JPH05145211A - Electrolytic capacitor and printed wiring board for attaching same - Google Patents
Electrolytic capacitor and printed wiring board for attaching sameInfo
- Publication number
- JPH05145211A JPH05145211A JP33009791A JP33009791A JPH05145211A JP H05145211 A JPH05145211 A JP H05145211A JP 33009791 A JP33009791 A JP 33009791A JP 33009791 A JP33009791 A JP 33009791A JP H05145211 A JPH05145211 A JP H05145211A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- electrolytic capacitor
- terminals
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は逆挿入防止を考慮した印
刷配線板および電解コンデンサに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board and an electrolytic capacitor in consideration of prevention of reverse insertion.
【０００２】[0002]
【従来の技術】印刷配線板（以下基板と略す）への電解
コンデンサの取付については、リード線タイプの小形電
解コンデンサの場合、テーピングされた電子部品連を自
動装着機により自動搭載されることが多くなってきてい
る。しかしより大形の基板自立形コンデンサの場合テー
ピングが困難であり、主として人手により基板に装着さ
れている。電解コンデンサの場合、端子に極性があるの
で、基板に装着する際には極性を揃える必要があるが、
従来の基板では電解コンデンサの取付穴は陽極用陰極用
が同径であったために、しばしば極性を逆に挿入してし
まうことがあった。極性を逆にして取付けられた電解コ
ンデンサは逆電圧が印加されることになり、電解コンデ
ンサ自体の破壊と同時に、基板としての機能をも損ねる
危険性があり、逆挿入の点検に多大な労力を要してい
た。2. Description of the Related Art For mounting an electrolytic capacitor on a printed wiring board (hereinafter abbreviated as a substrate), in the case of a lead wire type small electrolytic capacitor, a taped series of electronic components may be automatically mounted by an automatic mounting machine. It is getting more and more. However, in the case of a larger-sized substrate self-standing capacitor, taping is difficult, and it is mounted on the substrate mainly by hand. In the case of electrolytic capacitors, the terminals have polarities, so it is necessary to make the polarities the same when mounting them on the board.
In the conventional substrate, the mounting holes of the electrolytic capacitor had the same diameter for the anode and the cathode, so that the polarities were often inserted in reverse. A reverse voltage will be applied to the electrolytic capacitor installed with the polarity reversed, and there is a risk of damaging the electrolytic capacitor itself and also impairing its function as a board. I needed it.
【０００３】[0003]
【発明が解決しようとする課題】上述の逆挿入防止策と
して、電解コンデンサの端子形状を陽極と陰極とで異形
にしたり、端子径や端子幅を異ならせ、基板の端子穴も
それに合わせて形状を変える試みがなされている。ただ
し、すべての基板が逆挿入防止用になるとは限らず、ま
た、逆挿入防止用の方法が異なると電解コンデンサと基
板とが適合しなくなるという問題があった。本発明は前
述の問題点に鑑みてなされたものであり、逆挿入防止用
の基板には逆挿入防止の機能を果たし、通常の同径の端
子穴を有する基板にも通常のコンデンサと同様に使用す
ることができる汎用性の高い電解コンデンサと、それに
適合する印刷配線板（基板）を提供することを目的とす
る。As a measure for preventing the reverse insertion described above, the terminal shape of the electrolytic capacitor is made different between the anode and the cathode, the terminal diameter and the terminal width are made different, and the terminal hole of the substrate is also shaped accordingly. Attempts have been made to change. However, not all substrates are for reverse insertion prevention, and if the methods for reverse insertion prevention are different, there is a problem that the electrolytic capacitor and the substrate do not match. The present invention has been made in view of the above-mentioned problems, the reverse insertion prevention board performs a reverse insertion prevention function, and a board having a normal terminal hole of the same diameter is also used as a normal capacitor. An object is to provide a highly versatile electrolytic capacitor that can be used, and a printed wiring board (substrate) suitable for it.
【０００４】[0004]
【課題を解決するための手段】上記目的による本発明で
は、電解コンデンサ取付用の、直径Ｄ0 、ピッチＰ0 の
同径の２つの端子穴を有する印刷配線板に対し、２つの
端子穴の直径Ｄ、およびｄを Ｄ＝Ｄ0 ＞ｄ とし、ピッチＰの設定値を、 Ｐ1 ＝Ｐ0 −（Ｄ−ｄ）／２ または、 Ｐ2 ＝Ｐ0 ＋（Ｄ−ｄ）／２ としたことを特徴としている。また、電解コンデンサ取
付用の、直径Ｄ0 、ピッチＰ0 の同径の２つの端子穴を
有する印刷配線板に対し、２つの端子穴の直径Ｄ、およ
びｄを Ｄ＝Ｄ0 ＞ｄ とし、ピッチＰの設定値を、 Ｐ1 ＝Ｐ0 −（Ｄ−ｄ）／２ または、 Ｐ2 ＝Ｐ0 ＋（Ｄ−ｄ）／２ とした印刷配線板に取り付ける電解コンデンサにおい
て、前記２つの端子穴に挿入する端子の一方の端子の対
角寸法Ｘを ｄ＜Ｘ≦Ｄ とし、他方の端子の対角寸法ｘを ｘ≦ｄとし、２つの
端子の内側距離Ｗ1の設定値を Ｐ0 −Ｄ0 ≦Ｗ1 ＜Ｐ1 または、外側距離Ｗ2 の設定値を Ｐ2 ＜Ｗ2 ≦Ｐ0 ＋Ｄ0 としたことを特徴としている。具体的には従来の基板は
端子穴径２．０（公差±0.1 ）mm、ピッチ10.0（公差
±0.1 ）mmのものが主流であるので、本発明による基板
では、電解コンデンサ取付用端子穴のうちの一方の端子
穴の径Ｄを２．０（公差 ＋0.1 ，−0.05）mm、他方の
端子穴の径ｄを１．７０（公差 ＋0.1 ，−0.05）mmと
し、ピッチＰ1 を10.15 ±0.1mm または9.85±0.1mm と
すると好適である。また、具体的には、電解コンデンサ
の一方の端子の対角寸法Ｘを1.90±0.05mm、他方の端子
の対角寸法ｄを1.60±0.05mmとし、両端子間の内側距離
Ｗ1 を 8.0≦Ｗ1 ＜9.85（公差 ±0.1 ）mmまたは両端
子間の外側距離Ｗ2 を 10.15＜Ｗ2 ≦12.0（公差 ±0.
1 ）mmとするのが好ましい。According to the present invention according to the above object, a printed wiring board having two terminal holes of the same diameter D 0 and pitch P 0 for mounting an electrolytic capacitor has two terminal holes. The diameters D and d are D = D 0 > d, and the set value of the pitch P is P 1 = P 0 − (D−d) / 2 or P 2 = P 0 + (D−d) / 2. It is characterized by doing. Further, for a printed wiring board having two terminal holes with the same diameter D 0 and a pitch P 0 for mounting an electrolytic capacitor, the diameters D and d of the two terminal holes are D = D 0 > d In the electrolytic capacitor attached to the printed wiring board, the setting value of the pitch P is P 1 = P 0 − (D−d) / 2 or P 2 = P 0 + (D−d) / 2. The diagonal dimension X of one of the terminals to be inserted into the hole is d <X ≦ D, the diagonal dimension x of the other terminal is x ≦ d, and the set value of the inner distance W 1 between the two terminals is P 0. It is characterized in that −D 0 ≦ W 1 <P 1 or the set value of the outer distance W 2 is P 2 <W 2 ≦ P 0 + D 0 . Specifically, the conventional board has a terminal hole diameter of 2.0 (tolerance ± 0.1) mm and a pitch of 10.0 (tolerance).
Since ± 0.1) mm is the mainstream, the diameter D of one terminal hole of the electrolytic capacitor mounting terminal holes is 2.0 (tolerance +0.1, -0.05) mm, the other in the substrate according to the present invention. It is preferable that the diameter d of the terminal hole is 1.70 (tolerance +0.1, -0.05) mm and the pitch P 1 is 10.15 ± 0.1 mm or 9.85 ± 0.1 mm. Further, specifically, the diagonal dimension X of one terminal of the electrolytic capacitor is 1.90 ± 0.05 mm, the diagonal dimension d of the other terminal is 1.60 ± 0.05 mm, and the inner distance W 1 between both terminals is 8.0 ≦. W 1 <9.85 (tolerance ± 0.1) mm or the outer distance W 2 between both terminals is 10.15 <W 2 ≦ 12.0 (tolerance ± 0.
1) mm is preferable.
【０００５】[0005]
【作用】従来の基板自立コンデンサの取付は図１１に示
したように、基板の端子穴にコンデンサの端子を挿入
し、端子は端子穴の内側壁または外側壁に接することに
より脱落を防止する構造になっていた。本発明の基板
に、同じく本発明による電解コンデンサを取付けた状態
を図３ないし図８に示した。本発明によれば、直径の異
なった端子取付穴に、同じく寸法の異なった端子をもつ
電解コンデンサを取付けることにより、逆に挿入しよう
とすると大きいほうの寸法を持つ端子が小さいほうの端
子取付穴に入らないので取付けできず、逆挿入を防止す
ることができる。また、本発明では、基板の端子取付穴
およびコンデンサ端子それぞれの内側寸法または外側寸
法をほぼ従来のものに合わせてあるので、本発明による
コンデンサを従来基板に取付けた場合でも、端子の内側
または外側が端子穴の壁に接するようになり、脱落の心
配なく従来基板に取付けることができる。As shown in FIG. 11, the conventional board self-supporting capacitor has a structure in which the terminal of the capacitor is inserted into the terminal hole of the board, and the terminal is in contact with the inner wall or the outer wall of the terminal hole to prevent the terminal from falling off. Was becoming. A state in which the electrolytic capacitor according to the present invention is also attached to the substrate of the present invention is shown in FIGS. According to the present invention, by mounting an electrolytic capacitor having terminals of different sizes in the terminal mounting holes of different diameters, the terminal having the larger dimension will be inserted into the terminal mounting hole having the smaller dimension. It cannot be installed because it does not go in and prevents reverse insertion. Further, in the present invention, since the inner and outer dimensions of the terminal mounting hole of the board and the capacitor terminal are substantially matched with those of the conventional one, even when the capacitor according to the present invention is mounted on the conventional board, the inside or the outside of the terminal is Since it comes into contact with the wall of the terminal hole, it can be attached to the conventional board without worrying about falling off.
【０００６】[0006]
【実施例】以下、実施例に基づいて本発明を詳細に説明
する。尚、従来の基板としては、端子穴径２．０（公差
±0.1 ）mmピッチ１０．０（公差 ±0.1 ）mmのもの
が主流なので、これを基本として実施例を説明する。EXAMPLES The present invention will be described in detail below based on examples. Incidentally, as a conventional substrate, the one having a terminal hole diameter of 2.0 (tolerance ± 0.1) mm and a pitch of 10.0 (tolerance ± 0.1) mm is the mainstream, and the embodiment will be described based on this.
【０００７】〔実施例１〕本発明による基板１０につい
ての第１の実施例を図１に示した。ここで、大きいほう
の端子取付穴（以下単に端子穴という）１２の直径は、
Ｄ＝2.0(公差 ＋0.1,−0.05）mm、小さいほうの端子穴
１４の直径はｄ＝1.7(公差 ＋0.1,−0.05）mmとし、ピ
ッチＰ1 を Ｐ1 ＝Ｐ0 −（Ｄ−ｄ）／２＝10.0-(2.0-1.7)/2＝9.85（公差±0.1 ）ｍｍ とした。これによって、図１からわかるように、本実施
例の端子穴の内側距離が従来基板の場合と同じになる。[Embodiment 1] A first embodiment of a substrate 10 according to the present invention is shown in FIG. Here, the diameter of the larger terminal mounting hole (hereinafter simply referred to as the terminal hole) 12 is
D = 2.0 (tolerance + 0.1, -0.05) mm, the diameter of the terminal holes 14 of the smaller is d = 1.7 (tolerance + 0.1, -0.05) and mm, the pitch P 1 P 1 = P 0 - (D -D) /2=10.0- (2.0-1.7) /2=9.85 (tolerance ± 0.1) mm. As a result, as can be seen from FIG. 1, the inner distance of the terminal hole of this embodiment becomes the same as that of the conventional substrate.
【０００８】〔実施例２〕本発明による基板１０につい
ての第２の実施例を図２に示した。ここでは、端子穴１
２、１４の径は実施例１と同じにし、ピッチＰ2 を Ｐ2 ＝Ｐ0 ＋（Ｄ−ｄ）／２＝10.1（公差±0.1 ）ｍｍ とした。これによって今度は端子穴１２、１４の外側距
離が従来基板の場合と同じになる。[Embodiment 2] A second embodiment of the substrate 10 according to the present invention is shown in FIG. Here, the terminal hole 1
The diameters of 2 and 14 were the same as in Example 1, and the pitch P 2 was P 2 = P 0 + (D−d) /2=10.1 (tolerance ± 0.1) mm. This in turn makes the outer distances of the terminal holes 12, 14 the same as in the case of conventional boards.
【０００９】〔実施例３〕本発明第３の実施例の電解コ
ンデンサ１８を、同じく本発明第１の実施例の基板１０
に取付けた状態を図９に示し、端子穴の中の断面図を図
３に示した。本実施例における電解コンデンサ１８は大
きいほうの端子２０の対角寸法を1.90±0.05mmとし、小
さいほうの端子２２の対角寸法を1.60±0.05mmとしてあ
る。従って、大きいほうの端子２０を大きいほうの端子
穴１２へ、小さいほうの端子２２を小さいほうの端子穴
１４へそれぞれ挿入する場合は、公差を考慮しても十分
に入る大きさとしてある。また、大きいほうの端子２０
の最小寸法は1.85mmであり、小さいほうの端子穴１４の
最大寸法は1.80mmであるので、逆にした場合は挿入でき
ないようになっている。また、電解コンデンサ１８の端
子２０、２２の内側寸法Ｗ1 は図３よりＰ0 −Ｄ0 より
若干大きいことが望ましいが、端子にはある程度のバネ
性があるので、0.6mm 程度の寸法違いは吸収できる。図
３に示す例は、電解コンデンサ１８の端子２０、２２が
両端子を結ぶ線に対して４５度傾いた場合の例である。
図４は、端子２０、２２が両端子を結ぶ線と平行になる
例、図５は端子２０、２２が両端子を結ぶ線に対して直
角となる例を示す。図５において端子２０、２２の厚さ
が薄い場合に端子が端子穴内壁に接する条件はＷ1 ＜Ｐ
1 となる。[Embodiment 3] The electrolytic capacitor 18 of the third embodiment of the present invention is the same as the substrate 10 of the first embodiment of the present invention.
9 is shown in FIG. 9, and a sectional view of the inside of the terminal hole is shown in FIG. In the electrolytic capacitor 18 in this embodiment, the diagonal dimension of the larger terminal 20 is 1.90 ± 0.05 mm, and the diagonal dimension of the smaller terminal 22 is 1.60 ± 0.05 mm. Therefore, when the larger terminal 20 is inserted into the larger terminal hole 12 and the smaller terminal 22 is inserted into the smaller terminal hole 14, the sizes are sufficiently large even if tolerances are taken into consideration. Also, the larger terminal 20
Since the minimum size of 1. is 1.85 mm, and the maximum size of the smaller terminal hole 14 is 1.80 mm, it cannot be inserted if reversed. Further, it is desirable that the inner dimension W 1 of the terminals 20 and 22 of the electrolytic capacitor 18 is slightly larger than P 0 -D 0 from FIG. 3, but since the terminals have a certain degree of spring property, a dimension difference of about 0.6 mm is Can be absorbed. The example shown in FIG. 3 is an example in which the terminals 20 and 22 of the electrolytic capacitor 18 are inclined by 45 degrees with respect to the line connecting both terminals.
4 shows an example in which the terminals 20 and 22 are parallel to the line connecting both terminals, and FIG. 5 shows an example in which the terminals 20 and 22 are at right angles to the line connecting both terminals. In FIG. 5, when the terminals 20 and 22 are thin, the condition that the terminals contact the inner wall of the terminal hole is W 1 <P
Becomes 1 .
【００１０】〔実施例４〕本発明第４の実施例の電解コ
ンデンサ１８を、同じく本発明第２の実施例の基板１０
に取付けた状態を図１０に示し、端子穴１２、１４の中
の断面図を図６に示した。本実施例においては電解コン
デンサ１８の端子２０、２２の対角寸法は実施例３と同
じであり、端子２０、２２の外側寸法Ｗ2 をほぼＰ0 ＋
Ｄ0 に近い値にしてある。図６は電解コンデンサ１８の
端子２０、２２が相互に４５°傾いた場合の例である。
図７は、端子２０、２２が両端子を結ぶ線と平行になる
例、図８は端子２０、２２が両端子を結ぶ線に対して直
角となる例を示す。図８において端子２０、２２の厚さ
が薄い場合に端子が端子穴内壁に接する条件はＷ2 ＜Ｐ
2 となる。以上、本発明について好適な実施例を挙げて
種々説明したが、本発明はこの実施例に限定されるもの
ではなく、発明の精神を逸脱しない範囲において多くの
改変を施し得るのはもちろんのことである。[Embodiment 4] The electrolytic capacitor 18 of the fourth embodiment of the present invention is the same as the substrate 10 of the second embodiment of the present invention.
10 is shown in FIG. 10, and a sectional view inside the terminal holes 12 and 14 is shown in FIG. In this embodiment, the diagonal dimensions of the terminals 20 and 22 of the electrolytic capacitor 18 are the same as those in the third embodiment, and the outer dimension W 2 of the terminals 20 and 22 is approximately P 0 +.
The value is close to D 0 . FIG. 6 shows an example in which the terminals 20 and 22 of the electrolytic capacitor 18 are inclined 45 ° with respect to each other.
FIG. 7 shows an example in which the terminals 20 and 22 are parallel to a line connecting both terminals, and FIG. 8 shows an example in which the terminals 20 and 22 are perpendicular to a line connecting both terminals. In FIG. 8, when the terminals 20 and 22 are thin, the condition for the terminals to contact the inner wall of the terminal hole is W 2 <P
It becomes 2 . Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and many modifications can be made without departing from the spirit of the invention. Is.
【００１１】[0011]
【発明の効果】本発明によれば、直径の異なった端子取
付穴に、同じく寸法の異なった端子をもつ電解コンデン
サを取付けることにより、逆に挿入しようとすると大き
いほうの寸法を持つ端子が小さいほうの端子取付穴に入
らないので取付けできず、逆挿入を防止することができ
る。また、本発明では、基板の端子取付穴およびコンデ
ンサ端子それぞれの内側寸法または外側寸法をほぼ従来
のものに合わせてあるので、本発明によるコンデンサを
従来基板に取付けた場合でも、端子の内側または外側が
端子穴の壁に接するようになり、脱落の心配なく従来基
板に取付けることができる。According to the present invention, when electrolytic capacitors having terminals of different sizes are mounted in the terminal mounting holes of different diameters, the terminal having the larger size is smaller when the reverse insertion is attempted. Since it does not go into the terminal mounting hole on the other side, it cannot be mounted and reverse insertion can be prevented. Further, in the present invention, since the inner and outer dimensions of the terminal mounting hole of the board and the capacitor terminal are substantially matched with those of the conventional one, even when the capacitor according to the present invention is mounted on the conventional board, the inside or the outside of the terminal is Since it comes into contact with the wall of the terminal hole, it can be attached to the conventional board without worrying about falling off.
【図１】基板の第１の実施例を示す拡大した平面図であ
る。FIG. 1 is an enlarged plan view showing a first embodiment of a substrate.
【図２】基板の第２の実施例を示す拡大した平面図であ
る。FIG. 2 is an enlarged plan view showing a second embodiment of the substrate.
【図３】電解コンデンサを第１の実施例の基板に取付け
た状態を示す横断面図である。FIG. 3 is a cross-sectional view showing a state in which the electrolytic capacitor is attached to the substrate of the first embodiment.
【図４】電解コンデンサを第１の実施例の基板に取付け
た状態を示す横断面図である。FIG. 4 is a cross-sectional view showing a state where the electrolytic capacitor is attached to the substrate of the first embodiment.
【図５】電解コンデンサを第１の実施例の基板に取付け
た状態を示す横断面図である。FIG. 5 is a transverse cross-sectional view showing a state where the electrolytic capacitor is attached to the substrate of the first embodiment.
【図６】電解コンデンサを第２の実施例の基板に取付け
た状態を示す横断面図である。FIG. 6 is a transverse cross-sectional view showing a state in which an electrolytic capacitor is attached to the substrate of the second embodiment.
【図７】電解コンデンサを第２の実施例の基板に取付け
た状態を示す横断面図である。FIG. 7 is a cross-sectional view showing a state in which an electrolytic capacitor is attached to a substrate of the second embodiment.
【図８】電解コンデンサを第２の実施例の基板に取付け
た状態を示す横断面図である。FIG. 8 is a transverse cross-sectional view showing a state in which an electrolytic capacitor is attached to the substrate of the second embodiment.
【図９】図３の縦断面図である。9 is a vertical cross-sectional view of FIG.
【図１０】図６の縦断面図である。10 is a vertical cross-sectional view of FIG.
【図１１】従来の電解コンデンサの取付状態を示す部分
断面図である。FIG. 11 is a partial cross-sectional view showing a mounting state of a conventional electrolytic capacitor.
１０ 基板 １２ 端子穴 １４ 端子穴 １８ 電解コンデンサ ２０ 端子 ２２ 端子 10 board 12 terminal hole 14 terminal hole 18 electrolytic capacitor 20 terminal 22 terminal
Claims (4)
ッチＰ0の同径の２つの端子穴を有する印刷配線板に対
し、 ２つの端子穴の直径Ｄ、およびｄを Ｄ＝Ｄ0 ＞ｄ とし、ピッチＰの設定値を、 Ｐ1 ＝Ｐ0 −（Ｄ−ｄ）／２ または、 Ｐ2 ＝Ｐ0 ＋（Ｄ−ｄ）／２ としたことを特徴とする印刷配線板。1. A printed wiring board for mounting an electrolytic capacitor, which has two terminal holes having a diameter D 0 and a pitch P 0 and having the same diameter, the diameters D and d of the two terminal holes are D = D 0 >. and d, the set value of the pitch P, P 1 = P 0 - (D-d) / 2 or, P 2 = P 0 + ( D-d) / 2 and the printed wiring board, characterized in that the.
ッチＰ0の同径の２つの端子穴を有する印刷配線板に対
し、 ２つの端子穴の直径Ｄ、およびｄを Ｄ＝Ｄ0 ＞ｄ とし、ピッチＰの設定値を、 Ｐ1 ＝Ｐ0 −（Ｄ−ｄ）／２ または、 Ｐ2 ＝Ｐ0 ＋（Ｄ−ｄ）／２ とした印刷配線板に取り付ける電解コンデンサにおい
て、 前記２つの端子穴に挿入する端子の一方の端子の対角寸
法Ｘを ｄ＜Ｘ≦Ｄ とし、他方の端子の対角寸法ｘを ｘ≦ｄとし、 ２つの端子の内側距離Ｗ1 の設定値を Ｐ0 −Ｄ0 ≦Ｗ1 ＜Ｐ1 または、外側距離Ｗ2 の設定値を Ｐ2 ＜Ｗ2 ≦Ｐ0 ＋Ｄ0 としたことを特徴とする電解コンデンサ。2. A printed wiring board for mounting an electrolytic capacitor, which has two terminal holes having the same diameter D 0 and a pitch P 0 and having the same diameter, has two terminal holes having diameters D and d of D = D 0 >. d and the set value of the pitch P is P 1 = P 0- (D-d) / 2 or P 2 = P 0 + (D-d) / 2 The diagonal dimension X of one of the terminals to be inserted into the two terminal holes is d <X ≦ D, the diagonal dimension x of the other terminal is x ≦ d, and the set value of the inner distance W 1 of the two terminals is set. Where P 0 −D 0 ≦ W 1 <P 1 or the set value of the outer distance W 2 is P 2 <W 2 ≦ P 0 + D 0 .
方の端子穴の径Ｄを２．０（公差 ＋0.1 ，−0.05）m
m、他方の端子穴の径ｄを１．７（公差 ＋0.1 ，−0.0
5）mmとし、ピッチＰ1 を10.15 ±0.1mm または9.85±
0.1mm としたことを特徴とする請求項１記載の印刷配線
板。3. The diameter D of one of the terminal holes for mounting the electrolytic capacitor is 2.0 (tolerance +0.1, -0.05) m.
m, the diameter d of the other terminal hole is 1.7 (tolerance +0.1, -0.0
5) mm and pitch P 1 is 10.15 ± 0.1 mm or 9.85 ±
The printed wiring board according to claim 1, wherein the printed wiring board has a thickness of 0.1 mm.
Ｘを1.90±0.05mm、他方の端子の対角寸法ｘを1.60±0.
05mmとし、両端子間の内側距離Ｗ1 を 8.0≦Ｗ1 ＜9.85
(mm)または両端子間の外側距離Ｗ2 を 10.15＜Ｗ2 ≦1
2.0としたことを特徴とする請求項２記載の電解コンデ
ンサ。4. The diagonal dimension X of one terminal of the electrolytic capacitor is 1.90 ± 0.05 mm, and the diagonal dimension x of the other terminal is 1.60 ± 0.
And 05Mm, the inner distance W 1 between the terminals 8.0 ≦ W 1 <9.85
(mm) or outside distance W 2 between both terminals is 10.15 <W 2 ≦ 1
The electrolytic capacitor according to claim 2, wherein the electrolytic capacitor is 2.0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33009791A JPH05145211A (en) | 1991-11-18 | 1991-11-18 | Electrolytic capacitor and printed wiring board for attaching same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33009791A JPH05145211A (en) | 1991-11-18 | 1991-11-18 | Electrolytic capacitor and printed wiring board for attaching same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05145211A true JPH05145211A (en) | 1993-06-11 |
Family
ID=18228761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33009791A Pending JPH05145211A (en) | 1991-11-18 | 1991-11-18 | Electrolytic capacitor and printed wiring board for attaching same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05145211A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763297A (en) * | 1993-07-05 | 1998-06-09 | Fujitsu Limited | Integrated circuit carrier having lead-socket array with various inner dimensions |
| JP2011159923A (en) * | 2010-02-03 | 2011-08-18 | Denso Corp | Electronic device |
-
1991
- 1991-11-18 JP JP33009791A patent/JPH05145211A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5763297A (en) * | 1993-07-05 | 1998-06-09 | Fujitsu Limited | Integrated circuit carrier having lead-socket array with various inner dimensions |
| JP2011159923A (en) * | 2010-02-03 | 2011-08-18 | Denso Corp | Electronic device |
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