JPH05144094A - Production of optical disk stamper - Google Patents

Production of optical disk stamper

Info

Publication number
JPH05144094A
JPH05144094A JP32838091A JP32838091A JPH05144094A JP H05144094 A JPH05144094 A JP H05144094A JP 32838091 A JP32838091 A JP 32838091A JP 32838091 A JP32838091 A JP 32838091A JP H05144094 A JPH05144094 A JP H05144094A
Authority
JP
Japan
Prior art keywords
stamper
master
mold
polishing
electroforming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32838091A
Other languages
Japanese (ja)
Inventor
Yoko Kanazawa
陽子 金澤
Sayori Aihara
さより 相原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Tosoh Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tosoh Corp filed Critical Tosoh Corp
Priority to JP32838091A priority Critical patent/JPH05144094A/en
Publication of JPH05144094A publication Critical patent/JPH05144094A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To simplify stages by executing the rear surface polishing of a stamper after an electrocasting stage. CONSTITUTION:The parts of retainers 8 of a molding flask may be molded of the same material as the material of a side wall 7 or of a material different therefrom. The shape of the retainers 8 is not particularly specified, insofar as a glass master disk can be fixed. If the material of the retainer parts 8 is different from the material of the side wall 7, the material which tightly adheres to the side wall 7 and withstands an electrocasting temp. is more preferable. The stamper, master disk and retaining die are washed and dried together upon ending the electrocasting. The stamper can be polished while the rear surface thereof is held tightly adhered to the master disk by using the molding flask and, therefore, there is no need for protecting the signal surface of the stamper and the stages are simplified. The molding flask and the stamper are removed from the glass master disk and the inside and outside diameters of the stamper are worked after the polishing, by which the stamper is produced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は光ディスクスタンパーの
製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical disk stamper.

【0002】[0002]

【従来の技術】従来、光ディスク用スタンパーの製造
は、通常次の方法で行われている。即ち、ガラス等から
なる原盤を精密研磨した後に、精密洗浄、表面処理を施
し、このガラス原盤上にポジ型フォトレジスト層を形成
し、レーザ光をディスク内周から外周に一定速度で照射
して所定の情報記録パターンを露光し、このレジスト層
を現像して微細な情報記録パターンを形成する。
2. Description of the Related Art Conventionally, a stamper for an optical disc is usually manufactured by the following method. That is, after precisely polishing a master made of glass or the like, precision cleaning and surface treatment are performed, a positive photoresist layer is formed on the glass master, and laser light is irradiated from the inner circumference to the outer circumference at a constant speed. A predetermined information recording pattern is exposed and this resist layer is developed to form a fine information recording pattern.

【0003】この情報記録パターンを有する基材原盤上
に、スパッタリングなどの方法により、導電性金属、例
えばニッケルの導電膜(電極)を形成し、その後電鋳、
研磨して、情報記録パターンが転写されたニッケルのス
タンパーを製造し、次いで、得られたスタンパーの裏面
を研磨治具に接着させるなどの方法を用いて研磨し、研
磨スタンパーを得る方法である。
A conductive metal (eg, nickel) conductive film (electrode) is formed on the substrate master having this information recording pattern by a method such as sputtering, and then electroforming,
In this method, a nickel stamper to which an information recording pattern has been transferred is manufactured by polishing, and then the back surface of the obtained stamper is bonded to a polishing jig to obtain a polishing stamper.

【0004】[0004]

【発明が解決しようとする課題】上記したような方法で
は、ガラス原盤とレジスト層との密着性が不充分な場
合、次に行う電鋳工程で、例えばニッケル電鋳する際な
どに、しばしばポジ型フォトレジスト層がガラス原盤か
ら剥離することがある。このため電鋳液がその間隙に侵
入したり、電鋳の際に電鋳層とガラス原盤の間に浮きが
生じるなどして、電鋳厚みの精度が悪化する等様々な問
題が生じる。
According to the above-mentioned method, when the adhesion between the glass master and the resist layer is insufficient, in the electroforming step to be carried out next, for example, when nickel electroforming is performed, a positive electrode is often used. The mold photoresist layer may peel off from the glass master. As a result, various problems occur such as the accuracy of the electroformed thickness is deteriorated because the electroforming liquid enters the gap and floats between the electroformed layer and the glass master during electroforming.

【0005】また、ガラス原盤とレジスト層、従ってス
タンパーとガラス原盤が剥離すると、後に、スタンパー
の裏面を研磨する際、例えば、スタンパーの信号面を保
護膜などで保護し、この面を両面テープなどで研磨治具
に接着させて研磨を行うが、この際、スタンパーとテー
プの間に気泡が入りやすく、気泡が入った状態で研磨を
行うと、研磨面を均一な力により研磨することが困難と
なり、研磨むらが生じるなどの問題がある。更に、この
ようにして得られたスタンパーを用いて製造されるディ
スク基板は、その表面に荒れが発生し、基板のノイズレ
ベルの増大の原因となる。
Further, when the glass master and the resist layer, and hence the stamper and the glass master are peeled off, when the back surface of the stamper is polished later, for example, the signal surface of the stamper is protected by a protective film, and this surface is coated with double-sided tape or the like. Although it is adhered to a polishing jig with and is used for polishing, bubbles easily enter between the stamper and the tape at this time, and if polishing is performed with bubbles, it is difficult to polish the polishing surface with a uniform force. Therefore, there are problems such as uneven polishing. Further, the disk substrate manufactured using the stamper thus obtained has a rough surface, which causes an increase in the noise level of the substrate.

【0006】本発明は、上記した従来技術の実状に鑑み
てなされたもので、その目的とするところは、簡略な工
程で、良質なスタンパーを製造する方法を提供すること
である。
The present invention has been made in view of the above-mentioned circumstances of the prior art, and an object of the present invention is to provide a method for manufacturing a high-quality stamper by a simple process.

【0007】[0007]

【課題を解決するための手段】本発明者らは、スタンパ
ーを製造する電鋳工程に関し種々検討した結果、導電膜
とガラス原盤の周辺の部分を型枠により物理的に固定し
て電鋳を行うと、上記したような層間の剥離現象が発生
せず、良質なスタンパーを製造できるとの知見を得て本
発明を完成した。
As a result of various studies on the electroforming process for manufacturing a stamper, the present inventors have found that the conductive film and the peripheral portion of the glass master are physically fixed by a mold to perform electroforming. The present invention has been completed based on the finding that the above-described delamination phenomenon between layers does not occur and a high-quality stamper can be manufactured.

【0008】即ち本発明は、導電膜を形成した基材原盤
を電鋳し光ディスクスタンパーを製造する方法におい
て、基材原盤を型枠で固定して電鋳を行う光ディスクス
タンパーの製造方法に関するものである。
That is, the present invention relates to a method for manufacturing an optical disk stamper by electroforming a base material master having a conductive film formed thereon, and relates to a method for manufacturing an optical disk stamper in which the base material master is fixed by a mold and electroformed. is there.

【0009】以下、本発明をさらに詳細に説明する。図
1は、カッティング済みのレジスト原盤(図中1)に、
Niなどの金属膜(図中3)を形成した基材原盤の断面
図である。図2は、この原盤を型枠(図中4)に装着す
る方法を示す図であり、図3はこれらを固定した図であ
る。このように固定した原盤を、メッキ工程で電鋳処理
に供する。
The present invention will be described in more detail below. Figure 1 shows a resist master that has been cut (1 in the figure)
FIG. 3 is a cross-sectional view of a base material master on which a metal film such as Ni (3 in the figure) is formed. FIG. 2 is a diagram showing a method of mounting this master on a mold (4 in the figure), and FIG. 3 is a diagram in which these are fixed. The master thus fixed is subjected to electroforming treatment in the plating process.

【0010】本発明で用いる型枠は、基材原盤の周辺部
分を固定するもので、例えば図4〜図6に示したような
型枠、即ち、ドーナツ状の底板(図中6)に側壁(図中
7)及び押さえ(図中8)を持つ型枠では、底板の外径
は原盤の直径より大であり、また、内径は原盤の直径よ
り小で、かつ、製造するスタンパーの直径より大きいも
のである。前記した底板の外径と内径は、前述した範囲
を満たしていればどの様な大きさでもスタンパーの製造
に問題はないが、電鋳装置を考えた場合、その外径は原
盤の直径の105〜115%が、また、内径は原盤の直
径の80〜95%が好ましい。しかし、用いる原盤と製
造しようとするスタンパーの外径に応じて内径は80%
以下にすることも可能である。
The mold used in the present invention is for fixing the peripheral portion of the base material master. For example, the mold as shown in FIGS. 4 to 6, that is, the donut-shaped bottom plate (6 in the figure) has a side wall. In a formwork having (7 in the figure) and a presser (8 in the figure), the outer diameter of the bottom plate is larger than the diameter of the master, and the inner diameter is smaller than the diameter of the master and smaller than the diameter of the stamper to be manufactured. It's a big one. There is no problem in manufacturing the stamper as long as the outside diameter and the inside diameter of the bottom plate satisfy the above-mentioned range, but when considering an electroforming apparatus, the outside diameter is 105 mm of the diameter of the master. ˜115%, and the inner diameter is preferably 80 to 95% of the diameter of the master. However, the inner diameter is 80% depending on the master used and the outer diameter of the stamper to be manufactured.
It is also possible to:

【0011】型枠側壁の内径は、原盤の直径より大きけ
れば充分である。必要以上にこの内径が大きすぎると、
型枠内で原盤が堅固に固定されないので、取扱い上原盤
よりやや大きめが望ましい。
It is sufficient that the inner diameter of the mold side wall is larger than the diameter of the master. If this inner diameter is too large,
Since the master is not firmly fixed in the form, it is preferable to handle it slightly larger than the master.

【0012】本発明で使用する型枠の厚み(側壁部分の
厚み)は、特に限定しないが、原盤をこの型枠に出し入
れする作業を考慮して原盤の厚さと略同等かより小さい
ことが好ましい。しかし、必要以上に薄すぎると、原盤
を固定する際などの取扱いの面での強度が低下し、スタ
ンパーの目的とする厚さを得る上で好ましくない。通常
は約200μm以上の厚さが必要と思われるが、型枠の
強度とスタンパーの厚さを考慮して、250〜350μ
mが好ましい。
The thickness of the mold used in the present invention (thickness of the side wall portion) is not particularly limited, but it is preferable that it is substantially equal to or smaller than the thickness of the master in consideration of the work of putting the master into and out of the mold. . However, if the thickness is unnecessarily thin, the strength in handling when fixing the master is lowered, and it is not preferable for obtaining the target thickness of the stamper. Normally, it is necessary to have a thickness of about 200 μm or more, but considering the strength of the mold and the thickness of the stamper, 250-350 μm
m is preferred.

【0013】本発明の型枠の材料は、電鋳工程を考慮す
ると導電性の物質が好ましい。また、電鋳工程において
物理的、化学的に安定な物質として、金属が好ましく、
金属の中でも、Ni,Feなどを用いるとメッキ液の汚
染が小さく良好な結果が得られる。型枠の側壁部分の材
質については、型枠の底板部分と同一材料でこれらを一
体成型したものでも良く、また、異なる材料を用いる場
合は、型枠の底板部分と充分に密着し、電鋳工程におけ
る温度の上昇に耐えるものであればどのような材料でも
良いが、底板部分に金属を使用する場合は、密着性の点
から金属が好ましい。又、側壁部分の形状は、原盤の全
周辺側面部を覆う形状のものが、電鋳液の原盤各層間へ
の侵入を防ぐ上で好ましいが、前記側面の一部を固定す
る形状のものでも良い。
The material of the mold of the present invention is preferably a conductive substance in consideration of the electroforming process. Further, as a physically and chemically stable substance in the electroforming step, metal is preferable,
Among metals, the use of Ni, Fe or the like causes less contamination of the plating solution and gives good results. As for the material of the side wall of the mold, the same material as the bottom plate of the mold may be integrally molded.If different materials are used, the bottom plate of the mold should be sufficiently adhered and electroformed. Any material may be used as long as it can withstand a rise in temperature in the process, but when a metal is used for the bottom plate portion, metal is preferable from the viewpoint of adhesion. Further, it is preferable that the side wall portion has a shape that covers the entire peripheral side surface of the master in order to prevent the electroforming liquid from entering between the respective layers of the master, but a shape that fixes a part of the side surface is also possible. good.

【0014】図6に示した型枠の押さえ(8)の部分
は、側壁と同一材料で成形することも、異なる材料で成
形することもできる。押さえ部分の形状は、ガラス原盤
を固定できれば形状は特定しない。押さえ部分の材料が
側壁部分と異なる場合、その材料は型枠の側壁に充分に
密着し、電鋳温度に耐えるものが好ましい。また押さえ
の数は特に制限されず、原盤を充分強固に固定すること
ができる数あればよい。
The portion of the mold retainer (8) shown in FIG. 6 can be made of the same material as the side wall or a different material. The shape of the pressing portion is not specified as long as the glass master can be fixed. When the material of the pressing portion is different from that of the side wall portion, it is preferable that the material is sufficiently adhered to the side wall of the mold and can withstand the electroforming temperature. Further, the number of pressings is not particularly limited as long as the master can be firmly fixed.

【0015】上記したような型枠を用いて、電鋳槽にお
いてレジストパターン上にNi等の金属で電鋳を行いス
タンパー(図7の5)を形成する。電鋳終了後、スタン
パー、原盤、押さえ金型を一緒に洗浄し、乾燥する。ま
た、本発明の方法の利点の一つは、この型枠を用いて、
スタンパーの裏面を原盤に密着したままの状態で研磨す
ることができる点である。そのため、スタンパーの信号
面を保護する工程を省略することができる。研磨後、型
枠とスタンパーをガラス原盤から取り外し、スタンパー
の内外径を加工し、スタンパーを製造する。
Using the mold as described above, a stamper (5 in FIG. 7) is formed by electroforming a metal such as Ni on the resist pattern in an electroforming tank. After electroforming, the stamper, master and pressing die are washed together and dried. Also, one of the advantages of the method of the present invention, using this form,
The point is that the back surface of the stamper can be polished while it is in close contact with the master. Therefore, the step of protecting the signal surface of the stamper can be omitted. After polishing, the mold and stamper are removed from the glass master and the inner and outer diameters of the stamper are processed to manufacture the stamper.

【0016】[0016]

【発明の効果】以上の通り、本発明によれば、電鋳工程
において、レジストが原盤から剥離することがなく、次
に続く工程を簡略化し、高品質のスタンパーを作ること
ができる。具体的には、電鋳工程の次にスタンパーの裏
面研磨作業を行うため、従来は、スタンパーの信号面を
保護膜コートし、スタンパーを研磨治具にテープなどて
接着させて研磨する必要があったが、本発明によりこの
工程を省略することができる。さらに、スタンパーの反
りによる研磨むらが無くなる。
As described above, according to the present invention, the resist does not peel off from the master in the electroforming process, the subsequent process can be simplified, and a high-quality stamper can be manufactured. Specifically, since the back surface polishing work of the stamper is performed after the electroforming step, conventionally, it is necessary to coat the signal surface of the stamper with a protective film and adhere the stamper to a polishing jig with tape or the like for polishing. However, this step can be omitted by the present invention. Furthermore, uneven polishing due to warpage of the stamper is eliminated.

【0017】[0017]

【実施例】以下、実施例により本発明を更に詳細に説明
するが、本発明はこれらに限定されるものではない。
The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.

【0018】実施例1 まず、表面が精密に研磨された外径200φmm、厚さ
6mmtのガラス原盤の一方の表面にポジ型レジスト2
を塗布した。カッティング済みレジスト原盤に、Niの
スパッタ膜を付着させた後、図2に示す型枠を用いて電
鋳を行った。
Example 1 First, a positive type resist 2 was formed on one surface of a glass master having an outer diameter of 200 mm and a thickness of 6 mm, whose surface was precisely polished.
Was applied. After a Ni sputtered film was adhered to the cut resist master, electroforming was performed using the frame shown in FIG.

【0019】Ni製の型枠は、側壁の直径203φm
m、高さ3mmt、底板部分の外径210φmm、内径
185φmm、Ni板の厚さは300μmとした。ま
た、押さえ部分は4箇所とし、幅10mm、長さ30m
mの板状で、型枠の底部分と同様にNi製とした。型枠
に、レジスト膜付き面を下にした原盤を入れ、次に、レ
ジストと原盤が剥がれないように、この型枠の押さえ部
分を曲げて押さえた(図3参照)。
The Ni formwork has a side wall diameter of 203 φm.
m, height 3 mmt, bottom plate outer diameter 210 φ mm, inner diameter 185 φ mm, and Ni plate thickness 300 μm. In addition, there are four pressing parts, and the width is 10 mm and the length is 30 m.
It was a plate-shaped m and was made of Ni like the bottom part of the mold. A master having the surface with the resist film facing down was placed in the mold, and then the pressing portion of the mold was bent and pressed so that the resist and the master were not separated (see FIG. 3).

【0020】このものを、レジストパターン上にNiで
電鋳を行い、スタンパーの厚さが295〜300μmと
なるように電鋳した(図7参照)。電鋳後、この原盤、
スタンパー、型枠を一緒に洗浄し、次の研磨工程におい
て研磨の治具に、型枠、原盤をつけた状態のまま研磨治
具に取り付け、スタンパー裏面を鏡面に研磨した。
This product was electroformed with Ni on the resist pattern so that the stamper had a thickness of 295 to 300 μm (see FIG. 7). After electroforming, this master,
The stamper and the mold were washed together, and in the next polishing step, the mold was attached to the polishing jig while the mold and the master were still attached, and the back surface of the stamper was polished to a mirror surface.

【0021】研磨後、スタンパーと型枠を原盤から取り
外し、スタンパーの内外径の打ち抜き、洗浄工程を経て
スタンパーを得た。電鋳工程で押さえの型枠を用いたこ
とにより、スタンパーの製造時間を短縮することがで
き、また、スタンパーの反りによる研磨むらが無く、均
一な研磨面を持つスタンパーを得た。
After the polishing, the stamper and the mold were removed from the master, the inner and outer diameters of the stamper were punched out, and a washing process was performed to obtain a stamper. By using the pressing mold in the electroforming process, the manufacturing time of the stamper can be shortened, and there is no unevenness of polishing due to warp of the stamper, and a stamper having a uniform polished surface is obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】カッティング済みのレジスト原盤に、金属膜を
形成した基材原盤の断面図。
FIG. 1 is a cross-sectional view of a base material master in which a metal film is formed on a resist master after cutting.

【図2】原盤を型枠に装着する方法の一例を示す図。FIG. 2 is a diagram showing an example of a method of mounting a master on a mold.

【図3】原盤と型枠とを固定した状態の一実施態様を示
す図。
FIG. 3 is a diagram showing an embodiment in which a master and a mold are fixed.

【図4】本発明で用いる型枠の一例の断面を示す図。FIG. 4 is a view showing a cross section of an example of a mold used in the present invention.

【図5】本発明で用いる型枠の一例の上面を示す図。FIG. 5 is a diagram showing a top surface of an example of a mold used in the present invention.

【図6】本発明で用いる型枠の一例の概観を示す図。FIG. 6 is a diagram showing an overview of an example of a mold used in the present invention.

【図7】型枠を用いた電鋳で得たスタンパー及びの基材
原盤の断面図。
FIG. 7 is a cross-sectional view of a stamper and a base material master of the stamper obtained by electroforming using a mold.

【符号の説明】[Explanation of symbols]

1:ガラス原盤 2:レジスト膜 3:Niスパッタ膜 4:型枠 5:スタンパー 6:型枠の底板 7:型枠の側壁 8:型枠の押さえ 1: Glass master 2: Resist film 3: Ni sputtered film 4: Formwork 5: Stamper 6: Formwork bottom plate 7: Formwork side wall 8: Formwork hold down

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】導電膜を形成した基材原盤を電鋳し光ディ
スクスタンパーを製造する方法において、基材原盤を型
枠で固定して電鋳を行うことを特徴とする製造方法。
1. A method for manufacturing an optical disk stamper by electroforming a base material master having a conductive film formed thereon, wherein the base material master is fixed with a mold to perform electroforming.
JP32838091A 1991-11-18 1991-11-18 Production of optical disk stamper Pending JPH05144094A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32838091A JPH05144094A (en) 1991-11-18 1991-11-18 Production of optical disk stamper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32838091A JPH05144094A (en) 1991-11-18 1991-11-18 Production of optical disk stamper

Publications (1)

Publication Number Publication Date
JPH05144094A true JPH05144094A (en) 1993-06-11

Family

ID=18209604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32838091A Pending JPH05144094A (en) 1991-11-18 1991-11-18 Production of optical disk stamper

Country Status (1)

Country Link
JP (1) JPH05144094A (en)

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