JPH0511017A - Temperature characteristic testing device - Google Patents

Abstract

PURPOSE:To reduce the size of a temperature characteristic testing device and to highly accurately adjust the temperature of an object to be measured in a short time by injecting a specific heat medium controlled to a prescribed temperature into a measuring chamber and dipping the object to be measured in the medium. CONSTITUTION:A fluorine-containing inert liquid 8 of a prescribed temperature (e.g. 200 deg.C or-100 deg.C) is injected into a measuring chamber 1 from a supply pipe 6 and circulated through a discharge pipe 7 while the chamber 1 is filled with the liquid 8 to some extent. A semiconductor device 2 is carried into the chamber 1 while the device 2 is attracted to the handier 3 by suction with its terminals upward and dipped in the liquid 8. Since the device 2 is preheated or precooled to a certain temperature in a preheating/precooling chamber, the device 2 can reach the temperature of the liquid 8 in a short time. The liquid 8 is a highly volatile insulator and the occurrence of imperfect insulation is prevented by maintaining a space section above the liquid 8 in the chamber 1. Since the liquid 8 can be controlled in temperature within a range of, for example, + or -1 deg.C, characteristic tests can be performed under a highly accurate temperature condition.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature characteristic test apparatus for conducting a temperature test in an electric characteristic test process for semiconductor devices and the like.

In recent years, for example, as semiconductor devices have been highly integrated and highly densified, high reliability has been demanded, and it is required to perform various conditions for conducting an electrical characteristic test with high accuracy. Therefore, it is necessary to carry out the temperature condition applied to the semiconductor device within an extremely small error range.

[0003]

2. Description of the Related Art Conventionally, for example, an electrical characteristic test of a semiconductor device or the like is performed by an LSI test system at a normal temperature, a high temperature or a low temperature.

FIG. 3 shows a partial configuration diagram of a conventional test apparatus. In the test apparatus of FIG. 3, the semiconductor device 50 before the test
Is heated and cooled in the preliminary chamber 51. For example, when heating to a high temperature (90 ° C. to 100 ° C.) in the preliminary chamber 51, the semiconductor device 50 is placed on the preheated stainless steel heat plate 52 or the like for preheating.

The semiconductor device 5 preheated in the preliminary chamber 51.
0 is held by the vacuum suction of the handler 53 or the like and is transferred into the measurement chamber 54, and the contact portion 55 having the terminals matched with each other.
It is placed on and placed in electrical contact. The characteristics are measured by connecting to the contact portion 55 and the outdoor tester 56. In this case, warm air at a predetermined temperature (for example, 200 ° C. or −100 ° C.) or cold air such as N ₂ gas is supplied into the measurement chamber 54 from the blower 57 to bring the semiconductor device 50 to a desired set temperature. Raise or lower. Although not shown, the set temperature is adjusted by a temperature sensor such as a thermistor in the measuring unit 54 and a temperature detector such as a diode of the contact unit 55.

Then, the semiconductor device 50 whose measurement has been completed
Is again conveyed to the room temperature chamber 58 by the handler 53, and is forcibly returned to room temperature by the cooling plate 59 (or the heat plate 52).

[0007]

However, in the above-mentioned test apparatus, the temperature inside the measuring chamber 54 is raised or lowered to the set value temperature by blowing by the blow portion 57, so that the temperature is preliminarily set in the preliminary chamber 51. However, there is a problem that it takes a long time and a highly accurate temperature setting cannot be guaranteed.

Further, when the semiconductor device becomes large and the package shape becomes large, there is a problem that the capacity of the auxiliary chamber 51 must be increased and the handler 53 to be transferred must also be increased in size.

Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a temperature characteristic testing apparatus which is miniaturized and which adjusts the temperature of an object to be measured such as a semiconductor device with high accuracy in a short time. To aim.

[0010]

The above object is to provide a temperature characteristic test apparatus for testing the temperature characteristic of an object to be measured at a predetermined temperature, the measuring means being provided to perform the temperature characteristic test of the object to be measured. Of the measurement chamber, a transport unit for transporting the measurement object to the measurement chamber, and an insulating heat medium into which the measurement object is immersed at a predetermined temperature in a predetermined amount and in which the measurement object is immersed. The problem can be solved by using a fluorine-based inert liquid as the heat medium.

[0011]

As described above, the object to be measured is immersed in a heating medium such as a fluorine-based inert liquid. In this case, the heat medium is heated or cooled to a predetermined temperature state in advance to bring the object to be measured to the same temperature. Therefore, it becomes possible to heat and cool the object to be measured to a predetermined temperature in a short time. Further, since the temperature of the object to be measured depends on the heat medium, the temperature of the heat medium can be adjusted with high accuracy, and reliable temperature guarantee at the time of test becomes possible. Further, even if the object to be measured is increased in size, it is not necessary to expand the area for preheating and cooling, and the device can be downsized.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a block diagram of an embodiment of the present invention.
FIG. 1 shows a part of the temperature characteristic test apparatus,
The DUT will be described as a semiconductor device, for example.

In FIG. 1, a handler 3 for carrying a semiconductor device 2 is provided in the measuring chamber 1. In addition, measurement room 1
A contact part 4 is provided on the upper surface of the and is electrically connected to an external tester 5. The contact portion 4 and the tester 5 constitute a measuring means.

A supply pipe 6 and a discharge pipe 7 are formed in the measuring chamber 1. Then, a predetermined amount of a heat medium 8 of, for example, a fluorine-based inert liquid at a predetermined temperature is injected into the measurement chamber 1 from the supply pipe 6. This fluorine-based inert liquid is an insulator, is a highly volatile liquid, and has a large heat transfer coefficient.

First, a heating medium (fluorine-based inert liquid) 8 of, for example, 200 ° C. (or −100 ° C.) is injected from the supply pipe 6 into the measuring chamber 1, and is discharged while maintaining a certain amount of filling. It is circulated through the pipe 7. A semiconductor device 2 whose terminals are attracted upward by a handler 3 in the measurement chamber 1.
Is transported and immersed in the heat medium 8. Although not shown, the semiconductor device 2 is kept at a certain temperature in the preheating / cooling chamber. As a result, the semiconductor device 2 is in a temperature state (200 ° C. or −100) equivalent to that of the heating medium 8 in a short time.
℃).

Then, the terminals of the semiconductor device 2 are brought into contact with the contact portions 4, and the electrical temperature characteristics are measured by the tester 4. In this case, even if the heat medium 8 is a highly volatile insulating material, the space above the measuring chamber 1 is used to prevent the occurrence of insulation failure. After the measurement, although not shown, the semiconductor device 2 is brought to a room temperature state and the test is completed.

The temperature of the heat medium 8 can be easily controlled, for example, the temperature can be controlled within a range of ± 1 ° C.,
It can be tested under highly accurate temperature conditions. Further, the measurement at an extremely low temperature of −40 ° C. or lower, which has been difficult in the past, can be similarly performed. Further, even if the semiconductor device 2 is a large package, it is not necessary to increase the equipment (capacity) for heating and cooling, and the device can be downsized.

Next, FIG. 2 shows a block diagram of an application example of the present invention. FIG. 2 shows a characteristic test system, in which a plurality of (six chambers in FIG. 2) measurement chambers 1 and first and second liquid tanks 1 are provided.
0a, 10b, and the first and second heat exchangers 11a,
11b.

For example, the first liquid tank 10a is filled with a heat medium 8 of a fluorine-based inert liquid at 200 ° C., the temperature of which is adjusted, and the second liquid tank 10b is filled with the same heat of -100 ° C. The medium 8 is temperature-controlled and filled. Then, it is injected into each measurement chamber 1 from the supply pipe 6 via the supply pipe 12 via the exchanger 13. In addition, the discharge pipe 7 of the measurement chamber 1
The first and second heat exchangers 1 through the discharge pipe 14
1a, 11b, and the first and second liquid tanks 10a, 10
It is circulated in b. That is, the heat medium 8 having a desired temperature is injected into the measurement chamber 1 by the exchanger 13 and an appropriate test is performed.

If the exchanger 13 is replaced with a mixer,
The heating medium 8 at a desired set temperature can be obtained by appropriately mixing the heating medium 8 at high temperature and the heating medium at low temperature, and the test can be performed with a wide temperature range and a highly accurate temperature error.

In the above embodiments, the object to be measured is shown as a semiconductor device, but the present invention is not limited to this, and can be applied to all devices that require an electrical temperature characteristic test.

[0022]

As described above, according to the present invention, it is possible to downsize the device by injecting the heat medium into the measuring chamber at a predetermined temperature and immersing the object to be measured in the heat medium. In addition, the test can be performed by adjusting the temperature of the measured object with high accuracy in a short time.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of an application example of the present invention.

FIG. 3 is a partial configuration diagram of a conventional test apparatus.

[Explanation of symbols]

1 measurement room 2 Semiconductor device 3 handlers 4 Contact section 5 tester 8 heat medium

Claims (2)

[Claims] 1. A temperature characteristic test apparatus for testing the temperature characteristic of an object to be measured (2) at a predetermined temperature, wherein measuring means (4, 5) is provided, and the temperature characteristic test of the object to be measured (2) is performed. Measuring chamber (1) for carrying out the measurement, and a transport section (3) for transporting the DUT (2) to the measuring chamber
And an insulating heat medium (8) injecting a predetermined amount into the measurement chamber (1) in the predetermined temperature state and immersing the object to be measured (2), Test equipment. 2. The temperature characteristic test apparatus according to claim 1, wherein the heat medium (8) is a fluorine-based inert liquid.