JPH05132614A - Resin composition - Google Patents

Abstract

PURPOSE:To obtain a resin composition useful for an electric and an electronic fields, etc., having a given amount of amino group, excellent heat resistance, chemical resistance, moldability, impact strength and durability by blending a specific polyarylate with a specific amide in a specified ratio. CONSTITUTION:The objective composition which is a resin composition obtained by blending (A) 10-100 pts.wt. polyarylate such as a polyarylate having 1.5-3.0 relative viscosity, comprising bisphenol A and terephthalic acid with (B) 10-100 pts.wt. polyamide such as nylon 6 having 1.5-5.0 relative viscosity and 10-100 equivalent/10 g amino group content in a molten state wherein the amino group content in the resin composition satisfies the formula b<=3ax/4 when the amount of amino group contained in the polyamide is (a) equivalent/10<6>g, the amount of amino group contained in the resin composition is (b)equivalent/10<6>g and weight fraction of polyamide in the resin composition is (x).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition composed of polyarylate and polyamide, and more specifically, it has excellent heat resistance, chemical resistance and moldability, and mechanical properties, particularly impact strength. The present invention relates to a resin composition which can be suitably used in a wide range of fields such as electric and electronic fields, automobile fields, and mechanical fields because it is greatly improved.

[0002]

2. Description of the Related Art Polyarylate has a heat distortion temperature of 175 ° C.
Although it is as high as (18.6 kg / cm ² load) and excellent in heat resistance, it is well known that chemical resistance is not sufficient and environmental stress cracks easily occur. For example, even at room temperature, cracking occurs in a short time when contacting acetone with a strain load of only 0.3%. In addition, it cannot be said that it is excellent in moldability, and in order to mold polyarylate by an injection molding method, a temperature of 350 ° C. or higher is generally required.

However, for example, a resin composition composed of 45% by weight of polyarylate composed of bisphenol A, terephthalic acid and isophthalic acid and 55% by weight of nylon 6 exhibits excellent chemical resistance and is 5%. No crack was generated even when strained and brought into contact with acetone, and the heat distortion temperature was as high as 160 ° C. Also, according to the evaluation of the moldability by the spiral flow length, it was about 10 times better than the case of polyarylate alone. Therefore, it is used as various molded products mainly in electric and electronic fields.

However, the Izod impact strength of this resin composition is 6 kg.cm/cm. This value is not always satisfactory for engineering plastics.For example, in applications to connectors in the electrical field, there is a problem that cracks tend to occur when terminals are press-fitted, and connectors with hinges require repeated installation and removal. Therefore, there is a problem that fatigue fracture of the hinge portion is likely to occur. Further, in the application to exterior parts in the field of automobiles, there is a problem that they are easily damaged by the collision of stones.

Many attempts have been made to improve the impact strength of such a resin composition composed of polyarylate and polyamide, but in many cases, the heat resistance is lowered on the other hand,
New performance disadvantages such as a decrease in elastic modulus are caused. For example, in JP-A-54-56652, a mixture of polyarylate and polyamide with an elastomer is disclosed, and in JP-A-54-93043, a mixture of ionomer is disclosed in JP-A-59-105050. Is a blend of sulfonic acid group-containing polyethylene terephthalate. In JP-A-61-183353, α, β
-A compound containing an olefin polymer obtained by copolymerizing a glycidyl ester of an unsaturated acid is disclosed in JP-A-62-28314.
No. 6, JP-A-64-31865 and JP-A No. 1-161044 disclose an olefin polymer obtained by copolymerizing a glycidyl ester of an α, β-unsaturated acid and an α, β-unsaturated dicarboxylic acid. A compound containing an olefin polymer obtained by copolymerizing an anhydride is disclosed in JP-A-64-153.
The publications disclose blends of elastomers and epoxy functional polymers, respectively.

In each of the inventions disclosed in these publications, an olefin polymer having a low elastic modulus is blended in a resin composition, and although the impact strength is improved, the heat resistance and the mechanical strength are lowered. There is a new problem of doing. Among the mechanical strength, the elastic modulus is remarkably reduced. The decrease in mechanical strength and heat resistance markedly reduces the uses of the resin composition.

As described above, an attempt to improve the impact strength of a resin composition composed of polyarylate and polyamide without lowering the mechanical properties and heat resistance greatly expands the uses of such resin composition. Despite the strong desire, little was done, and no success.

[0008]

In view of the above circumstances, an object of the present invention is to provide a resin composition which is excellent in heat resistance, chemical resistance and moldability, and is improved in mechanical properties, particularly impact strength. It is in.

[0009]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventors have found that a polyarylate having a specific relative viscosity and a polyamide having a specific relative viscosity and an amino group content. Those obtained by melt-kneading and, in which the amount of amino groups in the resulting resin composition is reduced to a specific value or less, are excellent in heat resistance, chemical resistance and moldability, and mechanical properties, particularly impact strength, are greatly improved. As a result, they have reached the present invention.

That is, the gist of the present invention is (a) 10 to 100 parts by weight of polyarylate having a relative viscosity of 1.5 to 3.0, and (b) a relative viscosity of 1.5 to 5.0. A resin composition obtained by melt-kneading 10 to 100 parts by weight of a polyamide having a group content of 10 to 100 equivalents / 10 ⁶ g, wherein the amino group contained in the polyamide is a equivalent /
10 ⁶ g, the amino group contained in the resin composition is b equivalent / 1
0 ⁶ g, where x is the weight fraction of the polyamide in the resin composition, the content of amino groups in the resin composition satisfies the formula (1). b ≤ 3ax / 4 (1)

The present invention will be described in detail below. The polyarylate used in the present invention is obtained from a bisphenol component and an aromatic dicarboxylic acid component, and the bisphenol component constituting the polyarylate is 2,2-bis (4-hydroxyphenyl) propane (bisphenol A). , 1,1-bis (4-hydroxyphenyl) -1-phenylethane (bisphenol A
P), hydroquinone, resorcinol, 4,4′-dihydroxybiphenyl, 1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, bis (4-hydroxyphenyl) methane, bis (4
-Hydroxyphenyl) ethane, bis (3,5-dimethyl-4-hydroxyphenyl) methane, bis (3,5-
Diethyl-4-hydroxyphenyl) methane, 1,1-
Bis (3,5-dimethyl-4-hydroxyphenyl) ethane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) ethane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) ) Propane, 2,2-bis (3,5-dimethyl-4-hydroxyphenyl) propane (tetramethylbisphenol A), 1,1-bis (3,5-diethyl-4-hydroxyphenyl) propane, 2,2 -Bis (3,5-diethyl-4-hydroxyphenyl) propane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) butane, 2,2-bis (3,5-dimethyl-4-hydroxy) Phenyl) butane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) butane, 2,2-bis (3,5-diethyl-)
4-hydroxyphenyl) butane, 1,1-bis (3,3
5-dimethyl-4-hydroxyphenyl) cyclohexane, 1,1-bis (3,5-diethyl-4-hydroxyphenyl) cyclohexane, bis (3,5-dimethyl-)
4-hydroxyphenyl) phenylmethane, bis (3,3
5-diethyl-4-hydroxyphenyl) phenylmethane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) -1-phenylethane, 1,1-bis (3,3)
5-diethyl-4-hydroxyphenyl) -1-phenylethane, bis (3,5-dimethyl-4-hydroxyphenyl) diphenylmethane, bis (3,5-diethyl-
4-hydroxyphenyl) diphenylmethane, bis (4
-Hydroxyphenyl) ether, bis (3,5-dimethyl-4-hydroxyphenyl) ether, bis (3,3
5-diethyl-4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) sulfide, bis (3,5-dimethyl-4-hydroxyphenyl) sulfide, bis (3,5-diethyl-4-hydroxyphenyl) sulfide, Bis (4-hydroxyphenyl)
Sulfone, bis (3,5-dimethyl-4-hydroxyphenyl) sulfone, bis (3,5-diethyl-4-hydroxyphenyl) sulfone, bis (4-hydroxyphenyl) ketone, bis (3,5-dimethyl-4) -Hydroxyphenyl) ketone, bis (3,5-diethyl-4-hydroxyphenyl) ketone and the like. Of these, the most preferred bisphenol is bisphenol A,
Bisphenol AP and tetramethylbisphenol A. Also, the bisphenol may be 2
More than one type may be used.

Examples of the aromatic dicarboxylic acid component constituting the polyarylate include terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, 4,4'-dicarboxydiphenyl and bis (p-carboxyphenyl) alkane. Of these, terephthalic acid and isophthalic acid are most preferably used, and they may be used alone or in combination depending on the purpose. In that case, the higher the blending ratio of terephthalic acid, the higher the heat resistance of the polyarylate obtained.

The polyarylate used in the present invention may be obtained by substituting a part of the aromatic dicarboxylic acid with another dicarboxylic acid as long as the characteristics thereof are not substantially impaired. However, in that case, the content of other dicarboxylic acids is preferably 20 mol% or less based on the total dicarboxylic acids.
Examples of such a dicarboxylic acid include alicyclic or aliphatic dicarboxylic acids such as cyclohexanedicarboxylic acid, adipic acid, sebacic acid and glutaric acid, and halides thereof. Further, if necessary, a copolymer of aromatic hydroxycarboxylic acid such as p-hydroxybenzoic acid or m-hydroxybenzoic acid may be used.

The polyarylate can be produced by a melt polymerization method or an interfacial polymerization method. In the melt polymerization method, for example, an acetylated bisphenol and an aromatic dicarboxylic acid are optionally added in the presence of a catalyst such as a Lewis acid. In addition, it is produced by polymerizing under high temperature and reduced pressure. However, in this case, the resulting polymer is often colored. In the interfacial polymerization method, for example, terephthalic acid and / or isophthalic acid is dissolved as an acid halide in an organic solvent incompatible with water, bisphenols are dissolved in an alkaline aqueous solution, and these two solutions are mixed and stirred to produce polyarylate. To do. In this case, a polymer with little coloring can be obtained.

The relative viscosity of the polyarylate used in the present invention is 1.5 to 3.0. When the relative viscosity is less than 1.5, the mechanical performance of the resin composition deteriorates, and when it exceeds 3.0, the moldability of the resin composition rapidly decreases. The relative viscosity is phenol / tetrachloroethane = 60/40 (weight ratio) as a solvent,
It was determined under the conditions of a temperature of 25 ° C. and a concentration of 1 g / dl.

The polyamide used in the present invention is a polymer having an amide bond and is composed of amino acid, lactam or diamine and dicarboxylic acid. Examples of the amino acid include 6-aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, and para-aminomethylbenzoic acid. Examples of the lactam include ε-caprolactam and ω-laurolactam, and examples of the diamine include tetra. Methylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine,
2,4,4-trimethylhexamethylenediamine, 5-
Methylnonamethylenediamine, 2,4-dimethyloctamethylenediamine, metaxylylenediamine, paraxylylenediamine, 1,3-bis (aminomethyl) cyclohexane, 1-amino-3-aminomethyl-3,5,5
-Trimethylcyclohexane, 3,8-bis (aminomethyl) tricyclodecane, bis (4-aminocyclohexyl) methane, bis (3-methyl-4-aminocyclohexyl) methane, 2,2-bis (4-aminocyclohexyl) Propane, bis (aminopropyl) piperazine,
Aminoethylpiperazine and the like can be mentioned. Examples of the dicarboxylic acid include adipic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid, 2-chloroterephthalic acid, 2-methylterephthalic acid, 5-methylisophthalic acid, 5- Examples thereof include sodium sulfoisophthalic acid, hexahydroterephthalic acid, hexahydroisophthalic acid and diglycolic acid.

Polyamides used in the present invention are preferably polycaproamide (nylon 6), polytetramethylene adipamide (nylon 46), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebaca. Mido (nylon 610), polyhexamethylene dodecamide (nylon 612), polyundecamethylene adipamide (nylon 116), polyundecane amide (nylon 11), polydodecane amide (nylon 12), polytrimethylhexamethylene terephthalamide (Nylon TMDT), polyhexamethylene isophthalamide (nylon 6I), polyhexamethylene terephthal / isophthalamide (nylon 6T / 6I), polybis (4-aminocyclohexyl) methandodecamide,
(Nylon PACM12), polybis (3-methyl-4)
-Aminocyclohexyl) methandodecamide (nylon dimethyl PACM12), polymethaxylylene adipamide (nylon MXD6), polyundecamethylene terephthalamide (nylon 11T), polyundecamethylene hexahydroterephthalamide (nylon 11T)
(H)) and copolymerized polyamides and mixed polyamides thereof. Especially nylon 6 and nylon 4
6, Nylon 66 and their copolyamides, mixed polyamides are preferred.

As the polyamide, one produced by a known melt polymerization method is used. The relative viscosity of polyamide is
It is 1.5 to 5.0. When the relative viscosity is less than 1.5, the mechanical performance of the resin composition is reduced. On the contrary, when it exceeds 5.0, the moldability of the resin composition is rapidly lowered. In addition, relative viscosity uses phenol / tetrachloroethane = 60/40 (weight ratio) as a solvent and the temperature is 2
It was determined under the conditions of 5 ° C. and a concentration of 1 g / dl.

The amino group contained in the polyamide used in the present invention is 10 to 100 equivalents / 10 ⁶ g. If the amino group in the polyamide is less than 10 equivalents / 10 ⁶ g, a resin composition having a satisfactory impact strength cannot be obtained. Conversely, if the amino group exceeds 100 equivalents / 10 ⁶ g, the impact strength of the resin composition And the mechanical strength decreases. The amino group content is determined by dissolving the sample in m-cresol and titrating with p-toluenesulfonic acid by a conventional method.

A resin composition is obtained by melt-kneading 10 to 100 parts by weight of the above polyarylate and 10 to 100 parts by weight of polyamide as described below. At this time, when the polyarylate component is less than 10 parts by weight, not only the heat resistance of the resin composition is lowered, but also the impact strength, the mechanical strength at the time of absorbing water and the dimensional stability are lowered. On the other hand, when the polyarylate component exceeds 100 parts by weight, not only the chemical resistance and moldability of the resin composition decrease, but also the thermal stability and impact strength decrease. Similarly, when the amount of the polyamide component is less than 10 parts by weight, not only the chemical resistance and moldability are lowered, but also the thermal stability and the impact strength are lowered. The polyamide component is 10
If the amount exceeds 0 parts by weight, not only the heat resistance of the resin composition is lowered, but also the impact strength, the mechanical strength at the time of absorbing water and the dimensional stability are lowered.

In melt-kneading, it is possible to carry out melt-kneading using a general extruder or injection molding machine. In general, since polyarylate is amorphous and polyamide is crystalline, the temperature of melt kneading is preferably at least 50 ° C. higher than the glass transition temperature of polyarylate and at least 10 ° C. higher than the melting point of polyamide. .. When not only polyarylate but also polyamide is amorphous, it is preferable to melt-knead at a temperature at least 50 ° C. higher than any glass transition temperature.
In any case, if the temperature is 380 ° C. or higher, the resin composition may be decomposed, which is not preferable.

Further, during the melt-kneading, the amino group contained in the polyamide is a equivalent / 10 ⁶ g, the amino group contained in the resin composition is b equivalent / 10 ⁶ g, and the weight fraction of the polyamide in the resin composition is When x is set, it is necessary to perform melt-kneading until the formula (1) is satisfied. b ≤ 3ax / 4 (1)

If the amino groups are not changed by melt-kneading the polyarylate and the polyamide, the amount of amino groups contained in the resin composition should be ax equivalent / 10 ⁶ g. However, melt-kneading until the formula (1) is satisfied indicates that the amino groups contained in the polyamide are partially consumed by the melt-kneading. That is, it suggests that the amino group of the polyamide had some chemical reaction with the polyarylate during the melt-kneading. This is considered to be the reason why the impact strength of the resin composition of the present invention is excellent. This indicates that in order to improve the impact strength of the resin composition, it is necessary that the amino groups of the polyamide react with the polyarylate at a certain value or more. In fact, as will be seen in Examples and Comparative Examples described later, when the resin composition does not satisfy the formula (1), the impact strength is greatly reduced.

It is quite surprising that the resin composition satisfying the formula (1) as described above is greatly improved in impact strength without using an olefin polymer having a low elastic modulus as in the prior art. And, such a technology has never been known so far. In addition, since the olefin polymer is not added, the resulting resin composition has improved impact strength and at the same time maintains all the original mechanical properties, heat resistance, chemical resistance, and moldability.

In the present invention, it is preferable that both the polyarylate and the polyamide component are sufficiently dried to remove water before melt-kneading. Further, depending on the case, it is possible to provide a vent port on the extruder to simultaneously dehydrate during the melt-kneading. The water content is preferably 0.5% or less based on the weight of the resin composition and melt-kneaded. When melt-kneading is performed at a water content of more than 0.5%, the polyarylate or polyamide constituting the resin composition is significantly hydrolyzed, and it tends to be difficult to obtain a resin composition having satisfactory physical properties. is there.

In the present invention, pigments, heat stabilizers, antioxidants, weathering agents, flame retardants, plasticizers, mold release agents, reinforcing agents, etc. may be added as long as the characteristics of the resin composition are not significantly impaired. It is possible. Examples of the heat stabilizers and antioxidants include hindered phenols, phosphorus compounds, hindered amines, sulfur compounds, copper compounds and mixtures thereof. Among them, phosphorus compounds are most effective, and as such phosphorus compounds, phosphorous acid, phosphite ester,
Orthophosphoric acid, orthophosphate ester, etc. Also, as the reinforcing material, clay, talc, calcium carbonate, zinc carbonate,
Wollastonite, silica, alumina, magnesium oxide, calcium silicate, asbestos, sodium aluminate, calcium aluminate, sodium aluminosilicate, magnesium silicate, aluminum hydroxide, calcium hydroxide, barium sulfate, potassium alum, sodium alum , Tetsumei van, glass balloon, carbon black, zinc oxide, antimony trioxide, boric acid, borax, zinc borate, zeolite, hydrotalcite, metal fibers, metal whiskers, ceramic whiskers, potassium titanate, ticker boron, mica, Examples include graphite, glass fiber, carbon fiber and the like. These additives are generally added during melt kneading.

Further, it is possible to blend other polymers, if necessary. Such polymers include polybutadiene, butadiene-styrene copolymer, acrylic rubber, ethylene-propylene copolymer, ethylene-propylene terpolymer, natural rubber, chlorinated butyl rubber, chlorinated polyethylene, styrene-butadiene block copolymer,
Elastomers such as butadiene-styrene radial tereblock copolymer, styrene-maleic anhydride copolymer, styrene-phenylmaleimide copolymer, polyethylene, polypropylene, butadiene-acrylonitrile copolymer, polyvinyl chloride, polyethylene terephthalate, polybutylene Terephthalate, polyacetal, polyvinylidene fluoride, polysulfone, polyphenylene sulfide, polyether sulfone, phenoxy resin,
Polyphenylene ether, polymethylmethacrylate,
Examples thereof include polyether ketone, polycarbonate, polytetrafluoroethylene and the like.

The resin composition of the present invention can be made into a desired molded article by a usual molding processing method. Injection molding,
A hot melt molding method such as extrusion molding, blow molding, and sintering molding can be applied. Alternatively, a thin film can be formed from an organic solvent solution by a casting method.

The resin composition of the present invention is excellent in heat resistance, chemical resistance and moldability, and is also excellent in mechanical properties, particularly impact strength. In addition, the water absorption rate is naturally lower than that of the polyamide alone, and therefore the mechanical properties and dimensional changes due to water absorption are small. The resin composition of the present invention is applied to its excellent heat resistance, chemical resistance, moldability, mechanical properties, particularly impact strength, and is used in mechanical parts such as switches and connectors in electric and electronic fields, housings, and under parts in the automotive field. It can be suitably used for bonnet parts, exterior parts, outer plate parts, optical parts such as reflectors, and gears and bearing retainers in the mechanical field.

[0030]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited thereto.
The measurement methods and samples used in the following examples and comparative examples are as follows. The glass transition temperature and the crystal melting point were measured at a temperature rising rate of 20 ° C./min using a differential thermal analyzer.

1. Bending Strength and Flexural Modulus ASTM D79 using a 1/8 inch thick bending test piece
Bending strength and flexural modulus were measured based on 0.

2. Izod impact test An Izod impact test was performed using the above test piece. The measurement was performed based on ASTM D256.

3. Heat distortion temperature (HDT) The heat distortion temperature (HDT) was measured using the above-mentioned molded piece.
The measurement was performed based on ASTM D648. Load is 1
It was carried out at 8.6 kg / cm ² .

4. Spiral length The spiral length was measured by injection molding (using Mitsubishi Heavy Industries MST125 / 75 molding machine) using a spiral mold having a semicircular cross section with a diameter of 5 mm. The cylinder temperature of the molding machine was the same as the extruder cylinder temperature shown in Tables 1 and 3, and the mold temperature was 80 ° C. Injection pressure is 6
It was set to 00 kg / cm ² .

5. Dimensional change A square test piece having a thickness of 2 mm and a width of 50 mm was used to measure its thickness, vertical and horizontal dimensional changes, and the average value was taken as the dimensional change.

6. Water absorption rate Using the same test piece as above, it was determined from the weight change after moisture absorption treatment.

7. Retention rate of elastic modulus after water absorption treatment A 1/8 inch bending test piece obtained by injection molding was
The treatment was performed for 168 hours under the condition of 95% RH, and the above 1. The flexural modulus before and after the water absorption treatment was measured in the same manner as above to determine the retention rate of the elastic modulus.

9. Polyarylate The following four types of polyarylate were used as representative examples. (1) U-polymer (U-100 manufactured by Unitika, bisphenol A / terephthalic acid / isophthalic acid copolymer, relative viscosity 1.60, glass transition temperature 193 ° C., PAR-1) (2) Synthesized in Reference Example 1 Polyarylate (PAR-2) (3) Polyarylate synthesized in Reference Example 2 (PAR-3) (4) Polyarylate synthesized in Reference Example 3 (PAR-4)

10. Polyamide The following three types of polyamide were used as typical examples. (1) Nylon 6 (manufactured by Unitika, A1030BRL, relative viscosity 2.6, amino group amount 60 equivalents / 10 ⁶ g, melting point 22)
(0 ° C) (2) Nylon 66 (manufactured by ICI, A125, relative viscosity 2.
76, amino group amount 48 equivalent / 10 ⁶ g, 260 ° C) (3) nylon 46 (manufactured by Unitika, F5000, relative viscosity 2.80, amino group amount 34 equivalent / 10 ⁶ g, 290 ° C)

Reference Example 1 Bisphenol A in a reaction vessel equipped with a stirrer
3.0 mol and bisphenol AP 3.0 mol, sodium hydroxide 790 g, sodium hydrosulfite 1
0 g and 11.2 g of tri-n-butylbenzylammonium chloride (TBBAC) as phase transfer catalyst,
Further, 0.12 mol of p-tert-butylphenol was dissolved in water as a terminal stopper so that the total amount was 20 liters (aqueous phase). Separately terephthalic acid chloride (TP
C) 3.0 mol and isophthalic acid chloride (IPC)
3.0 mol was dissolved in dichloromethane so that the total amount was 10 liters (organic phase). The reaction vessel was kept at 20 ° C., and the organic phase was immediately added to the aqueous phase under strong stirring. After reacting for 4 hours under a nitrogen atmosphere, acetic acid was added to neutralize the aqueous phase and the stirring was stopped. The reaction solution rapidly separated into an aqueous phase and a viscous organic phase containing a polymer. The aqueous phase was removed, the organic phase was washed with a large amount of water, and then dropped into methanol to isolate the polymer. The isolated polymer solid was further washed with hot water at 80 ° C and then at 120 ° C.
It was vacuum dried for 16 hours. The relative viscosity of the obtained polyarylate (PAR-2) was 1.68. The glass transition temperature was 220 ° C.

Reference Example 2 Polyarylate was obtained in the same manner as in Example 1 except that bisphenol AP was used alone as the bisphenol.
The relative viscosity of the obtained polyarylate (PAR-3) was 1.65. The glass transition temperature was 242 ° C.

Reference Example 3 Polyarylate was obtained in the same manner as in Reference Example 1 except that bisphenol AP was used alone as the bisphenol.
The relative viscosity of the obtained polyarylate (PAR-4) was 1.70. The glass transition temperature was 239 ° C.

Examples 1 to 12 The raw materials having the formulations shown in Table 1 were vacuum dried at 100 ° C. for 16 hours, and then the screw structure was adjusted to give an average residence time of 1 minute 58 seconds (the resin composition was melt-extruded). The dye was added in a pulse from the material supply port on the way, and the time when the concentration of the dye discharged from the extruder was the maximum was taken as the average residence time), and it was melted using a twin-screw extruder (PCM45, Ikegai Tekko). The mixture was kneaded, extruded, and cut into pellets of the resin composition. In each case, good pelletization was possible. The cylinder temperature of the extruder was adjusted to the temperatures listed in Table 1. Amino group content (b value) of the obtained resin composition
Table 1 shows the results of the measurement. In all cases, the value was 3/4 or less of ax. Various pellets of the obtained resin composition were molded using an injection molding machine (Mitsubishi Heavy Industries MST125 / 75 type) to obtain various test pieces. The cylinder temperature at the time of molding was matched with that at the time of melt extrusion in Table 1. Various performance evaluations were performed using the test pieces. The results are listed in Table 2.

[0044]

[Table 1]

[0045]

[Table 2]

Comparative Examples 1 to 7 As shown in Table 3, the same composition as in Examples 1, 2 and 3 was used with an average residence time of 43 seconds and a single-screw extruder (Japan Steel Works 40 mm single-screw extruder) was used. Other than the above, Examples 1 and 2,
Melt extrusion was carried out in the same manner as in 3 to obtain pellets of the resin composition (Comparative Examples 1, 2, 3). In each case, good pelletization was possible. Amino group content of the obtained pellets (b
Values) are listed in Table 3. None of the values was less than 3/4 of ax. Various performance evaluations were performed using the obtained resin composition pellets in the same manner as in the examples. The results are listed in Table 4. For comparison, various performance evaluations were also performed on PAR-1 (Comparative Example 4), Nylon 6 (Comparative Example 5), Nylon 66 (Comparative Example 6) and Nylon 46 (Comparative Example 7) alone. The results are also shown in Table 4.

[0047]

[Table 3]

[0048]

[Table 4]

[0049]

Since the resin composition of the present invention is constituted as described above, the amino groups of the polyamide are sufficiently reacted with the polyarylate, and the resin composition has excellent impact strength. Further, the resin composition of the present invention maintains the original excellent mechanical properties, heat resistance, chemical resistance, and moldability. Therefore, the resin composition of the present invention is excellent in durability that can be used in a wide range of fields such as electric and electronic fields, automobile fields, and mechanical fields as an engineering plastic by taking advantage of the above excellent properties, and in various environments. It can be suitably used as a material.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shinichiro Katahira 23, Uji-Kozakura, Uji-shi, Kyoto Unitika Central Research Institute (72) Inventor, Megumi Ogasa 23, Uji-Kozakura, Uji-shi, Kyoto Unitika-sha Central Research Company In-house

Claims (1)

[Claims] 1. (a) 10 to 100 parts by weight of polyarylate having a relative viscosity of 1.5 to 3.0, (b) a relative viscosity of 1.5 to 5.0, and an amino group content of 10 A resin composition obtained by melt-kneading 10 to 100 parts by weight of polyamide, which is ˜100 equivalents / 10 ⁶ g, wherein the amino group contained in the polyamide is a equivalents / 10 ⁶ g, which is included in the resin composition. A resin characterized in that the content of amino groups in the resin composition satisfies formula (1), where b equivalents of amino groups are 10 ⁶ g and the weight fraction of polyamide in the resin composition is x. Composition. b ≤ 3ax / 4 (1)