JPH0514613Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a mounting device for a solid-state image sensor.

[Summary of the idea]

This idea aims to reduce the number of parts and assembly steps by providing a mounting bracket for attaching a solid-state image sensor to, for example, an optical prism with a board positioning function and a grounding function.

[Conventional technology]

A solid-state image sensor made of a charge-coupled device (hereinafter abbreviated as CCD) is small and lightweight, and is used, for example, in color video cameras. In this case, the CCD is connected to an optical prism that splits the image into
Mounted by mounting device.

FIG. 3 is a side view of the mounting device with the CCD attached to the optical prism, and FIG. 4 is an exploded perspective view of the mounting device.

In the figure, 1 is an optical prism, 2a and 2b are support bases for fixing the prism 1 to a housing, etc.
5 is a CCD, 3 and 4 are first and second metal fittings for attaching the CCD 5 to the prism 1, the first metal fitting 3 is fixed to the prism 1, and the second metal fitting 4 is soldered to the metal fitting 3. and fixed. Further, 7 is a substrate, and the pins 6 of the CCD 5 are inserted into a plurality of holes 11 formed in the substrate and soldered. 8 is inserted between the CCD 5 and the board 7,
A spacer for positioning the board 7 in the thickness direction, 9 a grounding member for connecting the board and the metal fitting 4 and grounding the board, 10a and 10b a CCD 5
This is a male screw for fixing to the metal fitting 4.

The screws 10a and 10b are inserted into the screw holes 12a and 12b through the holes 15a and 15b, respectively,
The CCD 5 is screwed and fixed to the metal fitting 4. Next, the spacer 8 is installed on the upper surface of the CCD 5, and the pin 6 of the CCD 5 is inserted into the hole 11 of the substrate 7. One end 9a of the grounding member 9 is attached to the substrate 7, and the other end 9b is attached to the side surface of the second mounting bracket 4 by screwing, soldering, or the like.

[Problem that the invention attempts to solve]

Since the above-described conventional mounting device required the spacer 8 and the grounding member 9, the number of parts and assembly steps were large, which caused an increase in costs.

By the way, if the number of parts and the number of assembly steps can be reduced without impairing the board positioning function and the grounding function of the above-described solid-state image sensor mounting device, a large cost reduction can be achieved.

The present invention is intended to provide a mounting device for a solid-state image pickup device which has a simple structure with a small number of parts and assembly steps.

[Means for solving problems]

This device includes a solid-state image sensor 5, a mounting bracket 27 fixed to a surface opposite to the side toward which the tip of a pin 6 protruding from the solid-state image sensor 5 faces, and a hole 11 into which the pin 6 is inserted. The mounting bracket 27 includes a substrate 7, and has protrusions 18a and 18b that stand upright in a direction perpendicular to the surface of the solid-state image sensor 5 and whose tips face in the same direction as the pins 6.
a, 18b have shoulder portions 20a, 20b, 28a, 2
8b and protrusions 19a, 19b are formed, and through holes 26a, 26b are provided in the substrate 7 at locations corresponding to the protrusions 19a, 19b.

[Effect]

The pins of the solid-state image sensor 5 are inserted into the holes 11 of the substrate 7, and the protrusions 19a, 19b of the protrusions 18a, 18b formed on the mounting bracket 27 are inserted into the through holes 26a, 26b of the substrate, so that the protrusions 18a,
The substrate 7 is positioned by the shoulders 20a, 20b, 28a, 28b of 18b.

Furthermore, the protrusions 19a and/or 19b are soldered to the substrate 7 to be electrically connected and grounded.

〔Example〕

FIG. 1 is an exploded perspective view of an embodiment of this invention.
FIG. 2a is a side view thereof, and FIG. 2b is a front view thereof. Components equivalent to those shown in FIG. 4 are given the same reference numerals.

In the figure, reference numeral 23 denotes a flat first mounting bracket, which is attached to the prism 1. This metal fitting 2
3 has an opening 23 in the center for passing light.
A is formed. Further, on a pair of mutually opposing sides of this metal fitting 23, four leg portions 24a, 2
4b, 25a, 25b are formed.

Reference numeral 27 denotes a second mounting fitting, and an opening 27A for passing light is formed in the center of the flat portion 29 of this fitting 27. Further, four leg portions 21a, 21b, 22a, and 22b are formed on a pair of opposing sides of the second mounting fitting 27. These four legs 21a, 21b, 22
a, 22b are leg portions 24a, 2 of the first metal fitting 23;
4b, 25a, and 25b, respectively, by soldering. Furthermore, substrate positioning portions 18a and 18b are formed on a pair of mutually opposing sides of the second mounting bracket 27, which are protrusions extending in a direction perpendicular to the plane portion 29, that is, in the thickness direction. The positioning parts 18a and 18b include protrusions 19a and 19b that are inserted into holes 26a and 26b provided in the board 7 and soldered thereto, and a shoulder part 20a that contacts the bottom surface of the board 7 and stably supports the board 7. ,20b,
28a and 28b are formed. The positioning parts 18a and 18b position and connect the board 7 and the second mounting bracket 27, and the protrusion 19
Grounding is provided by one or both of a and 19b. In addition, in this mounting bracket 27, 16a,
16b is a screw hole into which screws 10a and 10b are inserted, and 17a and 17b are holes 1 formed in CCD 5.
This is a cylindrical protrusion inserted into CCD 3a and 13b for positioning the CCD 5. The CCD 5 is attached to the upper surface of this second mounting bracket 27 and fixed with screws 10a and 10b.

[Effect of idea]

According to this invention, the board positioning parts 18a and 18b formed on the second mounting bracket 27 allow
Since the positioning of the board 7 and the grounding of the board 7 are performed, the spacer 8 for positioning the board and the member 9 for grounding the board, which were conventionally necessary, are no longer necessary. Therefore, this invention has the effect of reducing the number of parts and assembly steps without impairing the functions of the CCD mounting device, thereby reducing costs.

[Brief explanation of drawings]

Figure 1 is an exploded perspective view of one embodiment of this invention, Figures 2 a and b are side and front views of the embodiment shown in Figure 1, Figure 3 is a side view of the conventional example, and Figure 4. 3 is an exploded perspective view of the conventional example shown in FIG. 3. FIG. 1 is an optical prism, 5 is a CCD, 7 is a substrate, 1
8a, 18b are board positioning parts, 19a, 19b
20a, 20b, 28a, 28b are shoulders, 23 is a first mounting bracket, and 27 is a second mounting bracket.

Claims (1)

[Scope of utility model registration request] A solid-state image sensor, a mounting bracket fixed to a surface opposite to the side toward which a tip of a pin protruding from the solid-state image sensor faces, and a substrate having a hole into which the pin is inserted; There is a protrusion that stands upright in a direction perpendicular to the surface of the solid-state image sensor and has a tip facing in the same direction as the pin, a shoulder and a protrusion are formed on the protrusion, and a shoulder and a protrusion are formed on the substrate. A through hole is provided at the location, and the pin is inserted into the hole of the board, and the protrusion is inserted into the through hole, and the protrusion is electrically connected to the board and grounded. A mounting device for a solid-state image sensor, in which the position of the substrate is determined by the portion.