JPH05109871A - Apparatus positioning substrate - Google Patents
Apparatus positioning substrateInfo
- Publication number
- JPH05109871A JPH05109871A JP26667691A JP26667691A JPH05109871A JP H05109871 A JPH05109871 A JP H05109871A JP 26667691 A JP26667691 A JP 26667691A JP 26667691 A JP26667691 A JP 26667691A JP H05109871 A JPH05109871 A JP H05109871A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plate
- pins
- alignment
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子、液晶表示
素子等を製造するための露光装置、加工装置、検査装置
等に組み込まれている円形状のウェハ基板、矩形状のガ
ラス基板の機械的な位置決め装置、いわゆるプリアライ
メント装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a machine for a circular wafer substrate or a rectangular glass substrate incorporated in an exposure apparatus, a processing apparatus, an inspection apparatus or the like for manufacturing semiconductor elements, liquid crystal display elements and the like. The present invention relates to a conventional positioning device, a so-called pre-alignment device.
【０００２】[0002]
【従来の技術】図１は、矩形状のガラス基板（以下プレ
ートとする）Ｐ上に、投影レンズＰＬを介してレチクル
Ｒのパターンを投影露光する装置を示す。図１の装置に
おいて、水銀ランプ１、楕円鏡２を含む照明系からの照
明光は、レチクルＲを均一な照度で照明する。2. Description of the Related Art FIG. 1 shows an apparatus for projecting and exposing a pattern of a reticle R onto a rectangular glass substrate (hereinafter referred to as a plate) P via a projection lens PL. In the apparatus of FIG. 1, illumination light from an illumination system including a mercury lamp 1 and an elliptical mirror 2 illuminates a reticle R with a uniform illuminance.
【０００３】プレートＰはホルダー３上に載置されて真
空吸着されるが、ホルダー３上での位置決めのために、
プレートＰの互いに直交する２辺が基準ピン（ローラ）
４Ａ、４Ｂ、４Ｃに当接した状態で固定される。このホ
ルダー３はＸ、Ｙ方向に２次元するＸＹステージ５上に
保持され、ＸＹステージ５は定盤（防振台上に載置）６
上に保持される。The plate P is placed on the holder 3 and is vacuum-adsorbed, but for positioning on the holder 3,
Two sides of the plate P orthogonal to each other are reference pins (rollers)
It is fixed while being in contact with 4A, 4B, and 4C. The holder 3 is held on an XY stage 5 which is two-dimensional in the X and Y directions, and the XY stage 5 is a surface plate (placed on a vibration isolation table) 6
Held on.
【０００４】さらに図１において、装置正面側にはプレ
ートＰの交換、搬送のための搬送アーム７が配置され、
駆動系８によって進退方向、回転方向に移動する。また
装置左側には、アーム７の方に向けてキャリア９が配置
される。キャリア９には複数枚の処理プレートＰが上下
方向に一定間隔をあけて平行に収納される。さらにキャ
リア９は駆動系１０によって上下動するように構成さ
れ、アーム７がキャリア９内の所望のプレートを取り出
せるように上下方向の位置決めを行う。Further, in FIG. 1, a transfer arm 7 for exchanging and transferring the plate P is arranged on the front side of the apparatus,
The drive system 8 moves in the forward / backward direction and the rotational direction. On the left side of the device, a carrier 9 is arranged toward the arm 7. A plurality of processing plates P are accommodated in the carrier 9 in parallel in the vertical direction at regular intervals. Further, the carrier 9 is configured to move up and down by the drive system 10, and the arm 7 performs vertical positioning so that a desired plate in the carrier 9 can be taken out.
【０００５】また図１の装置で、投影レンズＰＬの外周
には、プレートＰ上に形成されたアライメントマークを
光電検出するアライメント顕微鏡（以下、アライメント
系とする）ＧＡ、ＧＢ、ＧＣ、ＧＤが固設される。この
アライメント系ＧＡ〜ＧＢを用いてプレートＰの位置、
すなわちＸＹステージ５の位置（あるいはホルダー３の
微少回転）を決定する動作が、いわゆるファインアライ
メントになり、ホルダー３上の基準ピン４Ａ、４Ｂ、４
Ｃを使って、プレートＰをホルダー３上で位置決めする
のが、プリアライメントになる。Further, in the apparatus shown in FIG. 1, alignment microscopes (hereinafter referred to as alignment systems) GA, GB, GC and GD for photoelectrically detecting alignment marks formed on the plate P are fixed around the projection lens PL. Is set up. The position of the plate P using the alignment systems GA to GB,
That is, the operation for determining the position of the XY stage 5 (or the minute rotation of the holder 3) is so-called fine alignment, and the reference pins 4A, 4B, 4 on the holder 3 are arranged.
Pre-alignment uses C to position the plate P on the holder 3.
【０００６】図２は、従来のプリアライメント機構の一
例を示し、図１中に示した部材と同じものは同一の符号
で表わす。ホルダー３上の３つの基準ピン４Ａ、４Ｂ、
４Ｃは、いずれも転動可能なローラであり、プレートＰ
は基準ピン４Ｂ、４Ｃと押圧ピン（ローラ）４Ｅとで、
挾み込まれることによりＸ方向に位置決めされ、基準ピ
ン４Ａと押圧ピン（ローラ）４Ｄとで挾み込まれること
により、Ｙ方向に位置決めされる。押圧ピン４Ｄ、４Ｅ
はそれぞれ可動子１１Ａ、１１Ｂの先端に転動可能に軸
支され、可動子１１Ａ、１１Ｂが矢印ＫＹ、ＫＸ方向に
揺動することにより、プレートＰがＸ、Ｙ方向に押圧さ
れる。FIG. 2 shows an example of a conventional pre-alignment mechanism, and the same members as those shown in FIG. 1 are designated by the same reference numerals. The three reference pins 4A, 4B on the holder 3,
4C is a roller that can roll, and the plate P
Is a reference pin 4B, 4C and a pressing pin (roller) 4E,
It is positioned in the X direction by being pinched, and is positioned in the Y direction by being pinched by the reference pin 4A and the pressing pin (roller) 4D. Push pin 4D, 4E
Are rotatably supported by the tips of the movers 11A and 11B, respectively, and the plates P are pressed in the X and Y directions by swinging the movers 11A and 11B in the directions of arrows KY and KX.
【０００７】図１、図２では矩形のプレートＰを扱うも
のとしたが、同様の方式のプリアライメント機構は、円
形状の半導体ウェハを処理する露光装置にも組み込まれ
ている。Although the rectangular plate P is handled in FIGS. 1 and 2, a pre-alignment mechanism of a similar system is also incorporated in an exposure apparatus for processing a circular semiconductor wafer.
【０００８】[0008]
【発明が解決しようとする課題】従来の図２の技術で
は、プレートＰがホルダー３上で正しくプリアライメン
トされたか否か、すなわちプレートＰの一辺が基準ピン
４Ｂ、４Ｃに当接し、同時にプレートＰの直交する他の
一辺が基準ピン４Ａに当接したか否かを認識することは
難しく、もっぱら押圧ピン４Ｄ、４Ｅの矢印ＫＸ、ＫＹ
方向の押圧力や押圧継続時間等を経験的（実験的）に最
適にしておくことで対処していた。In the conventional technique of FIG. 2, whether the plate P is correctly pre-aligned on the holder 3, that is, one side of the plate P contacts the reference pins 4B and 4C, and at the same time, the plate P It is difficult to recognize whether or not the other side of the contact pin 4A that has abutted against the reference pin 4A is exclusively formed by the arrows KX and KY of the pressing pins 4D and 4E.
This has been dealt with by optimizing the pressing force in the direction, the pressing duration time, etc. empirically (experimentally).
【０００９】また確実なプリアライメントのために、本
来プリアライメントに必要な押圧力よりも大幅に大きい
押圧力で押圧ピン４Ｄ、４Ｅを駆動させており、プレー
トＰの周辺で押圧ピン４Ｄ、４Ｅ、あるいは基準ピン４
Ａ〜４Ｃと当接する部分が歪むといった欠点が生じてい
た。プレートＰはプリアライメントされた直後、ホルダ
ー３上に真空吸着されるので、プレートＰの周辺が歪ん
だ状態（周辺部の表面が湾曲した状態）のままホルダー
３上に固定されてしまう。Further, for reliable pre-alignment, the pressing pins 4D, 4E are driven with a pressing force much larger than the pressing force originally required for the pre-alignment, and the pressing pins 4D, 4E are driven around the plate P. Or reference pin 4
There was a defect that the portion in contact with A to 4C was distorted. Since the plate P is vacuum-adsorbed on the holder 3 immediately after being pre-aligned, the plate P is fixed on the holder 3 while the periphery of the plate P is distorted (the peripheral surface is curved).
【００１０】本発明はこのような問題点を解決し、プリ
アライメント時の基板の押圧力を小さくして基板の機械
的な歪み（変形）を皆無とした位置決め装置を得ること
を目的とする。An object of the present invention is to solve the above problems and to obtain a positioning device in which mechanical pressing (deformation) of the substrate is eliminated by reducing the pressing force of the substrate during prealignment.
【００１１】[0011]
【課題を解決する為の手段】本発明において、基板を位
置決めするときの基準となる複数の基準部材（基準ピン
４Ａ、４Ｂ、４Ｃ）を、基板との当接方向にわずかに離
れた第１位置と第２位置との間で変位するように指示す
るとともに、通常はその変位の第１位置（プアライメン
ト準備位置）の方向へ基準部材を付勢するような複数の
可動部材（２０〜２３）を設ける。According to the present invention, a plurality of reference members (reference pins 4A, 4B, 4C), which serve as a reference when positioning a substrate, are first separated from each other in the contact direction with the substrate. A plurality of movable members (20 to 23) for instructing to displace between the position and the second position and normally biasing the reference member toward the first position (prealignment preparation position) of the displacement. ) Is provided.
【００１２】さらに本発明で、押圧部材（押圧ピン４
Ｄ、４Ｅ）の動作によって基板が押圧されて、基準部材
（４Ａ〜４Ｃ）の夫々が第１位置から第２位置（プリア
ライメント基準位置）に変位したときに検知信号を出力
する複数の検出器（センサ２５：２５Ａ〜２５Ｃ）と、
その各検知信号がいずれも出力されたとき、基板の位置
決め完了を表わす信号（Ｅｏ）を発生する判定回路（ア
ンド回路２７）とを設けるようにした。Further, in the present invention, the pressing member (the pressing pin 4
A plurality of detectors that output detection signals when the substrate is pressed by the operation of (D, 4E) and each of the reference members (4A to 4C) is displaced from the first position to the second position (pre-alignment reference position). (Sensor 25: 25A to 25C),
A determination circuit (AND circuit 27) is provided for generating a signal (Eo) indicating the completion of the positioning of the substrate when each of the detection signals is output.
【００１３】[0013]
【作用】本発明によれは、判定回路によって位置決め完
了が確認ができるので、従来のように過大な押圧力で基
板を基準部材へ当接し続けることが防止できる。また本
発明では可動部材に付勢力をもたせたので、押圧部材の
動作により基板の端面が基準部材に当接し始めたときに
端面へ加わる応力は、可動部材の付勢力と同程になる。
このため押圧部材による基板の押圧力は、その付勢力よ
りも若干大きくするだけでよく、この点に関しても従来
より有利となる。According to the present invention, since the completion of positioning can be confirmed by the determination circuit, it is possible to prevent the substrate from continuously contacting the reference member with an excessive pressing force as in the prior art. Further, in the present invention, since the movable member is provided with an urging force, the stress applied to the end surface of the substrate when the end surface of the substrate starts to contact the reference member due to the operation of the pressing member becomes almost the same as the urging force of the movable member.
Therefore, the pressing force of the substrate by the pressing member need only be made slightly larger than the urging force thereof, which is also advantageous from the conventional point.
【００１４】[0014]
【実施例】図３は本発明の実施例による位置決め機構を
示す平面図であり、図２に示した機構中の部材と同じ機
能のものには同一の符号をつけてある。また図２は載置
されたプレートＰが正しくプリアライメントされた状態
を示し、３つの基準ピン（ローラ）４Ａ、４Ｂ、４Ｃ、
及び２つの押圧ピン（ローラ）４Ｄ、４Ｅの平面内での
各配置は、図２と同じであるとする。FIG. 3 is a plan view showing a positioning mechanism according to an embodiment of the present invention, in which members having the same functions as those in the mechanism shown in FIG. 2 are designated by the same reference numerals. Further, FIG. 2 shows a state in which the mounted plate P is correctly pre-aligned, and three reference pins (rollers) 4A, 4B, 4C,
The respective arrangements of the two pressing pins (rollers) 4D and 4E in the plane are the same as those in FIG.
【００１５】本実施例ては、３つの基準ピン４Ａ、４
Ｂ、４Ｃがホルダー３に直接軸支されるのではなく、所
定量だけ移動（揺動）可能なレバー２０を介して設けら
れる。図３では基準ピン４Ｂについての機構だけを説明
するが、他の基準ピン４Ａ、４Ｃについても全く同じ機
構になっている。さて、レバー２０は回転軸（ピボッ
ト）２１を介してホルダー３上に軸支される。そしてレ
バー２０の一端部に基準ピン４Ｂが転動可能に軸支され
る。そのレバー２０の揺動量は、ホルダー３に植設され
た２本の固定ピン２２Ａ、２２Ｂによって規制される。
図３のように、基準ピン４ＢがプレートＰと当接し、プ
レートＰが押圧ピン４Ｅによって矢印ＫＸの方向へ押さ
れると、レバー２０の一端側は固定ピン２２Ｂに当接し
た状態になり、この位置が基準ピン４Ｂの正しいプリア
ライメント基準位置になる。In this embodiment, three reference pins 4A and 4A are used.
B and 4C are not directly supported on the holder 3 but provided via a lever 20 that can move (swing) by a predetermined amount. Although only the mechanism for the reference pin 4B will be described with reference to FIG. 3, the other reference pins 4A, 4C have exactly the same mechanism. Now, the lever 20 is pivotally supported on the holder 3 via a rotary shaft (pivot) 21. The reference pin 4B is rotatably supported by one end of the lever 20. The swing amount of the lever 20 is regulated by the two fixing pins 22A and 22B planted in the holder 3.
As shown in FIG. 3, when the reference pin 4B comes into contact with the plate P and the plate P is pushed by the pressing pin 4E in the direction of arrow KX, one end of the lever 20 comes into contact with the fixed pin 22B. The position becomes the correct pre-alignment reference position of the reference pin 4B.
【００１６】またレバー２０の他端側とホルダー３との
間には引張りバネ２３が設けられ、レバー２０の他端側
が固定ピン２２Ａへ当接するような付勢力が与えられ
る。従ってプレートＰがない状態では、図４に示すよう
にレバー２０の他端側はバネ２３によって常時固定ピン
２２Ａへ一定の付勢力で当接している。ここで図４のよ
うな状態のときの基準ピン４Ｂ（４Ａ、４Ｃ）の位置
を、プリアライメント準備位置と呼び、図３の状態のと
きの基準ピンの位置を、プリアライメント基準位置と呼
ぶことにする。従って３つの基準ピン４Ａ、４Ｂ、４Ｃ
は、プアライメントすべきプレートＰの各辺の位置決め
方向（矢印ＫＸ、ＫＹ）にわずかに離れた２点、すなわ
ち準備位置と基準位置との間を移動することになる。そ
の移動量はプレートＰの大きさや搬送精度によって異な
るが、数mm程度に設定される。A tension spring 23 is provided between the other end of the lever 20 and the holder 3 so that the other end of the lever 20 abuts the fixing pin 22A. Therefore, in the state without the plate P, the other end of the lever 20 is always in contact with the fixed pin 22A by the spring 23 with a constant urging force as shown in FIG. Here, the position of the reference pin 4B (4A, 4C) in the state as shown in FIG. 4 is called a pre-alignment preparation position, and the position of the reference pin in the state of FIG. 3 is called a pre-alignment reference position. To Therefore, the three reference pins 4A, 4B, 4C
Will move between two points slightly apart in the positioning direction (arrows KX, KY) of each side of the plate P to be prealigned, that is, between the preparation position and the reference position. The amount of movement varies depending on the size of the plate P and conveyance accuracy, but is set to about several mm.
【００１７】さて、本実施例ではプリアライメントの良
否をチェックするためにレバー２０の一端側に遮光板２
４を水平に固設し、レバー２０の揺動とともにＸＹ平面
内で回動するように構成する。図４に示すように遮光板
２４の遮光端は、透過形（または反射形）のフォトイン
タラプター等のセンサー２５の光束ＩＬ内に進退するよ
うに配置される。そして、図３のように基準ピン４Ｂ
（４Ａ、４Ｃ）が基準位置にきたときは、センサー２５
の光束が遮光板２４によって完全に、あるいは所定だけ
遮断される。基準ピン４Ｂの位置が不完全であるとき、
センサー２５の光束ＩＬは部分的に、あるいは全く遮光
されないため、高い光電出力が発生する。In this embodiment, the light shield plate 2 is provided on one end side of the lever 20 to check the quality of pre-alignment.
4 is fixed horizontally and is configured to rotate in the XY plane as the lever 20 swings. As shown in FIG. 4, the light-shielding end of the light-shielding plate 24 is arranged so as to advance and retreat into the light flux IL of the sensor 25 such as a transmissive (or reflective) photointerrupter. Then, as shown in FIG. 3, the reference pin 4B
When (4A, 4C) is at the reference position, the sensor 25
The light flux of is completely or predeterminedly blocked by the light shielding plate 24. When the position of the reference pin 4B is incomplete,
Since the light flux IL of the sensor 25 is not shielded partially or at all, a high photoelectric output is generated.
【００１８】図５は、図３、図４に示したプリアライメ
ント機構の制御系のブロックを示し、３つの基準ピン４
Ａ〜４Ｃの各々に対応したセンサーは、それぞれセンサ
ー２５Ａ、２５Ｂ、２５Ｃとする。センサー２５Ａ、２
５Ｂ、２５Ｃの各出力はインバータ２６Ａ、２６Ｂ、２
６Ｃを介して３入力のアンド回路２７に印加される。本
実施例ではプリアライメントが正しく達成されたとき、
各センサーの光束が遮断されるため、各インバータ２６
Ａ、２６Ｂ、２６Ｃの出力は全て論理「０」（Ｌレベ
ル）になり、負論理表記のアンド回路２７は論理「１」
を出力する。また３つのセンサーのうちいずれか１つで
も正常でないとき、アンド回路２７は「０」を出力す
る。制御回路２８はそのアンド回路２７の出力信号Ｅｏ
をエラー信号としてモニターし、信号Ｅｏが「１」にな
ったら次のシーケンスを続けるように働く。FIG. 5 shows a block of a control system of the pre-alignment mechanism shown in FIGS. 3 and 4, and three reference pins 4 are provided.
The sensors corresponding to A to 4C are sensors 25A, 25B, and 25C, respectively. Sensor 25A, 2
The outputs of 5B and 25C are inverters 26A, 26B and 2
It is applied to the 3-input AND circuit 27 via 6C. In this embodiment, when prealignment is correctly achieved,
Since the light flux of each sensor is blocked, each inverter 26
The outputs of A, 26B, and 26C are all logic "0" (L level), and the AND circuit 27 in the negative logic notation is logic "1".
Is output. Further, when any one of the three sensors is not normal, the AND circuit 27 outputs "0". The control circuit 28 outputs the output signal Eo of the AND circuit 27.
Is monitored as an error signal, and when the signal Eo becomes "1", the next sequence is continued.
【００１９】制御回路２８は、さらに各インバータ２６
Ａ、２６Ｂ、２６Ｃの各出力信号Ａ 0 、Ａ1 、Ａ2 を入
力し、どの基準ピンでエラーになったかを解析し、ある
程度回復できるエーラであれば、回復処理を実行する。
例えば、プリアライメント動作の開始指令を受けて、押
圧ピン４Ｄ、４Ｅの夫々をＫＸ、ＫＹ方向へ動かすアク
チュエータ（モータ、エアシリンダ等）を起動してから
所定時間経過後に、信号Ｅｏが「０」のままであるとき
は、３つの基準ピン４Ａ〜４Ｃの全てが不完全な位置で
止まっているため、制御回路２８はプレートＰをアーム
７によってホルダー３上から１度持ち上げて再び載置す
るように、駆動系８を制御する。これによって、プレー
トＰが再度ホルダー３上に載ったときの位置が微妙にず
れ、再びプリアライメント動作を行ったときに、正しく
位置決めされることもある。尚、この動作はホルダー３
からプレートＰを所定量だけ持ち上げるセンターアップ
機構によっても実行できる。The control circuit 28 further includes each inverter 26.
Output signals A of A, 26B and 26C 0, A1, A2Enter
And analyze which reference pin caused the error.
If it is an error that can be recovered to a certain degree, recovery processing is executed.
For example, in response to a pre-alignment operation start command,
An actuator that moves each of the pressure pins 4D and 4E in the KX and KY directions.
After starting the tuner (motor, air cylinder, etc.)
When the signal Eo remains “0” after a predetermined time has elapsed
Is in a position where all three reference pins 4A-4C are incomplete.
Since it is stopped, the control circuit 28 arms the plate P.
Lift from the holder 3 once by 7 and place it again
The drive system 8 is controlled so that By this, play
The position when the toe P is placed on the holder 3 again
When the pre-alignment operation is performed again, the
It may be positioned. This operation is performed by holder 3
Center up by lifting the plate P from the
It can also be executed by the mechanism.
【００２０】また基準ピン４Ｂ、４Ｃに対するセンサー
２５Ｂ、２５Ｃの各信号Ａ0 、Ａ2 が「１」で、他の信
号Ａ1 が「０」のときは、図３中でプレートＰのＹ方向
の位置決めが不完全であることがわかる。その場合、押
圧ピン４Ｄを一度退避させてから再度プレートＰをＫＹ
方向に押圧するようにアクチュエータを制御する。これ
により、Ｙ方向の位置決めの不完全さが回復することも
ある。When the signals A 0 and A 2 of the sensors 25B and 25C for the reference pins 4B and 4C are "1" and the other signals A 1 are "0", the plate P in the Y direction in FIG. It can be seen that the positioning of is incomplete. In that case, the pressing pin 4D should be retracted once, and then the plate P should be KY again.
The actuator is controlled to push in the direction. This may recover the imperfect positioning in the Y direction.
【００２１】以上のように、各センサーからの信号の状
態である程度、エラーの状況がわかることになる。また
プリアライメント動作中は、ホルダー３の吸着面からエ
アーを噴出させてプレートＰの移動をスムーズにしてお
き、信号Ｅｏが「１」になった時点でホルダー３を吸着
に切り替え、バキュームセンサーにより吸着が確認され
た後で、２つの押圧ピン４Ｄ、４Ｅの押圧力を解除す
る。As described above, the status of the error can be understood to some extent by the state of the signal from each sensor. Further, during the pre-alignment operation, air is ejected from the suction surface of the holder 3 to smooth the movement of the plate P, and when the signal Eo becomes “1”, the holder 3 is switched to suction and suction is performed by the vacuum sensor. After it is confirmed, the pressing force of the two pressing pins 4D and 4E is released.
【００２２】以上、本実施例では基準ピン４Ａ〜４Ｃの
各々が位置決め方向（矢印ＫＸ、ＫＹ）に微動できるよ
うに設置されているため、プリアライメント動作の開始
時には、プレートＰの端面（辺）が基準ピンに当接した
後、その基準ピンが基準位置まで変位する間は、バネ２
３の付勢力に応じた力でプレート端面を押圧することに
なる。As described above, in this embodiment, each of the reference pins 4A to 4C is installed so as to be able to finely move in the positioning direction (arrows KX, KY), so at the start of the prealignment operation, the end surface (side) of the plate P is started. After contacting the reference pin with the reference pin, the spring 2
The plate end surface is pressed by a force corresponding to the biasing force of 3.
【００２３】従って、押圧ピン４Ｄ、４Ｅの押圧力を、
基準ピン４Ａ〜４Ｃの夫々の付勢力よりも若干大きくし
ておけば、常に確実なプリアライメントが可能になり、
押圧ピン４Ｄ、４Ｅの押圧力を必要以上に大きくしてお
く必要がなくなる。図６は、第２の実施例によるウェハ
プリアライメント機構を示し、先の図３と同じ機能の部
材には同一の符号をつけてある。ただし、ウェハのプリ
アライメントは、ウェハＷの周辺に設けられた直線状の
フラットＯＦを基準として行うため、フラットＯＦには
２つの基準ピン４Ｂ、４Ｃが同時に当接するように配置
され、フラットＯＦから９０°回転した位置に基準ピン
４Ａが配置される。Therefore, the pressing force of the pressing pins 4D, 4E is
If the biasing force of each of the reference pins 4A to 4C is set to be slightly larger, reliable pre-alignment is always possible,
It is not necessary to increase the pressing force of the pressing pins 4D and 4E more than necessary. FIG. 6 shows a wafer pre-alignment mechanism according to the second embodiment, in which members having the same functions as those in FIG. 3 are designated by the same reference numerals. However, since the pre-alignment of the wafer is performed with reference to the linear flat OF provided around the wafer W, the two reference pins 4B and 4C are arranged so as to contact the flat OF at the same time. The reference pin 4A is arranged at a position rotated by 90 °.
【００２４】本実施例も、先の図３の例と同様に、プリ
アライメント達成時にウェハＷの端面に不要に大きな押
圧力を加えることがなく、しかもプリアライメントの正
確な完了がチェックできる。次に本発明のいくつかの変
形例について図７を参照して説明する。図７（Ａ）は、
基準ピン４Ａを含む可動部材の変形例であって、基準ピ
ン４Ａとしてのローラは、可動金具３２の一端側に軸支
され、可動金具３２はホルダー３に固設される固定金具
３０と精密ヒンジ３１を介して揺動可能に連結される。Also in this embodiment, similarly to the example of FIG. 3 described above, it is possible to check the accurate completion of the pre-alignment without applying an unnecessarily large pressing force to the end surface of the wafer W when the pre-alignment is achieved. Next, some modified examples of the present invention will be described with reference to FIG. 7. FIG. 7 (A) shows
In a modification of the movable member including the reference pin 4A, a roller as the reference pin 4A is axially supported on one end side of the movable metal fitting 32, and the movable metal fitting 32 is fixed to the holder 3 and a precision hinge. It is swingably connected via 31.
【００２５】また可動金具３２の一端側は、固定金具３
０から延設した係止片３０Ａによって、図示の状態から
右側へ揺動することを規制される。そして固定金具３０
と可動金具３２との間には圧縮バネ３３が設けられ、基
準ピン４Ａをプリアライメント基準位置（可動金具３２
の一端が係止片３０Ａに当接した位置）に付勢する。さ
て、可動金具３２の裏側には、固定金具３０側から伸び
た金属性調整ネジ３４の先端が配置され、プリアライメ
ント時に基準ピン４Ａが変位したときの基準位置を規定
する。すなわち、可動金具３２が図示の状態から変位す
るとき、可動金具３２の裏面がネジ３４の先端に当接す
ることで、その変位が係止される。そのネジ３４はピッ
チの細いものを使い、固定金具３０に固着された絶縁板
３０Ｂのみを介して螺合され、固定金具３０とは接触し
ないようになっている。またこのネジ３４と電気的に導
通したリード線３４Ａが配線される。Further, one end side of the movable fitting 32 is fixed to the fixed fitting 3
The locking piece 30A extending from 0 restricts swinging from the illustrated state to the right. And fixing bracket 30
A compression spring 33 is provided between the movable pin 32 and the movable bracket 32, and the reference pin 4A is moved to the pre-alignment reference position (the movable bracket 32).
Is biased to a position where one end of the abuts against the locking piece 30A). The tip of the metallic adjustment screw 34 extending from the fixed metal fitting 30 side is arranged on the back side of the movable metal fitting 32, and defines the reference position when the reference pin 4A is displaced during pre-alignment. That is, when the movable fitting 32 is displaced from the state shown in the figure, the displacement is locked by the back surface of the movable fitting 32 contacting the tip of the screw 34. The screw 34 has a narrow pitch and is screwed only through the insulating plate 30B fixed to the fixing member 30 so as not to come into contact with the fixing member 30. Also, a lead wire 34A electrically connected to the screw 34 is wired.
【００２６】本実施例によれば、ネジ３４の微調整によ
って基準ピン４Ａのプリアライメント基準位置を調整す
ることができるので、基板の搬送精度を考慮して総合的
なプリアライメント達成位置、及び精度を容易に最適化
することができる。図７（Ｂ）は図７（Ａ）の機構の場
合に好適なチェック回路の一例であり、図７（Ａ）にお
いてネジ３４の先端が可動金具３２の裏面に接触したと
きに閉じるスイッチＳＷａ（ＳＷｂ、ＳＷｃ）として扱
う。図７（Ａ）の場合、可動金具３２側はアースになる
ので、電源電圧から抵抗Ｒａ（Ｒｂ、Ｒｃ）を介してリ
ード線３４Ａと接続し、その接続点の電位を負論理で示
したアンド回路２７で受けることによって、プリアライ
メント完了信号Ｅｏを得ることができる。According to this embodiment, since the pre-alignment reference position of the reference pin 4A can be adjusted by finely adjusting the screw 34, the overall pre-alignment achievement position and accuracy are taken into consideration in consideration of the substrate transfer accuracy. Can be easily optimized. FIG. 7B is an example of a check circuit suitable for the mechanism of FIG. 7A, and in FIG. 7A, a switch SWa (closed when the tip of the screw 34 comes into contact with the back surface of the movable metal fitting 32). SWb, SWc). In the case of FIG. 7 (A), since the movable metal fitting 32 side is grounded, the power supply voltage is connected to the lead wire 34A via the resistor Ra (Rb, Rc), and the potential at the connection point is indicated by negative logic. The circuit 27 receives the pre-alignment completion signal Eo.
【００２７】また固定金具３０を絶縁体を介してホルダ
ー３に固定するときは、固定金具３０、可動金具３２は
電気的にアースから浮いた状体になる。そのため固定金
具３０からもリード線を配線し、３ヶ所の基準ピンの夫
々に対応したスイッチＳＷａ、ＳＷｂ、ＳＷｃを直列に
接続し、その直列路の導通、非導通を判別することで、
プリアライメント完了をチェックしてもよい。When the fixing metal fitting 30 is fixed to the holder 3 via the insulator, the fixing metal fitting 30 and the movable metal fitting 32 are electrically floating from the ground. Therefore, by connecting a lead wire from the fixing metal fitting 30 and connecting the switches SWa, SWb, and SWc corresponding to the respective three reference pins in series, and determining whether the series path is conductive or non-conductive,
You may check the completion of pre-alignment.
【００２８】尚、図７（Ａ）のようにネジ３４の先端と
可動金具３２との接触を利用したスイッチの場合、接触
によって微小（μｍ単位）な金属粉が発生することもあ
るので、発塵防止のカバー等を設けるとよい。Incidentally, in the case of a switch utilizing the contact between the tip of the screw 34 and the movable metal fitting 32 as shown in FIG. 7A, minute (μm unit) metal powder may be generated due to the contact, so that it is generated. It is advisable to provide a dustproof cover or the like.
【００２９】[0029]
【発明の効果】以上、本発明によれば基板の位置決め
（プリアライメント）が正しく行われたか否かを検知す
る可動の基準部材を設けたので、押圧部材による押圧力
は、保持手段の載置面と基板との接触による摩擦力より
もわずかに大きくしておくだけでよく、押圧部材に当接
する基板の一部分の変形、破損を防止できる。このため
位置決め後に基板を保持手段（ホルダー）上に吸着して
も、基板の変形（たわみ、局所的な湾曲）がなく、露光
装置においては転写パターンが歪んで露光されることが
皆無になる。As described above, according to the present invention, since the movable reference member for detecting whether or not the positioning (pre-alignment) of the substrate is correctly performed is provided, the pressing force of the pressing member causes the holding means to be mounted. It is only necessary to make the frictional force due to the contact between the surface and the substrate slightly larger, and it is possible to prevent the deformation and damage of a part of the substrate that contacts the pressing member. Therefore, even if the substrate is sucked onto the holding means (holder) after the positioning, the substrate is not deformed (deflected or locally curved), and the exposure pattern is never distorted and exposed in the exposure apparatus.
【００３０】さらに露光装置においては、基板の表面の
投影光軸方向への変形が防止されることから、焦点深度
の浅い投影光学系を使ったとしてもパターン投影像のデ
フォーカスも低減できるといった利点がある。また極端
に大きな押圧力を必要としないので、基板端面の一部が
破損、摩減することによるダストの発生も押さえられ
る。Further, in the exposure apparatus, since the deformation of the surface of the substrate in the projection optical axis direction is prevented, the defocus of the pattern projection image can be reduced even if the projection optical system having a shallow depth of focus is used. There is. Further, since an extremely large pressing force is not required, it is possible to suppress generation of dust due to damage or abrasion of a part of the substrate end surface.
【図１】従来より使われている投影露光装置の一例を示
す斜視図FIG. 1 is a perspective view showing an example of a conventional projection exposure apparatus.
【図２】従来のプリアライメント機構を示す平面図FIG. 2 is a plan view showing a conventional pre-alignment mechanism.
【図３】本発明の第１実施例によるプリアライメント機
構を示す平面図FIG. 3 is a plan view showing a pre-alignment mechanism according to the first embodiment of the present invention.
【図４】プリアライメント機構の基準ピン周辺の構成を
拡大して示した平面図FIG. 4 is an enlarged plan view showing a configuration around a reference pin of a pre-alignment mechanism.
【図５】検知回路を含む制御系の構成を示すブロック図FIG. 5 is a block diagram showing a configuration of a control system including a detection circuit.
【図６】第２実施例によるプリアライメント機構を示す
平面図FIG. 6 is a plan view showing a pre-alignment mechanism according to a second embodiment.
【図７】プリアライメント機構と検知回路の変形例を示
す図FIG. 7 is a diagram showing a modification of the pre-alignment mechanism and the detection circuit.
Ｐ プレート Ｗ ウェハ ３ ホルダー ４Ａ、４Ｂ、４Ｃ 基準ピン（ローラ） ４Ｄ、４Ｅ 押圧ピン（ローラ） ２０ 可動レバー ２１ 回転軸 ２２Ａ、２２Ｂ 係止ピン ２３ 引張バネ ２４ 遮光板 ２５、２５Ａ、２５Ｂ、２５Ｃ センサー ２７ アンド回路（判定回路） ２８ 制御系 P Plate W Wafer 3 Holder 4A, 4B, 4C Reference Pin (Roller) 4D, 4E Pressing Pin (Roller) 20 Movable Lever 21 Rotating Shaft 22A, 22B Locking Pin 23 Tension Spring 24 Light-Shielding Plate 25, 25A, 25B, 25C Sensor 27 AND circuit (judgment circuit) 28 Control system
Claims (1)
と、該保持手段の載置面に対して所定の位置関係で配置
された複数の基準部材と、前記基板の端面部を前記複数
の基準部材の夫々に当接させるように前記基板を押圧す
る押圧部材とを具え、前記基板を前記保持手段の載置面
上で位置決めする装置において、 前記基準部材の夫々を前記基板の位置決め時の当接方向
に所定量だけ離れた第１位置と第２位置との間で変位可
能に支持するとともに、所定の付勢力で前記第１位置側
に付勢るす複数の可動部材と；前記押圧部材の動作によ
って前記基準部材の夫々が前記第１位置から第２位置に
変位したときに検知信号を出力する複数の検出器と；該
複数の検出器がいずれも前記検知信号を出力したとき、
前記基板の位置決め完了を表わす信号を発生する判定回
路とを備えたことを特徴とする基板の位置決め装置。1. A holding means for mounting a substrate to be positioned, a plurality of reference members arranged in a predetermined positional relationship with respect to a mounting surface of the holding means, and an end surface portion of the substrate for the plurality of reference members. A device for positioning the substrate on the mounting surface of the holding means, comprising a pressing member that presses the substrate so as to make contact with each of the reference members, wherein each of the reference members is positioned when positioning the substrate. A plurality of movable members that are displaceably supported between a first position and a second position that are apart from each other by a predetermined amount in the contact direction, and that are biased toward the first position by a predetermined biasing force; A plurality of detectors that output detection signals when each of the reference members is displaced from the first position to the second position by the operation of the members; and when all of the plurality of detectors output the detection signals,
And a determination circuit that generates a signal indicating that the positioning of the substrate has been completed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26667691A JP3175058B2 (en) | 1991-10-16 | 1991-10-16 | Substrate positioning device and substrate positioning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26667691A JP3175058B2 (en) | 1991-10-16 | 1991-10-16 | Substrate positioning device and substrate positioning method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05109871A true JPH05109871A (en) | 1993-04-30 |
| JP3175058B2 JP3175058B2 (en) | 2001-06-11 |
Family
ID=17434149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26667691A Expired - Lifetime JP3175058B2 (en) | 1991-10-16 | 1991-10-16 | Substrate positioning device and substrate positioning method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3175058B2 (en) |
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| JP2015050264A (en) * | 2013-08-30 | 2015-03-16 | 株式会社Ｊｖｃケンウッド | Manufacturing apparatus and manufacturing method |
| CN104992919A (en) * | 2015-07-21 | 2015-10-21 | 合肥鑫晟光电科技有限公司 | Positioning foot, positioning device and positioning method |
| US9963297B2 (en) | 2015-07-21 | 2018-05-08 | Boe Technology Group Co., Ltd. | Positioning foot, positioning device and position correction method |
| CN109928212A (en) * | 2019-04-09 | 2019-06-25 | 深圳市华星光电半导体显示技术有限公司 | Display panel positioning device |
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