２】[0002]
【従来の技術】従来磁気ヘッドスプリングのばね力は、
プレス又は、ロール曲げの方法により、あらかじめ所定
の角度にばね部を成形した後、後工程でばね力をロード
セルなどの歪計によって測定している。その測定値が規
定値より外れた場合、メカ的に曲げ戻し、あるいは追加
曲げを行って規定値内に調整する方法が一般的に知られ
ている。2. Description of the Related Art The spring force of a conventional magnetic head spring is
After the spring portion is formed in advance to a predetermined angle by a press or roll bending method, the spring force is measured by a strain gauge such as a load cell in a post process. When the measured value deviates from the specified value, a method of mechanically bending back or additionally bending to adjust the value within the specified value is generally known.
【０００３】また、特開平１−２２７２７９に見るよう
に、ばね部成形方法としてばね力成形部に収束したレー
ザ光パルスを、互いに近接した複数個の走査数で照射す
る方法が公知され、曲げ角度ひいてはばね力を所要の値
に正確に合致させれば、微調整工程が不要になるとされ
ている。As disclosed in Japanese Patent Application Laid-Open No. 1-2227279, a method of irradiating a laser light pulse converged on a spring force forming portion with a plurality of scanning numbers close to each other is known as a spring portion forming method, and a bending angle As a result, if the spring force is exactly matched with the required value, the fine adjustment process is not required.
【０００４】[0004]
【発明が解決しようとする課題】上記従来技術における
メカ的ばね力調整方法では、熟練者によるばね力調整が
必要であり、ばね部にスプリングバックが生じ、ばね力
を高精度に調整することが困難である。In the mechanical spring force adjusting method in the above-mentioned prior art, it is necessary to adjust the spring force by a skilled person, and spring back is generated in the spring portion, so that the spring force can be adjusted with high accuracy. Have difficulty.
【０００５】一方、ばね成形手段としてレーザ光を複数
個の走査線で照射した場合は、組立工程中でのハンドリ
ング等により、ばね力が変化することを考慮すれば、最
終工程でのばね力微調整をしなければならない問題があ
る。On the other hand, when the laser beam is applied as the spring forming means by a plurality of scanning lines, considering that the spring force changes due to the handling during the assembling process, the spring force in the final process is small. There is a problem that must be adjusted.
【０００６】さらに、ばね力を調整する作業において従
来磁気ヘッド構造では、上下方向の空間が是非必要であ
り、ＨＤＡ（ＨＥＡＤ−ＤＩＳＫ−ＡＳＳＥＭＢＬＹ）
後、空間を確保できなくなり、ばね力調整が困難である
などの問題がある。Further, in the work of adjusting the spring force, the conventional magnetic head structure needs a space in the vertical direction by all means, and HDA (HEAD-DISK-ASSEMBLY) is required.
After that, there is a problem that space cannot be secured and it is difficult to adjust the spring force.
【０００７】[0007]
【課題を解決するための手段】上記メカ的ばね力微調整
方法における問題点は、レーザパルスを１点又は、複数
点予め評価した条件（ロードオン高さ、レーザパワー）
でロードスプリングのばね部に照射することによって、
瞬間的に加熱、冷却して解決される。A problem with the above mechanical spring force fine adjustment method is that the laser pulse is evaluated at one point or a plurality of points in advance (load-on height, laser power).
By irradiating the spring part of the load spring with
It is solved by heating and cooling momentarily.
【０００８】一方、ＨＤＡ後等における横からのばね力
調整方法においては、ばね部を分解し、ばねの一部をた
るませた構造にすることによって横からのレーザ照射が
可能となり、解決される。On the other hand, in the method of adjusting the spring force from the side after HDA, etc., the laser irradiation from the side becomes possible by disassembling the spring portion and making a part of the spring slack. ..
【０００９】[0009]
【作用】ばね力を調整するため、ばね部に塑性変形を与
えるメカ的調整方法では、スプリングバック等により、
一般的に金属に於いては経時的にばね力が変化し易い特
性をもつ。[Function] In the mechanical adjustment method of plastically deforming the spring portion in order to adjust the spring force, the springback or the like is used to
Generally, a metal has a characteristic that the spring force easily changes with time.
【００１０】そこで本発明では、ばね部をロードオンし
た状態に押し下げ、ばね応力を発生させ、予め条件出し
した位置にレーザを照射することにより、瞬間的に加
熱、冷却でき、ばね応力を部分的に開放できる。これに
よりスプリングバックのない、ばね力微調整ができる。Therefore, in the present invention, the spring portion is pushed down to a load-on state to generate spring stress, and by irradiating the laser to a preconditioned condition, it is possible to heat and cool instantaneously, and the spring stress is partially It can be opened to This allows fine adjustment of the spring force without springback.
【００１１】また、ばね部にたるみを設けた構造のヘッ
ドでは、たるみ部にレーザを予め条件出しした位置、方
法によって照射し、瞬間的に加熱、冷却あるいは溶解す
ることによって、ばね応力を部分的に開放できる。これ
により、スプリングバックのないヘッドばねの横からの
ばね力調整が可能となる。Further, in the head having a structure in which the slack is provided in the spring portion, the slack portion is irradiated with a laser by a preconditioned condition and method, and is momentarily heated, cooled, or melted to partially cause the spring stress. It can be opened to As a result, it is possible to adjust the spring force from the side of the head spring without springback.
【００１２】[0012]
【実施例】図１は、従来ヘッド構造を示す図で、マウン
ト３に取り付けられたロードスプリング１の一部にヘッ
ドばね力を与えるばね部２が構成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view showing a conventional head structure, in which a spring portion 2 for applying a head spring force is constructed on a part of a load spring 1 mounted on a mount 3.
【００１３】図２は、本発明によるばね力微調整方法を
示す図であり、図１のマウント３を固定した状態で、Ａ
方向に力を加え、ロードスプリング１を押し下げ、ばね
部２にばね応力を発生させた状態である。図３に示すロ
ードスプリング１を押し下げる高さＨは、調整量との関
係で決定されるもので、予め評価しておく。そして、ば
ね部２にレーザ４を径約φ０.５mmで照射して、ばね応
力を部分的に開放して、ばね力を調整する。調整量は、
レーザの強さ、照射位置、照射数によって変えることが
可能であり、ロードセル５で測定しながら行うこともで
きる。図４は、本発明請求項２を示すヘッド構造であ
る。ヘッドばね部２に細かい溝６１を設け、ばね部を分
割した構造になっている。またこの分割したばね６は、
図５に示すように複数個設けてもよい。またロードスプ
リングを押し下げた状態で、分割したばね６が、両サイ
ドのばね２よりも上側か、下側にふくらむ構造である必
要がある。図６(1)〜(3)にその実施例を示すように、ロ
ードスプリング１を規定高さまで押し下げた状態の時、
ばね６がたるむ構造、あるいは中央に曲げ部を設け、積
極的に出張る構造にする必要がある。FIG. 2 is a view showing a spring force fine adjustment method according to the present invention, in which the mount 3 shown in FIG.
A force is applied in the direction to push down the load spring 1 to generate spring stress in the spring portion 2. The height H of pushing down the load spring 1 shown in FIG. 3 is determined in relation to the adjustment amount, and is evaluated in advance. Then, the spring portion 2 is irradiated with the laser 4 with a diameter of about 0.5 mm to partially release the spring stress and adjust the spring force. The adjustment amount is
It can be changed depending on the intensity of the laser, the irradiation position, and the number of irradiations, and the measurement can be performed with the load cell 5. FIG. 4 shows a head structure according to claim 2 of the present invention. A fine groove 61 is provided in the head spring portion 2 so that the spring portion is divided. Also, this split spring 6
Plural pieces may be provided as shown in FIG. In addition, it is necessary that the split springs 6 bulge above or below the springs 2 on both sides with the load spring pushed down. As shown in FIGS. 6 (1) to 6 (3), when the load spring 1 is pushed down to a specified height,
It is necessary to have a structure in which the spring 6 sags, or a structure in which a bent portion is provided in the center to actively travel.
【００１４】図７は、ガラスディスク７の回転により浮
上する磁気ヘッドの浮上量を測定しながら、ばね部６に
レーザ４を横方向から照射して、ばね力ひいては浮上量
を調整することを示す図である。ばね力を調整する量に
よって、レーザ４の照射条件は異なるが瞬間的に加熱、
冷却または、ばね部の一部を溶かすことで、安定したば
ね力の調整ができる。FIG. 7 shows that while measuring the flying height of the magnetic head that is floated by the rotation of the glass disk 7, the spring 6 is laterally irradiated with the laser 4 to adjust the spring force and thus the flying height. It is a figure. The irradiation condition of the laser 4 varies depending on the amount of adjusting the spring force, but the laser light is momentarily heated,
A stable spring force can be adjusted by cooling or melting a part of the spring portion.
【００１５】また図８に示すようにＨＤＡ後、リードラ
イトしながらばね力の調整を行うこともでき、ひいては
電磁気特性の調整もできる。Further, as shown in FIG. 8, after HDA, the spring force can be adjusted while reading and writing, and by extension, the electromagnetic characteristics can be adjusted.
【００１６】さらに、ＨＤＡ状態でなくとも、ヘッド単
体で行うこともでき、浮上量調整、電磁気特性の調整が
可能である。この時は、レーザを横方向からでなくと
も、上又は下方向から照射してもよい。Further, the head alone can be used without being in the HDA state, and the flying height can be adjusted and the electromagnetic characteristics can be adjusted. At this time, the laser may be emitted from above or below instead of from the lateral direction.
【００１７】[0017]
【発明の効果】上述の如く本発明により、スプリングバ
ックのないヘッドばね力の微調整方法を提供でき、最終
工程における安定した磁気ヘッド特性を得ることが可能
となり、ＨＤＡの信頼性を向上できる。As described above, according to the present invention, it is possible to provide a method of finely adjusting the head spring force without springback, and it is possible to obtain stable magnetic head characteristics in the final step and improve the reliability of the HDA.
【図１】従来ヘッドの構造図である。FIG. 1 is a structural diagram of a conventional head.
【図２】本発明の請求項１を説明するヘッドの側面図で
ある。FIG. 2 is a side view of the head for explaining claim 1 of the present invention.
【図３】同じくヘッドの側面図である。FIG. 3 is a side view of the same head.
【図４】本発明の請求項２を説明するヘッドの構造図で
ある。FIG. 4 is a structural diagram of a head for explaining claim 2 of the present invention.
【図５】本発明の他の実施例を示す図である。FIG. 5 is a diagram showing another embodiment of the present invention.
【図６】同じく他の実施例を示す図である。FIG. 6 is a view showing another embodiment of the present invention.
【図７】本発明を説明する応用例を示す図である。FIG. 7 is a diagram showing an application example for explaining the present invention.
【図８】同じく応用例を示す図である。FIG. 8 is a diagram similarly showing an application example.
１…ロードスプリング ２…ばね力成形部 ３…マウント ４…レーザ ５…ロードセル ６…ばね力調整部 ７…ガラスディスク ８…磁気ディスク ９…ヘッドアーム 1 ... Load spring 2 ... Spring force forming part 3 ... Mount 4 ... Laser 5 ... Load cell 6 ... Spring force adjusting part 7 ... Glass disk 8 ... Magnetic disk 9 ... Head arm
───────────────────────────────────────────────────── フロントページの続き (72)発明者 馬越 幸守 神奈川県小田原市国府津2880番地株式会社 日立製作所小田原工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Komori Magoshi 2880 Kozu, Odawara-shi, Kanagawa Hitachi, Ltd. Odawara Plant
Claims (1)
ド、ライトする磁気ディスク用の磁気ヘッドにおいて、
該磁気ヘッドのばね力成形部に切り欠きを設け、ばね厚
み方向に部分的にたるみをもたせた構造として、レーザ
を横方向から照射して、ばね力の微調整を行い易くした
ことを特徴とする磁気ヘッド。1. A magnetic head for a magnetic disk for reading and writing while keeping a flying height of submicron,
A notch is provided in the spring force forming portion of the magnetic head so that a partial slack is provided in the spring thickness direction, and a laser is irradiated from the lateral direction to facilitate fine adjustment of the spring force. Magnetic head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3322866A JPH05159501A (en) | 1991-12-06 | 1991-12-06 | Magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3322866A JPH05159501A (en) | 1991-12-06 | 1991-12-06 | Magnetic head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05159501A true JPH05159501A (en) | 1993-06-25 |
Family
ID=18148488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3322866A Pending JPH05159501A (en) | 1991-12-06 | 1991-12-06 | Magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05159501A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6594902B1 (en) | 2001-05-07 | 2003-07-22 | Hutchinson Technology Incorporated | Active spring rate adjust |
| US6711929B2 (en) | 2001-02-28 | 2004-03-30 | Tdk Corporation | Method and apparatus for adjusting load applied by suspension |
| US6837092B1 (en) | 2000-02-10 | 2005-01-04 | Hutchinson Technology Incorporated | Method for adjusting a head suspension parameter |
| US6977788B2 (en) | 2000-06-13 | 2005-12-20 | Tdk Corporation | Method and apparatus for adjusting angular position of magnetic head unit |
| US7020949B2 (en) | 2001-03-12 | 2006-04-04 | Tdk Corporation | Method of fabricating head supporting member |
| US7219413B1 (en) | 2002-03-08 | 2007-05-22 | Hutchinson Technology Incorporated | Adjusting system and method for head slider mounting regions on head suspensions |
| JP2007184575A (en) * | 2005-12-14 | 2007-07-19 | Asml Netherlands Bv | Exposure device using laser trimming for contrast device consisting of a large number of mirrors, and device manufacturing method |
| US7275408B1 (en) | 2003-04-08 | 2007-10-02 | Hutchinson Technology Incorporated | Scanning beam suspension adjustment |
| CN100369149C (en) * | 2002-08-26 | 2008-02-13 | 日本发条株式会社 | Thin plate forming method, correcting apparatus for thin plate and over beam and correcting method thereof |
| JP2008152858A (en) * | 2006-12-18 | 2008-07-03 | Nippon Densan Corp | Motor component, method for manufacturing the same, and recording disk driving device equipped with the motor |
-
1991
- 1991-12-06 JP JP3322866A patent/JPH05159501A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6837092B1 (en) | 2000-02-10 | 2005-01-04 | Hutchinson Technology Incorporated | Method for adjusting a head suspension parameter |
| US7213433B2 (en) | 2000-02-10 | 2007-05-08 | Hutchinson Technology Incorporated | Method for adjusting a head suspension parameter |
| US6977788B2 (en) | 2000-06-13 | 2005-12-20 | Tdk Corporation | Method and apparatus for adjusting angular position of magnetic head unit |
| US6711929B2 (en) | 2001-02-28 | 2004-03-30 | Tdk Corporation | Method and apparatus for adjusting load applied by suspension |
| US7020949B2 (en) | 2001-03-12 | 2006-04-04 | Tdk Corporation | Method of fabricating head supporting member |
| US6594902B1 (en) | 2001-05-07 | 2003-07-22 | Hutchinson Technology Incorporated | Active spring rate adjust |
| US7219413B1 (en) | 2002-03-08 | 2007-05-22 | Hutchinson Technology Incorporated | Adjusting system and method for head slider mounting regions on head suspensions |
| CN100369149C (en) * | 2002-08-26 | 2008-02-13 | 日本发条株式会社 | Thin plate forming method, correcting apparatus for thin plate and over beam and correcting method thereof |
| US7275408B1 (en) | 2003-04-08 | 2007-10-02 | Hutchinson Technology Incorporated | Scanning beam suspension adjustment |
| JP2007184575A (en) * | 2005-12-14 | 2007-07-19 | Asml Netherlands Bv | Exposure device using laser trimming for contrast device consisting of a large number of mirrors, and device manufacturing method |
| JP4705008B2 (en) * | 2005-12-14 | 2011-06-22 | エーエスエムエル ネザーランズ ビー．ブイ． | EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD USING LASER TRIMING ON CONTRAST DEVICE COMPRISING MULTIPLE MIRRORS |
| JP2008152858A (en) * | 2006-12-18 | 2008-07-03 | Nippon Densan Corp | Motor component, method for manufacturing the same, and recording disk driving device equipped with the motor |
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