JPH05140338A - Circuit board produced by using fluororesin composition - Google Patents

Abstract

PURPOSE:To obtain a circuit board having excellent mechanical properties, heat-resistance, etc., by using a cured material produced by three-dimensionally cross-linking a resin composition composed of a bismaleimide compound and a biscyanamide compound. CONSTITUTION:The objective circuit board can be produced by compounding (A) a compound of formula I (C9F17 is perfluorononenyl having one double bond; X is bivalent group containing ester bond or ether bond) with (B) a compound of formula II at a ratio of 95:5 to 5:95, dissolving the obtained resin composition containing the components A and B in a solvent, three-dimensionally cross-linking the resin by the polymerization reaction of the multiple bond, impregnating the cured material in an inorganic fiber cloth, etc., and laminating and bonding the obtained prepregs.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluorine-containing thermosetting resin composition, and more particularly to a resin composition suitable as a low dielectric constant insulating material excellent in moldability, heat resistance and adhesiveness.

[0002]

2. Description of the Related Art Bismaleimide and the like have been conventionally used as a heat-resistant thermosetting resin composition, but a resin obtained by adding bismaleamide to bismaleimide has improved heat resistance and moldability. Have been found
58-71924). However, these resins are known to have a relatively high relative dielectric constant because they have a large number of amide groups or imide groups having a large polarizability. A resin using a fluorine-containing maleimide or the like has been proposed for a thermosetting resin composition having a low relative dielectric constant (Japanese Patent Laid-Open No. 2-73809), but it is known that the introduction of fluorine reduces the adhesiveness. Has been. Therefore, it has been difficult to realize a high-density multilayer wiring board using a fluorine-containing resin.

[0003]

A material having both an adhesive property and a low relative dielectric constant is required for use in a multi-layer printed board of a large-sized computer which requires high-speed signal transmission. Conventional thermosetting resin compositions have introduced a fluorine-substituted functional group in order to lower the relative dielectric constant, but this method has a drawback in that the adhesiveness with a metal is impaired.
It is generally known that a polar functional group such as ester may be introduced in order to improve the adhesiveness, but the relative dielectric constant is increased by the usual method.

The object of the present invention is to provide a laminated material using a resin composition which has a low relative dielectric constant without impairing heat resistance and adhesiveness and does not generate by-products during molding, which is a characteristic of imide-based materials. And to realize a high-density multilayer wiring board having an insulating layer having a low dielectric constant.

[0005]

Means for Solving the Problems The present invention is a combination of a polar functional group and a fluorine-containing maleimide compound and a fluorine-containing cyanamide compound which can compensate for the increase in the relative dielectric constant due to the introduction of the functional group. It is possible to provide a resin composition having a low relative permittivity without damaging the resin composition and not generating a by-product during molding, which is a feature of the imide-based material. By applying this resin composition to a laminated material, a high-density multilayer wiring board having an insulating layer having a low dielectric constant can be realized.

Claim 1 General formula (1)

[0007]

[Chemical 5]

(In the formula, the C ₉ F ₁₇ group is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond.). Compound and general formula (2)

[0009]

[Chemical 6]

(Wherein, C ₉ F ₁₇ group is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond). A laminated material using a cured product obtained by three-dimensionally crosslinking a resin composition containing a compound by a polymerization reaction of multiple bonds.

(2) A mixing ratio of the bismaleimide compound of (1) and the biscyanamide compound of (1) is 95: 5.
A laminated material using a cured product obtained by three-dimensionally cross-linking a thermosetting resin composition, characterized by being used at 5:95.

Claim 3 General formula (1)

[0013]

[Chemical 7]

(In the formula, the C ₉ F ₁₇ group is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond.) Bismaleimide Compound and general formula (2)

[0015]

[Chemical 8]

(Wherein C ₉ F ₁₇ is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond). Compound and maleimide compound, cyanamide compound, cyanato compound, isocyanato compound, epoxy compound, cured product obtained by three-dimensionally crosslinking a thermosetting resin composition characterized by containing at least one kind of vinyl compound is used. Laminated material.

(4) A laminated material using a cured product obtained by three-dimensionally cross-linking a resin composition prepared by dissolving the resin composition in a solvent and forming a uniform varnish according to any one of (1), (2) and (3).

5. A prepreg obtained by impregnating an inorganic fiber cloth as a reinforcing material with the resin composition according to claim 1, 2, 3 or 4.

6. A prepreg obtained by impregnating an organic fiber cloth as a reinforcing material with the resin composition according to claim 1, 2, 3 or 4.

(7) A laminated material using the resin composition according to any one of (1), (2), (3) and (4) together with other resin components.

8. A laminated material obtained by laminating and adhering a prepreg obtained by impregnating an inorganic fiber cloth as a reinforcing material with the resin composition according to claim 5 or 6.

9. A laminated material obtained by laminating and adhering a prepreg obtained by impregnating an organic fiber cloth as a reinforcing material with the resin composition according to claim 5 or 6.

(10) A wiring board comprising the resin composition according to any one of (1) to (9) and a laminated material using the composition.

(11) A large-area substrate composed of the resin composition according to any one of (1) to (9) and a laminated material using the composition.

A module substrate comprising the resin composition according to any one of claims 1 to 9 and a laminate material using the composition.

(13) A microchip carrier substrate formed of the resin composition according to any one of (1) to (9) and a laminated material using the composition.

14. A pin grid array substrate comprising the resin composition according to claim 1 and a laminated material using the composition.

In the present invention, examples of the fluorine-containing maleimide compound represented by the general formula (1) are shown below.

[0029]

[Chemical 9]

Further, examples of the fluorine-containing cyanamide compound represented by the general formula (2) in the present invention include those shown below.

[0031]

[Chemical 10]

However, examples of the C ₉ F ₁₇ group include those shown below.

[0033]

[Chemical 11]

Although these compounds have polar groups for improving the adhesiveness, the bond dissociation energy with carbon is 100 kJ / mol larger than that of hydrogen, and
Since it also has a substituent having a high molar content of fluorine and a high content of fluorine, it is possible to obtain a thermosetting resin having excellent adhesiveness and heat resistance and a low relative dielectric constant.

By using these compounds as a thermosetting resin composition, the moldability of the resin can be improved, and at the same time, the resin having a fluorine-substituted substituent has excellent heat resistance and a low dielectric constant. I was able to get

A thermosetting resin using a fluorine-containing cyanamide compound and a fluorine-containing maleimide compound is heat-resistant by forming a melamine ring which is a heteroaromatic ring or an melamine ring and an imide ring which are heteroaromatic rings by a trimerization reaction such as heating, and complicated three-dimensional crosslinking A low dielectric constant material with excellent properties. This results in a heat-resistant insulating material that retains mechanical properties and dimensional stability even at high temperatures. Further, since no reaction by-product such as condensed water is generated in this crosslinking and curing reaction, there is an advantage that it can be applied in various fields such as various structural materials and molding. This is different from typical heat-resistant insulating materials such as polyimide, polybenzimidazole, and polybenzothiazole.

[0037]

The polar group introduced to improve the adhesiveness of the thermosetting resin raises the dielectric constant because the bond dissociation energy with carbon is 100 kJ / mol higher than that of hydrogen and the inclusion of fluorine with a large molar specific volume. It became possible by introducing a substituent with a high ratio. The heat resistance was able to maintain the conventional properties by retaining the maleimide and cyanamide structures that construct a three-dimensional cross-link by the polymerization reaction of multiple bonds. Further, a high density multilayer wiring board can be realized by improving the adhesiveness which is a problem of the fluorine-containing resin.

[0038]

【Example】

<Example 1> 1-perfluorononenyloxy-3,5
80 parts by weight of -phthaloylbis (4- (4-maleimidophenoxy)) (A) (neos), 1-perfluorononenyloxy-3,5-phthaloylbis (4- (4-
Cyanamide phenoxy)) (C) (Manac), 20 parts by weight, and a resin composition comprising 0.5 parts by weight of a peroxide as a polymerization initiator are dissolved in a solvent dimethylformamide to prepare a 50% solution, and the mixture is shaken and stirred to produce a varnish. Used as.

Nitto Boseki T glass cloth (thickness 60 μm) as a reinforcing material was impregnated with the varnish and dried for 10 minutes in constant temperature air at 150 ° C. to obtain a prepreg. 10 sheets of the obtained prepreg are piled up, and pressure is 30 kgf / c in the press.
m ^2, was heated for 30 minutes at a temperature 220 ° C., further 250 ° C.
After that, the adhesive was cured for 1 hour to obtain a laminated plate. As a sample for measuring the copper foil peel strength, 10 prepregs were stacked, and copper foil (manufactured by Furukawa Electric Co., Ltd., thickness 70 μm) was stacked on both surfaces and laminated and bonded under the same conditions. The characteristics of the sample manufactured by the above method were evaluated. The relative permittivity was calculated by measuring the capacitance of the sample according to JIS-C-6481 using an LF impedance analyzer 4192A manufactured by Hewlett-Packard Company. Copper foil peel strength is measured using Fudo Industrial Rheometer NRM-3101D according to JIS-C-64
According to No. 81, the peel strength of the copper foil in the vertical direction was measured under the condition of the peeling speed of 50 mm / min. The thermal decomposition start temperature is
It measured using the high-speed differential thermal balance TGD-7000RH manufactured by Vacuum Riko. Powder sample 10 mg obtained by crushing resin component
The heating loss curve was measured at a temperature rising rate of 5 ° C./min in an atmosphere having a He flow rate of 100 cm ³ / min, and the temperature showing 5% loss was defined as the thermal decomposition start temperature. The coefficient of thermal expansion was measured using a thermomechanical property measuring device TM-3000 manufactured by Vacuum Riko Co., Ltd., and the coefficient of thermal expansion in the thickness direction of a sample cut out from a laminated plate into 7 mm × 7 mm
(50-220 ° C) was measured. The measurement was performed in a compression mode with a temperature rising rate of 2 ° C./min and a load of 10 g. Flame retardancy is measured by UL
It was measured by -94. The measurement results are summarized in the table.

Example 2 80 parts by weight of 1-perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (neos), 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared using a resin composition containing 20 parts by weight of a polymerization initiator and 0.5 parts by weight of a peroxide. The varnish preparation method was according to the method shown in Example 13. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber woven Kevlar 49 manufactured by DuPont as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in the table.

Example 3 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (Neos) 80 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared using a resin composition containing 20 parts by weight of a polymerization initiator and 0.5 parts by weight of a peroxide. The varnish preparation method was according to the method shown in Example 13. Using this varnish, a aromatic amide organic synthetic fiber non-woven fabric GAU-505 manufactured by Nippon Aroma Co., Ltd. was used as a reinforcing material in the same manner as in Example 1.
50 was used to prepare a prepreg and a laminated board, and the characteristics were evaluated. The results are shown in the table.

Example 4 1-perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (neos) 70 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared by using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 13. Using this varnish, Nitto Boseki T glass cloth (thickness: 60 μm) was used as a reinforcing material in the same manner as in Example 1.
A prepreg and a laminated board were produced by using and the characteristics were evaluated. The results are shown in the table.

Example 5 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (Neos) 70 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared by using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber woven Kevlar 49 manufactured by DuPont as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in the table.

Example 6 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (Neos) 70 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared by using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber nonwoven fabric GAU-505-50 manufactured by Japan Aroma Co., Ltd. as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in Table 1.

[0045]

[Table 1]

Example 7 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (Neos) 70 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminated board were produced by using Nitto Boseki T glass cloth (thickness 60 μm) as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated.
The results are shown in Table 1.

Example 8 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (Neos) 70 parts by weight, 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber woven Kevlar 49 manufactured by DuPont as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in Table 1.

<Example 9> 70 parts by weight of 1-perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (A) (neos), 1-perfluorononenyloxy-3 , 5-phthaloylbis (4
-(4-Cyanamidephenoxy)) (C) (Manac)
A varnish was prepared using a resin composition comprising 20 parts by weight, 10 parts by weight of 4,4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber nonwoven fabric GAU-505-50 manufactured by Japan Aroma Co., Ltd. as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in Table 1.

Example 10 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (B) (Neos) 80 parts by weight, 1-perfluorononenyloxy-3 A varnish was prepared by using a resin composition comprising 20 parts by weight of 5,5-phthaloylbis (4- (4-cyanamidephenoxy)) (D) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a N-Tobo T glass cloth (thickness: 60 μm) was used as a reinforcing material in the same manner as in Example 1 to prepare a prepreg,
A laminated board was prepared and its characteristics were evaluated. The results are shown in Table 1.

Example 11 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (B) (Neos) 80 parts by weight, 1-perfluorononenyloxy-3 A varnish was prepared by using a resin composition comprising 20 parts by weight of 5,5-phthaloylbis (4- (4-cyanamidephenoxy)) (D) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber woven Kevlar 49 manufactured by DuPont as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in Table 1.

Example 12 1-Perfluorononenyloxy-3,5-phthaloylbis (4- (4-maleimidophenoxy)) (B) (Neos) 80 parts by weight, 1-perfluorononenyloxy-3 A varnish was prepared by using a resin composition comprising 20 parts by weight of 5,5-phthaloylbis (4- (4-cyanamidephenoxy)) (D) (Manac) and 0.5 part by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, the aromatic amide organic synthetic fiber nonwoven fabric GAU-505 manufactured by Japan Aroma Co., Ltd. was used as a reinforcing material in the same manner as in Example 1.
Using -50, a prepreg and a laminated board were produced and the characteristics were evaluated. The results are shown in Table 1.

Comparative Example 1 80 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 4,
A varnish was prepared using a resin composition containing 20 parts by weight of 4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 parts by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a N-Tobo T glass cloth (thickness: 60 μm) was used as a reinforcing material in the same manner as in Example 1 to prepare a prepreg,
A laminated board was prepared and its characteristics were evaluated. The results are shown in Table 1.

Comparative Example 2 80 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 4,
A varnish was prepared using a resin composition containing 20 parts by weight of 4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 parts by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, a prepreg and a laminate were prepared by using the aromatic amide organic synthetic fiber woven Kevlar 49 manufactured by DuPont as a reinforcing material in the same manner as in Example 1, and the characteristics were evaluated. The results are shown in Table 1.

Comparative Example 3 80 parts by weight of 4,4'-diphenylmethane bismaleimide (E) (Mitsui Toatsu) and 4,
A varnish was prepared using a resin composition containing 20 parts by weight of 4'-dicyanamide diphenyl ether (F) (Manac) and 0.5 parts by weight of a peroxide as a polymerization initiator. The varnish preparation method was according to the method shown in Example 1. Using this varnish, the aromatic amide organic synthetic fiber nonwoven fabric GAU-505 manufactured by Japan Aroma Co., Ltd. was used as a reinforcing material in the same manner as in Example 1.
Using -50, a prepreg and a laminated board were produced and the characteristics were evaluated. The results are shown in Table 1.

<Comparative Example 4> As a comparative example, a polytetrafluoroethylene-based copper clad laminate R47 manufactured by Matsushita Electric Works, Ltd.
37 was evaluated in the same manner as in Example 1.

<Comparative Example 5> As a comparative example, a glass polyimide copper-clad laminate MCL-I-67 manufactured by Hitachi Chemical Co., Ltd.
Was evaluated in the same manner as in Example 1.

<Comparative Example 6> As a comparative example, a glass epoxy copper-clad laminate MCL-E-67 manufactured by Hitachi Chemical Co., Ltd. was evaluated in the same manner as in Example 1.

Compounds (A) used in Examples and Comparative Examples
(I) is shown below.

[0059]

[Chemical 12]

[0060]

[Chemical 13]

As shown in Table 1, each of the laminated plates shown in this example realized a low dielectric constant of the resin component without impairing the properties such as heat resistance, adhesiveness and thermal expansion coefficient.

The following is an example in which a wiring board was prepared using the laminated materials shown in Examples 13 to 24.

Example 16 Using the prepreg obtained in Example 1, copper foil (70 μm) on both sides was heated in a press at a pressure of 30 kgf / cm ² and a temperature of 220 ° C. for 30 minutes, and further at 250 ° C. The adhesive was cured for 1 hour to obtain a copper-clad laminate. Circuits were formed on both surfaces of this copper-clad laminate and laminated and adhered via a prepreg to prepare a pin grid array substrate on which LSI is mounted. This substrate has a six-layer structure, and each has two surface layers, a power supply layer and a signal layer.

<Example 17> Using the prepreg obtained in Example 1, a microchip carrier substrate on which an LSI was mounted was prepared in the same manner as in Example 16. This board is 6
It has a layered structure, and each has two surface layers, a power supply layer,
It has a signal layer.

<Embodiment 18> Using the prepreg obtained in Embodiment 1 and in the same manner as in Embodiment 16, Embodiment 26
A module substrate on which the microchip carrier substrate obtained in (1) was mounted was prepared. This substrate is composed of 2 surface layers, 10 power supply layers, 16 signal layers, and 8 expansion layers.
It has a 6-layer structure. Also, 81 microchip carrier substrates (9 × 9) can be mounted on this substrate.

Example 19 Example 27 is carried out in the same manner as in Example 16 using the prepreg obtained in Example 1.
A large-area substrate on which the module substrate obtained in (1) was mounted was created. This substrate has 2 surface layers, 20 power supply layers,
It has a 54-layer structure consisting of 24 signal layers and 8 expansion layers.
Further, this module can mount 64 module boards (8 × 8).

Example 20 Using the prepreg obtained in Example 3 and in the same manner as in Example 16, Example 27
A large-area substrate on which the module substrate obtained in (1) was mounted was created. This substrate has 2 surface layers, 16 power supply layers,
It has a 46-layer structure consisting of 20 signal layers and 8 expansion layers.
In addition, 36 (6 × 6) module boards can be mounted on this board.

[0068]

EFFECT OF THE INVENTION The fluorine-containing resin of the present invention is a compound containing fluorine-containing cyanamide in which an imide compound which is excellent as a heat-resistant material has a polar moiety for improving adhesiveness and a fluorine group for lowering the dielectric constant. Used. It was possible to increase the molar specific volume of the cured product obtained by incorporating a large amount of fluorine groups into the structure, and to lower the dielectric constant. Further, since the fluorine group has a large bond dissociation energy with carbon, it was possible to improve the thermal decomposition temperature, which is a measure of heat resistance, and mechanical strength at the same time. Further, since the cyanamide group is fast-curing, workability is excellent. As described above, it was confirmed that the thermosetting resin composed of the fluorinated cyanamide and the fluorinated imide had excellent moldability, and the obtained cured product had excellent heat resistance and mechanical properties. Further, the relative permittivity, which is important for the electrical characteristics of the insulating material, can be reduced, and it can be a material suitable for fields requiring a low permittivity such as a mold material, a wiring board, and an interlayer insulating film of an LSI. Can be expected.

[Brief description of drawings]

FIG. 1 is a perspective view of a multilayer printed board according to an embodiment of the present invention.

[Explanation of symbols]

1 ... Substrate, 2 ... Circuit, 3 ... Prepreg sheet, 4 ... Through hole.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location C08J 5/24 CEZ 7188-4F C08L 79/08 LRE 9285-4J H01B 3/30 9059-5G H01L 23 / 12 H05K 1/03 D 7011-4E // C08L 35:00 7921-4J (72) Inventor Akira Nagai 4026 Kuji-cho, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi, Ltd. (72) Inventor Yoshinori Kawai Ibaraki Hitachi, Ltd. 4026 Kuji Town, Hitachi City, Hitachi Prefecture (72) Inventor Akio Takahashi 4026 Kuji Town, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi Ltd.

Claims (14)

[Claims] 1. A general formula (1): (In the formula, the C ₉ F ₁₇ group is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond.), And a bismaleimide compound represented by the following formula: General formula (2) (In the formula, the C ₉ F ₁₇ group represents a perfluorononenyl group having one double bond, and X represents a divalent group containing an ester bond or an ether bond.) A laminated material comprising a cured product obtained by three-dimensionally crosslinking a resin composition by a polymerization reaction of multiple bonds. 2. The mixing ratio of the bismaleimide compound and the biscyanamide compound according to claim 1, which is 95: 5.
A laminated material using a cured product obtained by three-dimensionally crosslinking the thermosetting resin composition used at 5:95. 3. General formula (1): (In the formula, the C ₉ F ₁₇ group is a perfluorononenyl group having one double bond, and X is a divalent group containing an ester bond or an ether bond.), And a bismaleimide compound represented by the following formula: General formula (2) (In the formula, the C ₉ F ₁₇ group represents a perfluorononenyl group having one double bond, and X represents a divalent group containing an ester bond or an ether bond.) And a maleimide. Compounds, cyanamide compounds, cyanato compounds, isocyanato compounds, epoxy compounds,
A laminated material comprising a cured product obtained by three-dimensionally crosslinking a thermosetting resin composition containing at least one of vinyl compounds. 4. A laminated material according to claim 1, wherein the resin composition is dissolved in a solvent and a cured product obtained by three-dimensionally crosslinking the resin composition prepared with a uniform varnish. 5. A prepreg obtained by impregnating an inorganic fiber cloth as a reinforcing material with the resin composition according to claim 1, 2, 3 or 4. 6. A prepreg obtained by impregnating an organic fiber cloth as a reinforcing material with the resin composition according to claim 1, 2, 3 or 4. 7. A laminate material using the resin composition according to claim 1, 2, 3 or 4 together with other resin components. 8. A laminated material obtained by laminating and adhering a prepreg obtained by impregnating an inorganic fiber cloth as a reinforcing material with the resin composition according to claim 5 or 6. 9. A laminated material obtained by laminating and adhering a prepreg obtained by impregnating an organic fiber cloth as a reinforcing material with the resin composition according to claim 5 or 6. 10. A wiring board comprising the resin composition according to claim 1 and a laminated material using the resin composition. 11. A large-area substrate composed of the resin composition according to claim 1 and a laminated material using the resin composition. 12. A module substrate composed of the resin composition according to claim 1 and a laminated material using the resin composition. 13. A microchip carrier substrate composed of the resin composition according to claim 1 and a laminated material using the resin composition. 14. A pin grid array substrate composed of the resin composition according to claim 1 and a laminated material using the resin composition.