JPH05123782A - Fixing structure and fixing method for optical semiconductor element - Google Patents

Abstract

PURPOSE:To provide the fixing structure for an optical semiconductor element having high reliability by using press-fitting force and fixing by caulking in combination to fix the optical semiconductor element to an element holder. CONSTITUTION:The element holder 5 is cylindrical and a press-fitting part 6 to be press fitted with the header part 3 of the optical semiconductor element 1 is provided within this element holder 5. A groove part 7 is provided on the outer peripheral surface of the element holder 5 along the circumferential direction. This groove part 7 is provided in the same position as the surface facing the aperture of the element holder 5 of the header 3 press-fitted into the press-fitting part 6. The aperture part side of the element holder 5 is caulked to the inner side from this groove part 7, by which a caulking part 8 is formed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fixing structure for an optical semiconductor element in an optical semiconductor coupler and a fixing method thereof.

[0002]

2. Description of the Related Art FIG. 5 is a side sectional view showing a conventional fixing structure of an optical semiconductor element in an optical semiconductor coupler. In the figure, 12 is an optical semiconductor element, and 13 is an element holder for holding this optical semiconductor element.

Reference numeral 14 is a lens holder, 15 is a condenser lens held by the lens holder 14, and 16 is a lens holder 1.
4 is an optical fiber held by the optical fiber 4 and these components constitute an optical semiconductor coupler 17. This optical semiconductor coupler 1
In FIG. 7, the optical semiconductor element 12, the condenser lens 15 and the optical fiber 16 are respectively held by the element holder 13 and the lens holder 14 so that their optical axes coincide with each other.

Here, the element holder 1 of the optical semiconductor element 12
The conventional fixing method to 3 is performed by press-fitting the optical semiconductor element 12 into the element holder 13.

[0005]

However, in the above-described conventional method for fixing an optical semiconductor element, since the holding strength of the optical semiconductor element by the element holder depends only on the pressure input, the optical semiconductor element can be attached to the element holder. It cannot be said that it is securely fixed, and long-term reliability is not sufficiently obtained, and there was a problem that the lower the pressure input in the manufacturing process, the more easily the characteristic variation occurs.

The present invention has been made in order to solve such a problem, and an optical semiconductor element having high reliability can be obtained without depending on the holding strength of the optical semiconductor element by the element holder only by the pressure input. An object is to provide a fixing structure and a fixing method.

[0007]

In order to achieve this object, the present invention provides an optical semiconductor element having a disk-shaped header portion, a cylindrical element holder for holding the optical semiconductor element, and this element holder. The press-fitting portion provided inside and having an inner diameter slightly smaller than the outer diameter of the header portion, and a press-fitting portion having a depth slightly deeper than the thickness of the header portion, and the header portion of the optical semiconductor element press-fitted into the press-fitting portion, A groove provided along the circumferential direction on the outer peripheral surface of the element holder at the same position as the surface facing the opening side of the element holder for press-fitting the optical semiconductor element into the press-fitting portion, and an opening from the groove of the element holder. It has a caulking part formed by caulking the part side inward.

The caulking portion is a caulking die processed into a mortar shape with respect to the element holder in which the optical semiconductor element is press-fitted in the press-fitting portion, and the opening of the element holder for press-fitting the optical semiconductor element in the press-fitting portion. It is formed by making uniform contact with the part, further pressing the caulking die in the axial direction of the element holder, and caulking the opening side of the groove of the element holder inward at once.

[0009]

According to the present invention having the above-mentioned structure, after the optical semiconductor element is press-fitted into the press-fitting portion of the element holder, the opening side of the element holder is caulked inward to form the caulking portion. As a result, the optical semiconductor element is fixed to the element holder by caulking in addition to press-fitting, so that it is securely fixed in all directions.

[0010]

Embodiments will be described below with reference to the drawings. 1 is a side sectional view showing a fixing structure of an optical semiconductor element according to an embodiment of the present invention, FIG. 2 is an explanatory view of an element holder of the present embodiment, FIG. 2 (a) is a sectional perspective view, and FIG. b) is a side sectional view.

In the figure, reference numeral 1 is an optical semiconductor element, and element 2
A disk-shaped header portion 3 to which the elements are fixed, a cap portion 4 for covering the element 2 having a smaller diameter than the header portion 3, and the like. Reference numeral 5 is a cylindrical element holder, 6 is a press-fitting portion provided in the element holder 5, and the inner diameter of the press-fitting portion 6 is processed to be slightly smaller than the outer diameter of the header portion 3 of the optical semiconductor element 1. Has been done.

The inner diameter of the optical semiconductor element 1 in the insertion direction from the press-fitting portion 6 in the element holder 5 is smaller than the inner diameter of the press-fitting portion 6 and the cap portion 4 of the optical semiconductor element 1 can be inserted without difficulty. Is becoming The depth of the press-fitting portion 6 is slightly deeper (about 0.5 mm to 1 mm in the present embodiment) than the thickness of the header portion 3 of the optical semiconductor element 1, and the header portion 3 of the optical semiconductor element 1 is placed in the element holder 5. When the press-fitting portion 6 is press-fitted, the caulking margin is left on the opening side of the element holder 5 for press-fitting the optical semiconductor element 1 into the press-fitting portion 6.

Reference numeral 7 denotes a groove portion provided along the circumferential direction on the outer peripheral surface portion of the press-fitting portion 6 of the element holder 5. The groove portion 7 connects the header portion 3 of the optical semiconductor element 1 to the press-fitting portion 6 of the element holder 5.
It is provided at the same position as the surface of the header portion 3 facing the opening side of the element holder 5 when press-fitted into. As a result, the caulking margin is closer to the opening than the groove 7 of the element holder 5.

In this embodiment, the press-fitting portion 6 of the element holder 5 has a thickness of about 0.5 mm, and the depth of the groove 7 is about half the thickness of the press-fitting portion 6. When a pushing force is applied to the holder 5 in the axial direction, the stress is concentrated in the groove portion 7 in the element holder 5. Reference numeral 8 is a caulking portion, and the caulking portion 8 is formed by caulking the opening side from the groove portion 7 of the element holder 5 which remains as a caulking margin.

FIG. 3 is a side sectional view showing a method of caulking and fixing an optical semiconductor element to an element holder in the present embodiment, and FIG. 4 is a sectional perspective view of an essential part of FIG. In FIG. 3, 9 is a caulking jig, which is provided with a mechanism for setting the element holder 5 described above. Reference numeral 10 denotes a caulking die provided so as to face the caulking jig 9, and when the element holder 5 is set on the caulking jig 9, the portion of the caulking die 10 facing the opening of the element holder 5 has this opening. Caulking part Caulking part 8
To form a mortar. The caulking die 10 is supported by a post protruding from the side of the caulking jig 9 via a spring, and the caulking die 10 moves up and down with respect to the caulking jig 9.

Reference numeral 11 denotes the caulking die 1 by a hydraulic press or the like.
The pressing means of 0, the pressing means 11 by this hydraulic press or the like
Is to press the caulking die 10 toward the caulking jig 9 with a predetermined pressure. The operation of caulking and fixing according to the present invention will be described below with reference to FIGS. 3 and 4. First, an element holder 5 in which the optical semiconductor element 1 is press-fitted in a pre-process (not shown)
Is set on the caulking jig 9 so that the opening of the element holder 5 for press-fitting the optical semiconductor element 1 into the press-fitting portion 6 serving as the caulking portion 8 faces the mortar-shaped portion of the caulking die 10. This state is shown in FIGS. 3 (a) and 4 (a).

By pressing the caulking die 10 toward the caulking jig 9 with a predetermined pressure by pressing means 11 such as a hydraulic press, the mortar-shaped portion of the caulking die 10 is pressed into the press-fitting portion 6.
The optical semiconductor element 1 is pressed uniformly into the opening of the element holder 5, and the caulking die 10 is pressed by pressing means 11 such as a hydraulic press to open the opening in the element holder 5.
By axially pressing, stress concentrates on the groove portion 7 which is the weakest portion of the element holder 5, and the portion left from the groove portion 7 of the element holder 5 on the opening side as the caulking margin is caulked inside. The part 8 is formed.

The state after the caulking portion 8 is formed is shown in FIGS. 3B and 4B, and the caulking portion 8 is an opening portion of the element holder 5 for press-fitting the optical semiconductor element 1. Since the groove 7 is caulked inward, the optical semiconductor element 1
Is securely fixed so as not to move toward the opening of the element holder 5. The optical semiconductor element 1 is fixed so as not to move inward from the press-fitting portion 6 by making the diameter inside the press-fitting portion 6 in the element holder 5 smaller than the diameter of the press-fitting portion 6.

Furthermore, since the header portion 3 is press-fitted into the press-fitting portion 6 of the element holder 5, the optical semiconductor element 1 is reliably positioned and fixed in the radial direction. In this way, by fixing the optical semiconductor element 1 to the element holder 5 by crimping in addition to the pressure input, the optical semiconductor element 1 is highly reliable in all directions with respect to the element holder 5. Since a fixed state can be obtained, it is suitable as a fixing means for the optical semiconductor element 1 and the element holder 5 in the optical semiconductor coupler. Further, since the optical semiconductor element can be reliably and reliably fixed to the element holder by the configuration and method described above, it is not necessary to fix the optical semiconductor element to the element holder by soldering or welding. There is no need to worry about heat applied to semiconductor elements.

[0020]

As described above, according to the present invention, an optical semiconductor element having a disk-shaped header portion, a cylindrical element holder for holding the optical semiconductor element, and an optical semiconductor element provided in the element holder are provided. A press-fitting portion having an inner diameter slightly smaller than the outer diameter of the header portion and a depth slightly deeper than the thickness of the header portion, and an optical semiconductor in the press-fitting portion of the header portion of the optical semiconductor element press-fitted into the press-fitting portion. It has a groove portion provided along the circumferential direction on the outer peripheral surface of the element holder at the same position as the surface facing the opening side of the element holder for press-fitting the element,
For the element holder in which the optical semiconductor element is press-fitted in the press-fitting part,
The caulking die processed into a mortar shape is evenly contacted with the opening of the element holder for press-fitting the optical semiconductor element into the press-fitting portion, and the caulking die is further pressed in the axial direction of the element holder,
The element holder is formed such that the opening side of the element holder is swaged inward at once to form a swaged portion.

Therefore, the optical semiconductor element is securely fixed in all directions by the pressure input and the caulking fixing to the element holder, so that an optical coupler having high reliability can be provided for a long period of time. Further, when forming the caulked portion, since the groove portion is provided on the outer peripheral surface of the element holder, the stress due to the pressing means such as the hydraulic press for caulking and fixing is concentrated in the groove portion, so that the optical semiconductor element, etc. Since the stress applied to the area is minimized and the caulking portion is formed by bending the groove portion, the adhesiveness between the optical semiconductor element and the element holder can be increased.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a fixing structure of an optical semiconductor device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an element holder according to this embodiment.

FIG. 3 is a side sectional view showing a method of caulking and fixing an optical semiconductor element to an element holder in this embodiment.

4 is a cross-sectional perspective view of a main part of FIG.

FIG. 5 is a side sectional view showing a conventional fixing structure of an optical semiconductor device in an optical semiconductor coupler.

[Explanation of symbols]

 1 Optical semiconductor element 3 Header section 5 Element holder 6 Press-fitting section 7 Groove section 8 Caulking section

Claims (2)

[Claims] 1. An optical semiconductor element having a disk-shaped header portion, a cylindrical element holder for holding the optical semiconductor element, and a small diameter smaller than the outer diameter of the header portion provided in the element holder. A press-fitting portion having an inner diameter and a depth slightly deeper than the thickness of the header portion, and an opening of an element holder for press-fitting the optical semiconductor element into the press-fitting portion of the header portion of the optical semiconductor element press-fitted into the press-fitting portion. A groove provided along the circumferential direction on the outer peripheral surface of the element holder at the same position as the surface facing the side, and a caulking portion formed by caulking the opening side inward from the groove of the element holder. A fixed structure for an optical semiconductor element, comprising: 2. An optical semiconductor element having a disk-shaped header portion, a cylindrical element holder for holding the optical semiconductor element, and a small diameter smaller than the outer diameter of the header portion provided in the element holder. A press-fitting portion having an inner diameter and a depth slightly deeper than the thickness of the header portion, and an opening of an element holder for press-fitting the optical semiconductor element into the press-fitting portion of the header portion of the optical semiconductor element press-fitted into the press-fitting portion. A groove portion provided along the circumferential direction on the outer peripheral surface of the element holder at the same position as the surface toward the section side, the optical semiconductor element to the element holder press-fitted into the press-fitting portion,
The caulking die processed into a mortar shape is evenly contacted with the opening of the element holder for press-fitting the optical semiconductor element into the press-fitting portion, and the caulking die is further pressed in the axial direction of the element holder,
A method of fixing an optical semiconductor element, characterized in that the opening side of the element holder is swaged inward at once.