JPH05121787A - Brightness correction method of led array print head - Google Patents
Brightness correction method of led array print headInfo
- Publication number
- JPH05121787A JPH05121787A JP27956491A JP27956491A JPH05121787A JP H05121787 A JPH05121787 A JP H05121787A JP 27956491 A JP27956491 A JP 27956491A JP 27956491 A JP27956491 A JP 27956491A JP H05121787 A JPH05121787 A JP H05121787A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- emitting semiconductor
- brightness
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子写真式プリンタ等
における光源として使用されるＬＥＤアレイプリントヘ
ッドにおいて、発光用半導体チップの表面に複数個形成
した各発光素子部における輝度のバラ付きを修正する方
法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention corrects a variation in brightness in each light emitting element portion formed on the surface of a light emitting semiconductor chip in an LED array print head used as a light source in an electrophotographic printer or the like. It is about how to do.
【０００２】[0002]
【従来の技術】従来、この種のＬＥＤアレイプリントヘ
ッドは、例えば、特開平３−３４４７５号公報等に記載
されているように、基板１の上面に、上面に発光素子部
を一列状に形成した発光用半導体チップの複数個を一列
状に並べて搭載すると共に、該各発光用半導体チップの
各々に対する複数個の駆動用ＩＣを、前記各発光用半導
体チップの箇所ごとに搭載し、更に、前記基板の上面に
は、前記各駆動用ＩＣに対する配線回路パターンを形成
する一方、前記各発光用半導体チップの各々における発
光素子部と前記各駆動用ＩＣとの間を、細い金属線にて
接続する一方、前記各駆動用ＩＣと前記配線回路パター
ンとの間を、細い金属線にて接続し、更に、前記各発光
用半導体チップの表面を、透光性の樹脂コートにて被覆
すると言う構成にしている。2. Description of the Related Art Conventionally, in this type of LED array print head, as described in, for example, JP-A-3-34475, light emitting element portions are formed in a line on the upper surface of a substrate 1. A plurality of the light emitting semiconductor chips are mounted side by side in a line, and a plurality of driving ICs for each of the light emitting semiconductor chips are mounted at each of the light emitting semiconductor chips, and further, A wiring circuit pattern for each of the driving ICs is formed on the upper surface of the substrate, and the light emitting element section of each of the light emitting semiconductor chips and each of the driving ICs are connected by a thin metal wire. On the other hand, a structure in which each of the driving ICs and the wiring circuit pattern is connected by a thin metal wire, and the surface of each of the light emitting semiconductor chips is further covered with a light-transmissive resin coat To have.
【０００３】ところで、このＬＥＤアレイプリントヘッ
ドに使用する発光用半導体チップの各発光素子部におけ
る輝度には、当該各発光素子部を前記半導体チップの上
面に形成するときの過程の状態において、元々バラ付き
が存在するものであり、また、この発光素子部を披露す
る樹脂コートの膜厚さに厚い薄いによってもバラ付きが
存在するものである。By the way, the brightness of each light emitting element portion of the light emitting semiconductor chip used in this LED array print head is originally different in the process of forming each light emitting element portion on the upper surface of the semiconductor chip. There are variations, and there are variations depending on the thickness of the resin coat showing the light emitting element portion.
【０００４】[0004]
【発明が解決しようとする課題】そこで、従来は、ＬＥ
Ｄアレイプリントヘッドの製造した後において、その各
発光用半導体チップにおける各発光素子部の各々におけ
る輝度を測定し、輝度が所定の値から外れている発光素
子部を有する発光用半導体チップは、これを基板から取
り外し、当該箇所に、別の発光用半導体チップを取付け
ると言うように、発光用半導体チップを、取付け替えす
るようにしているから、これに多大の手数を必要とし
て、製造コストが大幅にアップすると言う問題があっ
た。Therefore, in the past, LE has been used.
After manufacturing the D array printhead, the brightness of each light emitting element section in each light emitting semiconductor chip is measured, and a light emitting semiconductor chip having a light emitting element section whose brightness deviates from a predetermined value is Is removed from the substrate, and another light emitting semiconductor chip is attached to the location, so that the light emitting semiconductor chip is reattached, which requires a great deal of work, which significantly increases the manufacturing cost. There was a problem saying that it would be uploaded to.
【０００５】本発明は、ＬＥＤアレイプリントヘッドに
おいて問題となるのは、その各発光素子部における輝度
が、或る特定の発光素子部において低くなることである
（各発光素子部における輝度が或る特定の発光素子部に
おいて低くなると、ＬＥＤアレイプリントヘッドによる
写真印字に印字むらが発生する）一方、前記各発光素子
部における輝度は、当該発光素子部を被覆する透光性樹
脂コートにおける膜厚さに比例して高くすることができ
る点に着目し、このことを利用して、各発光素子部にお
ける輝度のバラ付きを、前記各発光用半導体チップの交
換することなく、修正できるようにした方法を提供する
ことを技術的課題とするものである。The problem of the present invention in the LED array print head is that the luminance of each light emitting element portion becomes low in a certain specific light emitting element portion (there is a certain luminance in each light emitting element portion). When the specific light emitting element portion is lowered, print unevenness occurs in photographic printing by the LED array print head. On the other hand, the brightness of each light emitting element portion is the film thickness of the translucent resin coat covering the light emitting element portion. Focusing on the fact that it can be raised in proportion to the above, by utilizing this, it is possible to correct the variation in luminance in each light emitting element section without replacing the light emitting semiconductor chips. It is a technical task to provide
【０００６】[0006]
【課題を解決するための手段】この技術的課題を達成す
るため本発明は、上面に複数個の発光素子部を形成した
発光用半導体チップの複数個を一列状を搭載し、該各発
光用半導体チップに、透光性の樹脂コートを、当該各発
光用半導体チップを被覆するように形成して成るＬＥＤ
アレイプリントヘッドにおいて、前記各発光用半導体チ
ップの各発光素子部における各々の輝度を測定する一
方、前記樹脂コートの表面には、前記各発光用半導体チ
ップの各発光素子部のうち輝度が低い発光素子部の箇所
に、透光性の樹脂を部分的に塗着することにした。In order to achieve this technical object, the present invention mounts a plurality of light emitting semiconductor chips each having a plurality of light emitting element portions formed on the upper surface thereof in a line, An LED in which a light-transmitting resin coat is formed on a semiconductor chip so as to cover each of the light-emitting semiconductor chips.
In the array printhead, the brightness of each light emitting element section of each light emitting semiconductor chip is measured, while the light emission of the light emitting element section of each light emitting semiconductor chip having a low brightness is formed on the surface of the resin coat. A transparent resin is partially applied to the element portion.
【０００７】[0007]
【作 用】各発光用半導体チップに対する樹脂コート
の表面うち各発光素子部の箇所に、透光性の樹脂を部分
的に塗着すると、この部分的に塗着した透光性樹脂が、
いわゆるレンズの働きをして、発光素子部における輝度
を高めることができる。そこで、前記のように、各発光
用半導体チップの各発光素子部における各々の輝度を測
定する一方、前記樹脂コートの表面には、前記各発光用
半導体チップの各発光素子部のうち輝度が低い発光素子
部の箇所に、透光性の樹脂を部分的に塗着することによ
り、各発光用半導体チップの各発光素子部における輝度
のバラ付きが小さくなるように修正することができるか
ら、前記従来のように、発光用半導体チップの取付け替
えを行うことを必要としないのであり、換言すると、発
光用半導体チップの取付け替えを行うことなく、各発光
素子部における輝度のバラ付きを小さくするように修正
することができるのである。[Operation] When a light-transmissive resin is partially applied to the part of each light-emitting element part on the surface of the resin coat for each light-emitting semiconductor chip, this partially applied light-transmissive resin becomes
By acting as a so-called lens, the brightness in the light emitting element portion can be increased. Therefore, as described above, the luminance of each light emitting element portion of each light emitting semiconductor chip is measured, while the luminance of each light emitting element portion of each light emitting semiconductor chip is low on the surface of the resin coat. By partially applying a translucent resin to the location of the light emitting element portion, it is possible to correct so that the variation in luminance in each light emitting element portion of each light emitting semiconductor chip can be corrected. Since it is not necessary to replace the light emitting semiconductor chip as in the conventional case, in other words, it is possible to reduce the variation in brightness in each light emitting element section without replacing the light emitting semiconductor chip. Can be modified to.
【０００８】[0008]
【発明の効果】従って、本発明によると、各発光素子部
における輝度のバラ付きを小さくする修正が、至極簡単
にできて、これに要するコストを大幅に低減できる効果
を有する。Therefore, according to the present invention, there is an effect that the correction for reducing the variation in the brightness in each light emitting element portion can be made extremely simple and the cost required therefor can be greatly reduced.
【０００９】[0009]
【実施例】以下、本発明の実施例を図面について説明す
る。図において符号Ａは、ＬＥＤアレイプリントヘッド
を示し、このＬＥＤアレイプリントヘッドＡは、基板１
の上面に、上面に複数個の発光素子部２ａを一列状に形
成した発光用半導体チップ２の複数個を一列状に並べて
搭載すると共に、該各発光用半導体チップ２の各々に対
する複数個の駆動用ＩＣ３を、前記各発光用半導体チッ
プ２の箇所ごとに搭載し、更に、前記基板１の上面に
は、前記各駆動用ＩＣ３に対する配線回路パターン４を
形成する一方、前記各発光用半導体チップ２の各々にお
ける発光素子部２ａと前記各駆動用ＩＣ３との間を、細
い金属線５によるワイヤーボンディングにて接続する一
方、前記各駆動用ＩＣと前記配線回路パターン４との間
を、細い金属線６によるワイヤーボンディングにて接続
し、更に、前記各発光用半導体チップ２、各駆動ＩＣ
３、及びこれらの相互間を接続する各金属線５，６の部
分を、シリコン樹脂等のように透光性を有する樹脂コー
ト７にて被覆すると言う構成になっている。Embodiments of the present invention will now be described with reference to the drawings. In the figure, reference numeral A indicates an LED array print head, which is the substrate 1
A plurality of light emitting semiconductor chips 2 each having a plurality of light emitting element portions 2a formed in a line on the upper surface thereof are mounted side by side in a row, and a plurality of driving for each light emitting semiconductor chip 2 is performed. ICs 3 are mounted on the respective light emitting semiconductor chips 2 at respective locations, and a wiring circuit pattern 4 for the respective driving ICs 3 is formed on the upper surface of the substrate 1, while the respective light emitting semiconductor chips 2 are formed. Each of the light emitting element portions 2a and each of the driving ICs 3 is connected by wire bonding with a thin metal wire 5, and each of the driving ICs and the wiring circuit pattern 4 is connected with a thin metal wire. 6 by wire bonding, and further, each of the light emitting semiconductor chips 2 and each driving IC
3 and the portions of the metal wires 5 and 6 that connect them to each other are covered with a resin coat 7 having a light-transmitting property such as silicon resin.
【００１０】そして、前記ＬＥＤアレイプリントヘッド
Ａにおける各発光用半導体チップ２の各発光素子部２ａ
における輝度を、各発光素子部２ａの各々について測定
して、この測定の結果、輝度が低い発光素子部２ａの箇
所には、これに被覆する樹脂コート７の表面に、図３及
び図４に二点鎖線で示すように、同じくシリコン樹脂等
のように透光性を有する樹脂８を、ノズル（図示せず）
の滴下等によって、部分的に塗着するのである。Then, each light emitting element portion 2a of each light emitting semiconductor chip 2 in the LED array print head A is
Is measured for each of the light emitting element portions 2a, and as a result of the measurement, the light emitting element portion 2a having a low luminance has the resin coating 7 on the surface thereof, as shown in FIGS. As indicated by the chain double-dashed line, a resin 8 having a light-transmitting property, such as a silicone resin, is also used for the nozzle (not shown).
It is partially applied by, for example, dropping.
【００１１】すると、このように部分的に塗着した樹脂
８が、いわゆるレンズの働きをして、当該樹脂８に対応
する発光素子部２ａにおける輝度を高くすることができ
るから、各発光用半導体チップ２の各発光素子部２ａに
おける輝度のバラ付きを小さくするように修正すること
ができるのである。なお、前記各発光用半導体チップ
２、各駆動ＩＣ３、及びこれらの相互間を接続する各金
属線５，６の部分を、シリコン樹脂等のように透光性を
有する樹脂コート７にて被覆するに際しては、前記ＬＥ
ＤアレイプリントヘッドＡを、矢印で示すように、その
長手方向に沿って適宜速度で移送する途中において、当
該ＬＥＤアレイプリントヘッドＡにおいて各発光用半導
体チップ２と各駆動用ＩＣ３との間における各金属線５
の部分に、第１ノズルＢから樹脂液を散布すると共に、
前記ＬＥＤアレイプリントヘッドＡにおいて各駆動用Ｉ
Ｃ３と配線回路パターン４との間における各金属線６の
部分に、第２ノズルＣから樹脂液を散布するのであり
（なお、ＬＥＤアレイプリントヘッドＡを移動すること
なく、両ノズルＢ，Ｃを、ＬＥＤアレイプリントヘッド
Ａの長手方向に沿って移動するようにしても良い）、こ
の場合、本発明者達の実験によると、第１ノズルＢから
散布する樹脂液として、例えば、東レ・ダウコーニング
・シリコーン株式会社から商品名「半導体表面保護コー
ティング材、ＪＣＲ６１６２」として販売されているよ
うに、シリコン樹脂を主成分とする一液性の加熱硬化型
樹脂液を使用し、この樹脂液を、その２５℃における粘
度を１５〜５０ｃｐ（特に、好ましくは、２０ｃｐ）に
した状態で散布することにより、前記樹脂コート７のう
ち発光用半導体チップ２における発光素子部２ａを被覆
する部分の膜厚さを、各発光素子部２ａの各々について
略等しくすることができるのであった。Then, the resin 8 thus partially coated functions as a so-called lens to increase the brightness in the light emitting element portion 2a corresponding to the resin 8, and thus each light emitting semiconductor. This can be corrected so as to reduce the variation in brightness in each light emitting element portion 2a of the chip 2. The light emitting semiconductor chips 2, the driving ICs 3, and the metal wires 5 and 6 connecting these to each other are covered with a resin coat 7 having a light-transmitting property such as silicon resin. In the case of LE
While the D array print head A is being transported at an appropriate speed along the longitudinal direction as indicated by the arrow, each of the LED array print heads A between each light emitting semiconductor chip 2 and each driving IC 3 is moved. Metal wire 5
While spraying the resin liquid from the first nozzle B to the part of
Each driving I in the LED array print head A
The resin liquid is sprayed from the second nozzle C to the portion of each metal line 6 between C3 and the wiring circuit pattern 4 (both nozzles B and C are moved without moving the LED array print head A). , May be moved along the longitudinal direction of the LED array print head A). In this case, according to the experiments by the present inventors, the resin liquid sprayed from the first nozzle B is, for example, Toray Dow Corning. -As sold under the trade name "Semiconductor surface protection coating material, JCR6162" by Silicone Co., Ltd., a one-component thermosetting resin liquid containing silicon resin as a main component is used, and this resin liquid is By spraying in a state where the viscosity at 25 ° C. is 15 to 50 cp (particularly preferably 20 cp), the semiconductor chip for light emission of the resin coat 7 is dispersed. The film thickness of the portion covering the light emitting element portion 2a of 2 was be able to substantially equal for each of the light emitting element portion 2a.
【図１】ＬＥＤアレイプリントヘッドの斜視図である。FIG. 1 is a perspective view of an LED array printhead.
【図２】図１のII−II視断面図であり、樹脂コートを施
していない状態を示す。FIG. 2 is a sectional view taken along line II-II of FIG. 1, showing a state where no resin coat is applied.
【図３】図２の要部拡大図であり、樹脂コートを施した
後の状態を示す。FIG. 3 is an enlarged view of a main part of FIG. 2, showing a state after applying a resin coat.
【図４】図３のIV−IV視断面図である。4 is a sectional view taken along line IV-IV in FIG.
Ａ ＬＥＤアレイプリントヘッド １ 基板 ２ 発光用半導体チップ ２ａ 発光素子部 ３ 駆動用ＩＣ ４ 配線回路パターン ５ 発光用半導体チップと駆動用ＩＣとを
接続する金属線 ６ 駆動用ＩＣと配線回路パターンとを接
続する金属線 ７ 樹脂コート ８ 部分的に塗着する樹脂 Ｂ 第１ノズル Ｃ 第２ノズルA LED array print head 1 substrate 2 light emitting semiconductor chip 2a light emitting element section 3 driving IC 4 wiring circuit pattern 5 metal wire connecting the light emitting semiconductor chip and driving IC 6 connecting the driving IC and wiring circuit pattern Metal wire 7 Resin coat 8 Partially applied resin B 1st nozzle C 2nd nozzle
Claims (1)
用半導体チップの複数個を一列状を搭載し、該各発光用
半導体チップに、透光性の樹脂コートを、当該各発光用
半導体チップを被覆するように形成して成るＬＥＤアレ
イプリントヘッドにおいて、前記各発光用半導体チップ
の各発光素子部における各々の輝度を測定する一方、前
記樹脂コートの表面には、前記各発光用半導体チップの
各発光素子部のうち輝度が低い発光素子部の箇所に、透
光性の樹脂を部分的に塗着することを特徴とするＬＥＤ
アレイプリントヘッドの輝度修正方法。1. A plurality of light emitting semiconductor chips each having a plurality of light emitting element portions formed on an upper surface thereof are mounted in a line, and each of the light emitting semiconductor chips is provided with a light-transmitting resin coat. In an LED array printhead formed so as to cover a semiconductor chip, the brightness of each light emitting element portion of each light emitting semiconductor chip is measured, while each light emitting semiconductor is formed on the surface of the resin coat. An LED characterized in that a light-transmissive resin is partially applied to a portion of each light-emitting element portion of the chip having a low brightness.
Brightness correction method for array print head.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27956491A JP3197303B2 (en) | 1991-10-25 | 1991-10-25 | LED array printhead brightness correction method |
| US07/959,652 US5475417A (en) | 1991-10-25 | 1992-10-13 | LED array printhead and method of adjusting light luminance of same |
| GB9221764A GB2262069B (en) | 1991-10-25 | 1992-10-16 | LED array printhead and method of making the same |
| DE19924235167 DE4235167C2 (en) | 1991-10-25 | 1992-10-19 | Printhead with LED arrangement and method for its production |
| KR1019920019671A KR100230756B1 (en) | 1991-10-25 | 1992-10-24 | Led array print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27956491A JP3197303B2 (en) | 1991-10-25 | 1991-10-25 | LED array printhead brightness correction method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05121787A true JPH05121787A (en) | 1993-05-18 |
| JP3197303B2 JP3197303B2 (en) | 2001-08-13 |
Family
ID=17612736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27956491A Expired - Fee Related JP3197303B2 (en) | 1991-10-25 | 1991-10-25 | LED array printhead brightness correction method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3197303B2 (en) |
-
1991
- 1991-10-25 JP JP27956491A patent/JP3197303B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3197303B2 (en) | 2001-08-13 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |