JPH0513859Y2 - - Google Patents
Info
- Publication number
- JPH0513859Y2 JPH0513859Y2 JP12715287U JP12715287U JPH0513859Y2 JP H0513859 Y2 JPH0513859 Y2 JP H0513859Y2 JP 12715287 U JP12715287 U JP 12715287U JP 12715287 U JP12715287 U JP 12715287U JP H0513859 Y2 JPH0513859 Y2 JP H0513859Y2
- Authority
- JP
- Japan
- Prior art keywords
- floor
- equipment
- electronic
- circuit component
- floor panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 description 8
- 238000010276 construction Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
本考案は床パネルにかかり、詳しくはコンピユ
ータ等の各種OA機器が設置されるフリーアクセ
スフロアに用いて好適な床パネルに関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a floor panel, and more specifically, to a floor panel suitable for use in a raised floor where various office equipment such as computers are installed.
（従来の技術及びその問題点）
現在、コンピユータを始めとする各種のOA機
器はオフイスに欠かせないものであり、これらの
OA機器の普及に伴つていわゆるフリーアクセス
フロアを採用するオフイスが急増している。この
フリーアクセスフロアは、周知のようにOA機器
に必要な各種の配線を二重床内の空間に収容でき
るため、室内の床上の配線をなくして美観の向上
や床上スペースの有効利用に資するものである。(Conventional technology and its problems) Currently, computers and various other OA equipment are indispensable in offices.
With the spread of office automation equipment, the number of offices adopting so-called raised floors is rapidly increasing. As is well known, this raised floor allows the various types of wiring required for OA equipment to be accommodated in the space within the double floor, thereby eliminating the need for wiring on the floor inside the room, contributing to improved aesthetics and effective use of floor space. It is.
しかるに、オフイス内のOA機器自体の数は
年々増加しており、また情報化社会の進展につれ
て関係する専門書や雑誌等が増えている現状にお
いて、オフイスの室内空間は日毎に狭くなつてい
るといつても過言ではない。特に、オフイスワー
カー１人当りの占有作業面積を５〜６m2とした場
合、アメニテイー等を考慮すると一人当り少なく
とも12〜13m2の面積をオフイス内に確保すること
が必要と言われているが、これは物理的、経済的
に困難な状況である。 However, as the number of office automation equipment in offices increases year by year, and the number of related specialized books and magazines increases as the information society progresses, the indoor space in offices is becoming smaller day by day. It is always no exaggeration. In particular, when the working area per office worker is set at 5 to 6 m2 , it is said that it is necessary to secure at least 12 to 13 m2 of area per person in the office, considering amenities, etc. This is a physically and economically difficult situation.
このような点に鑑み、最近では、床下を二分割
してその中に電子機器等の筐体の一部を収納しよ
うとする思想が提案されており、これはケーブル
セパレーターを用いてその上にトランシーバーや
モデム、カプラー、分岐部品、電話機端子等をセ
ツトするものである。この方法は、主として
LAN（ローカルエリアネツトワーク）に対応させ
るために考えられたものであるが、床下寸法とし
て約100mm程度の距離を確保しなくてはならず、
施工上の制約があると共に、かかる構造を採用し
ても室内におけるOA機器の占有空間は若干減少
するに過ぎず、オフイスワーカーに対して十分に
広い作業空間を提供するには程遠い現状である。 In view of this, a recent proposal has been to divide the area under the floor into two parts and store part of the housing of electronic equipment therein. It is used to set transceivers, modems, couplers, branch parts, telephone terminals, etc. This method mainly
Although it was designed to be compatible with LAN (Local Area Network), it was necessary to ensure a distance of approximately 100 mm under the floor.
There are construction constraints, and even if such a structure is adopted, the space occupied by OA equipment in the room will only be slightly reduced, and the current situation is far from providing a sufficiently large work space for office workers.
本考案は上記の問題点を解決するために提案さ
れたもので、その目的とするところは、OA機器
等の電子回路の一部をなす集積回路等の回路部品
や必要に応じて各種電子・電気部品を内蔵するこ
とにより、OA機器等の本体の小型化、省スペー
スを図り、室内自由空間の大幅な増加を可能にし
た床パネルを提供することにある。 The present invention was proposed to solve the above problems, and its purpose is to use circuit components such as integrated circuits that form part of electronic circuits of OA equipment, etc., and various electronic The objective of the present invention is to provide a floor panel that allows for the miniaturization and space saving of the main body of OA equipment, etc. by incorporating electrical components, and allows for a significant increase in indoor free space.
（問題点を解決するための手段）
上記問題点を解決するため、本考案は、フリー
アクセスフロア等を構成する床パネルに、各種電
子・電気機器を構成する電子回路の一部をなす集
積回路（以下、「IC」という）を内蔵したことを
特徴とする。(Means for Solving the Problems) In order to solve the above problems, the present invention provides an integrated circuit that forms part of the electronic circuits that make up various electronic and electrical devices on floor panels that make up raised floors, etc. (hereinafter referred to as "IC") is built-in.
ここで、上記各種電子・電気機器としては、コ
ンピユータやワードプロセツサ、通信機器等の各
種OA機器を予定しており、また、内蔵されるも
のとしてはIC等の回路素子ばかりでなく、これ
に加えて各種コネクタやメモリバツクアツプ用の
バツテリー、スピーカー等の電子・電気部品であ
つてもよい。 Here, the various electronic and electrical devices mentioned above are planned to include various OA devices such as computers, word processors, and communication devices, and the built-in devices include not only circuit elements such as ICs, but also In addition, it may also be electronic/electrical components such as various connectors, batteries for memory backup, and speakers.
（作用）
本考案によれば、OA機器等の電子・電気機器
を構成する電子回路の一部をなすICが床パネル
に内蔵されるため、電子・電気機器本体の小型化
が可能になる。このICと電子・電気機器本体と
の接続は、ICに付属して設けられたコネクタを
介して適宜行われる。(Function) According to the present invention, since the IC that forms part of the electronic circuit that constitutes electronic and electrical equipment such as office automation equipment is built into the floor panel, it is possible to downsize the electronic and electrical equipment itself. Connection between this IC and the main body of the electronic/electrical device is made as appropriate via a connector provided as an accessory to the IC.
また、前記ICは、例えば平板状に形成された
回路構成部に内蔵され、その表裏が絶縁パネル及
び補強用シートによつて保護されることから、絶
縁性、耐荷重性、耐震性等が確保される。 In addition, the IC is built into a circuit component formed into a flat plate shape, and the front and back sides of the IC are protected by insulation panels and reinforcing sheets, ensuring insulation, load-bearing properties, earthquake resistance, etc. be done.
（実施例） 以下、図に沿つて本考案の実施例を説明する。(Example) Embodiments of the present invention will be described below with reference to the drawings.
第１図及び第２図は本考案の第１実施例を示す
もので、これらの図において、１は床上側（室内
側）に位置する絶縁材料からなる絶縁パネルであ
り、その内部にはコンピユータや通信機器等の各
種OA機器の電子回路の一部を構成するICや個別
回路部品を備えた回路構成部２が内蔵されてい
る。ここで、回路構成部２の機能としては、例え
ばコンピユータ等の入出力インターフエイスや
ICメモリ等による外部記憶装置等が考えられる。
なお、IC等は、そのチツプを回路構成部２に内
蔵しても、あるいは回路構成部２内に実装した半
導体基板上にエツチング等の手段により直接形成
してもよい。 1 and 2 show a first embodiment of the present invention. In these figures, 1 is an insulating panel made of an insulating material located above the floor (indoor side), and a computer is installed inside the panel. A built-in circuit configuration section 2 includes ICs and individual circuit components that constitute part of the electronic circuits of various OA equipment such as office automation equipment and communication equipment. Here, the functions of the circuit component 2 include, for example, an input/output interface of a computer, etc.
An external storage device such as an IC memory or the like can be considered.
Note that the IC and the like may be built into the circuit component 2, or may be directly formed on a semiconductor substrate mounted within the circuit component 2 by means such as etching.
そして、回路構成部２を含む絶縁パネル１の下
方には、床下側に位置する金属製またはカーボン
を混入してなる補強用シート３が一体的に接合さ
れている。この補強用シート３の四辺には切欠３
ａがそれぞれ形成されていると共に、前記回路構
成部２の四辺にはコネクタ４が回路構成部２内の
IC等と電気的に接続された状態で取付けられて
おり、絶縁パネル１と補強用シート３とを一体化
した際にコネクタ４が切欠３ａ内に合致して収容
されるようになつている。 A reinforcing sheet 3 made of metal or mixed with carbon and located under the floor is integrally bonded to the lower part of the insulating panel 1 including the circuit component 2. Notches 3 are formed on the four sides of this reinforcing sheet 3.
a are formed respectively, and connectors 4 are formed on the four sides of the circuit component 2 in the circuit component 2.
It is attached in a state where it is electrically connected to an IC or the like, and when the insulating panel 1 and reinforcing sheet 3 are integrated, the connector 4 is fitted and accommodated in the notch 3a.
なお、第１図及び第２図において、５は図示さ
れていない各種OA機器本体と回路構成部２とを
接続するケーブルである。 Note that in FIGS. 1 and 2, reference numeral 5 denotes a cable that connects various OA equipment bodies (not shown) and the circuit component 2. As shown in FIG.
こうして形成された本考案にかかる床パネルＰ
は、第３図に示す如く二重床としてのフリーアク
セスフロアを構成し、この床パネルＰ上に配置さ
れた各種のOA機器１０にケーブル５により接続
される。なお、ケーブル５は例えばコネクタ４の
一部を除去することによつて形成したケーブル貫
通孔を介して床パネルＰの上下に導入すればよ
い。 Floor panel P according to the present invention formed in this way
constitutes a free access floor as a double floor as shown in FIG. 3, and is connected to various OA devices 10 arranged on this floor panel P by cables 5. Note that the cable 5 may be introduced into the upper and lower portions of the floor panel P, for example, through a cable through hole formed by removing a part of the connector 4.
次に、第４図及び第５図は本考案の第２実施例
を示している。この実施例は、絶縁パネル１′の
表面側にコネクタ４′を露出させて絶縁パネル
１′の表面側からケーブル５を装着できるように
したものである。なお、第１実施例と同様に、絶
縁パネル１′には回路構成部２が内蔵されており、
その内部のIC等はコネクタ４′に接続されている
と共に、これらに対して補強用シート３′が一体
的に固着されて床パネルが構成される。 Next, FIGS. 4 and 5 show a second embodiment of the present invention. In this embodiment, a connector 4' is exposed on the front side of the insulating panel 1' so that the cable 5 can be attached from the front side of the insulating panel 1'. Note that, as in the first embodiment, the insulating panel 1' has a built-in circuit component 2.
ICs and the like inside are connected to a connector 4', and a reinforcing sheet 3' is integrally fixed to these to form a floor panel.
この実施例にあつては、フリーアクセスフロア
の施工時にケーブル５が室内に露出することとな
るが、回路構成部２の内蔵により先の実施例と同
様にOA機器の小型化が図ることができる。 In this embodiment, the cable 5 will be exposed indoors during construction of the raised floor, but the built-in circuit component 2 allows the OA equipment to be made smaller as in the previous embodiment. .
なお、図示されていないが、回路構成部２を絶
縁パネルと補強用シートとの間に挟み込むように
構成しても、あるいは回路構成部２を補強用シー
トに内蔵して構成してもよい。このように構成し
た場合において、第１図及び第２図に示した如く
コネクタを補強用シート側に露出させて床パネル
下面からケーブルを接続することもまた可能であ
る。 Although not shown, the circuit component 2 may be sandwiched between an insulating panel and a reinforcing sheet, or the circuit component 2 may be built into the reinforcing sheet. In the case of this configuration, it is also possible to expose the connector on the reinforcing sheet side and connect the cable from the bottom surface of the floor panel as shown in FIGS. 1 and 2.
（考案の効果）
以上のように本考案によれば、OA機器等の各
種電子・電気機器を構成する電子回路の一部をな
すIC等を床パネルに内蔵したため、電子・電気
機器本体を小型化することができ、室内における
これらの占有スペースを減少させてオフイスにお
ける作業空間を大幅に拡大することができる。(Effects of the invention) As described above, according to the invention, ICs, etc. that form part of the electronic circuits that constitute various electronic and electrical equipment such as office automation equipment are built into the floor panel, making the main body of the electronic and electrical equipment smaller. It is possible to reduce the space occupied indoors and greatly expand the work space in the office.
更に、フリーアクセスフロアと併用することに
より、室内空間の一層の有効利用を図ることがで
きる等の効果がある。 Furthermore, when used in combination with a raised floor, there are effects such as more effective use of indoor space.
第１図ないし第３図は本考案の第１実施例を示
すもので、第１図は断面図、第２図は分解斜視
図、第３図は施工状態を示す断面図、第４図及び
第５図は本考案の第２実施例を示すもので、第４
図は断面図、第５図は分解斜視図である。
１，１′……絶縁パネル、２……回路構成部、
３，３′……補強用シート、３ａ……切欠、４，
４′……コネクタ、５……ケーブル、１０……
OA機器、Ｐ……床パネル。
1 to 3 show a first embodiment of the present invention, in which FIG. 1 is a sectional view, FIG. 2 is an exploded perspective view, FIG. 3 is a sectional view showing the construction state, and FIGS. FIG. 5 shows the second embodiment of the present invention.
The figure is a sectional view, and FIG. 5 is an exploded perspective view. 1, 1'...Insulation panel, 2...Circuit component,
3, 3'...Reinforcement sheet, 3a...Notch, 4,
4'...Connector, 5...Cable, 10...
OA equipment, P...floor panel.
Claims (1)
る電子回路の一部をなす集積回路を内蔵したこと
を特徴とする床パネル。 A floor panel characterized by having an integrated circuit that forms part of the electronic circuits that make up various electronic and electrical devices built into the floor panel body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12715287U JPH0513859Y2 (en) | 1987-08-21 | 1987-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12715287U JPH0513859Y2 (en) | 1987-08-21 | 1987-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6431833U JPS6431833U (en) | 1989-02-28 |
| JPH0513859Y2 true JPH0513859Y2 (en) | 1993-04-13 |
Family
ID=31379319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12715287U Expired - Lifetime JPH0513859Y2 (en) | 1987-08-21 | 1987-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513859Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008280783A (en) * | 2007-05-11 | 2008-11-20 | Takenaka Komuten Co Ltd | Power communication floor structure, and supply panel and functional module for the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5502621B2 (en) * | 2010-07-05 | 2014-05-28 | パナソニック株式会社 | Floor with contactless power supply function |
-
1987
- 1987-08-21 JP JP12715287U patent/JPH0513859Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008280783A (en) * | 2007-05-11 | 2008-11-20 | Takenaka Komuten Co Ltd | Power communication floor structure, and supply panel and functional module for the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6431833U (en) | 1989-02-28 |
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