JP3456501B2 - Polyamide resin composition - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyamide resin composition for molding which has excellent heat resistance, particularly rigidity retention and can be used for a member exposed to a relatively high temperature, and has good moldability.

[0002]

2. Description of the Related Art Polyamide resins represented by nylon 6 and nylon 66 are excellent in toughness, chemical resistance, electrical characteristics and the like, and are widely used as molding materials for automobile parts, machine parts, electric / electronic equipment parts, etc. It's being used. inside that,
Nylon MXD6, which uses metaxylylenediamine as the diamine component and adipic acid as the dicarboxylic acid component, has the advantages of higher strength, higher elastic modulus, and lower water absorption than conventional polyamide resins. As a result, the use of the material for electric / electronic device parts and automobile parts, which are required to be light and small, has been increasing, and the demand for the parts has been remarkably increasing in recent years.

However, although the use of Nylon MXD6 is being promoted for applications such as parts around the engine of automobiles exposed to relatively high temperatures and headlight reflectors, heat resistance, especially rigidity at high temperatures, is further enhanced. There is a need. The heat resistance, particularly the rigidity, of the polymer material tends to be greatly reduced when the glass transition point is exceeded. Therefore, a copolyamide resin having a high glass transition point aiming at maintaining rigidity at high temperature has been studied in recent years. These polyamide resins have a basic structure of the monomer composition of nylon 66 (hexamethylenediamine and adipic acid), and heat resistance by using aromatic dicarboxylic acid such as isophthalic acid or terephthalic acid as a dicarboxylic acid component in part or in whole. Has been improved (Japanese Patent Publication No. 64-11073 and Japanese Patent Publication No. 3-56576). However, since these copolyamide resins have a melting point of around 300 ° C. or higher, they are prone to thermal deterioration due to heating during molding, and there is a problem that molding is not easy.

[0004]

The present invention uses a polyamide having a high glass transition point and a melting point capable of being molded at a temperature at which thermal decomposition does not occur, whereby good heat resistance, for example, comparison is achieved. It is an object of the present invention to provide a polyamide molding material which has high rigidity and can be used as a member around an engine of an automobile exposed to an extremely high temperature, a headlight reflector, and the like, and has good moldability.

[0005]

As a result of intensive studies, the inventors of the present invention have found that a polyamide resin composition using a polyamide resin obtained from a specific monomer composition has excellent heat resistance and good moldability. The inventors have found that they have the present invention and have completed the present invention.

That is, according to the present invention, para-xylylenediamine 15-65 mol% and meta-xylylenediamine 85-85 are used.
Diamine consisting of 35 mol%, α having 6 to 12 carbon atoms,
ω-aliphatic dicarboxylic acid 45 to 80 mol% and aromatic dicarboxylic acid (wherein aromatic dicarboxylic acid is terephthalic acid 90 to 100 mol% and isophthalic acid and / or 2,6-naphthalenedicarboxylic acid 10 to A polyamide formed from 55 to 20 mol% of a dicarboxylic acid, which is an aromatic dicarboxylic acid containing 0 mol% and having a glass transition point (Tg) of 90 to 130 ° C. (363 to 403).
K), and a polyamide resin containing polyamide as a main component whose ratio between the glass transition point (Tg) and the melting point (Tm) is within the range of the formula (1) 0.707 ≦ (Tg / Tm) ≦ 0.750 ( 1) In the formula (1), Tm and Tg are absolute temperatures (K).

Also, the present invention relates to a molding polyamide resin composition having excellent heat resistance and good moldability, which is obtained by blending 100 parts by weight of the above polyamide resin with 10 to 150 parts by weight of an inorganic filler.

The diamine component of the polyamide resin used in the present invention contains para-xylylenediamine in an amount of 15 to 65 mol%,
Contains 85 to 35 mol% of metaxylylenediamine, the balance being aliphatic diamine such as tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, octamethylenediamine, nonamethylenediamine and the like, aromatic diamine such as meta Phenylenediamine, paraphenylenediamine, etc., and alicyclic diamines such as 1,3-bisaminomethylcyclohexane,
One or more of 1,4-bisaminomethylcyclohexane and the like can be appropriately selected and used.

When the content of paraxylylenediamine in the diamine component is less than 15 mol%, the crystallinity of the obtained polyamide resin is often lowered when the dicarboxylic acid component is composed of two or more kinds of monomers. However, the mechanical performance of the resin composition using the same deteriorates. Further, if an attempt is made to obtain a crystallized molded product, the moldability will be lowered, for example, the mold temperature must be increased and the mold holding time must be lengthened. Further, when the content of paraxylylenediamine in the diamine component exceeds 65 mol%, the melting point of the obtained polyamide resin approaches 300 ° C., heat deterioration due to heating during molding tends to occur, and molding becomes difficult.

The dicarboxylic acid component is an α, ω-aliphatic dicarboxylic acid having 6 to 12 carbon atoms, preferably 45 to 80 mol% adipic acid, 90 to 100 mol% terephthalic acid, and isophthalic acid and / or It contains 55 to 20 mol% of an aromatic dicarboxylic acid containing 10 to 0 mol% of 2,6-naphthalenedicarboxylic acid, and the balance is an aliphatic dicarboxylic acid,
For example, one or more of succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedioic acid, dodecanedioic acid, or an aromatic dicarboxylic acid such as 1,5-naphthalenedicarboxylic acid is desired. It may be appropriately selected according to However, when the aromatic dicarboxylic acid content in the dicarboxylic acid component is less than 20 mol%, the glass transition point of the obtained polyamide resin is low and the heat resistance becomes insufficient. If the aromatic dicarboxylic acid content in the dicarboxylic acid component exceeds 55 mol%, the polyamide resin obtained tends to have a high melt viscosity, resulting in a marked deterioration in moldability.

The glass transition point of the polyamide resin of the present invention is 90 to 130 ° C. When the glass transition point is lower than 90 ° C, the heat resistance of the obtained molded product, especially the rigidity at high temperature, is insufficient. Further, it is generally known from the following books, etc. that the relationship between the glass transition point Tg and the melting point Tm can be represented by the general formula (2).

[0012]     Tg / Tm = 1/2 to 2/3 (Tm, Tg: absolute temperature [K]) (2)

"Polymer Design of Polymers" edited by The Society of Polymer Science, Japan
(1972) p. 178, Masao Haizai "Modern Physical Chemistry Course 13, Polymer", Tokyo Kagaku Dojin (1967) page 222, Wada Hachihisa "Polymer Solid Properties", Baifukan (1971) 6)
Page 2, "Polymer Chemistry Course 14, Polymer Material Testing Method", Jichijin Shokan (1963), page 184, "Synthetic Polymer", Asakura Shoten (1970), 17
Page, Murahashi, Imoto, Tani)

From the equation (2), when a polymer material having a high glass transition point is to be obtained, the melting point also increases as the glass transition point increases. Therefore, the glass transition point is 13
When the temperature exceeds 0 ° C, the melting point of the polyamide tends to increase accordingly, and the molding temperature often becomes 300 ° C or higher during molding, which makes molding difficult. In the present invention, by using a polyamide having a value of Tg / Tm higher than the generally known value, a polyamide resin having both heat resistance and good moldability could be obtained.

A small value of Tg / Tm indicates that the glass transition point is low relative to the melting point, and a large value of A indicates that the glass transition point is low.
It shows that the glass transition point is high relative to the melting point. Tg / Tm
When the value of is less than 0.707, the melting point of the polyamide having a high glass transition point tends to be high, and accordingly, the molding temperature is also set to be high, whereby the polyamide resin is easily decomposed by heat and the moldability is improved. Getting worse. Also, Tg /
When the value of Tm exceeds 0.750, it has a low melting point relative to the glass transition point, and due to its low temperature, the heat resistance decreases.

The relative viscosity of the polyamide used here (96% sulfuric acid solution 1 g / 100 mL) is 1.5 in view of the melt viscosity during molding and the mechanical strength after molding.
It is preferably ˜4.0.

The inorganic filler to be blended when used as a molding material in the present invention is not particularly limited as long as it is generally used in this type of composition, and powdery, fibrous, granular and flake inorganic fillers are used. The thing or the thing which used these together can be used.

The powdery filler is preferably 100
It has a particle size of less than or equal to μm, more preferably less than or equal to 80 μm, and includes carbonates such as kaolinite, silica, calcium carbonate and magnesium carbonate, sulfates such as calcium sulfate and magnesium sulfate, sulfides and metal oxides. Can be used. As the fibrous filler, glass fiber, whiskers of potassium titanate or calcium sulfate, carbon fiber, alumina fiber and the like can be used. In addition, one or more kinds of additives such as flame retardants, antistatic agents, lubricants, plasticizers, stabilizers against oxidation and deterioration due to heat and ultraviolet rays, colorants and the like can be used if necessary.

The inorganic filler used in the resin composition of the present invention is blended in an amount of 10 to 150 parts by weight with respect to 100 parts by weight of the polyamide resin. When the blending ratio is less than 10 parts by weight, the strength of the obtained polyamide resin composition molded article may be insufficient. On the other hand, if the amount exceeds 150 parts by weight, the fluidity of the polyamide resin composition deteriorates, and it becomes difficult to perform melt kneading, molding and the like.

Further, the talc used in the resin composition of the present invention has a particle size of preferably 100 μm or less, more preferably 80 μm or less, and is 0.3 to 30 with respect to 100 parts by weight of the polyamide resin. It is compounded in parts by weight. If the blending ratio of talc is less than 0.3 parts by weight with respect to 100 parts by weight of the polyamide resin, the crystallization rate of the composition of the polyamide resin composition will decrease, and if an attempt is made to obtain a crystallized molded product, a mold will be used. The moldability is deteriorated because the temperature must be raised and the die holding time must be lengthened.
Further, if the mixing ratio of talc exceeds 30 parts by weight,
It is not preferable because it causes adverse effects such as deterioration of fluidity of the resin during molding and deterioration of mechanical performance of the obtained molded product.

[0021]

EXAMPLES The present invention will be described below with reference to examples, but the present invention is not limited to these examples. In the examples, "parts" represent parts by weight unless otherwise specified. The molding conditions of Examples 1 to 4 and 6 are as shown below. Cylinder temperature 280 ℃ Mold temperature 150 ℃ Injection pressure 1000kgf / cm ²

The molding conditions of Example 5 are as follows. Cylinder temperature 300 ℃ Mold temperature 150 ℃ Injection pressure 1000kgf / cm ²

The molding conditions of Comparative Example 1 are as follows. Cylinder temperature 270 ℃ Mold temperature 130 ℃ Injection pressure 1000kgf / cm ²

The molding conditions of Comparative Example 2 are as follows. Cylinder temperature 280 ℃ Mold temperature 130 ℃ Injection pressure 1000kgf / cm ²

The evaluation was carried out by the following method. (1) Transition temperature: JIS K-7121 (however, the water content of the measurement sample was 0.1% by weight or less.) (2) Bending test: ASTM D790

Example 1 A mixed dicarboxylic acid containing 70 mol% of adipic acid and 30 mol% of terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. Paraxylylenediamine (30 mol%) and metaxylylenediamine (7) were added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide A". Polyamide A has a glass transition point of 108 ° C., a melting point of 243 ° C., and a relative viscosity (96%
The sulfuric acid solution (1 g / 100 mL) was 2.09.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide A synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 280 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 1 shows the compounding composition and the evaluation result of the bending test.

Example 2 A mixed dicarboxylic acid containing 70 mol% of adipic acid and 30 mol% of terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. Paraxylylenediamine (40 mol%) and metaxylylenediamine (6) were added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide B". Polyamide B has a glass transition point of 110 ° C., a melting point of 257 ° C., and a relative viscosity (96%
The sulfuric acid solution (1 g / 100 mL) was 1.90.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide B synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 280 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 1 shows the compounding composition and the evaluation result of the bending test.

Example 3 A mixed dicarboxylic acid containing 80 mol% adipic acid and 20 mol% terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. Paraxylylenediamine (30 mol%) and metaxylylenediamine (7) were added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide C". Polyamide C had a glass transition point of 94 ° C., a melting point of 245 ° C., and a relative viscosity (96% sulfuric acid solution 1 g / 100 mL) of 2.02.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide C synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 280 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 1 shows the compounding composition and the evaluation result of the bending test.

Example 4 A mixed dicarboxylic acid containing 60 mol% of adipic acid and 40 mol% of terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. Paraxylylenediamine (30 mol%) and metaxylylenediamine (7) were added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide D". Polyamide D has a glass transition point of 117 ° C., a melting point of 256 ° C., and a relative viscosity (96%
The sulfuric acid solution (1 g / 100 mL) was 1.92.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide D synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 280 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 1 shows the compounding composition and the evaluation result of the bending test.

Example 5 A mixed dicarboxylic acid containing 50 mol% of adipic acid and 50 mol% of terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. Paraxylylenediamine (30 mol%) and metaxylylenediamine (7) were added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the dropping was completed, the reaction was continued, and when the viscosity reached a predetermined value, the product was discharged from the reaction can, cooled with water, and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide E". Polyamide E has a glass transition temperature of 125 ° C,
Melting point is 280 ° C, relative viscosity (96% sulfuric acid solution 1 g / 10
0 mL) was 1.89.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide E synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 300 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 2 shows the blended composition and the evaluation result of the bending test.

Example 6 A mixed dicarboxylic acid containing 67 mol% adipic acid, 30 mol% terephthalic acid and 3 mol% isophthalic acid was prepared.
It was heated and melted in a reaction canister in a nitrogen atmosphere. Mixed xylylenediamine containing 40 mol% of para-xylylenediamine and 60 mol% of meta-xylylenediamine was successively added dropwise to the molten dicarboxylic acid, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. . After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide F".
Polyamide F has a glass transition point of 114 ° C. and a melting point of 253.
C., relative viscosity (96% sulfuric acid solution 1 g / 100 mL) was 1.98.

4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of polyamide F synthesized under the above conditions,
Using a vented single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), the mixture was melt-kneaded at a cylinder temperature of 280 ° C., then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 2 shows the blended composition and the evaluation result of the bending test.

Comparative Example 1 4 parts of talc and 100 parts of glass fiber were mixed with 100 parts of nylon MXD6 (manufactured by Mitsubishi Gas Chemical Co., Inc., glass transition point: 82 ° C., melting point: 237 ° C.), and a vented single-screw extruder was used. Cylinder temperature of 2 using (manufactured by Nakatani Machinery Co., Ltd.)
After melt-kneading at 70 ° C., it was cooled with water and pelletized. The obtained resin composition is used to perform ASTM on an injection molding machine.
A D790 bending test test piece and a D638 tensile test test piece were molded. Table 2 shows the blended composition, the bending test, and the evaluation results of the saturated water absorption.

Comparative Example 2 Adipic acid was heated and melted in a reaction canister in a nitrogen atmosphere.
Paraxylylenediamine (3) was added to the molten dicarboxylic acid.
Mixed xylylenediamine containing 0 mol% and metaxylylenediamine of 70 mol% was successively added dropwise, and the mixture was stirred while maintaining the reaction temperature so as to always exceed the melting point of the product. After the completion of dropping, the reaction was continued with stirring until a predetermined viscosity was reached, and when the viscosity was reached, the product was discharged from the reaction can, cooled with water and pelletized. The polyamide resin thus obtained is hereinafter referred to as "polyamide G".

Polyamide G has a glass transition point of 89 ° C., a melting point of 258 ° C., and a relative viscosity (96% sulfuric acid solution 1 g / 100).
mL) was 2.08. To 100 parts of polyamide G synthesized under the above conditions, 4 parts of talc and 10 parts of glass fiber
0 parts were blended and melt-kneaded at a cylinder temperature of 280 ° C. using a vent type single-screw extruder (manufactured by Nakatani Machinery Co., Ltd.), then water-cooled and pelletized. The obtained resin composition was used to mold a test piece for ASTM D790 bending test with an injection molding machine. Table 1 shows the compounding composition and the evaluation result of the bending test.

Comparative Example 3 A mixed dicarboxylic acid containing 30 mol% of adipic acid and 70 mol% of terephthalic acid was heated and melted in a reaction vessel under a nitrogen atmosphere. 30 mol% of para-xylylenediamine and 70 mol of meta-xylylenediamine were added to the molten dicarboxylic acid.
Sequentially dropwise adding mixed xylylenediamine containing mol%,
The reaction was stirred while maintaining the reaction temperature so that it was always above the melting point of the product. However, the viscosity of the polyamide resin after the dropping was so large that the contents could not be stirred and taken out.

Compared to Comparative Examples 1 and 2, Examples 1 to 6 retained their bending strength and bending elastic modulus at 80 ° C, 100 ° C and 120 ° C.

EFFECTS OF THE INVENTION According to the present invention, good heat resistance, for example, high rigidity that can be used for a member around an automobile engine exposed to a relatively high temperature, a headlight reflector, and the like, and good molding are obtained. It has become possible to provide a polyamide-forming material having properties.

Table 1 Example 1 Example 2 Example 3 Example 4 Polyamide resin A B C D Glass transition point (° C) 108 110 110 94 117 Melting point (° C) 243 257 245 256 Tg / Tm value 0.738 0 .723 0.709 0.737 Component mixing ratio (parts by weight) Polyamide resin 100 100 100 100 100 Glass fiber 100 100 100 100 Talc 4 4 4 4 Bending strength (MPa) 20 ° C. 345 341 339 350 80 ° C. 310 296 291 326 100 ° C. 281 279 232 291 291 120 ° C. 231 243 185 268 Flexural modulus (GPa) 20 ° C. 17 17 17 17 18 80 ° C. 16 16 16 16 17 100 ° C. 15 15 12 16 16 120 ° C. 12 13 10 14

Table 2 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Polyamide Resin EF MXD6 G Glass Transition Point (° C.) 125 114 82 89 Melting Point (° C.) 280 253 237 258 Tg / Tm Value 0.720 0 .736 0.696 0.682 Component mixing ratio (parts by weight) Polyamide resin 100 100 100 100 100 Glass fiber 100 100 100 100 Talc 4 8 4 4 Bending strength (MPa) 20 ° C. 322 336 385 359 80 ° C. 309 325 288 286 100 ° C. 289 283 215 215 120 ° C. 282 255 178 171 Flexural modulus (GPa) 20 ° C. 18 17 18 18 17 80 ° C. 18 16 14 15 15 100 ° C. 17 15 10 9 9 120 ° C. 15 14 8 7

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuyoshi Watanabe 5-6-2 Higashi-Hachiman, Hiratsuka-shi, Kanagawa Mitsubishi Engineering Plastics Co., Ltd. Technology Center (56) Reference JP-A-5-305702 (JP, A) ) US Pat. No. 4983719 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) C08G 69/00-69/50

Claims (3)

(57) [Claims] 1. A diamine comprising 15 to 65 mol% of paraxylylenediamine and 85 to 35 mol% of metaxylylenediamine, 45 to 80 mol% of an α, ω-aliphatic dicarboxylic acid having 6 to 12 carbon atoms, and an aroma. Group dicarboxylic acids (where
Aromatic dicarboxylic acid is an aromatic dicarboxylic acid containing 90 to 100 mol% of terephthalic acid and 10 to 0 mol% of isophthalic acid and / or 2,6-naphthalenedicarboxylic acid) 55 to 20 mol% of dicarboxylic acid Which has a glass transition point (Tg) of 90 to 130 ° C. (363 to 403K) and a ratio of the glass transition point (Tg) to the melting point (Tm) within the range of the formula (1). A polyamide resin whose main component is a certain polyamide. 0.707 ≦ (Tg / Tm) ≦ 0.750 (1) In the formula (1), Tm and Tg are absolute temperatures (K). 2. A molding polyamide resin composition having excellent heat resistance and good moldability, comprising 100 parts by weight of the polyamide resin according to claim 1 and 10 to 150 parts by weight of an inorganic filler. 3. 100 parts by weight of the polyamide resin according to claim 1, 0.3 to 30 parts by weight of talc and 1 part of the inorganic filler.
A polyamide resin composition for molding, which comprises 0 to 150 parts by weight and has excellent heat resistance and good moldability.