JPH0515307B2 - - Google Patents
Info
- Publication number
- JPH0515307B2 JPH0515307B2 JP61188112A JP18811286A JPH0515307B2 JP H0515307 B2 JPH0515307 B2 JP H0515307B2 JP 61188112 A JP61188112 A JP 61188112A JP 18811286 A JP18811286 A JP 18811286A JP H0515307 B2 JPH0515307 B2 JP H0515307B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cooling
- fin
- cooling plate
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 30
- 239000003507 refrigerant Substances 0.000 claims description 15
- 239000002826 coolant Substances 0.000 claims description 9
- 239000011553 magnetic fluid Substances 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811286A JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18811286A JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6344748A JPS6344748A (ja) | 1988-02-25 |
| JPH0515307B2 true JPH0515307B2 (US07223432-20070529-C00017.png) | 1993-03-01 |
Family
ID=16217910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18811286A Granted JPS6344748A (ja) | 1986-08-11 | 1986-08-11 | 半導体素子の冷却構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6344748A (US07223432-20070529-C00017.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2792304B2 (ja) * | 1992-01-22 | 1998-09-03 | 日本電気株式会社 | 集積回路用冷却装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188596A (ja) * | 1984-10-05 | 1986-05-06 | 富士通株式会社 | 電子部品の冷却構造 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311894Y2 (US07223432-20070529-C00017.png) * | 1984-10-25 | 1991-03-20 |
-
1986
- 1986-08-11 JP JP18811286A patent/JPS6344748A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6188596A (ja) * | 1984-10-05 | 1986-05-06 | 富士通株式会社 | 電子部品の冷却構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6344748A (ja) | 1988-02-25 |
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