JPH0512136U - Thermal head - Google Patents

Abstract

(57) [Summary] [Object] To provide a high-quality thermal head with good printing by improving the alignment accuracy of the heat sink and the thermal substrate having the heating resistor array. [Structure] Positioning marks, for example, marking lines 6 and 7 of a thermal substrate 5 are formed on a heat radiating plate 4 in advance so that the heating resistor array 1 is aligned with the outer periphery of a platen roller via a printing paper. It is characterized by

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a thermal head used in facsimiles, video printers and the like.

[0002]

[Prior Art]

 Conventionally, in the thermal head, strict accuracy is required for setting the position of the heating resistor array, which is the operation output part.

The reason will be described below. When the thermal head is installed inside the equipment to perform printing, it is necessary to maintain an appropriate positional relationship with the platen roller and the mechanical parts that play an important role together. Specifically, the center of the heating resistor array and the outer periphery of the platen roller must be in contact with each other during driving.

Here, if the platen roller and the thermal head are in contact with each other at a position where the platen roller and the thermal head are in contact with each other at a position where the platen roller and the thermal head are out of contact with each other, the pressure of the platen roller is lowered, resulting in poor thermal efficiency. The print density becomes low.

In some cases, printing becomes impossible, and since there is no escape area for heat, the temperature of the resistor gradually rises, which may eventually destroy the thermal head itself.

In order to prevent such a defect, first, it is necessary to accurately determine the position of the heating resistor array in the thermal head itself.

FIG. 3 is a plan view of a conventional thermal head.

As a conventional method of aligning the heat generating resistor array 1, that is, the substrate 2, one end A of the thermal substrate 2 is aligned with one end B of the heat dissipation plate 3 as shown in FIG. Alternatively, a method of attaching the PWB substrate (fixing with screws) and then aligning it with one end of the PWB substrate is also conceivable.

[0009]

[Problems to be solved by the device]

 However, none of the above-mentioned methods prioritizes the alignment of the heating resistor array 1 at the center, and therefore, the accuracy of the surface is deteriorated due to the dimensional variations of the thermal substrate 2 and the heat sink 3, patterning misalignment at the photo process, and the like. Was not guaranteed.

Therefore, an object of the present invention is to provide a high-precision thermal head in which the heating resistor array exactly matches the outer circumference of the platen roller via the printing paper.

[0011]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention comprises a heat sink and a thermal substrate having a heat generating resistor array arranged on the heat sink, and the heat generating resistor array is provided on the heat sink through a printing paper. It is characterized in that the alignment mark of the thermal substrate is formed in advance so as to coincide with the outer periphery of the platen roller.

[0012]

[Action]

 A heat radiating plate and a thermal substrate having a heat generating resistor array arranged on the heat radiating plate, wherein the heat radiating plate is aligned with the outer periphery of the platen roller via the printing paper. Since the alignment mark of the thermal board is formed in advance, the thermal board having the heat dissipation plate and the heating resistor array can be accurately aligned in a short time. As a result, the heat of the heating resistor array is efficiently transferred and good printing can be performed.

[0013]

【Example】

 An embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a plan view of a heat dissipation plate for a thermal head according to this embodiment, and FIG. 2 is a plan view of a thermal head according to this embodiment.

In the thermal head of this embodiment, as shown in FIG. 1, scribing lines 6 and 7 are formed in advance on the heat dissipation plate 4 as alignment marks for disposing a thermal substrate 5 to be described later. The scribing lines 6 and 7 are formed so that the heating resistor array 1 described later is aligned with the outer periphery of the platen roller via a printing paper (not shown).

As shown in FIG. 1, the scribing lines 6 and 7 are distributed from the center of the heat dissipation plate 4, and two scribing lines 6 and 7 are arranged in the sub-scanning direction in accordance with the length of a thermal substrate 5 (6 in the figure). A total of four (2 in the figure) 2 in the main scanning direction from the both ends of the heat dissipation plate 4 along the line where the heating resistor array 1 is arranged.

The thermal board 5 is attached to the heat dissipation plate 4 as described above. At that time, the marking lines 6 described above extend along the left and right ends of the thermal board 5, and the marking lines 7 generate heat. The thermal substrate 5 is aligned so as to be on the extension line of the antibody array 1.

As described above, according to this embodiment, the heating resistor array 1 is aligned with the marking line 7, so that the alignment of the heating resistor array 1 can be performed accurately and in a short time. As a result, it is possible to provide a higher quality thermal head with improved workability and good printing.

In this embodiment, the marking line is formed on the heat sink as the alignment mark. However, the marking line is not limited to this, and a marking line may be provided, for example.

[0020]

[Effect of the device]

 As described above, according to the present invention, the thermal substrate having the heating resistor array and the heat-dissipating plate can be accurately aligned in a short time, workability can be improved, and high-quality thermal printing with good printing can be performed. A head can be provided.

[Brief description of drawings]

FIG. 1 is a plan view of a heat dissipation plate for a thermal head according to an embodiment of the present invention.

FIG. 2 is a plan view of a thermal head according to an embodiment of the present invention.

FIG. 3 is a plan view of a thermal head according to a conventional example.

[Explanation of symbols]

 1 Heat generating resistor array 4 Heat sink 5 Thermal board 6, 7 Scribing line (alignment mark)

Claims (1)

[Scope of utility model registration request] 1. A heat radiating plate and a thermal substrate having a heat generating resistor array arranged on the heat radiating plate, wherein the heat radiating resistor array is aligned with the outer periphery of a platen roller via printing paper. So that the alignment mark of the thermal substrate is formed in advance.