JPH05129736A - Printed substrate - Google Patents

Printed substrate

Info

Publication number
JPH05129736A
JPH05129736A JP28590891A JP28590891A JPH05129736A JP H05129736 A JPH05129736 A JP H05129736A JP 28590891 A JP28590891 A JP 28590891A JP 28590891 A JP28590891 A JP 28590891A JP H05129736 A JPH05129736 A JP H05129736A
Authority
JP
Japan
Prior art keywords
insulating substrate
circuit pattern
conductor foil
cut
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28590891A
Other languages
Japanese (ja)
Inventor
Kenji Minami
賢治 南
Ryoichi Kawamura
僚一 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP28590891A priority Critical patent/JPH05129736A/en
Publication of JPH05129736A publication Critical patent/JPH05129736A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To provide the title printed substrate capable of avoiding the shortcircuit and mis-operation during the adjusting step of the characteristics of electric circuit for enhancing the quality as well as the workability, besides, reducing the packaging manhours for cutting down the cost furthermore, enabling the electric elements to be surface-packaged for making profitable in terms of practical application and mass production. CONSTITUTION:A circuit pattern 4 comprising a conductor foil 3 is provided on an insulating substrate 2. Next, resistors 5, 6 as electric elements 5, 6 are connected to the circuit pattern 4 in parallel state. Next, a cutting hole 7 located inside the cutting position of the conductor foil 3 is formed on the insulating substrate 2 opposite to the outer edge thereof so that the conductor foil 3 may be cut off togehter with the insulating substrate 2 to cut off the specific resistor 6 from the circuit pattern 4. Through these procedures, the insulating substrate 2 and the conductor foil 3 are cut off toward the hole 7 using tools etc., so as to cut off the resistor, 6 from the, circuit pattern 4.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電話装置等の各種電子
機器に用い、電気回路の特性を調整することができるプ
リント基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board which can be used in various electronic devices such as telephone devices and whose electric circuit characteristics can be adjusted.

【0002】[0002]

【従来の技術】従来、電話装置を大量生産するには、一
般的に図3に示すような構成のプリント基板が用いられ
ている。図3に示すように、プリント基板51は絶縁基
板52上に導体箔53から成る回路パターン54が設け
られ、回路パターン54に抵抗器55、56が並列状態
に接続され、抵抗器56は更にジャンパ線57により回
路パターン54に切り離し可能に接続されている。
2. Description of the Related Art Conventionally, a printed circuit board having a structure shown in FIG. 3 is generally used for mass production of telephone devices. As shown in FIG. 3, a printed circuit board 51 is provided with a circuit pattern 54 made of a conductor foil 53 on an insulating substrate 52, resistors 55 and 56 are connected in parallel to the circuit pattern 54, and the resistor 56 is further a jumper. The line 57 is detachably connected to the circuit pattern 54.

【0003】そして、ジャンパ線57をニッパ等の工具
で切断することにより、抵抗器56を回路パターン54
から切り離し、受話音量レベルを上げるように調整する
ことができる。
Then, by cutting the jumper wire 57 with a tool such as a nipper, the resistor 56 is connected to the circuit pattern 54.
It can be adjusted to increase the listening volume level.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記の
ような従来例の構成では、切断したジャンパ線57がプ
リント基板51上の電気素子、回路パターン54や電話
装置の筐体等とショートしたり、誤って他のジャンパ線
を切断してしまうおそれがあるという問題があった。ま
た、ジャンパ線57はディスクリートタイプの電気素子
を実装するため、プリント基板51上の電気素子の面実
装化を阻害すると共に、実装設備や工数がかかるという
問題もあった。
However, in the structure of the conventional example as described above, the cut jumper wire 57 is short-circuited with the electric elements on the printed circuit board 51, the circuit pattern 54, the casing of the telephone device, or the like. There was a problem that other jumper wires might be accidentally cut. Further, since the jumper wire 57 mounts a discrete type electric element, there is a problem that it hinders the surface mounting of the electric element on the printed board 51, and that mounting equipment and man-hours are required.

【0005】本発明は、このような従来の問題を解決す
るものであり、電気回路の特性を調整する際のショー
ト、誤作業を防止して品質を向上させることができると
共に、作業性を向上させることができ、また、実装設
備、実装工数を少なくしてコストを低下させることがで
き、更に、電気素子を面実装化することができて実用
上、量産上、有利となるようにしたプリント基板を提供
することを目的とするものである。
The present invention solves such a conventional problem, and can prevent a short circuit and an erroneous operation when adjusting the characteristics of an electric circuit to improve the quality and improve the workability. In addition, it is possible to reduce the cost by reducing the mounting equipment and the number of mounting steps, and further, the electric element can be surface-mounted, which is advantageous in practical use and mass production. It is intended to provide a substrate.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
の本発明の技術的手段は、絶縁基板上に設けられた導体
箔から成る回路パターンと、この回路パターンに接続さ
れた電気回路の特性を調整するための複数の電気素子
と、これらの電気素子のうち、所望の電気素子を上記回
路パターンから切り離すために上記導体箔を上記絶縁基
板と共に切断するように、上記絶縁基板にその外縁に対
し、導体箔の切断箇所の内方に位置して形成された切断
用の穴とを備えたものである。
The technical means of the present invention for achieving the above object is to provide a circuit pattern made of a conductor foil provided on an insulating substrate and characteristics of an electric circuit connected to the circuit pattern. A plurality of electric elements for adjusting the electric element, among these electric elements, so as to cut the conductor foil together with the insulating substrate to separate the desired electric element from the circuit pattern, on the outer edge of the insulating substrate. On the other hand, it is provided with a hole for cutting formed inside the cut portion of the conductor foil.

【0007】上記目的を達成するための本発明の他の技
術的手段は、絶縁基板上に設けられた導体箔から成る回
路パターンと、この回路パターンに接続された電気回路
の特性を調整するための複数の電子素子と、これらの電
気素子のうち、所望の電気素子を上記回路パターンから
切り離すために上記導体箔の一部を上記絶縁基板の一部
と共に切除するように、上記絶縁基板に形成された切除
用の溝とを備えたものである。
Another technical means of the present invention for achieving the above object is to adjust the characteristics of a circuit pattern made of a conductor foil provided on an insulating substrate and an electric circuit connected to this circuit pattern. A plurality of electronic elements, and among these electric elements, formed on the insulating substrate so as to cut off a part of the conductor foil together with a part of the insulating substrate to separate a desired electric element from the circuit pattern. And a groove for excision.

【0008】[0008]

【作用】したがって、本発明によれば、導体箔を絶縁基
板と共に工具等で切断用の穴に向かって切断し、または
導体箔の一部を絶縁基板の一部と共に切除用の溝を利用
して折り曲げるなどにより切除し、電気回路の特性を調
整するので、従来のようなジャンパ線が不要となる。こ
れに伴い、ショート、誤作業を防止することができ、ま
た、実装設備、実装工数を少なくすることができ、更
に、電気素子を面実装化することができる。
Therefore, according to the present invention, the conductor foil is cut together with the insulating substrate toward the cutting hole with a tool, or a part of the conductor foil is used together with a part of the insulating substrate in the cutting groove. Since it is cut off by bending it and the characteristics of the electric circuit are adjusted, the jumper wire as in the past is not necessary. Along with this, it is possible to prevent a short circuit and an erroneous operation, reduce the mounting equipment and the mounting man-hour, and further, surface mount the electric element.

【0009】[0009]

【実施例】(実施例1)以下、本発明の第1の実施例に
ついて図面を参照しながら説明する。
(Embodiment 1) A first embodiment of the present invention will be described below with reference to the drawings.

【0010】図1は本発明の第1の実施例におけるプリ
ント基板を示す一部拡大平面図である。
FIG. 1 is a partially enlarged plan view showing a printed circuit board according to a first embodiment of the present invention.

【0011】本実施例においては、電話装置に用い、受
話音量を調整するようにしたプリント基板について説明
する。図1に示すように、プリント基板1は絶縁基板2
上に導体箔3から成る回路パターン4が印刷により設け
られている。回路パターン4には抵抗器5、6が並列に
接続されている。抵抗器6を回路パターン4から切り離
すために導体箔3を絶縁基板2と共に切断するように、
絶縁基板2にその外縁に対し、導体箔3における切断箇
所の内方に位置して切断用の穴7が形成されている。
In the present embodiment, a printed circuit board used in a telephone device and adapted to adjust the reception volume will be described. As shown in FIG. 1, the printed circuit board 1 is an insulating substrate 2.
A circuit pattern 4 composed of a conductor foil 3 is provided on the top by printing. Resistors 5 and 6 are connected in parallel to the circuit pattern 4. In order to cut the resistor 6 from the circuit pattern 4, the conductor foil 3 is cut together with the insulating substrate 2,
A hole 7 for cutting is formed in the insulating substrate 2 at the inner side of the cut portion of the conductor foil 3 with respect to the outer edge thereof.

【0012】そして、工具等を用い、絶縁基板2および
回路パターン4を構成する導体箔3を絶縁基板2の外縁
より穴7に向かってXで示す所望の幅で切断することに
より、抵抗器6を回路パターン4から切り離す。これに
より抵抗値を小さくし、受話音量レベルを上げるように
調整することができる。
Then, by using a tool or the like, the insulating substrate 2 and the conductor foil 3 forming the circuit pattern 4 are cut from the outer edge of the insulating substrate 2 toward the hole 7 to a desired width indicated by X, whereby the resistor 6 is cut. Is separated from the circuit pattern 4. This makes it possible to reduce the resistance value and increase the reception sound volume level.

【0013】本実施例のように穴7をあらかじめ打抜き
等により長円形等に形成しておくことにより、切断箇所
を明確にすることができると共に、絶縁基板2等の切断
の際に絶縁基板2の破損を防止することができる。
By forming the hole 7 into an oval shape or the like in advance by punching or the like as in this embodiment, the cut portion can be made clear and the insulating substrate 2 or the like can be cut when the insulating substrate 2 or the like is cut. Can be prevented from being damaged.

【0014】(実施例2)以下、本発明の第2の実施例
について図面を参照しながら説明する。
(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

【0015】図2は本発明の第2の実施例におけるプリ
ント基板を示す一部拡大平面図である。
FIG. 2 is a partially enlarged plan view showing a printed circuit board according to the second embodiment of the present invention.

【0016】本実施例においても、上記第1の実施例と
同様、電話装置に用い、受話音量を調整するようにした
プリント基板について説明するが、本実施例において
は、上記第1の実施例と同一部分については同一符号を
付してその説明を省略し、異なる構成について説明す
る。
In this embodiment as well, as in the first embodiment, a printed circuit board which is used in a telephone device and which adjusts the reception sound volume will be described. In this embodiment, the first embodiment will be described. The same parts as those in FIG.

【0017】図2に示すように、抵抗器6を回路パター
ン4から切り離すために回路パターン4に接続する導体
箔3の一部が絶縁基板2の外縁に向かって突出するよう
に迂回され、この迂回部の途中で絶縁基板2の一部と共
に切除し得るように迂回部を残して切除用の溝8が切欠
かれて形成されている。
As shown in FIG. 2, a part of the conductor foil 3 connected to the circuit pattern 4 for disconnecting the resistor 6 from the circuit pattern 4 is diverted so as to project toward the outer edge of the insulating substrate 2. A groove 8 for cutting is formed by cutting out so as to leave the bypass portion so that it can be cut along with a part of the insulating substrate 2 in the middle of the bypass portion.

【0018】そして、切除用の溝8を利用して絶縁基板
2を折り曲げるなどにより絶縁基板2の切除用の溝8の
外方一部を導体箔3の迂回部と共にYで示すように切除
することにより、抵抗器6を回路パターン4から切り離
す。これにより抵抗値を小さくし、受話音量レベルを上
げるように調整することができる。
Then, the insulating substrate 2 is bent by utilizing the cutting groove 8 and the outer portion of the cutting groove 8 of the insulating substrate 2 is cut together with the bypass portion of the conductor foil 3 as indicated by Y. By doing so, the resistor 6 is separated from the circuit pattern 4. This makes it possible to reduce the resistance value and increase the reception sound volume level.

【0019】本実施例によれば、切除用の溝8により切
除箇所を明確にすることができると共に、工具等を用い
ることなく、切除して受話音量を調整することができ
る。
According to this embodiment, the excision groove 8 makes it possible to clarify the excision site, and it is possible to excise and adjust the reception volume without using a tool or the like.

【0020】[0020]

【発明の効果】以上説明したように本発明によれば、導
体箔を絶縁基板と共に工具等で切断用の穴に向かって切
断し、または導体箔の一部を絶縁基板の一部と共に切除
用の溝を利用して折り曲げるなどにより切除し、電気回
路の特性を調整するので、従来のようなジャンパ線が不
要となる。これに伴い、ショート、誤作業を防止するこ
とができ、品質を向上させることができると共に、作業
性を向上させることができる。また、実装設備、実装工
数を少なくしてコストを低下させることができる。更
に、電気素子を面実装化するようにして実用上、量産
上、有利となる。
As described above, according to the present invention, a conductor foil is cut together with an insulating substrate toward a cutting hole with a tool or a part of the conductor foil is cut together with a part of the insulating substrate. The jumper wire as in the conventional case is not necessary because the characteristics of the electric circuit are adjusted by cutting off the groove using the groove. Along with this, it is possible to prevent short-circuiting and erroneous work, improve quality, and improve workability. Further, it is possible to reduce the cost by reducing the mounting equipment and the mounting man-hours. Further, the surface mounting of the electric element is advantageous in practical use and mass production.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例におけるプリント基板を
示す一部拡大平面図
FIG. 1 is a partially enlarged plan view showing a printed circuit board according to a first embodiment of the present invention.

【図2】本発明の第2の実施例におけるプリント基板を
示す一部拡大平面図
FIG. 2 is a partially enlarged plan view showing a printed circuit board according to a second embodiment of the present invention.

【図3】従来のプリント基板を示す一部拡大斜視図FIG. 3 is a partially enlarged perspective view showing a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

1 プリント基板 2 絶縁基板 3 導体箔 4 回路パターン 5 抵抗器 6 抵抗器 7 切断用の穴 8 切除用の溝 1 Printed Circuit Board 2 Insulating Board 3 Conductor Foil 4 Circuit Pattern 5 Resistor 6 Resistor 7 Hole for Cutting 8 Groove for Cutting

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 絶縁基板上に設けられた導体箔から成る
回路パターンと、この回路パターンに接続された電気回
路の特性を調整するための複数の電気素子と、これらの
電気素子のうち、所望の電気素子を上記回路パターンか
ら切り離すために上記導体箔を上記絶縁基板と共に切断
するように、上記絶縁基板にその外縁に対し、導体箔の
切断箇所の内方に位置して形成された切断用の穴とを備
えたプリント基板。
1. A circuit pattern made of a conductor foil provided on an insulating substrate, a plurality of electric elements for adjusting characteristics of an electric circuit connected to the circuit pattern, and a desired one of these electric elements. For cutting the conductor foil with the insulating substrate so as to separate the electric element from the circuit pattern, the cutting being formed at the inner side of the cut portion of the conductor foil with respect to the outer edge of the insulating substrate. Printed circuit board with holes.
【請求項2】 絶縁基板上に設けられた導体箔から成る
回路パターンと、この回路パターンに接続された電気回
路の特性を調整するための複数の電気素子と、これらの
電気素子のうち、所望の電気素子を上記回路パターンか
ら切り離すために上記導体箔の一部を上記絶縁基板の一
部と共に切除するように、上記絶縁基板に形成された切
除用の溝とを備えたプリント基板。
2. A circuit pattern made of a conductor foil provided on an insulating substrate, a plurality of electric elements for adjusting characteristics of an electric circuit connected to the circuit pattern, and a desired one of these electric elements. A cutting groove formed in the insulating substrate so as to cut a part of the conductor foil together with a part of the insulating substrate to separate the electric element from the circuit pattern.
JP28590891A 1991-10-31 1991-10-31 Printed substrate Pending JPH05129736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28590891A JPH05129736A (en) 1991-10-31 1991-10-31 Printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28590891A JPH05129736A (en) 1991-10-31 1991-10-31 Printed substrate

Publications (1)

Publication Number Publication Date
JPH05129736A true JPH05129736A (en) 1993-05-25

Family

ID=17697579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28590891A Pending JPH05129736A (en) 1991-10-31 1991-10-31 Printed substrate

Country Status (1)

Country Link
JP (1) JPH05129736A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001091527A1 (en) * 2000-05-26 2001-11-29 Sony Corporation Flexible board and information processor
JP2010021495A (en) * 2008-07-14 2010-01-28 Nec Electronics Corp Wiring circuit board and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001091527A1 (en) * 2000-05-26 2001-11-29 Sony Corporation Flexible board and information processor
JP2010021495A (en) * 2008-07-14 2010-01-28 Nec Electronics Corp Wiring circuit board and its manufacturing method

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