JPH05138858A - Apparatus for supplying solder to printed circuit board - Google Patents

Abstract

PURPOSE:To improve workability and to control the supply amount of solder with high accuracy in an apparatus for supplying solder to a printed circuit board. CONSTITUTION:A screen sheet roll 2 wherein a screen sheet 1 obtained by forming a plurality of solder supply patterns to a long sheet material is wound from both ends and a solder coating mechanism 5 having a plurality of solder jet orifices provided thereto parallel and independently driving the solder jet orifices to inject cream solder in a dot state are provided. Further, the predetermined solder supply pattern selected from the screen sheet 1 is held to a target printed circuit board 6 to supply the cream solder to the predetermined region of the printed circuit board 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply device for a printed circuit board.

[0002]

2. Description of the Related Art A conventional example of supplying solder to a printed circuit board 6 is shown in the drawing. In the conventional example shown in FIG.
On the printed circuit board 6, a screen plate 15 having a solder supply pattern punched is placed.
Cream solder 4 is supplied on the top. After that, the upper surface of the screen plate 15 is rubbed with a spatula-shaped squeegee 16 to supply solder to a region on the screen plate 15 that matches the pattern. In addition, in FIG. 6A, 17 is a frame for supporting the plate.

In the conventional example shown in FIG. 6 (b),
The printed circuit board 6 is sent in the direction of the arrow in the figure while being sandwiched between the pair of rollers 18, 18. Further, a mold plate 19 is provided on the outer periphery of one of the rollers, and the cream solder 4 applied to the mold plate 19 is transferred to the printed board 6 when the printed board 6 is conveyed.

[0004]

However, in the above-mentioned conventional example, the screen plate 15 prepared for each printed circuit board 6 is relatively large because its four circumferences are supported by the frame 17, and a lot of storage space is required. In the case of using the roller 18, there is a drawback that the work of attaching and detaching the template 19 to the roller 18 is troublesome and the workability is poor. It had a drawback that it was difficult to manage and could not be supplied uniformly.

The present invention has been made to solve the above drawbacks, and provides a solder supply device for a printed circuit board, which has good workability and can manage the solder supply amount with high accuracy. The purpose is to do.

[0006]

According to the present invention, the above object is to provide a screen sheet 1 in which a plurality of solder supply patterns are formed on a long sheet body from both ends as shown in FIG. 1 corresponding to an embodiment. Rolled screen sheet roll 2
And a plurality of solder injection holes 3 are provided side by side, and each solder injection hole 3
And a solder coating mechanism 5 for independently spraying the cream solder 4 in a dot shape, and the screen sheet 1
This is achieved by holding a predetermined solder supply pattern selected from the above on the target printed circuit board 6 and providing a solder supply device for the printed circuit board 6 that supplies the cream solder 4 to a predetermined area of the printed circuit board 6. ..

[0007]

In the present invention, the conventional screen plate 15 is
The screen sheet roll 2 is wound and mounted. The screen sheet roll 2 is provided with supply patterns corresponding to a plurality of types of printed circuit boards 6, and a desired supply pattern is held on the target printed circuit board 6 according to the type of the target printed circuit board 6.

As a result, as in the conventional case, the screen plate 1
5 or not only does the work of replacing the pattern plate 19 become unnecessary, but the storage space is also small. further,
On the set screen sheet 1, the cream solder 4 is supplied in a dot shape from the solder injection holes 3, and the supply amount is finely controlled.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 shows an overall view of the solder supply device. The solder supply device has a case 22 installed on the floor surface 21 by legs 20, a conveyor 10 provided in the case 22, and a solder coating mechanism 5 arranged above the conveyor 10. The printed circuit board 6 is conveyed to the inside of the housing 22 by the carry-in conveyor 23 arranged outside the housing 22 and delivered to the conveyor 10, and soldered inside the housing 22, and then the discharge conveyor 24 performs the next process. Sent to.

The solder coating mechanism 5 includes a jet nozzle 7 for spraying the cream solder 4, a pair of winding shafts 14, 14 for holding the screen sheet roll 2, and a screen sheet unwound from the screen sheet roll 2. It is provided with guide rollers 25, 25 for guiding 1 below the jet nozzle 7, and pressing rollers 8, 8 arranged in the vicinity of the jet nozzle 7 so as to press the screen sheet 1 on the printed circuit board 6.

The screen sheet 1 is formed by connecting screens corresponding to different solder supply patterns, and a desired solder supply pattern is fed onto the printed circuit board 6 according to a command from the control unit 13.

The jet nozzle 7 has a plurality of solder injection holes 3, 3 ... Arranged in a direction orthogonal to the conveyance direction of the printed circuit board 6, and each solder injection hole 3 is instructed by a controller 13. The cream solder 4 is ejected in a dot shape by being driven independently, and the cream solder 4 is supplied to the corresponding portion on the printed circuit board 6. The jet nozzle 7, the pressing roller 8, and the guide roller 25 are integrally driven as shown in FIG. 2, and while moving along the printed circuit board 6, a required amount of cream solder 4 is placed at a desired position on the printed circuit board 6. To supply. A solder scraping piece 26 is in contact with the pressing roller 8 and scrapes the cream solder 4 attached to the pressing roller 8.

Further, the solder supply device is configured to inject the cream solder 4 from these jet nozzles 7 at
A control unit 13 for managing and controlling the jetting amount or the feeding amount of the screen sheet roll 2, a storage unit 12 for storing control contents, and a board identifying mechanism 11 for automatically identifying the model of the printed board 6 and the like. , A sheet identification mechanism 27 for identifying the type of the solder supply pattern corresponding to the printed circuit board 6.

In this embodiment, the board identifying mechanism 11 and the sheet identifying mechanism 27 are bar code readers.
As shown in FIG. 4, the printed circuit board 6 and the screen sheet 1 are provided with bar codes (the board identification mark 9 and the sheet identification mark 28) so that they can be read by these bar code readers. Incidentally, in FIG.
Is a sprocket hole for transporting the screen sheet 1.

The operations of the control unit 13 and the storage unit 12 are shown in FIG. First, the storage unit 12 includes an index unit (IDX1, IDX2 ...) Representing the type of the printed circuit board 6.
And a data section (D1, D2 ...), Conveyor 1
When the printed circuit board 6 is conveyed over 0, the board identification mechanism 11 reads the bar code 9 on the printed circuit board 6 and sends it to the control unit 13. Upon receiving the signal from the board identification mechanism 11, the control unit 13 outputs a drive signal to the winding shaft 14 of the screen sheet roll 2 until the sheet identification mechanism 27 matches the signal from the board identification mechanism 11. , The solder supply pattern corresponding to the printed circuit board 6 is located on the lower surface of the jet nozzle 7, and at the same time, the storage unit 1
2 is accessed to fetch the data part D corresponding to the index part IDX.

Each data section D1, D2, ... Is composed of head position information, jet nozzle 7 moving speed information, and drive switch information of the solder injection hole 3, and the jet nozzle 7 reaches a position matching the head position information. Then, the jet nozzle 7 moves according to the moving speed information of the jet nozzle 7 at the position. The moving speed changes the supply amount of the cream solder 4 to the printed circuit board 6.

On the other hand, each of the solder injection holes 3 of the jet nozzle 7 traveling on the printed circuit board 6 based on the moving speed information of the jet nozzle 7 is turned ON / OFF based on the drive switch information, and a predetermined amount on the printed circuit board 6 is obtained. Solder is supplied to the area.

[0018]

As is apparent from the above description, according to the solder supply device for a printed circuit board according to the present invention, the work such as replacement and storage of the screen plate is not necessary, and the predetermined solder on the printed circuit board is required. Solder can be reliably supplied to the area.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing an operation of a solder coating mechanism.

FIG. 3 is a diagram showing a screen sheet.

FIG. 4 is a diagram showing an operation of a control unit.

FIG. 5 is a diagram showing the contents of a storage unit.

FIG. 6 is a diagram showing a conventional example.

[Explanation of symbols]

 1 Screen Sheet 2 Screen Sheet Roll 3 Solder Injection Hole 4 Cream Solder 5 Solder Application Mechanism 6 Printed Circuit Board 7 Jet Nozzle 8 Pressing Roller 9 Model Identification Mark 10 Conveyor 11 Board Identification Mechanism 12 Storage Section 13 Control Section 14 Rolling Axis

Claims (4)

[Claims] 1. A screen sheet roll (2) obtained by winding a screen sheet (1) having a plurality of solder supply patterns formed on a long sheet body from both ends, and a plurality of solder injection holes (3, 3, ...). And a solder coating mechanism (5) for arranging the solder spray holes (3) independently to spray the cream solder (4) in a dot shape, and selected from the screen sheet (1). A predetermined solder supply pattern is held on the target printed circuit board (6) and cream solder is applied to a predetermined area of the printed circuit board (6).
Solder supply device for printed circuit board that supplies (4). 2. The solder coating mechanism (5) comprises a solder injection hole.
A jet nozzle (7) provided with (3) and the screen sheet (1) as a target printed circuit board.
(6) The device for supplying solder to a printed circuit board according to claim 1, further comprising a pressing roller (8) which presses it on. 3. A conveyor (10) arranged below the solder coating mechanism (5) for carrying a target printed circuit board (6) having a model identification mark (9) on its upper surface, and the printed circuit board (6). ) A board identification mechanism (11) for identifying the above model identification mark (9) and a storage unit for storing control information for each printed circuit board (6)
(12), and a control unit (13) for fetching control information from the storage unit (12) based on the model identification mark (9), the control unit (13) is a screen based on the control information. The winding shaft (14) of the sheet roll (2) is driven to position the corresponding solder supply pattern on the upper surface of the printed circuit board (6), and each solder injection hole (3) is driven to move the printed circuit board (6) onto the printed circuit board (6). The solder supply device for a printed circuit board according to claim 1 or 2, wherein the cream solder (4) is supplied to a predetermined area of the. 4. The control information includes information for controlling a solder injection amount from a solder injection hole (3), and controls a solder supply amount to a target printed circuit board (6). Solder supply device for printed circuit boards.