JPH05125517A - Gas wiping device - Google Patents

Gas wiping device

Info

Publication number
JPH05125517A
JPH05125517A JP28601191A JP28601191A JPH05125517A JP H05125517 A JPH05125517 A JP H05125517A JP 28601191 A JP28601191 A JP 28601191A JP 28601191 A JP28601191 A JP 28601191A JP H05125517 A JPH05125517 A JP H05125517A
Authority
JP
Japan
Prior art keywords
slit nozzle
laser beam
wiping device
gas
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP28601191A
Other languages
Japanese (ja)
Inventor
Yasufumi Norimatsu
康文 則松
Shigeru Takahara
茂 高原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP28601191A priority Critical patent/JPH05125517A/en
Publication of JPH05125517A publication Critical patent/JPH05125517A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

PURPOSE:To provide a wiping device for stably controlling the film thickness on the surface of a steel sheet. CONSTITUTION:In the gas wiping device for controlling the film thickness of liquid stuck to the surface of the steel sheet by spouting high pressure squeezing gas 16 from a slit nozzle 15 extended to the width direction of the carried steel sheet, a laser beam irradiating device 21, which the laser beam irradiates from the one end of the slit nozzle 15, is arranged and a beam detecting part 26 for receiving the beam is arranged at the other end. In the slit nozzle 15, the laser beam is irradiated to observe the development of the clogged part in this slit and also, in the case the clogged part develops, the output of the laser beam is increased to melt and remove the clogged part.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は例えば製鉄機械の連続め
っきライン(CGL)及び酸洗ラインに設けられるガス
ワイピング装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas wiping device provided in, for example, a continuous plating line (CGL) and a pickling line of an iron making machine.

【0002】[0002]

【従来の技術】従来より例えば連続めっきラインに設け
られ、めっき後に表面に付着した液体の膜厚を制御する
ためにガスワイピング装置が用いられている。この従来
のガスワイピング装置の一例を図2,図3に示す。
2. Description of the Related Art Conventionally, a gas wiping device has been used, for example, which is provided in a continuous plating line and controls the film thickness of a liquid deposited on the surface after plating. An example of this conventional gas wiping device is shown in FIGS.

【0003】これらの図面に示すように、めっき金属を
含有するめっき液11を充填しためっき槽12内を通過
した鋼帯13には表面にめっき液11が付着しており、
このめっき液11の膜厚を調整制御するため、搬送され
る鋼帯13に対向するよう一対のワイピングノズル1
4,14が設けられている。このワイピングノズル14
には鋼帯の板幅方向に伸びるスリットノズル15が形成
されており、導入される絞りガス16の吹出しが板幅方
向に均一となるようにして鋼帯13表面のめっき液11
の膜厚を制御している。尚、図2中17はシンクロール
を図示する。
As shown in these drawings, the plating solution 11 adheres to the surface of a steel strip 13 which has passed through a plating tank 12 filled with a plating solution 11 containing a plating metal.
In order to adjust and control the film thickness of the plating solution 11, the pair of wiping nozzles 1 are arranged so as to face the steel strip 13 being conveyed.
4, 14 are provided. This wiping nozzle 14
Is formed with a slit nozzle 15 extending in the plate width direction of the steel strip, so that the blowing of the throttle gas 16 introduced is uniform in the plate width direction and the plating solution 11 on the surface of the steel strip 13 is formed.
The film thickness of is controlled. In addition, 17 in FIG. 2 shows a sink roll.

【0004】[0004]

【発明が解決しようとする課題】ところで、ワイピング
作業を行っていくと、絞りガス16の吹き付け等によ
り、めっき金属のスプラッシュ等がスリットノズル15
内につまりが発生することがあり、該ノズルのつまりに
よる鋼帯13の表面の絞り不良部18が発生し、製品に
バラツキが生じるという問題がある。
By the way, when the wiping operation is performed, the splash of the throttle gas 16 or the like causes the splash of the plating metal to occur in the slit nozzle 15.
There is a problem that clogging may occur inside, and a defective drawing portion 18 on the surface of the steel strip 13 due to clogging of the nozzle may occur, resulting in variations in products.

【0005】このためノズルのつまりの早期発見及び早
期除去を行うことが品質の低下、分止りの低下の防止に
つながっている。しかし、この除去作業も人手で行う場
合、液体金属のめっき槽12の近傍で行うため、非常に
危険であるという問題があり、簡易且つ安全なつまり部
の除去方法の確立が望まれている。
For this reason, early detection and early removal of nozzle clogging have led to the deterioration of quality and the prevention of partial separation. However, when this removing operation is also performed manually, it is very dangerous because it is performed in the vicinity of the liquid metal plating tank 12, and it is desired to establish a simple and safe method for removing the clogged portion.

【0006】[0006]

【課題を解決するための手段】前記目的を達成する本発
明に係るガスワイピング装置の構成は、搬送される鋼板
の板幅方向に伸びるスリットノズルから高圧ガスを噴出
し、該鋼板表面に付着した液体の膜厚を制御するガスワ
イピング装置であって、上記スリットノズルの一端から
スリットノズル内にレーザビームを出射する発光部を設
けると共に他端に該光を受光する受光部を設けてなるこ
とを特徴とする。
The structure of the gas wiping device according to the present invention which achieves the above object is such that a high pressure gas is ejected from a slit nozzle extending in the plate width direction of a conveyed steel plate and adhered to the surface of the steel plate. A gas wiping device for controlling the film thickness of a liquid, comprising a light emitting section for emitting a laser beam from one end of the slit nozzle into the slit nozzle and a light receiving section for receiving the light at the other end. Characterize.

【0007】[0007]

【作用】スリットノズルの長手方向を見通して、発光部
より受光部へ、光を放射する。スリットノズルの一部に
つまりがある場合、放射した光はつまり部で反射・吸収
・散乱されるため受光部に届く光量は減少する。これに
より、スリットノズルのつまり部の発生を検出する。上
記つまり部の除去手段として、高エネルギー密度を有す
るレーザ照射装置を用い、つまり部を直ちに溶融除去で
きるため、ラインを停止する必要がなくなり、ラインの
稼働率が向上する。また、危険な溶融金属槽近傍での従
来のつまり部の除去作業が不要となるため、作業員の安
全作業性が高まる。
The light is emitted from the light emitting portion to the light receiving portion while looking in the longitudinal direction of the slit nozzle. When a part of the slit nozzle is clogged, the emitted light is reflected, absorbed and scattered by the clogged part, so that the amount of light reaching the light receiving part is reduced. As a result, the occurrence of clogging of the slit nozzle is detected. A laser irradiation device having a high energy density is used as the means for removing the clogging portion, and the clogging portion can be immediately melted and removed. Therefore, it is not necessary to stop the line, and the operation rate of the line is improved. Further, since the conventional work of removing the clogging part in the vicinity of the dangerous molten metal tank is unnecessary, the safety workability of the worker is enhanced.

【0008】[0008]

【実施例】以下、本発明の好適な一実施例を図面を参照
して説明する。図1は本実施例に係るガスワイピング装
置の概略図である。尚、前述した図2,図3に示す装置
の部材と同一の部材には同符号を付して重複した説明は
省略する。図1に示すように、ガスワイピング装置のワ
イピングノズル14のスリットノズル15の一端には発
光部としてのレーザビーム照射装置21が設けられてい
る。ここで該レーザビーム照射装置21はレーザ光発生
装置22と、ここで発生したレーザビームを伝搬させる
光路23と、スリットノズル15内を見通すように設置
された出力部24と、レーザビームの出力部24からの
出射方向を可変自在とするスキャンニング装置25とか
ら構成されている。また、一方該スリットノズル15の
他端には出力部24から出射されたレーザビームを受光
する受光部としての光検出部26が設けられていると共
に、光検出部26とスリットノズル15との間には駆動
装置27により光路を開閉自在とするシャッタ板28が
設置されている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic diagram of a gas wiping device according to this embodiment. The same members as the members of the apparatus shown in FIGS. 2 and 3 described above are designated by the same reference numerals, and a duplicate description will be omitted. As shown in FIG. 1, a laser beam irradiation device 21 as a light emitting unit is provided at one end of the slit nozzle 15 of the wiping nozzle 14 of the gas wiping device. Here, the laser beam irradiation device 21 includes a laser beam generator 22, an optical path 23 for propagating the laser beam generated here, an output part 24 installed so as to see through the slit nozzle 15, and a laser beam output part. The scanning device 25 is configured to change the emission direction from the scanning device 24. On the other hand, at the other end of the slit nozzle 15, there is provided a photodetection section 26 as a photodetection section for receiving the laser beam emitted from the output section 24, and between the photodetection section 26 and the slit nozzle 15. A shutter plate 28 that opens and closes the optical path by a driving device 27 is installed in the.

【0009】上記構成において、通常のガスワイピング
装置にはレーザ光発生装置21のレーザ出力は小出力で
運転されている。スリットノズル15内に異常が無けれ
ば、光路23を通って出力部24より出力されたレーザ
ビームはスリットノズル15内を通過して光検出部26
に入り、その光検出量はほぼ一定である。そして、スリ
ットノズル15内につまり部が発生した場合には、レー
ザビームは該つまり部によって反射・散乱され、光検出
部26に入る光量が減少することにより、つまり部の発
生が検出される。このつまり部の発生が検出されると、
直ちに、該つまり部の除去作業に入る。先ず、光検出部
26の保護のためシャッタ板28が駆動装置によって光
路を閉鎖する。次いでレーザ光発生装置22のレーザ出
力を増加する。この結果、つまり部に高出力のレーザビ
ームが照射され該つまり部が溶融する。ワイピングノズ
ル14には常に絞りガス16が導入しているので、溶融
液化したつまり部は吹飛されて除去される。この際、ス
キャンニング装置25を作動させ、レーザビームをスキ
ャンニングすることにより周辺部の清掃が効果的になさ
れる。
In the above structure, the laser output of the laser light generator 21 is operated at a small output in a normal gas wiping device. If there is no abnormality in the slit nozzle 15, the laser beam output from the output unit 24 through the optical path 23 passes through the slit nozzle 15 and passes through the light detection unit 26.
And the amount of light detected is almost constant. When a clogged portion is generated in the slit nozzle 15, the laser beam is reflected / scattered by the clogged portion, and the amount of light entering the photodetection unit 26 is reduced, so that the occurrence of the clogged portion is detected. When the occurrence of this block is detected,
Immediately, the work for removing the block is started. First, the shutter plate 28 closes the optical path by the driving device in order to protect the light detection unit 26. Next, the laser output of the laser light generator 22 is increased. As a result, the clogged portion is irradiated with a high-power laser beam, and the clogged portion is melted. Since the throttle gas 16 is constantly introduced into the wiping nozzle 14, the molten and clogged portion is blown away and removed. At this time, the scanning device 25 is operated to scan the laser beam, thereby effectively cleaning the peripheral portion.

【0010】このようにして、スリットノズル15内に
つまりが発生した際には、直ちにつまり部が検出・溶融
除去されるので、ガスワイピングむらによる製品の品質
性の低下が大幅に軽減される。また、従来のつまり除去
作業に伴う溶融金属槽の近傍での作業が不要になるた
め、作業員の安全が確保され、安全性の向上が図れる。
In this manner, when the slit nozzle 15 is clogged, the clogged portion is immediately detected and melted and removed, so that the deterioration of the quality of the product due to the gas wiping unevenness is greatly reduced. Further, the work in the vicinity of the molten metal tank, which is required in the conventional clogging work, becomes unnecessary, so that the safety of the worker is secured and the safety can be improved.

【0011】尚、本実施例においては発光部としてつま
り部検出の光出射手段と、つまり部除去の溶融手段とを
レーザビーム照射装置を用いて兼用したがこれらを別々
に設けるようにして検出精度を向上させるようにしても
よい。
In the present embodiment, the light emitting portion was used as the light emitting means for detecting the portion and the melting means for removing the portion using the laser beam irradiating device. May be improved.

【0012】[0012]

【発明の効果】以上実施例と共に述べたように、本発明
に係るガスワイピング装置は、スリットノズル内をレー
ザ光を用いて常時監視すると共に、該ノズル内につまり
部が発生した際にはレーザ光の出力を増加させて該つま
り部を除去することができるので、例えば連続のめっき
ラインや酸性ラインにおいて常に安定したガスワイピン
グを行うことができ、品質の向上を図ることができる。
また、従来のように作業員の手作業によるつまり部除去
作業を不要とし、作業員の安全性も大幅に向上という効
果を奏する。
As described above in connection with the embodiments, the gas wiping device according to the present invention constantly monitors the inside of the slit nozzle by using laser light, and when the clogged portion occurs in the nozzle, the laser is wiped. Since the light output can be increased and the clogged portion can be removed, for example, stable gas wiping can be always performed in a continuous plating line or an acid line, and quality can be improved.
Further, unlike the conventional case, it is not necessary to manually remove the clogging part by the worker, and the safety of the worker is significantly improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本実施例に係るガスワイピング装置の概略図で
ある。
FIG. 1 is a schematic view of a gas wiping device according to this embodiment.

【図2】従来のワイピング装置の断面概略図である。FIG. 2 is a schematic sectional view of a conventional wiping device.

【図3】従来のワイピング装置の不具合を示す概略図で
ある。
FIG. 3 is a schematic view showing a defect of a conventional wiping device.

【符号の説明】[Explanation of symbols]

11 めっき液 12 めっき槽 13 鋼帯 14 ワイピングノズル 15 スリットノズル 16 絞りガス 17 シンクロール 18 絞り不良部 21 レーザビーム照射装置 22 レーザ光発生装置 23 光路 24 出力部 25 スキャンニング装置 26 光検出部 27 駆動装置 28 シャッタ板 11 Plating Solution 12 Plating Tank 13 Steel Strip 14 Wiping Nozzle 15 Slit Nozzle 16 Diaphragm Gas 17 Syncroll 18 Poor Drawing Part 21 Laser Beam Irradiator 22 Laser Light Generator 23 Optical Path 24 Output 25 Scanning Device 26 Photodetector 27 Drive Device 28 Shutter plate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 搬送される鋼板の板幅方向に伸びるスリ
ットノズルから高圧ガスを噴出し、該鋼板表面に付着し
た液体の膜厚を制御するガスワイピング装置であって、 上記スリットノズルの一端からスリットノズル内にレー
ザビームを出射する発光部を設けると共に他端に該光を
受光する受光部を設けてなることを特徴とするガスワイ
ピング装置。
1. A gas wiping device for ejecting a high-pressure gas from a slit nozzle extending in the plate width direction of a conveyed steel plate to control the film thickness of a liquid adhering to the surface of the steel plate, wherein one end of the slit nozzle is provided. A gas wiping device, characterized in that a light emitting part for emitting a laser beam is provided in the slit nozzle, and a light receiving part for receiving the light is provided at the other end.
JP28601191A 1991-10-31 1991-10-31 Gas wiping device Withdrawn JPH05125517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28601191A JPH05125517A (en) 1991-10-31 1991-10-31 Gas wiping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28601191A JPH05125517A (en) 1991-10-31 1991-10-31 Gas wiping device

Publications (1)

Publication Number Publication Date
JPH05125517A true JPH05125517A (en) 1993-05-21

Family

ID=17698841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28601191A Withdrawn JPH05125517A (en) 1991-10-31 1991-10-31 Gas wiping device

Country Status (1)

Country Link
JP (1) JPH05125517A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106480392A (en) * 2015-08-31 2017-03-08 鞍钢股份有限公司 Method for adjusting position of strip steel continuous hot galvanizing air knife frame
WO2018079087A1 (en) * 2016-10-24 2018-05-03 Jfeスチール株式会社 Gas wiping device and method for manufacturing molten metal plated steel strip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106480392A (en) * 2015-08-31 2017-03-08 鞍钢股份有限公司 Method for adjusting position of strip steel continuous hot galvanizing air knife frame
WO2018079087A1 (en) * 2016-10-24 2018-05-03 Jfeスチール株式会社 Gas wiping device and method for manufacturing molten metal plated steel strip

Similar Documents

Publication Publication Date Title
US20030197909A1 (en) Method and apparatus for preventing debris contamination of optical elements used for imaging
KR101666093B1 (en) Cutting device
KR970005634A (en) A color filter manufacturing method and apparatus, and a color filter, a color filter substrate, a display device, and a display device
JP2008173600A (en) Inspection apparatus for droplet ejection head and droplet ejection apparatus
US6073369A (en) Substrate drying apparatus and method
EP3808461B1 (en) Machine for automatically sorting or inspecting moving objects, provided with a device for cleaning
EP2692532B1 (en) Inkjet printing device and method for cleaning nozzle thereof
JPWO2004062868A1 (en) Scribing device, scribing method and automatic cutting line for brittle material substrate
JP2014113597A (en) Laser processing device
JPH05125517A (en) Gas wiping device
JP2001314986A (en) Laser beam cutting method
JP2001138082A (en) Method and device for controlling laser beam cutting
JP2001033466A (en) Device and method for measuring plate-passing speed of hot-rolled steel plate
Jovic et al. Laser welding with side-gas application and its impact on spatter formation and weld seam shape
JP3905732B2 (en) Laser processing head, laser cutting apparatus and laser cutting method using the same
US3532262A (en) Drag-soldering method and machine
US5837329A (en) Method for machining rollers and other objects using laser light and equipment for machining
JP2976672B2 (en) Edge crack and perforation detection device
JPH07112296A (en) Laser beam machining device
JPH0655283A (en) Laser beam machine
KR20190077730A (en) Method and apparatus for refining magnetic domains grain-oriented electrical steel
US6793314B2 (en) Cleaning ink jet print heads using ultra-violet and green Nd-YAG lasers
JP2005334924A (en) Device for detecting stain on mirror or lens in optical path system in laser beam machine
KR20200036328A (en) Apparatus for keeping head gap of laser welder
JPH06297180A (en) Excimer laser beam processing method, excimer laser beam machine for executing this processing method, nozzle sheet formed by this processing machine and ink jet recording head having this nozzle sheet

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990107