JPH0510438B2 - - Google Patents

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Publication number
JPH0510438B2
JPH0510438B2 JP60181027A JP18102785A JPH0510438B2 JP H0510438 B2 JPH0510438 B2 JP H0510438B2 JP 60181027 A JP60181027 A JP 60181027A JP 18102785 A JP18102785 A JP 18102785A JP H0510438 B2 JPH0510438 B2 JP H0510438B2
Authority
JP
Japan
Prior art keywords
plating
recovery
metal
tank
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60181027A
Other languages
Japanese (ja)
Other versions
JPS6244591A (en
Inventor
Kazuhiko Fukamachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NITSUKO KYOSEKI KK
Original Assignee
NITSUKO KYOSEKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NITSUKO KYOSEKI KK filed Critical NITSUKO KYOSEKI KK
Priority to JP18102785A priority Critical patent/JPS6244591A/en
Publication of JPS6244591A publication Critical patent/JPS6244591A/en
Publication of JPH0510438B2 publication Critical patent/JPH0510438B2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

[目的] 本発明は金属体の電気めつき、特に、金、銀、
パラジウム等の貴金属をめつきする電気めつきラ
インにおいて、効率的かつ経済的に貴金属の汲み
出しによる消耗を低減させる方法に関するもので
ある。 [従来の技術及び問題点] 一般に、金、銀、パラジウム等の貴金属めつき
製品は外観が美しいので装飾品として用いられた
り、あるいは耐食性や電気接続性が優れているた
めに、電子・電気部品などの用途に用いられる。 被めつき金属体としては、銅や黄銅、りん青銅
等の銅合金、あるいは鉄、鋼(ステンレスなど)、
42合金などの鉄合金等が用いられる。 めつき方法としては、予め金属条から個々の部
品に成形した後、この部品をバレルめつきやラツ
ク方式のめつきによつて被覆するいわゆる後めつ
き方法があるが、生産性と経済性から個々の部品
に成形する前に金属の条にめつきし、それを後に
部品に成形することが多くなつている。 被めつき金属体に貴金属めつきを行う場合、貴
金属めつき槽でめつきされた金属体は液切りをし
た(連続条の場合にはエアーナイフなどで液切り
をする)後、次の処理槽へ搬送される。 被めつき金属体に付着しためつき液に含まれ
て、めつき槽外に持ち出される貴金属の消費、す
なわち汲み出しによる貴金属の消費は例えば上記
のエアーナイフ等の液切りをいくら強化しても十
分ではない。 前記のような汲み出し量を低く押えることは、
貴金属めつきを低コストで行ううえで、非常に重
要な課題となつている。 このような問題に対処する一般的な方法として
は水洗槽などの貴金属回収槽を2段以上設置する
ことにより、めつきされた金属体から、貴金属分
を洗い落し種々の方法で回収している。 ところが複数の回収槽をめつき装置、特に連続
めつき装置内に設けることは、設置スペースがか
さむばかりではなく、回収槽の液から貴金属を回
収するためにさらに別の処理設備で電解回収や、
イオン交換樹脂による回収を行なわなければなら
ない。 [発明の構成] 本発明は、この点に鑑み金属の電気めつき設備
において、貴金属等のめつき金属の汲み出しによ
る消費をできるだけおさえ、かつ効率的なめつき
ができるように種々の検討を行つた結果、貴金属
の電気めつき槽に続いて該めつき用貴金属等の金
属イオンを含有させていない電解質溶液槽(以下
回収電解槽という)を設けこの回収電解槽中で前
記被めつき金属体を陰極として電解することによ
つて貴金属等のめつき金属の汲み出しによるロス
を低減させ、回収設備の大幅な簡素化、および回
収費用の節減が可能であることを見い出したもの
である。 [発明の具体的説明] 電気めつきした材料をめつき槽から前記回収電
解槽へ移動させる時に、めつき液が同時に汲み出
され、該めつき液に入つている貴金属等のめつき
金属が回収電解槽の中に移される。ここでさらに
被めつき金属体を陰極として電解することによ
り、前記汲み出されためつき液中に残存するめつ
き金属が被めつき金属体に析出する。 めつき層の厚みはこの析出を計算に入れて総合
的な厚さによつてめつき処理が施される。 したがつて前記のようなめつき液の汲み出しに
よるめつき金属のロスは著しく減少する。 電気めつき液から回収電解槽へのめつき液の汲
み出しにより、回収電解槽の電解質溶液の濃度、
成分、PH値などが次第に変つていくので、電気め
つき用電解液と回収電解槽の電解液は同一系統で
あることが望ましく、めつきが効果的になされる
よう、電解液が適宜選択される。また、同一系統
の回収電解槽中のめつき液のめつき金属イオン濃
度が高くなつた場合には前記めつき液の補充液と
して使用することもできる。 本発明において、「めつき金属を含有させてい
ない電解質溶液」とは、このようなめつき液の汲
み出しによつて回収電解槽に必然的に入つてくる
めつき金属は除外され、当然汲み出しによつてめ
つき液に含まれるめつき金属が混入する回収電解
槽の電解質溶液については、本願発明の上記「め
つき金属を含有されていない電解質溶液」に包含
されるものである。 金属条に連続的に電気めつきする場合には、前
述にようにエアーナイフを使用してもめつき液の
汲み出しを充分に防止できないので、本発明の回
収電解槽を設けて、めつき液のロスを防止するこ
とは極めて有効である。 また一般に貴金属めつきを施す場合には、高価
であるため、金属条の全面にめつきが施されるこ
とはむしろ希であり、片面、ストライプあるいは
スポツト等の部分めつきが主なめつき方法となつ
ている。部分めつきの場合には部分めつきのため
の付帯設備を必要とするので回収電解槽も部分め
つき槽と同一構造とすることが適当である。 本発明のめつき用電解液と電解回収槽によるめ
つきの収率の向上のための電解液の例を示すと次
の通りである。
[Objective] The present invention relates to electroplating of metal bodies, particularly gold, silver,
The present invention relates to a method for efficiently and economically reducing consumption due to pumping out precious metals in an electroplating line for plating precious metals such as palladium. [Prior art and problems] In general, products plated with precious metals such as gold, silver, and palladium are used as decorative items because of their beautiful appearance, and are used as electronic and electrical components due to their excellent corrosion resistance and electrical connectivity. It is used for such purposes. The metal body to be plated can be copper, brass, copper alloys such as phosphor bronze, iron, steel (stainless steel, etc.),
Iron alloys such as 42 alloy are used. As a plating method, there is a so-called post-plating method in which metal strips are formed into individual parts in advance and then the parts are coated with barrel plating or easy plating, but this method is difficult due to productivity and economic considerations. Increasingly, strips of metal are plated before being formed into individual parts, which are then formed into parts. When precious metal plating is performed on a metal body to be plated, the metal body plated in the precious metal plating tank is drained (in the case of continuous strips, drained with an air knife, etc.), and then subjected to the next treatment. Transported to tank. The consumption of precious metals contained in the plating liquid that adheres to the metal objects to be plated and taken out of the plating tank, that is, the consumption of precious metals due to pumping out, cannot be avoided no matter how strong the liquid draining device, such as the air knife mentioned above, is used. isn't it. Keeping the pumping amount low as mentioned above is
This is an extremely important issue in achieving low-cost precious metal plating. A common way to deal with this problem is to install two or more stages of precious metal recovery tanks, such as washing tanks, to wash away the precious metals from the plated metal objects and recover them using various methods. . However, installing multiple recovery tanks in a plating device, especially in a continuous plating device, not only increases the installation space, but also requires separate processing equipment for electrolytic recovery and recovery of precious metals from the liquid in the recovery tank.
Recovery by ion exchange resin must be carried out. [Structure of the Invention] In view of this point, the present invention has carried out various studies in order to minimize the consumption of plating metals such as precious metals due to pumping and to perform efficient plating in metal electroplating equipment. As a result, an electrolyte solution tank (hereinafter referred to as a recovery electrolytic tank) that does not contain metal ions such as precious metals for plating is provided next to the electroplating tank for precious metals, and the plated metal bodies are collected in this recovery electrolytic tank. It has been discovered that by electrolyzing as a cathode, losses due to pumping out of plated metals such as precious metals can be reduced, and recovery equipment can be significantly simplified and recovery costs can be reduced. [Detailed Description of the Invention] When the electroplated material is transferred from the plating tank to the recovery electrolytic tank, the plating solution is simultaneously pumped out, and the plating metals such as precious metals contained in the plating solution are removed. Transferred to a recovery electrolyzer. By further electrolyzing the plated metal body using the plated metal body as a cathode, the plated metal remaining in the pumped-out plating solution is deposited on the plated metal body. The thickness of the plating layer is determined by taking this precipitation into account and determining the overall thickness of the plating layer. Therefore, the loss of plating metal caused by pumping out the plating solution as described above is significantly reduced. By pumping the plating solution from the electroplating solution to the recovery electrolytic tank, the concentration of the electrolyte solution in the recovery electrolytic tank,
Since the components, pH value, etc. gradually change, it is desirable that the electrolytic solution for electroplating and the electrolytic solution in the recovery electrolytic tank be of the same system, and the electrolytic solution should be selected appropriately to ensure effective plating. Ru. Further, when the plating metal ion concentration of the plating solution in the recovery electrolytic cell of the same system becomes high, it can also be used as a replenisher for the plating solution. In the present invention, "an electrolyte solution that does not contain a plating metal" means that the plating metal that inevitably enters the recovery electrolytic tank by pumping out the plating solution is excluded, and of course, the electrolyte solution that does not contain a plating metal is excluded. The electrolyte solution of the recovery electrolytic cell in which the plating metal contained in the plating solution is mixed is included in the above-mentioned "electrolyte solution not containing the plating metal" of the present invention. When electroplating metal strips continuously, even if an air knife is used as described above, pumping out of the plating solution cannot be sufficiently prevented. Preventing losses is extremely effective. Generally, when plating precious metals, it is expensive, so it is rather rare that the entire surface of the metal strip is plated, and the main plating methods are single-sided, stripe, or spot plating. It's summery. In the case of partial plating, additional equipment for partial plating is required, so it is appropriate that the recovery electrolytic cell has the same structure as the partial plating tank. Examples of the electrolytic solution for plating and the electrolytic solution for improving the plating yield using the electrolytic recovery tank of the present invention are as follows.

【表】【table】

【表】 この様に、電解回収用の電解液は、基本的に
は、金、銀等のめつき金属イオンを添加しない点
を除けばめつき液と同等の組成であり、前述した
めつき以外にも本発明が適用できることはいうま
でもない。 以下に実施例を用いて本発明の効果を具体的に
示す。 [実施例および比較例] 板厚0.2mm、板幅60mmのりん青銅条に連続的に
金ストライプめつきを行なつた。めつき幅は5mm
でストライプは1本である。条は金めつき槽の出
口でエアナイフにより、金めつき液を液切りされ
た後回収槽に搬送される。その際、回収槽で、純
水浸漬処理した場合(比較例)と、電解回収した
場合(本発明例)について、回収槽内の金濃度の
変化を第1表に示す。 尚、めつき条件は以下に示す通りである。 めつき条件: (1) 通板速度 10m/min (2) 金めつき液 シアン化金カリウム 12g/ くえん酸カリウム 125g/ 酒石酸アンチモニルカリ 1g/ EDTAコバルト塩 3g/ (3) 電解回収用電解液 くえん酸カリウム 125g/ 酒石酸アンチモニルカリ 1g/ EDTAコバルト塩 3g/ (4) 回収槽液量 (純水浸漬、電解回収共) (5) 電解回収電流密度 0.5A/dm2
[Table] As shown above, the electrolytic solution for electrolytic recovery basically has the same composition as the plating solution except that no plating metal ions such as gold or silver are added, and the electrolytic solution has the same composition as the plating solution. It goes without saying that the present invention can be applied to other cases as well. The effects of the present invention will be specifically illustrated below using Examples. [Examples and Comparative Examples] A phosphor bronze strip having a thickness of 0.2 mm and a width of 60 mm was continuously plated with gold stripes. Plating width is 5mm
There is only one stripe. At the outlet of the gold plating tank, the gold plating solution is removed from the strip using an air knife, and then the strip is transported to a recovery tank. At that time, Table 1 shows the changes in the gold concentration in the recovery tank for the case where the gold was immersed in pure water (comparative example) and the case where it was electrolytically recovered (example of the present invention). The plating conditions are as shown below. Plating conditions: (1) Threading speed 10m/min (2) Gold plating solution Potassium gold cyanide 12g/ Potassium citrate 125g/ Potassium antimonyl tartrate 1g/ EDTA cobalt salt 3g/ (3) Electrolyte solution for electrolytic recovery Potassium citrate 125g/ Potassium antimonyl tartrate 1g/ EDTA cobalt salt 3g/ (4) Recovery tank liquid volume (both pure water immersion and electrolytic recovery) (5) Electrolytic recovery current density 0.5A/dm 2

【表】 第1表に示されるように、電解回収槽にて金が
電解回収され、金濃度が一定値以上にならないこ
とが確認された。 さらにこの結果金の汲み出しによるロスは、純
水浸漬式の回収槽(回分式向流水洗槽)を3段設
置した場合と、電解回収槽1段と純水浸漬式の回
収槽1段を組み合わせ2段にした場合とでほぼ同
等であることが確認された。
[Table] As shown in Table 1, it was confirmed that gold was electrolytically recovered in the electrolytic recovery tank and that the gold concentration did not exceed a certain value. Furthermore, as a result, the loss caused by pumping out gold can be reduced by installing three stages of pure water immersion type recovery tanks (batch type countercurrent washing tank), and by combining one stage of electrolytic recovery tank and one stage of pure water immersion type recovery tank. It was confirmed that the two-stage case was almost equivalent.

Claims (1)

【特許請求の範囲】 1 金属体の電気めつきに際し、電気めつきに後
めつき金属を添加していない回収電解槽の電解質
溶液中で被めつき金属体を陰極として電解処理
し、被めつき金属体をめつき槽から回収槽へ移動
させる時に被めつき金属体に伴つて汲み出された
めつき液中に残存するめつき金属を被めつき金属
体に析出させることを特徴とする電気めつき方
法。 2 めつき金属を添加していない、前記電気めつ
き用電解液と同系統の電解質溶液中で電解する前
記特許請求の範囲第1項記載の電気めつき方法。 3 金属条に連続的に電気めつきする前記特許請
求の範囲第1項又は第2項記載の電気めつき方
法。
[Scope of Claims] 1. When electroplating a metal body, the plated metal body is electrolytically treated as a cathode in an electrolyte solution of a recovery electrolytic tank to which no post-plating metal is added. An electric device characterized in that the plating metal remaining in the plating liquid pumped out along with the plating metal body when the plating metal body is transferred from the plating tank to the recovery tank is deposited on the plating metal body. How to attach. 2. The electroplating method according to claim 1, wherein electrolysis is carried out in an electrolyte solution of the same type as the electrolyte solution for electroplating, to which no plating metal is added. 3. The electroplating method according to claim 1 or 2, in which a metal strip is continuously electroplated.
JP18102785A 1985-08-20 1985-08-20 Electroplating method Granted JPS6244591A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18102785A JPS6244591A (en) 1985-08-20 1985-08-20 Electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18102785A JPS6244591A (en) 1985-08-20 1985-08-20 Electroplating method

Publications (2)

Publication Number Publication Date
JPS6244591A JPS6244591A (en) 1987-02-26
JPH0510438B2 true JPH0510438B2 (en) 1993-02-09

Family

ID=16093485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18102785A Granted JPS6244591A (en) 1985-08-20 1985-08-20 Electroplating method

Country Status (1)

Country Link
JP (1) JPS6244591A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152489A (en) * 1981-03-13 1982-09-20 Furukawa Electric Co Ltd:The Manufacture of silver plated iron and iron alloy
JPS596393A (en) * 1982-07-01 1984-01-13 Nippon Kokan Kk <Nkk> Preparation of tin plated steel plate for welded can
JPS59145793A (en) * 1983-02-08 1984-08-21 Toppan Printing Co Ltd Partial silver plating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57152489A (en) * 1981-03-13 1982-09-20 Furukawa Electric Co Ltd:The Manufacture of silver plated iron and iron alloy
JPS596393A (en) * 1982-07-01 1984-01-13 Nippon Kokan Kk <Nkk> Preparation of tin plated steel plate for welded can
JPS59145793A (en) * 1983-02-08 1984-08-21 Toppan Printing Co Ltd Partial silver plating method

Also Published As

Publication number Publication date
JPS6244591A (en) 1987-02-26

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