JPH05148337A - Epoxy resin composition suitable for structural adhesive - Google Patents
Epoxy resin composition suitable for structural adhesiveInfo
- Publication number
- JPH05148337A JPH05148337A JP3315638A JP31563891A JPH05148337A JP H05148337 A JPH05148337 A JP H05148337A JP 3315638 A JP3315638 A JP 3315638A JP 31563891 A JP31563891 A JP 31563891A JP H05148337 A JPH05148337 A JP H05148337A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- liquid rubber
- structural adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は自動車の車体組み立てに
おけるフード、ドアー、フェンダのヘム・フランジ部等
の接着あるいはウェルドボンド工法による車体骨格部品
の接着に用いられる構造用接着剤に適したエポキシ樹脂
組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin suitable as a structural adhesive used for bonding hoods, doors, hem / flange parts of fenders, etc. in car body assembly of automobiles or for bonding car body frame parts by the weld bond method It relates to a composition.
【0002】[0002]
【従来の技術】従来、エポキシ樹脂をベースとする構造
用接着剤としてビスフェノール型エポキシ樹脂、ゴム変
性エポキシ樹脂、合成ゴム、ウレタン変性エポキシ樹
脂、充填剤および硬化剤からなる各種のエポキシ樹脂組
成物が知られている。Conventionally, various epoxy resin compositions comprising bisphenol type epoxy resin, rubber modified epoxy resin, synthetic rubber, urethane modified epoxy resin, filler and curing agent have been used as structural adhesives based on epoxy resin. Are known.
【0003】一方、構造用に用いられる接着剤は、その
構造物の使用形態から接着部に剪断応力のみならず各種
方向の応力がかかるので構造用接着剤は剪断接着性およ
び剥離強度のいずれに対しても高度のものが要求され
る。従来公知の構造用接着剤に用いられるエポキシ樹脂
組成物は必ずしもこの様な要求を完全に満たすものでは
無く、特に剥離強度に於いて改良の余地があった。On the other hand, an adhesive used for a structure is subjected to not only shearing stress but also stress in various directions on the bonded portion depending on the usage form of the structure, so that the structural adhesive has both shear adhesiveness and peel strength. On the other hand, advanced equipment is required. Epoxy resin compositions used for conventionally known structural adhesives do not always completely meet such requirements, and there is room for improvement, especially in peel strength.
【0004】[0004]
【発明が解決しようとする課題】従って、本発明はビス
フェノール系エポキシ樹脂硬化物が元来有する剪断接着
性を実質的に損うこと無く剥離強度に優れる構造用接着
剤として適切なエポキシ樹脂組成物を提供することを目
的とする。Therefore, the present invention provides an epoxy resin composition suitable as a structural adhesive having excellent peel strength without substantially impairing the shear adhesiveness originally possessed by a bisphenol epoxy resin cured product. The purpose is to provide.
【0005】本発明者は鋭意、研究した結果、ビスフェ
ノール型樹脂と硬化剤からなる系に、ブロックイソシア
ネートを有する特殊なウレタン変性エポキシ樹脂及びカ
ルボキシル基を含有する特殊なブタジエン・アクリロニ
トリル液状ゴムを配合することにより上記目的が達成さ
れることを知見し本発明を完成するに到った。As a result of diligent research, the present inventor has blended a special urethane-modified epoxy resin having a blocked isocyanate and a special butadiene-acrylonitrile liquid rubber containing a carboxyl group into a system comprising a bisphenol type resin and a curing agent. As a result, they have found that the above objects can be achieved, and have completed the present invention.
【0006】[0006]
【課題を解決するための手段】本発明によれば、ビスフ
ェノール型エポキシ樹脂(A)65〜98重量部、ブロ
ックイソシアネートを含有するウレタン変性エポキシ樹
脂(B)35〜2重量部(ここでエポキシ樹脂(A)と
変性エポキシ樹脂(B)との合計量は100重量部とな
るようにする)、カルボキシル基含有ブタジエン・アク
リロニトリル液状ゴム(C)5〜50重量部および硬化
剤(D)からなる構造用接着剤に適したエポキシ樹脂組
成物が提供される。According to the present invention, 65 to 98 parts by weight of a bisphenol type epoxy resin (A) and 35 to 2 parts by weight of a urethane-modified epoxy resin (B) containing a blocked isocyanate (wherein the epoxy resin is used). The total amount of (A) and modified epoxy resin (B) is 100 parts by weight), a structure comprising 5 to 50 parts by weight of a carboxyl group-containing butadiene-acrylonitrile liquid rubber (C) and a curing agent (D). An epoxy resin composition suitable for an adhesive for use is provided.
【0007】本発明の組成物を接着剤に使用した場合、
エポキシ樹脂系接着剤が本来有する高い剪断接着力を有
し、しかも剥離強度も優れているので構造用接着剤とし
て極めて適切である。When the composition of the present invention is used as an adhesive,
It has a high shear adhesive strength originally possessed by an epoxy resin-based adhesive, and is also excellent in peel strength, so it is extremely suitable as a structural adhesive.
【0008】以下、本発明の構成を詳述するが本発明の
目的および利点がより一層明確になるであろう。Hereinafter, the constitution of the present invention will be described in detail, but the objects and advantages of the present invention will become clearer.
【0009】エポキシ樹脂(A) ビスフェノール型エポキシ樹脂(A)は、2,2−ビス
(4−ヒドロキシフェニル)プロパン:ビスフェノール
A、2,2−ビス(4−ヒドロキシフェニル)エタン:
ビスフェノールAD、ビス(4−ヒドロキシフェニル)
メタン:ビスフェノールFで例示されるビスフェノール
とエピクロルヒドリンから誘導されるエポキシ樹脂であ
り、代表的には下記構造式(1)で示される。 Epoxy Resin (A ) The bisphenol type epoxy resin (A) is 2,2-bis (4-hydroxyphenyl) propane: bisphenol A, 2,2-bis (4-hydroxyphenyl) ethane:
Bisphenol AD, bis (4-hydroxyphenyl)
Methane: An epoxy resin derived from bisphenol exemplified by bisphenol F and epichlorohydrin, and is typically represented by the following structural formula (1).
【0010】[0010]
【化1】 (上記式に於いてRは水素原子またはメチル基である)[Chemical 1] (In the above formula, R is a hydrogen atom or a methyl group)
【0011】エポキシ樹脂(A)の数平均分子量は35
0〜5000、特には、350〜2000が好ましい。
あまり分子量の高いのもは、エポキシ基の含量が低いの
で硬化後の架橋密度が低く、充分な剪断接着強度を得ら
れないと共に接着剤の粘度が大きくなり塗布作業等が困
難になる。The number average molecular weight of the epoxy resin (A) is 35.
0-5000, especially 350-2000 are preferable.
When the molecular weight is too high, since the content of epoxy groups is low, the crosslink density after curing is low, sufficient shear adhesive strength cannot be obtained, and the viscosity of the adhesive becomes large, which makes application work difficult.
【0012】ブロックイソシアネート含有ウレタン変性
エポキシ樹脂(B) 変性エポキシ樹脂(B)は以下の如き方法で調製され
る。即ち、ポリオール(a)に過剰のジイソシアネート
(b)を反応させ、末端にイソシアネート基を含有する
ウレタンプレポリマー(c)を調製した後、このプレポ
リマー(c)の末端イソシアネートの一部を水酸基含有
化合物(d)と反応させてブロックイソシアネートを形
成する。 Modified urethane containing blocked isocyanate
Epoxy resin (B) Modified epoxy resin (B) is prepared by the following method. That is, an excess diisocyanate (b) is reacted with the polyol (a) to prepare a urethane prepolymer (c) having an isocyanate group at the terminal, and then a part of the terminal isocyanate of this prepolymer (c) contains a hydroxyl group. It reacts with compound (d) to form a blocked isocyanate.
【0013】イソシアネートの一部がブロックされたプ
レポリマー(c)とビスフェノールA型エポキシ樹脂、
ビスフェノールF型エポキシ樹脂、グリシジルエステル
型エポキシ樹脂、ポリグリコール型エポキシ樹脂等のエ
ポキシ樹脂(e)とを反応させて変性エポキシ樹脂
(B)が製造される。A prepolymer (c) in which a part of the isocyanate is blocked and a bisphenol A type epoxy resin,
The modified epoxy resin (B) is produced by reacting with an epoxy resin (e) such as a bisphenol F type epoxy resin, a glycidyl ester type epoxy resin, or a polyglycol type epoxy resin.
【0014】上記に於いてポリオール(a)としてはポ
リテトラメチレングリコール、ポリエチレングリコー
ル、ポリプロピレングリコール、などのポリエーテルポ
リオール、その他ポリエステルポリオール、ポリエーテ
ルエステルポリオール、ポリエステルアミドポリオー
ル、アクリルポリオール、ポリウレタンポリオールなど
が挙げられるが、好ましいものは、ポリエーテルポリオ
ールである。In the above, examples of the polyol (a) include polyether polyols such as polytetramethylene glycol, polyethylene glycol and polypropylene glycol, other polyester polyols, polyether ester polyols, polyester amide polyols, acrylic polyols and polyurethane polyols. Although preferred, polyether polyols are preferred.
【0015】ジイソシアネート(b)としてはトリレン
ジイソシアネート、ジフェニルメタンジイソシアネー
ト、ヘキサメチレンジイソシアネート、テトラメチレン
ジイソシアネート、イソホロンジイソシアネート、メチ
レンビス(4−シクロヘキシルイソシアネート)、キシ
リレンジイソシアネート、などが挙げられ、なかでも、
トリレンジイソシアネート、ジフェニルメタンジイソシ
アネートが好ましい。Examples of the diisocyanate (b) include tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, tetramethylene diisocyanate, isophorone diisocyanate, methylene bis (4-cyclohexyl isocyanate), xylylene diisocyanate, and the like.
Tolylene diisocyanate and diphenylmethane diisocyanate are preferred.
【0016】上記反応で得られるウレタンプレポリマー
(c)は、そのポリマー末端にイソシアネート基を有す
るが、そのイソシアネートの一部をブロックするために
用いる水酸基含有化合物(d)としてフェノール、クレ
ゾール、キシレノール等のフェノール類、γ−ブチロラ
クタム、ε−カプロラクタム等のラクタム類、アセトキ
シム、メチルエチルケトキシム、シクロヘキサノンオキ
シム等のオキシム類、コハク酸イミド、フタル酸イミド
等のイミド類、エタノール、ブタノール、イソプロパノ
ール等のアルコール類などが挙げられる。The urethane prepolymer (c) obtained by the above reaction has an isocyanate group at the polymer terminal, and as the hydroxyl group-containing compound (d) used for blocking a part of the isocyanate, phenol, cresol, xylenol, etc. , Lactams such as γ-butyrolactam and ε-caprolactam, oximes such as acetoxime, methylethylketoxime and cyclohexanone oxime, imides such as succinimide and phthalimide, alcohols such as ethanol, butanol and isopropanol. Is mentioned.
【0017】この様なブロックイソシアネート含有ウレ
タン変性エポキシ樹脂(B)は市販されており、例え
ば、エー・シー・アール(株)のR−1541として販
売されている。Such a blocked isocyanate-containing urethane-modified epoxy resin (B) is commercially available, for example, as R-1541 of AC R Co., Ltd.
【0018】この変性エポキシ樹脂は本発明のエポキシ
樹脂組成物を硬化の目的で高温に加熱するとブロックイ
ソシアネートが解離してイソシアネート基と水酸基含有
化合物となりこれらがエポキシ基、硬化剤と反応して強
靱な結合を形成する。この結合と後述する液状ゴム
(C)との存在により、本発明組成物の硬化物は剪断接
着性および剥離強度に於いて優れることになる。When the epoxy resin composition of the present invention is heated to a high temperature for the purpose of curing, the modified epoxy resin is dissociated from the blocked isocyanate to form an isocyanate group and a hydroxyl group-containing compound, which react with the epoxy group and the curing agent and are tough. Form a bond. The presence of this bond and the liquid rubber (C) described below makes the cured product of the composition of the present invention excellent in shear adhesiveness and peel strength.
【0019】エポキシ樹脂(A)と変性エポキシ樹脂
(B)の配合割合は重量比((A)/(B))で65/
35〜98/2好ましくは80/20〜95/5であ
る。The weight ratio ((A) / (B)) of the epoxy resin (A) and the modified epoxy resin (B) is 65 /.
35 to 98/2, preferably 80/20 to 95/5.
【0020】カルボキシル基含有ブタジエン・アクリロ
ニトリル液状ゴム 好ましい液状ゴム(C)は下記構造式(2)で示される
カルボキシル基が末端に結合しているものである。 Carboxyl group-containing butadiene acrylo
Nitrile liquid rubber A preferable liquid rubber (C) has a carboxyl group represented by the following structural formula (2) bonded to the terminal.
【0021】[0021]
【化2】 (ここでx、y、mは繰り返し単位数でx/yは95/
5〜50/50、mは10〜50である。)[Chemical 2] (Where x, y and m are the number of repeating units and x / y is 95 /
5-50 / 50, m is 10-50. )
【0022】液状ゴム(c)はそれ自体公知の方法で製
造可能でもあるし、また、宇部興産(株)のHycar
CTBN 1300×31、CTBN 1300×
8、CTBN 1300×13、CTBN 1300×
9として市販され、容易に入手できる。液状ゴム(C)
のアクリロニトリルの含量の増大と共にエポキシ樹脂
(A)との相溶性が大きくなるが、あまり多いとゴム的
性質を失うので上記式(2)においてx/y(モル比)
は90/10〜70/30が好ましい。The liquid rubber (c) can be produced by a method known per se, and it can also be produced by Ube Industries, Ltd. Hycar.
CTBN 1300x31, CTBN 1300x
8, CTBN 1300x13, CTBN 1300x
It is marketed as 9 and is easily available. Liquid rubber (C)
The compatibility with the epoxy resin (A) increases with an increase in the content of acrylonitrile, but if it is too much, the rubber-like property is lost, so x / y (molar ratio) in the above formula (2)
Is preferably 90/10 to 70/30.
【0023】この液状ゴム(C)を適切な量配合すると
エポキシ樹脂(A)および(B)と硬化時に反応してエ
ポキシ樹脂の剛直な高分子鎖と結合し、硬化物に可撓性
を与え、剥離接着強度を大ならしめる。その意味に於い
て液状ゴム(C)の配合量はエポキシ樹脂(A)と変性
エポキシ樹脂(B)の合計100重量部に対して5〜5
0重量部、好ましくは10〜30重量部である。When this liquid rubber (C) is compounded in an appropriate amount, it reacts with the epoxy resins (A) and (B) during curing and bonds with the rigid polymer chains of the epoxy resin, giving flexibility to the cured product. , Increases peel adhesion strength. In that sense, the compounding amount of the liquid rubber (C) is 5 to 5 per 100 parts by weight of the total of the epoxy resin (A) and the modified epoxy resin (B).
It is 0 part by weight, preferably 10 to 30 parts by weight.
【0024】硬化剤(D) 本発明で使用される硬化剤は硬化温度100〜200℃
の温度範囲でエポキシ樹脂の硬化反応が実質的に開始す
るものであれば如何なるものであっても良いが、具体的
にはジシアンジアシド、イソフタル酸シヒドラジド、
N,N´−ジアルキル尿素誘導体、N,N´−ジアルキ
ルチオ尿素誘導体などの潜在性硬化剤、4,4´−ジア
ミノジフェニルメタン、4,4´−ジアミノジフェニル
スルホンなどの芳香族ジアミン系硬化剤、その他イミダ
ゾールおよびその誘導体を挙げることができるが、なか
でもジシアンジアミド、N,N´−ジアルキル尿素誘導
体などが好ましく使用できる。硬化剤の使用量は硬化剤
の種類およびエポキシ基の組成物中に於ける存在量を考
慮して適切に定めることができるが一般的には、エポキ
シ樹脂((A)+(B))100重量部に対して1〜3
0重量部程度配合される。また、必要に応じて硬化促進
剤を併用できる。 Curing agent (D) The curing agent used in the present invention has a curing temperature of 100 to 200 ° C.
Any substance may be used as long as the curing reaction of the epoxy resin is substantially started in the temperature range of, but specifically, dicyandiaside, isophthalic acid hydrazide,
Latent curing agents such as N, N′-dialkylurea derivatives and N, N′-dialkylthiourea derivatives, aromatic diamine-based curing agents such as 4,4′-diaminodiphenylmethane and 4,4′-diaminodiphenylsulfone, Other examples include imidazole and its derivatives, and among them, dicyandiamide, N, N'-dialkylurea derivative and the like can be preferably used. The amount of the curing agent used can be appropriately determined in consideration of the type of the curing agent and the amount of the epoxy group present in the composition, but generally, the epoxy resin ((A) + (B)) 100 1-3 parts by weight
About 0 parts by weight is blended. Further, a curing accelerator can be used in combination if necessary.
【0025】また、本発明の組成物に於いては(A)〜
(D)の必須成分の他に必要に応じて炭酸カルシュウ
ム、水酸化アルミニウム、酸化チタン、硫酸バリウム、
カルシュウムメタシリケート、カーボンフィラー、カー
ボンチョップ等の充填剤、等を含有することができる。Further, in the composition of the present invention, (A) to
In addition to the essential components of (D), calcium carbonate, aluminum hydroxide, titanium oxide, barium sulfate, if necessary,
Fillers such as calcium metasilicate, carbon filler, and carbon chop can be contained.
【0026】[0026]
【実施例】以下、実施例を以って本発明を具体的に説明
する。表1に記載している配合比率で各成分を混合し、
3本ロールで十分に分散させて接着剤を得た。EXAMPLES The present invention will be specifically described below with reference to examples. Mix the components in the mixing ratios listed in Table 1,
An adhesive was obtained by sufficiently dispersing it with three rolls.
【0027】この接着剤を被着体(鋼板SCP−28C
(防錆油面処理)、引張剪断接着試験用:25×150
×1.6mmT型剥離試験用:25×200×0.8m
m)に厚さ0.15mmに塗布し180℃、20分の硬
化条件にて硬化接着し、得られた試験片につき引張剪断
接着試験(引張速度5mm/min)および剥離強度試験(引
張速度50mm/min)を行った。結果を表1に示した。比
較例1は液状ゴムを60phr添加した例、比較例2は
液状ゴムとウレタン変性エポキシ樹脂を添加しない例、
比較例3はウレタン変性エポキシ樹脂添加しない例、比
較例4はウレタン変性エポキシ樹脂を過剰に添加した例
で接着性が低下していることがわかる。This adhesive is applied to an adherend (steel plate SCP-28C
(Rust prevention oil surface treatment), for tensile shear adhesion test: 25 x 150
× 1.6mm For T-type peel test: 25 × 200 × 0.8m
m) to a thickness of 0.15 mm and cured and adhered under the curing condition of 180 ° C. for 20 minutes, and the obtained test piece is subjected to a tensile shear adhesion test (pulling speed 5 mm / min) and a peel strength test (pulling speed 50 mm). / min). The results are shown in Table 1. Comparative Example 1 is an example in which 60 phr of liquid rubber is added, Comparative Example 2 is an example in which neither liquid rubber nor urethane-modified epoxy resin is added,
It can be seen that Comparative Example 3 is an example in which the urethane-modified epoxy resin is not added, and Comparative Example 4 is an example in which the urethane-modified epoxy resin is excessively added, and the adhesiveness is lowered.
【0028】[0028]
【表1】 [Table 1]
【0029】[0029]
【発明の効果】この様に本発明のエポキシ樹脂組成物は
剪断接着力および剥離接着力に、優れるので構造用接着
剤として極めて適切で有利に使用される。INDUSTRIAL APPLICABILITY As described above, the epoxy resin composition of the present invention is excellent in shear adhesive strength and peel adhesive strength, and therefore is extremely suitable and advantageously used as a structural adhesive.
Claims (1)
〜98重量部、ブロックイソシアネートを含有するウレ
タン変性エポキシ樹脂(B)35〜2重量部(ここでエ
ポキシ樹脂(A)と変性エポキシ樹脂(B)との合計量
は100重量部となるようにする)、カルボキシル基含
有ブタジエン・アクリロニトリル液状ゴム(C)5〜5
0重量部および硬化剤(D)からなる構造用接着剤に適
したエポキシ樹脂組成物。1. A bisphenol type epoxy resin (A) 65.
˜98 parts by weight, 35 to 2 parts by weight of urethane modified epoxy resin (B) containing blocked isocyanate (wherein the total amount of epoxy resin (A) and modified epoxy resin (B) is 100 parts by weight) ), Carboxyl group-containing butadiene / acrylonitrile liquid rubber (C) 5 to 5
An epoxy resin composition suitable for a structural adhesive comprising 0 parts by weight and a curing agent (D).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3315638A JPH05148337A (en) | 1991-11-29 | 1991-11-29 | Epoxy resin composition suitable for structural adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3315638A JPH05148337A (en) | 1991-11-29 | 1991-11-29 | Epoxy resin composition suitable for structural adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05148337A true JPH05148337A (en) | 1993-06-15 |
Family
ID=18067775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3315638A Withdrawn JPH05148337A (en) | 1991-11-29 | 1991-11-29 | Epoxy resin composition suitable for structural adhesive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05148337A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0649865A1 (en) * | 1993-10-23 | 1995-04-26 | Hoechst Aktiengesellschaft | Aqueous, self-crosslinking polyurethanevinyl hybrid dispersions |
EP1406939A4 (en) * | 2001-04-27 | 2004-09-15 | Henkel Kgaa | Thermosettable compositions useful for producing structural adhesive foams |
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JP2013510225A (en) * | 2009-11-05 | 2013-03-21 | ダウ グローバル テクノロジーズ エルエルシー | Structural epoxy resin adhesives containing ketoxime-capped elastomeric reinforcements |
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1991
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Cited By (28)
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EP0649865A1 (en) * | 1993-10-23 | 1995-04-26 | Hoechst Aktiengesellschaft | Aqueous, self-crosslinking polyurethanevinyl hybrid dispersions |
EP1406939A4 (en) * | 2001-04-27 | 2004-09-15 | Henkel Kgaa | Thermosettable compositions useful for producing structural adhesive foams |
WO2006132093A1 (en) | 2005-06-09 | 2006-12-14 | Adeka Corporation | Hardenable resin composition |
EP1900774A1 (en) * | 2005-06-09 | 2008-03-19 | Adeka Corporation | Hardenable resin composition |
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JP5258290B2 (en) * | 2005-06-09 | 2013-08-07 | 株式会社Adeka | Curable resin composition |
US9034135B2 (en) | 2006-12-21 | 2015-05-19 | Sika Technology Ag | Hem flange joint |
JP2011508792A (en) * | 2006-12-21 | 2011-03-17 | シーカ・テクノロジー・アーゲー | Hem flange adhesive bond |
JP2008239890A (en) * | 2007-03-28 | 2008-10-09 | Adeka Corp | Curable resin composition and automotive structural adhesive containing the same |
US11198754B2 (en) | 2007-11-14 | 2021-12-14 | Sika Technology Ag | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
JP2013510225A (en) * | 2009-11-05 | 2013-03-21 | ダウ グローバル テクノロジーズ エルエルシー | Structural epoxy resin adhesives containing ketoxime-capped elastomeric reinforcements |
JP2014514396A (en) * | 2011-03-29 | 2014-06-19 | アヴィオ エッセ.ピー.アー. | Polymer formulations with chemically tunable rheological properties for the manufacture of articles composed of prepregs and composites |
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JP2013067768A (en) * | 2011-09-21 | 2013-04-18 | Samsung Electro-Mechanics Co Ltd | Adhesive resin composition for hdd motor and hdd motor using the same |
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US11542418B2 (en) | 2017-09-15 | 2023-01-03 | Sumitomo Seika Chemicals Co., Ltd. | Epoxy resin composition |
US12054572B2 (en) | 2018-11-15 | 2024-08-06 | Denka Company Limited | Composition |
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