JPH0514529Y2 - - Google Patents

Info

Publication number
JPH0514529Y2
JPH0514529Y2 JP1987110390U JP11039087U JPH0514529Y2 JP H0514529 Y2 JPH0514529 Y2 JP H0514529Y2 JP 1987110390 U JP1987110390 U JP 1987110390U JP 11039087 U JP11039087 U JP 11039087U JP H0514529 Y2 JPH0514529 Y2 JP H0514529Y2
Authority
JP
Japan
Prior art keywords
housing
lens
conductive pattern
led
outer lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987110390U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6413746U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987110390U priority Critical patent/JPH0514529Y2/ja
Publication of JPS6413746U publication Critical patent/JPS6413746U/ja
Application granted granted Critical
Publication of JPH0514529Y2 publication Critical patent/JPH0514529Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP1987110390U 1987-07-17 1987-07-17 Expired - Lifetime JPH0514529Y2 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987110390U JPH0514529Y2 (zh) 1987-07-17 1987-07-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987110390U JPH0514529Y2 (zh) 1987-07-17 1987-07-17

Publications (2)

Publication Number Publication Date
JPS6413746U JPS6413746U (zh) 1989-01-24
JPH0514529Y2 true JPH0514529Y2 (zh) 1993-04-19

Family

ID=31347503

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987110390U Expired - Lifetime JPH0514529Y2 (zh) 1987-07-17 1987-07-17

Country Status (1)

Country Link
JP (1) JPH0514529Y2 (zh)

Also Published As

Publication number Publication date
JPS6413746U (zh) 1989-01-24

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