JPH04137689A - Mounting of electronic component and electronic component mounting board - Google Patents
Mounting of electronic component and electronic component mounting boardInfo
- Publication number
- JPH04137689A JPH04137689A JP25719790A JP25719790A JPH04137689A JP H04137689 A JPH04137689 A JP H04137689A JP 25719790 A JP25719790 A JP 25719790A JP 25719790 A JP25719790 A JP 25719790A JP H04137689 A JPH04137689 A JP H04137689A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- diameter
- insertion hole
- polarity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims abstract description 43
- 230000037431 insertion Effects 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 abstract description 9
- 229910052715 tantalum Inorganic materials 0.000 abstract description 9
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 8
- 238000010276 construction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 1
- 150000003481 tantalum Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品を基板に取り付ける電子部品取付方
法および電子部品取付基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component mounting method for mounting an electronic component to a board, and an electronic component mounting board.
従来、電子部品の複数本のリードの直径は同一となって
いる。そして、極性を有する電子部品、例えばタンタル
コンデンサの場合には、部品本体の極性が印刷されてい
る。また、このような電子部品が取り付けられている電
子部品取付基板上のリード挿入穴の直径は、電子部品の
リードの直径より幾分大きく、互いに同一となっている
。Conventionally, multiple leads of electronic components have the same diameter. In the case of electronic components having polarity, such as tantalum capacitors, the polarity of the component body is printed. Further, the diameters of the lead insertion holes on the electronic component mounting board to which such electronic components are attached are somewhat larger than the diameters of the leads of the electronic components, and are the same.
挿入極性が決められていた場合には、電子部品取付基板
に極性が印刷されている。そして、上述の電子部品をこ
の電子部品取付基板に手で取り付ける場合には、電子部
品および基板極性を目視により確認して正しい極性にな
るように挿入している。If the insertion polarity has been determined, the polarity is printed on the electronic component mounting board. When the above-mentioned electronic component is attached to the electronic component mounting board by hand, the polarity of the electronic component and the board is visually confirmed and inserted so that the polarity is correct.
しかしながら、従来にあっては電子部品の複数のリード
の直径が互いに同一となっており、しかもこれらのリー
ドが挿入される電子部品取付基板の複数の挿入穴の直径
も互いに同一となっているので、極性を反対にしても挿
入が可能となる。この場合、極性が反対に挿入されると
、極端な場合には電子部品が爆発するか、あるいは電子
部品取付基板がこげてしまうという問題があった。However, in the past, the diameters of multiple leads of electronic components were the same, and the diameters of the multiple insertion holes of the electronic component mounting board into which these leads were inserted were also the same. , insertion is possible even if the polarity is reversed. In this case, if the polarity is reversed, there is a problem that, in extreme cases, the electronic component may explode or the electronic component mounting board may be burnt.
本発明の目的は上述した問題に鑑みなされたもので、電
子部品および取付基板の極性の相違を未然に防止できる
ようにした電子部品取付方法および電子部品取付基板を
提供するにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting method and an electronic component mounting board that can prevent polarity differences between the electronic component and the mounting board.
請求項１記載の電子部品取付方法の発明では、複数本の
リードを存する電子部品の少なくとも１つのリードの直
径が他のリードの直径と異なる電子部品と、電子部品の
リードの数と同じ数だけのリード挿入穴を有し少なくと
も１つの挿入穴の直径が他の挿入穴の直径より小さい電
子部品取付基板とを用意して、前記電子部品のリードを
電子部品取付基板の挿入穴に挿入するようにしたことを
特徴とする。In the invention of the electronic component mounting method according to claim 1, an electronic component having a plurality of leads in which at least one lead has a diameter different from the diameter of the other leads, and an electronic component having the same number of leads as the electronic component. An electronic component mounting board having lead insertion holes of at least one insertion hole having a diameter smaller than the other insertion holes is prepared, and the lead of the electronic component is inserted into the insertion hole of the electronic component mounting board. It is characterized by the following.
また、請求項２記載の電子部品取付基板の発明では、単
一の電子部品のリードを挿入する複数個のリード挿入穴
を有する電子部品取付基板において、前記リード挿入穴
のうち少なくとも１つの直径が他の挿入穴の直径と異な
るよう形成したことを特徴とする。Further, in the invention of the electronic component mounting board according to claim 2, in the electronic component mounting board having a plurality of lead insertion holes into which leads of a single electronic component are inserted, at least one of the lead insertion holes has a diameter. It is characterized by being formed to have a diameter different from that of other insertion holes.
このように請求項１または請求項２記載の発明によれば
、電子部品のリードの直径と電子部品のリードが挿入さ
れる電子部品取付基板のリード挿入穴の直径のうち少な
くとも１つの直径が他のリードおよびリード挿入穴の直
径よりも相違するようにしてふり、異径のリードと異径
のリード挿入穴のみが挿入可能な構造となっているので
、リードがリード挿入穴に対して正しい方向にしか挿入
されないことになり、これによって極性相違を未然に防
ぐことができる。As described above, according to the invention described in claim 1 or claim 2, at least one of the diameters of the leads of the electronic component and the diameter of the lead insertion hole of the electronic component mounting board into which the leads of the electronic component are inserted is different from each other. The diameters of the lead and lead insertion hole are different from each other, and the structure is such that only leads of different diameters and lead insertion holes of different diameters can be inserted, so that the lead is oriented in the correct direction relative to the lead insertion hole. This means that polarity differences can be prevented from occurring.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の実施例で使用される電子部品の側面図
、第２図は本発明に係る電子部品取付基板の要部平面図
である。第１図に示した電子部品はタンタルコンデンサ
１であるこのタンタルコンデンサ１は直径Ｑ、９ｍｍの
正極性用リード２と直径０．５ｍｍの負極性用リード３
とを有している。FIG. 1 is a side view of an electronic component used in an embodiment of the present invention, and FIG. 2 is a plan view of essential parts of an electronic component mounting board according to the present invention. The electronic component shown in Fig. 1 is a tantalum capacitor 1. This tantalum capacitor 1 has a diameter Q, a 9 mm positive polarity lead 2, and a 0.5 mm diameter negative polarity lead 3.
It has
また、第２図に示す電子部品取付基板４には、タンタル
コンデンサ１の正極性用リード２が挿入される直径１．
２ｍｍのリード挿入穴５と、タンタルコンデンサ１の負
極性用リード３が挿入される直径０゜８ｍｍのリード挿
入穴６が設けられている。Moreover, the electronic component mounting board 4 shown in FIG.
A 2 mm lead insertion hole 5 and a 0.8 mm diameter lead insertion hole 6 into which the negative polarity lead 3 of the tantalum capacitor 1 is inserted are provided.
このように本実施例ではタンタルコンデンサ１の正極性
用リード２と負極性用リード３の直径を変えており、ま
たリード挿入穴５の直径とリード挿入穴６の直径も異な
っている。しかるに、負極性用リード３が挿入されるリ
ード挿入穴６の直径（０，８ｍｍ）は止揚性用リード２
の直径（０゜９ｍｍ）より小さいので、反対極性で挿入
しようとしてもこの正極性用リード２を負極性用リード
３のリード挿入穴６内に挿入することはできない。As described above, in this embodiment, the diameters of the positive polarity lead 2 and the negative polarity lead 3 of the tantalum capacitor 1 are different, and the diameters of the lead insertion hole 5 and the lead insertion hole 6 are also different. However, the diameter (0.8 mm) of the lead insertion hole 6 into which the negative polarity lead 3 is inserted is larger than that of the static lead 2.
(0.9 mm), the positive polarity lead 2 cannot be inserted into the lead insertion hole 6 of the negative polarity lead 3 even if an attempt is made to insert it with the opposite polarity.
なお、本実施例にあっては、リードとリード挿入穴とが
各２個の場合について述べたが、リードおよびリード挿
入穴の数は別にこれに限定されるものではなく、それ以
上の数においても本発明が適用できることはもちろんで
ある。In this embodiment, the case where there are two leads and two lead insertion holes has been described, but the number of leads and lead insertion holes is not limited to this, and larger numbers may be used. Of course, the present invention can also be applied to.
以上説明したように本発明によれば、電子部品のリード
の直径とこの電子部品のリードが挿入される電子部品取
付基板のリード挿入穴の直径のうち少なくとも１つの直
径が他のリードおよびリード挿入穴の直径よりも異なる
ように構成しており、異径のリードと異径のリード挿入
穴のみとが挿入可能になっているので、電子部品のリー
ドが電子部品取付基板のリード挿入穴に対して常に正し
い方向にしか挿入されないことになり、これによって極
性相違を未然に防止できるという優れた効果を奏する。As explained above, according to the present invention, at least one of the diameter of the lead of an electronic component and the diameter of the lead insertion hole of the electronic component mounting board into which the lead of the electronic component is inserted is different from that of the other lead and the lead insertion hole. The diameter of the hole is different from that of the hole, and only leads of different diameters and lead insertion holes of different diameters can be inserted, so that the leads of electronic components can be inserted into the lead insertion holes of the electronic component mounting board. Therefore, it is always inserted only in the correct direction, which has the excellent effect of preventing polarity differences.
第１図は本発明の一実施例で使用される電子部品の側面
図、第２図はこの実施例に係る電子部品取付基板の一部
平面図である。
１・・・・・・タンタルコンデンサ、
２・・・・・・正極性用リード、
３・・・・・・負極性用リード、
４・・・・・・電子部品取付基板、
５．６・・・・・・リード挿入穴。
出願人 新潟日本電気株式会社FIG. 1 is a side view of an electronic component used in an embodiment of the present invention, and FIG. 2 is a partial plan view of an electronic component mounting board according to this embodiment. 1...Tantalum capacitor, 2...Positive polarity lead, 3...Negative polarity lead, 4...Electronic component mounting board, 5.6. ...Lead insertion hole. Applicant Niigata NEC Co., Ltd.
Claims (2)
のリードの直径が他のリードの直径と異なる電子部品と
、電子部品のリードの数と同じ数だけのリード挿入穴を
有し少なくとも１つの挿入穴の直径が他の挿入穴の直径
より小さい電子部品取付基板とを有し、前記電子部品の
リードを電子部品取付基板の挿入穴に挿入するようにし
たことを特徴とする電子部品取付方法。1. An electronic component having a plurality of leads in which at least one lead has a diameter different from the diameter of the other leads, and an electronic component having the same number of lead insertion holes as the number of leads of the electronic component and at least one insertion hole. 1. A method for mounting an electronic component, comprising: an electronic component mounting board having a diameter smaller than the diameter of other insertion holes, and a lead of the electronic component is inserted into the insertion hole of the electronic component mounting board.
挿入穴を有する電子部品取付基板において、前記リード
挿入穴のうち少なくとも１つの直径が他の挿入穴の直径
と異なるよう形成したことを特徴とする電子部品取付基
板。2. An electronic component mounting board having a plurality of lead insertion holes into which leads of a single electronic component are inserted, characterized in that the diameter of at least one of the lead insertion holes is formed to be different from the diameter of the other insertion holes. Electronic component mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25719790A JPH04137689A (en) | 1990-09-28 | 1990-09-28 | Mounting of electronic component and electronic component mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25719790A JPH04137689A (en) | 1990-09-28 | 1990-09-28 | Mounting of electronic component and electronic component mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04137689A true JPH04137689A (en) | 1992-05-12 |
Family
ID=17303030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25719790A Pending JPH04137689A (en) | 1990-09-28 | 1990-09-28 | Mounting of electronic component and electronic component mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04137689A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8254146B2 (en) | 2009-02-26 | 2012-08-28 | Asustek Computer Inc. | Detachable capacitor device |
| US20130295417A1 (en) * | 2008-12-11 | 2013-11-07 | Samsung Sdi Co., Ltd. | Secondary battery |
-
1990
- 1990-09-28 JP JP25719790A patent/JPH04137689A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130295417A1 (en) * | 2008-12-11 | 2013-11-07 | Samsung Sdi Co., Ltd. | Secondary battery |
| US9564627B2 (en) * | 2008-12-11 | 2017-02-07 | Samsung Sdi Co., Ltd. | Secondary battery |
| US8254146B2 (en) | 2009-02-26 | 2012-08-28 | Asustek Computer Inc. | Detachable capacitor device |
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