JPH0780557A - Method for bending and method for positioning magnetic head - Google Patents

Method for bending and method for positioning magnetic head

Info

Publication number
JPH0780557A
JPH0780557A JP22549293A JP22549293A JPH0780557A JP H0780557 A JPH0780557 A JP H0780557A JP 22549293 A JP22549293 A JP 22549293A JP 22549293 A JP22549293 A JP 22549293A JP H0780557 A JPH0780557 A JP H0780557A
Authority
JP
Japan
Prior art keywords
head base
head
irradiation
bending
laser light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22549293A
Other languages
Japanese (ja)
Inventor
Hidekazu Nagaoka
英一 長岡
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP22549293A priority Critical patent/JPH0780557A/en
Publication of JPH0780557A publication Critical patent/JPH0780557A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a method where the highly precise bending can be made to a work of small width, and a magnetic head can be positioned with high precision even when the width of the head base is reduced by the highly dense packaging of the magnetic head. CONSTITUTION:A regulating member 20 is positioned on the rear side of a head base 2 where a head chip 1 is attached on the tip by a stage 21. When the laser beam emitted from a YAG laser beam source 6 is directly converged to the head base 2 which is a work, the temperature in the vicinity of an irradiated part 10 rises, and the tip part of the head base 2 is displaced downward by the thermal expansion. However, the regulating member 20 restricts this displacement, and the irradiated part 10 causes the thermal plastic deformation. When the irradiated part 10 is cooled to cause the thermal contraction, the contraction exceeding the condition before the irradiation is generated, and the head base 2 is folded in the upwardly recessed manner to be stopped, and the bending is realized thereby.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for heating and bending a work material such as metal, and a method for positioning a magnetic head used in a magnetic recording / reproducing apparatus.

[0002]

2. Description of the Related Art In recent years, not only magnetic recording / reproducing devices pursuing lightness, thinness, shortness and size, but also the processing precision required for producing products has been increasing year by year. Conventionally, bending of a work material such as metal has been generally performed by applying an external force, but it has been very difficult to meet the precision requirement of the order of micron.

As a bending method that meets such a demand for high-precision processing, a bending method of irradiating a workpiece with a pulsed laser beam is described in Japanese Patent Laid-Open No. 195813/1992. 10 and 11 show a method of adjusting the height of the magnetic head of the magnetic recording / reproducing apparatus using such a bending method using a laser beam. A brass head base 2 to which the head chip 1 is bonded is attached to the rotary cylinder 5 with a fixing screw 3. The positioning accuracy of the head chip 1 is an important accuracy that determines the accuracy of the magnetic track recorded on the information recording medium of the magnetic recording / reproducing apparatus. Therefore, the positioning in the height direction is required to have an accuracy of 1 micron or less.

The rotating cylinder 5 includes a YAG which is a heating source.
A hole 7 for penetrating the YAG laser light from the laser light source 6 is provided, and the YAG laser light is directly focused on the head base 2. The position of the head chip 1 is observed by the microscope 8.

The method of bending the head base 2 in this conventional example is performed as follows. A part of the head base 2 is irradiated with pulsed YAG laser light from the YAG laser light source 6. The irradiation unit 10 of the head base 2 absorbs the energy of the laser light, and the temperature in the vicinity of the irradiation unit 10 rises to the melting point of the material. The absorbed energy is diffused into the inside of the head base 2 by heat conduction, but since the heating speed is rapid, a steep temperature gradient is formed in the head base 2 during laser light irradiation. That is, the temperature rises near the material melting point in the vicinity of the irradiation portion 10, whereas the temperature in the irradiation portion 10 increases.
The temperature of the back surface 12 is maintained at a temperature slightly increased from room temperature. Due to the thermal expansion of the irradiation unit 10 and the steep temperature distribution, the head base 2 is once bent into a convex shape as shown in FIG. At this time, the temperature of the side part 11 that hits the periphery of the irradiation part 10 does not rise so much like the back surface 12. Therefore, when the head base 2 is about to bend due to thermal expansion of the irradiation unit 10, the side portion 11 works to restrain it. Due to the internal restraint of the side part 11, a compressive stress is generated in the irradiation part 10 and so-called thermoplastic deformation is caused.

Therefore, when the irradiation of the laser beam is completed and the irradiation portion 10 is cooled by heat conduction into the material and heat contraction occurs, the state before irradiation is changed by the amount of the thermoplastic deformation during heating. It contracts beyond and the head base 2 bends in an upward concave shape as shown in FIG. 13 and stops. That is, by irradiating the YAG laser beam, the head base 2 can be bent, and the height of the head chip 1 adhered to the tip can be increased by H in the figure. Since the displacement amount H of the head chip 1 is almost proportional to the total energy amount of the laser light to be irradiated, it is possible to position the head chip 1 on the order of submicron. Since the position of the head chip 1 is observed by the microscope 8, YA is repeated until the target position is reached.
The G laser light may be applied to the head base 2. As described above, by irradiating the head base 2 which is the work material with the pulsed laser beam, the work material can be bent with high accuracy.

[0007]

In various products pursuing lightness, thinness, shortness, and high precision bending is required even for small precision parts having a narrow width. Also in the above-mentioned magnetic recording / reproducing apparatus, it is necessary to narrow the width W of the head base 2 in order to mount the magnetic head at a high density. When the width W of the head base 2 is sufficiently wider than the irradiation diameter of the laser beam, the side portion 11 restrains the thermal expansion of the irradiation portion 10 during the irradiation of the laser beam, so that the thermoplastic deformation occurs and the head after cooling. It becomes possible to position the height of the chip 1. However, the width W of the head base 2
When the width becomes narrower and approaches the irradiation diameter of the laser beam, there is no longer any portion that restrains thermal expansion during heating, so that thermoplastic deformation does not occur. For this reason, the head base 2 elastically deforms back to the state before irradiation even after thermal contraction after cooling, and the head chip 1 cannot be positioned at all.

In the bending method according to the prior art,
The internal restraint by the side portion 11 required to cause the thermoplastic deformation at the time of heating also restrains the thermal contraction at the time of cooling, so that the deformation in which the head base 2 is bent upward into a concave shape is suppressed and the working efficiency is poor. It also had drawbacks.

The present invention solves the above problems and enables highly accurate bending work even on a narrow work material,
Further, the present invention provides a bending method with high processing efficiency without restraining heat shrinkage during cooling. The present invention provides a method for positioning the magnetic head with high accuracy even when the width of the head base is narrowed in order to mount the magnetic head with high density.

[0010]

[Means for Solving the Problems] To achieve the above object,
In the bending method of the present invention, a part of the material to be processed is heated by the heating means, and the deformation of the part of the material to be processed due to thermal expansion during heating is restricted by the restriction means.

Further, according to the magnetic head positioning method of the present invention, a portion of the head base portion, to which the head chip is fixed at the tip, is heated by the heating means, and the portion of the head base portion is deformed by thermal expansion during heating. It is to be bound by regulatory means.

[0012]

In the bending method of the present invention, the heating means rapidly heats a part of the workpiece by the above method,
Due to the thermal expansion, the work material once tries to bend in a specific direction. However, since the regulating means regulates the deformation of a part of the workpiece, the thermoplastic expansion occurs in the thermal expansion portion, and the workpiece is bent after cooling.

Further, in the magnetic head positioning method of the present invention, according to the above method, the heating means rapidly heats a part of the head base portion so that the head base portion may be bent once in a specific direction due to thermal expansion. To do. However, since the regulating means regulates the deformation of a part of the head base portion, the thermal expansion portion undergoes thermoplastic deformation, the head base portion is bent after cooling, and the magnetic head can be positioned with high accuracy.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to the drawings. 1 and 2 are explanatory views when the bending method according to the present invention is used for the height adjusting method of the magnetic head of the magnetic recording / reproducing apparatus.

First, a brass head base 2 having a head chip 1 bonded to its tip is fixed to a rotary cylinder 5 with a fixing screw 3.
Install on. A YAG laser light source 6 is used as a heating means of the head base 2 which is the work material, and the regulation member 20 is almost in contact with the head base 2 on the back side of the tip portion of the head base 2 to which the head chip 1 is adhered. On stage 2
Positioned by 1. In the rotating cylinder 5,
A hole 7 for penetrating the YAG laser light is provided, and the YAG laser light is directly focused on the head base 2. The diameter of the focused laser beam is the head base 2
The width of the YAG laser light source 6 is set to be approximately the same as or slightly wider than the width W of the YAG laser light source 6, and the position of the YAG laser light source 6 is set so that the center of the laser beam substantially coincides with the center of the head base 2 in the width direction. The position of the head chip 1 is observed by the microscope 8.

The method of bending the head base 2 in this embodiment is performed as follows. YAG laser light source 6
A part of the head base 2 is irradiated with pulsed YAG laser light from the. At this time, the irradiation unit 10 of the head base 2 absorbs the energy of the laser light, and the temperature in the vicinity of the irradiation unit 10 rises to the melting point of the material. The absorbed energy is diffused into the inside of the head base 2 by heat conduction, but since the heating rate is rapid, a steep temperature gradient is formed in the head base 2 during laser light irradiation. That is, while the temperature in the vicinity of the irradiation portion 10 rises to the vicinity of the melting point of the material, the temperature of the back surface 12 of the irradiation portion 10 is maintained at a temperature slightly increased from room temperature. Due to the thermal expansion of the irradiation unit 10 and the steep temperature distribution, the head base 2 is bent and the tip end portion to which the head chip 1 is bonded tends to be displaced downward, as in the above-described conventional example.

However, since the restricting member 20 effectively restrains the tip portion of the head base 2 which is displaced most, the tip portion of the head base 2 cannot be displaced downward, as shown in FIG. Bend once into such a shape.
At this time, the thermal expansion deformation of the irradiation unit 10 is restricted by the restriction member 20. Due to the external restraint of the restricting member 20, a compressive stress is generated in the irradiation section 10 and so-called thermoplastic deformation is caused.

Therefore, when the irradiation of the laser beam is completed and the irradiation part 10 is cooled by heat conduction into the material and heat contraction occurs, the state before irradiation is changed by the amount of the thermoplastic deformation during heating. When it contracts beyond, the head base 2 bends in an upward concave shape as shown in FIG. 4 and stops.

For example, from the YAG laser light source 6, energy of about 1 joule per pulse has a pulse width of 9 msec.
When the head base 2 made of brass and having a thickness of 1 mm was irradiated, the height of the head chip 1 could be changed by about 1 μm. FIG. 5 shows the result of measuring the change in the displacement of the head chip 1 in this experiment using a displacement meter (not shown) in contact. In the figure, the horizontal axis represents the measurement time and the vertical axis represents the displacement amount. As shown in the figure,
In the processing method according to the conventional example, the head chip 1 is once displaced downward, but after cooling, it returns to the state before laser irradiation, and residual displacement is hardly recognized. This is because the diameter of the laser beam is approximately the same as the width W of the head base 2, and there is nothing that restrains thermal expansion deformation during heating, and thermoplastic deformation does not occur.

That is, the YAG laser light is emitted in a pulsed form to the head base 2, and the displacement of the head base 2 in the laser light emission direction is restrained by the regulating member 20 to bend the narrow head base 2. Therefore, the height of the head chip 1 bonded to the tip can be precisely adjusted. Since the displacement amount H of the head chip 1 is almost proportional to the total energy amount of the laser light to be applied, it is possible to change the bending amount by changing the pulse width of the laser light. The head chip 1 can be positioned.
Further, since the position of the head chip 1 is observed by the microscope 8, it is sufficient to irradiate the head base 2 with YAG laser light repeatedly while adjusting the pulse width until the target position is reached.

At this time, the YAG laser light may be repeatedly applied to the same position, but in the direction of the arrow shown in FIG.
The head chip 1 is moved by moving the position of the laser light source 6 or the like.
By repeatedly irradiating while moving the irradiation position in the direction of the straight line connecting the fixing screw 3 and the fixing screw 3, the processing accuracy can be further enhanced.

On the other hand, the regulating member 20 arranged substantially in contact with the head base 2 is separated from the head base 2 during the repeated irradiation of the laser light. However, as is clear from the displacement measurement result of the head chip 1 in the conventional example shown in FIG. 5, the head chip 1 tends to be displaced downward by 10 μm or more during the irradiation of the laser beam, so that the regulating member 20 and the head base 2 It was possible to cause the head base 2 to be thermoplastically deformed by contacting with, and it was possible to repeat the bending process of the head base 2. More preferably, based on the observation result of the microscope 8, the stage 2
The laser beam is repeatedly emitted while adjusting the position of the regulating member 20 by 1 every time the laser beam is emitted. With such a method, not only the positioning accuracy of the head chip 1 can be further improved, but also the total processing amount by repeated irradiation,
That is, the total movement amount of the head chip 1 can be increased.

As described above, according to this embodiment, the head base 2, which is the workpiece, is irradiated with the laser light in pulses, and the displacement of the tip end portion of the head base 2 in the laser light irradiation direction is restricted. Since the member 20 restrains, even if the head base 2 has a narrow width, it is possible to surely cause the thermoplastic deformation. As a result, the head base 2 having a narrow width can be bent, which is impossible by the conventional bending process using laser irradiation, and the height of the head chip 1 bonded to the tip can be precisely adjusted. Moreover, since the total irradiation energy of the laser light can be easily changed,
High-precision positioning of sub-micron order is possible.

Further, according to this embodiment, the head base 2
Since the restriction member 20 only restricts the deformation of the head base 2 due to the thermal expansion thereof, when the head base 2 is deformed upward by the contraction deformation during cooling, there is nothing that hinders the deformation. Therefore, the ratio of the amount of displacement of the head chip 1 after cooling to the energy of the emitted laser light can be increased, and a processing method with high processing efficiency can be provided.

Next, a second embodiment of the present invention will be described with reference to the drawings. In the first embodiment, one head chip 1 is bonded to the head base 2 which is the workpiece, but in the present embodiment, in order to mount a plurality of magnetic heads on the rotating cylinder 5 in close proximity, As shown in FIG. 7 and FIG. 7, the head base 2 is provided with the movable portions 31 and 32, and the head chips 33 and 34 are bonded to the respective tip portions. Since the head chips 33 and 34 need to be installed close to each other, it is necessary to reduce the width of the movable portions 31 and 32 as illustrated. Further, in the first embodiment, the regulation member 20 as the regulation means is provided separately from the rotary cylinder 5,
In this embodiment, a crossbar 35 is arranged on the back side of the tip of the movable parts 31 and 32 so as to straddle both movable parts, and is fixed to the rotary cylinder 5 by screws 38 and 39 through screw holes 36 and 37. Has become. The other structure is the same as that of the first embodiment, and the description thereof is omitted.

The method of bending the head base 2 in this embodiment is performed as follows. YAG laser light source 6
The pulsed YAG laser light is emitted from a part of the movable portion 31 of the head base 2. The movable portion 31 absorbs the energy of the laser light and the temperature thereof rises rapidly, and the tip end portion to which the head chip 33 is bonded tends to be displaced downward.

However, since the crossbar 35 effectively restrains the tip portion of the movable portion 31 which is displaced most, the tip portion of the movable portion 31 cannot be displaced downward, and the thermoplastic deformation occurs. To do. For this reason, when the irradiation of the laser light is completed and the movable part 31 is cooled by heat conduction into the material to cause thermal contraction, the thermoplastic plastic deformation occurs during heating, and the contraction exceeds the state before irradiation. However, the movable part 31 is bent upward in a concave shape and stopped as in the first embodiment, and the height of the head chip 33 can be adjusted precisely. By rotating the rotating cylinder 5 slightly,
It is also possible to move the YAG laser light source 6 directly above the movable portion 32 and adjust the height of the head chip 34 by the same method.

As described above, according to this embodiment, the movable portions 31 and 32, which are the workpieces, are irradiated with the laser light in a pulsed manner, and the tip portions of the movable portions 31 and 32 are irradiated in the laser light irradiation direction. With a very simple structure in which only a single member for restraining the displacement, that is, the crossbar 35 is provided, it is possible to cause thermoplastic deformation in the narrow movable portions 31 and 32. As a result, it is possible to bend the movable portions 31 and 32 having a narrow width, which is not possible with the conventional bending process using laser irradiation, and to individually adjust the heights of the head chips 33 and 34 bonded to the tips. You can Moreover, since the total irradiation energy of the laser light can be easily changed, it is possible to perform highly accurate positioning on the order of submicrons. Further, in this embodiment, the crossbar 35
Since the bending work can be performed only by attaching once, the number of setups in the working process can be reduced and the working cost can be suppressed.

Next, a third embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 8 and 9, an irradiation hole 41 having a depth of more than half the thickness of the head base 2 is provided on the upper surface of the head base 2 which is a workpiece. Also,
Inside the portion of the rotary cylinder 5 facing the head chip 1, a protrusion 42 is provided as a regulation means for regulating the displacement of the head base 2 during heating. The other structure is the same as that of the first embodiment, and the description thereof is omitted.

The method of bending the head base 2 in this embodiment is performed as follows. YAG laser light source 6
The pulsed YAG laser light emitted from is focused on the irradiation hole 41 of the head base 2. Bottom 4 of irradiation hole 41
3 absorbs the energy of the laser beam and the temperature rises sharply up to the back surface 12. In the first embodiment,
Although the upper surface of the head base 2 is heated and the tip portion of the head base 2 tends to be displaced downward, in the present embodiment, the bottom portion 4 of the irradiation hole 41 deeper than the thickness of the head base 2 is formed.
Since 3 thermally expands, the tip portion of the head base 2 tends to be displaced upward.

However, since the protruding portion 42 provided on the rotary cylinder 5 effectively restrains the vicinity of the tip portion of the head base 2 which is displaced most, the bottom portion 43 undergoes thermoplastic deformation. Therefore, the irradiation of laser light is completed,
When the head base 2 is cooled by heat conduction into the material and heat contraction occurs, only the amount of thermoplastic deformation during heating causes
The head base 2 is contracted beyond the state before irradiation, and just in the opposite way to the first embodiment, the head base 2 is bent in an upward convex shape and stopped, and the height of the head chip 1 is displaced downward and positioned. You can

As described above, according to this embodiment, the head base 2 which is the work piece is provided with the irradiation hole 41 deeper than half the thickness thereof, and the laser beam is irradiated to the bottom portion 43 of the irradiation hole 41 in a pulsed manner. In addition, as a restricting means for restricting the displacement of the head base 2 during heating, only by providing the rotating cylinder 5 with the projecting portion 42 having an extremely simple structure, it is possible to reliably cause the plastic deformation of the narrow head base 2. it can. As a result, the head base 2 having a narrow width, which is impossible by the conventional bending process by laser irradiation, can be bent, and the height of the head chip 1 bonded to the tip can be adjusted. Moreover, since the total irradiation energy of the laser light can be easily changed, high-precision positioning on the order of submicron becomes possible. Further, in the present embodiment, the rotating cylinder 5 is used as the regulating means.
Since the bending process can be performed simply by providing the protrusion 42 on the
It is possible to mount the magnetic head at a high density on a smaller magnetic recording / reproducing device.

In the first, second and third embodiments described above, the YAG laser was used as the heating means, but it is also possible to focus various lasers and visible light, such as gas flame or high frequency induction. It is also possible to heat by a method such as heating. Further, any heating source capable of local heating such as arc welding, electron beam welding or ultrasonic welding can be used. Therefore, the processing method of the present invention can be easily introduced by utilizing the existing processing equipment.

Further, in the first, second and third embodiments, the position of the YAG laser light source 6 during the irradiation of the laser light is fixed, but the head base 2 which is the workpiece and the YAG which is the heat source. A processing method in which the laser light is irradiated while the position of the laser light source 6 is relatively moved in the width direction of the head base 2 is also possible. In this case, since the laser light scans the surface of the head base 2, the head base 2
The irradiation part 10 is uniformly heated in the width direction. For this reason,
The work piece can be precisely bent without any deformation such that the head base 2 is twisted, and the magnetic head can be positioned with high accuracy. At this time, what is important is that the laser light is scanned in the width direction of the head base 2 which is the work material, so that the laser beam is moved by an optical means such as a movable mirror while the YAG laser light source 6 is fixed. It goes without saying that the same effect can be obtained by scanning with light. Alternatively, even if the laser beam is not scanned, if the laser beam has a flat shape, the head base 2 is uniformly heated in the width direction, and the same effect can be obtained.

In this embodiment, an example in which the bending method according to the present invention is used for the height adjusting method of the magnetic head of the magnetic recording / reproducing apparatus has been described. Not limited to the head, bending of various small precision parts made of a plate-shaped or rod-shaped metal material, or position adjustment or posture adjustment by bending, by applying the bending method of the present invention, similar to the present embodiment, It goes without saying that highly precise processing and adjustment can be performed.

[0036]

As described above, in the bending method according to the present invention, in addition to the heating means for heating a part of the workpiece,
Since the restriction means restrains the deformation of a part of the work piece due to thermal expansion during heating, even if the work piece has a narrow width, thermoplastic deformation occurs during heating and the work piece is bent with high accuracy after cooling. Can be processed. Further, since the restricting means only restricts the deformation of a part of the work material due to the thermal expansion during heating, the shrinkage deformation of the work material during cooling is not hindered by anything and the processing efficiency is improved. It is possible to provide a high processing method.

Further, in the magnetic head positioning method according to the present invention, in addition to the heating means for heating a part of the head base portion to which the head chip is fixed at the tip, the regulating means causes the head base portion to undergo thermal expansion during heating. Since the deformation of a part is constrained, the magnetic head can be positioned with high accuracy even with a narrow head base. Then, it becomes possible to mount the magnetic head at high density,
It becomes possible to easily manufacture an ultra-small magnetic recording / reproducing apparatus.

[Brief description of drawings]

FIG. 1 is a sectional view of an essential part showing a relationship among a work material, a heating means and a regulating means in a first embodiment of the present invention.

FIG. 2 is a perspective view showing the shape of a work material according to the first embodiment of the present invention.

FIG. 3 is a principle view of a state in which a workpiece is being heated in a first embodiment of the present invention as viewed from a side surface.

FIG. 4 is a side view of the principle of the work material after cooling according to the first embodiment of the present invention as viewed from the side.

FIG. 5 is a time waveform chart showing a time-dependent change in displacement of a workpiece in the first embodiment of the present invention.

FIG. 6 is a cross-sectional view of essential parts showing the relationship between the work material and the heating means and regulating means in the second embodiment of the present invention.

FIG. 7 is a perspective view showing the shape of a work material according to the second embodiment of the present invention.

FIG. 8 is a cross-sectional view of essential parts showing the relationship between the work material and the heating means and regulating means in the third embodiment of the present invention.

FIG. 9 is a perspective view showing the shape of a work material according to a third embodiment of the present invention.

FIG. 10 is a sectional view of an essential part showing the relationship between a work material and a heating means in a conventional example.

FIG. 11 is a perspective view showing the shape of a material to be processed in a conventional example.

FIG. 12 is a principle view of a state in which a workpiece is being heated in a conventional example as seen from a side surface.

FIG. 13 is a side view showing a state in which a workpiece is cooled in a conventional example as viewed from the side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 head chip 2 head base 3 fixing screw 5 rotating cylinder 6 YAG laser light source 7 hole 8 microscope 10 irradiation part 11 side part 12 back surface 20 regulation member 21 stage 31 movable part 32 movable part 33 head chip 34 head chip 35 crossbar 41 irradiation Hole 42 Projection 43 Bottom

Claims (2)

[Claims]
1. A part of a work piece, at least one end of which is fixed, is heated by a heating means, and deformation of a part of the work piece due to thermal expansion during heating is restrained by a restricting means so that a thermoplastic deformation occurs during heating. A bending method comprising bending the material to be processed.
2. A portion of a head base portion, to which a head chip is fixed at the tip, is heated by a heating means, and deformation of the portion of the head base portion due to thermal expansion during heating is restrained by a regulating means to heat the portion. A method for positioning a magnetic head, characterized in that the head chip is positioned at an arbitrary position by the thermoplastic deformation of.
JP22549293A 1993-09-10 1993-09-10 Method for bending and method for positioning magnetic head Pending JPH0780557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22549293A JPH0780557A (en) 1993-09-10 1993-09-10 Method for bending and method for positioning magnetic head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22549293A JPH0780557A (en) 1993-09-10 1993-09-10 Method for bending and method for positioning magnetic head

Publications (1)

Publication Number Publication Date
JPH0780557A true JPH0780557A (en) 1995-03-28

Family

ID=16830172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22549293A Pending JPH0780557A (en) 1993-09-10 1993-09-10 Method for bending and method for positioning magnetic head

Country Status (1)

Country Link
JP (1) JPH0780557A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003040285A (en) * 2001-08-01 2003-02-13 Fujimori Kogyo Co Ltd Method for forming easy unsealing means, and pouch with easily unsealing means
US6640604B2 (en) 2001-02-14 2003-11-04 Fujitsu Limited Laser bending method and apparatus for bending a work piece in normal and reverse directions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640604B2 (en) 2001-02-14 2003-11-04 Fujitsu Limited Laser bending method and apparatus for bending a work piece in normal and reverse directions
JP2003040285A (en) * 2001-08-01 2003-02-13 Fujimori Kogyo Co Ltd Method for forming easy unsealing means, and pouch with easily unsealing means

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