JPH05102654A - Automatic solder repairing device for electrode terminal - Google Patents

Abstract

PURPOSE:To provide an automatic solder repairing device for electrode terminals which automatically repairs the solidified state of solder, joining electrode terminals to the electrodes of a board. CONSTITUTION:A bulb 11 having heating wires 9a-9c is arranged above a moving table 5 on which printed wiring boards 51 are to be put. Infrared rays 21 generated by a heating wire 9b are condensed by a convex lens 17 and heat a specified region 60b of an electrode terminal 55b. On the other hand, a nozzle moving device 47 moves a paste supply nozzle 31, a flux supply nozzle 35, or a solder sucking nozzle 39 to above the electrode terminal 55b on the basis of the positioning data of an abnormal electric terminal, and supply, shaping, or removal of solder is performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to automatic solder repair of electrode terminals for automatically repairing the solidified state of solder joining electrode terminals of electronic parts to electrodes provided on a substrate such as a printed wiring board. Regarding the device.

[0002]

2. Description of the Related Art Conventionally, electrode terminals protruding from an electronic component such as an integrated circuit are used by being soldered to electrodes provided on a substrate such as a printed wiring board. In this case, the solidified state of the solder that joins the electrode terminal and the electrode significantly affects the characteristics of the electronic circuit as follows. For example, if the amount of solder is too small and the electrode terminal and electrode are not joined sufficiently, contact failure between the electrode terminal and the electrode may occur. Conversely, if the amount of solder is too large, the solder may contact the electrode. If it spreads around the terminals, insulation failure may occur between adjacent electrodes. In addition, when the solder is solid in an irregular shape such as a ball, the solder may drop during use of the electronic circuit.

Therefore, the board after the soldering process is strictly inspected, and the solidified state of the solder is repaired one by one with a soldering iron with respect to the electrode terminal which is determined to have an abnormal solidified state. For example, when the amount of solder was too small, solder was added on the corresponding electrode, and the added solder was heated and melted with a soldering iron to firmly fix the electrode terminal to the electrode.

[0004]

However, such solder repair work is a fine manual work and requires skill. For this reason, in the present day when the circuit configuration of the electronic circuit is complicated, most of the production cost and working time related to the electronic circuit manufacturing may be spent on the solder repair work.

Therefore, the present invention has been made for the purpose of providing an automatic solder repair apparatus for electrode terminals, which is capable of automatically repairing the solidified state of the solder for joining the electrode terminals to the electrodes of the substrate.

[0006]

The invention according to claim 1 made to achieve the above object (hereinafter referred to as the first invention).
Is an automatic solder repair device for electrode terminals that repairs the solidified state of the solder that joins the electrode terminals of the electronic component to the electrodes on the board, and uses the position data of the electrode terminals where the solidified state of the solder is abnormal. Based on the above, by providing solder supplying means for individually supplying solder to the corresponding electrode terminals, and heating means for individually heating / melting the solder supplied to the corresponding electrode terminals, The invention is directed to an automatic solder repair device for an electrode terminal capable of replenishing solder, and the invention according to claim 2 (hereinafter referred to as a second invention) is to bond an electrode terminal of an electronic component to an electrode on a substrate. Of solder,
An automatic solder repair device for an electrode terminal that repairs a solidified state, based on position data of an electrode terminal in which the solidified state of solder is abnormal, a flux supply means for individually supplying a flux to the corresponding electrode terminal, By providing heating means for individually heating and melting the solder around the corresponding electrode terminals,
The invention is directed to an automatic solder repair device for an electrode terminal capable of shaping the solder around the corresponding electrode terminal, and the invention according to claim 3 (hereinafter, referred to as a third invention) is a substrate for an electrode terminal of an electronic component. An automatic solder repair device for an electrode terminal that repairs the solidified state of the solder that is joined to the upper electrode, and the solder around the corresponding electrode terminal is based on the position data of the electrode terminal where the solidified state of the solder is abnormal. An electrode that can remove excess solder around the electrode terminals by providing heating means for individually heating and melting the solder and solder suction means for sucking and removing the solder that is heated and melted by the heating means. The main point is an automatic solder repair device for terminals.

[0007]

In the automatic solder repairing apparatus of the first aspect of the invention configured as described above, the solder supplying means individually supplies the solder to the electrode terminals in which the solidified state of the solder is abnormal, and the heating means removes the supplied solder. Heat and melt. This makes it possible to replenish the electrode terminals with solder and firmly bond the electrode terminals to the electrodes on the substrate.

Further, in the automatic solder repair apparatus of the second invention, the flux supplying means individually supplies the flux to the corresponding electrode terminals based on the data of the electrode terminal positions where the solidified state of the solder is abnormal, and heats the heating. The means individually heats and melts the solder around the electrode terminals. The solder melted in the presence of the flux has improved fluidity, so that the solder is smoothly shaped around the electrode terminal.

Further, in the automatic solder repair apparatus of the third invention, the heating means individually heats and melts the solder around the electrode terminals in which the solidified state of the solder is abnormal, and the solder suction means is heated by the heating means and melted. Suction and remove the solder that has been used. As a result, excess solder around the electrode terminals can be removed.

[0010]

Embodiments of the present invention will now be described with reference to the drawings.
FIG. 1 is a schematic configuration diagram showing an automatic solder repair apparatus 1 of the embodiment. The automatic solder repair apparatus 1 of the present embodiment includes the solder 37 (see FIG. 4) for joining the IC board 53 to the printed wiring board 51.
After the solidified state (see (A)) is inspected by an automatic inspection device 49 described later, the printed wiring board 51 is placed on the moving table 3 for use.

The rectangular plate-shaped movable table 3 is constructed so as to be movable in the X-axis and Y-axis directions parallel to the surface thereof, and the movable table 3 is provided on the side surface thereof via shafts 5x and 5y, respectively. Moving devices 7x and 7y for moving in the axial direction are provided. The moving devices 7x and 7y are respectively connected to the control circuit ECU and driven by the drive signal output from the control circuit ECU.

Above the moving table 3, there are three heating wires 9
A tube 11 as a heating means is provided in which a, 9b, and 9c are arranged in parallel in the Y-axis direction at predetermined intervals. This heating wire 9
One ends of a to 9c are connected to the ground electrode 13, and the other ends thereof are connected to the pulse current generator 15, respectively. The pulse current generator 15 is also connected to the control circuit ECU, and the control circuit EC
Heating wires 9a-9 designated by the drive signal output by U
A pulse current is applied only to c. The inside of the tube 11 is evacuated to prevent the heating wires 9a to 9c from being oxidized when they generate heat. Further, the infrared rays generated by the heating wires 9a to 9c are condensed between the heating wires 9a to 9c and the moving table 3 to obtain I
A convex lens 17 for reducing and projecting is provided on the electrode terminals 55a, 55b, 55c of the C substrate 53.

On the other hand, at a position adjacent to the convex lens 17, a paste supply nozzle 31 as a solder supply means for supplying a solder / adhesive flux mixed paste 29 (hereinafter abbreviated as paste 29: see FIG. 3B) from the tip, a tip. A flux supply nozzle 35 as a flux supply means for supplying the cleaning flux 33 (see FIG. 4B) from the above, and a solder suction nozzle 39 as a solder suction means for sucking and removing the molten solder 37 are provided respectively. Has been done. Here, the cleaning flux 33 enhances the fluidity of the melted paste 29 and, at the time of soldering, the electrode terminal 55 and the electrode 57.
It is a flux that has the function of melting the oxide film formed on the surface.

Further, each of these nozzles 31, 35, and 3
9 is connected to a nozzle moving device 47 via arms 41, 43, and 45. The nozzle moving device 47 uses the drive signal from the control circuit ECU to output each of the nozzles 31 to 39.
Is moved to a designated place on the printed wiring board 51.

Further, the control circuit ECU inspects the solidified state of the solder 37 of each electrode terminal 55 by image processing, and the positional data of the electrode terminal 55 in which the solidified state of the solder 37 is abnormal is classified into three types of abnormalities described later. An automatic inspection device 49 (for example, a soldering appearance inspection device VI-3000 manufactured by NEC Corporation) that classifies and detects modes A, B, and C is connected.

Next, the operation of the automatic solder repairing apparatus 1 thus constructed will be described with reference to FIGS. The printed wiring board 51, on which the solidified state of the solder 37 has been inspected by the automatic inspection device 49, is placed at a predetermined position on the moving table 3 and the IC board 53
When the adjacent electrode terminals 55a to 55c are mounted so as to be aligned in the Y-axis direction and the automatic solder repair apparatus 1 is driven, the control circuit ECU starts the automatic solder repair processing illustrated in the flowchart of FIG.

When the processing is started, first in S01, the position data of the electrode terminal (probably the electrode terminal 55b) where the solidified state of the solder 37 is abnormal and the abnormal mode thereof are read from the inspection result of the automatic inspection device 49. In subsequent S03, the moving devices 7x and 7y are driven based on the position data, and the moving table 3 is moved so that the electrode terminal 55b is directly below the heating wire 9b located in the center of the convex lens 17.

When the movement of the movable table 3 is completed and the process proceeds to S05, the abnormal mode of the electrode terminal 55b read in S01 is determined, and if it is the mode A, the process proceeds to S07 and the mode B.
If it is, go to S09, and if it is mode C, go to S1.
To 1 respectively. Mode A is a mode in which there is a possibility that the electrode terminal 55b may have a contact failure due to no solder or lack of solder as illustrated in FIG. When the control circuit ECU determines that the abnormal mode of the electrode terminal 55b is the mode A and proceeds to S07, the control circuit ECU drives the nozzle moving device 47 to move the paste supply nozzle 31 near the tip of the electrode terminal 55b. In the subsequent S13, FIG.
As illustrated in (B), the paste 29 is supplied from the tip of the paste supply nozzle 31 to the vicinity of the tip of the electrode terminal 55b. When the supply of the paste 29 is completed and the process proceeds to S15, the control circuit ECU drives the pulse current generator 15,
A pulse current is passed through the heating wire 9b to generate infrared rays 21 as shown by the alternate long and short dash line in FIG.

Then, the infrared image of the heating wire 9b is reduced by the ratio of the distance between the convex lens 17-electrode terminal 55b and the distance between the heating wire 9b-convex lens 17 to the electrode terminal 5 at a reduction ratio.
It is projected on a predetermined area 60b of 5b. As a result, the solder 37 contained in the paste 29 through the electrode terminal 55b.
Is heated and melted, and spreads between the tip of the electrode terminal 55b and the electrode 57b of the printed wiring board 51 as illustrated in FIG. Therefore, the electrode terminal 55b is replenished with the solder 37 and firmly fixed to the electrode 57b. Since the intervals between the heating wires 9a, 9b, 9c are also projected at the same reduction ratio, the heating wires 9a, 9c can be adjusted by adjusting the height of the convex lens 17.
Infrared image of the predetermined area 60 on the electrode terminals 55c, 55a
c. It can be projected on 60a. Therefore, when the solidified state of the solder 37 is abnormal also in the electrode terminals 55a and 55c, it is possible to repair them at the same time by making such an adjustment.

When S15 ends and the process proceeds to S17, it is determined whether or not all the electrode terminals 55 for which the solidified state of the solder 37 is determined to be abnormal by the automatic inspection device 49 have been repaired. If there is an electrode terminal 55 that has not been repaired yet, the process proceeds to S03 and the electrode terminal 55 is connected to the heating wire 9b.
It is arranged immediately below and performs the same processing.

On the other hand, if it is determined in S05 that the abnormal mode is the mode B, the process proceeds to S09. The mode B is
As illustrated in FIG. 4 (A), the solder 37 is solidified in a shape such as a ball that easily falls off. After shifting to S09, the control circuit ECU drives the nozzle moving device 47 to move the flux supply nozzle 35 near the tip of the electrode terminal 55b. In subsequent S19, as illustrated in FIG. 4B, the cleaning flux 33 is supplied from the tip of the flux supply nozzle 35 to the vicinity of the tip of the electrode terminal 55b.

When the supply of the cleaning flux 33 is completed, the process proceeds to S15, and the heating wire 9b is energized as described above. Then, the solder 37 that has become a ball and solidified is heated and melted, and the molten solder 37 has improved fluidity due to the action of the cleaning flux. The cleaning flux also has a function of dissolving the oxide film on the surfaces of the electrode terminals 55b and the electrodes 57b. Therefore, the molten solder 37
Then, the affinity with the surfaces of the electrode terminals 55b and the electrodes 57b is improved, and the solder 37 spreads smoothly between the tips of the electrode terminals 55b and the electrodes 57b, as illustrated in FIG. 4C.
Therefore, the solder 37 is shaped and the electrode terminal 55b is connected to the electrode 57.
It can be firmly fixed to b.

When it is determined in S05 that the abnormal mode is the mode C, the process proceeds to S11. The mode C is
As illustrated in FIG. 5A, extra solder 37 is attached around the electrode terminals 55b, and the solder 37 must be removed and then re-sold again. After shifting to S11, the control circuit ECU drives the nozzle moving device 47 to move the flux supply nozzle 35 near the tip of the electrode terminal 55b. In the subsequent S21, FIG.
As illustrated in (B), the cleaning flux 3 from the tip of the flux supply nozzle 35 to the vicinity of the tip of the electrode terminal 55b.
Supply 3.

When the supply of the cleaning flux 33 is completed, the process proceeds to S23, the control circuit ECU drives the nozzle moving device 47 again, and this time moves the solder suction nozzle 39 to the vicinity of the tip of the electrode terminal 55b. In the subsequent S25, FIG.
As illustrated in (C), a pulse current is applied to the heating wire 9b to heat and melt the solder 37, while the solder suction nozzle 39 is driven to suck and remove the melted solder 37. When the solder 37 is removed, the solidified state of the solder 37 of the electrode terminal 55b becomes the same as that in FIG. 3A. Therefore, the process proceeds to S07, the paste supply nozzle 31 is moved, and then the process proceeds to S13 and the paste 29 is removed. Is supplied (FIG. 5 (D)), and further S1
5 and the solder 37 contained in the paste 29 is heated and melted (FIG. 5 (E)). As a result, the electrode terminal 55b is firmly fixed to the electrode 57b.

When all the electrode terminals 55 judged to be abnormal by the automatic inspection device 49 are repaired by repeating the above-mentioned processing, an affirmative judgment is made in S17 and the processing is ended.
Thus, in the automatic solder repair apparatus 1 of this embodiment, the solder 3
If the amount of 7 is insufficient, replenish the solder 37 and solder 3
If the solder 7 is solidified in a shape that is likely to be lost, the solder 37 can be shaped, and if excess solder 37 is attached, the solder 37 can be removed once and re-soldering can be performed again.
Therefore, various solidified states of the solder 37 can be automatically repaired to prevent contact failure between the electrode terminal 55 and the electrode 57 and insulation failure between the adjacent electrode terminals 55.

In the above embodiment, the cleaning flux 33 is supplied to the solder 37 to be removed in S11 and S21,
Although the fluidity of the melted solder 37 is improved so that the solder 37 can be removed better, the solder 37 may be directly heated and melted without being supplied with the cleaning flux 33 to be removed. ..

In the above embodiment, various nozzles 31, 3 are used.
Although the nozzles 5, 35 and 39 are moved through the arms 41, 43 and 45, the nozzles 31, 35 and 39 can be moved by various methods such as providing a rail above the moving table 3 to move the rail. Can be made Further nozzle 31
˜39 may be fixed at a predetermined position above the moving table 3, and in this case, the moving devices 7x and 7y are driven to solder 37
The electrode terminal 55 to be repaired for the solidified state of the nozzle 3
It may be moved to the bottom of 1 to 39.

On the other hand, in the above embodiment, the automatic inspection device 49 detects the position data of the electrode terminal 55 in which the solidified state of the solder 37 is abnormal.
It is not necessary to use 9. For example, the solidified state of the solder 37 may be visually inspected, and the position data may be input individually from a keyboard or the like.

[0029]

As described above in detail, in the automatic solder repair apparatus of the first invention, the electrode terminals whose solder solidification state is abnormal can be replenished with solder and firmly fixed to the electrodes on the substrate. .. For this reason, it is possible to satisfactorily prevent the occurrence of contact failure by automatically replenishing the electrode terminals, which may cause contact failure due to insufficient solder.

Further, in the automatic solder repairing apparatus of the second invention, the solder having an abnormal solidified state can be smoothly shaped around the electrode terminals. Therefore, it is possible to automatically prevent the solder solidified in a shape such as a ball that is likely to be dropped into a smooth shape and prevent the solder from being dropped.

Further, in the automatic solder repairing apparatus of the third invention, since excess solder around the electrode terminals can be removed,
For example, excess solder that may cause insulation failure between terminals can be automatically removed, and the insulation failure can be effectively prevented.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an automatic solder repair apparatus according to an embodiment.

FIG. 2 is a flowchart showing an automatic solder repair process of the embodiment.

FIG. 3 is an explanatory diagram illustrating a process of automatic solder repair processing relating to mode A.

FIG. 4 is an explanatory diagram showing a process of automatic solder repair processing relating to mode B.

FIG. 5 is an explanatory diagram showing a process of automatic solder repair processing relating to mode C.

[Explanation of symbols]

D 1 ... Automatic solder repair device 3 ... Moving table
7x, 7y ... Moving device 9a, 9b, 9c ... Heating wire 11 ... Tube
15 ... Pulse current generator 17 ... Convex lens 49 ... Automatic inspection device
ECU ... Control circuit 51 ... Printed wiring board 53 ... IC board
55 ... Electrode terminal 57 ... Electrode 29 ... Solder / adhesive flux mixed paste 31 ... Paste supply nozzle 33 ... Cleaning flux 35 ... Flux supply nozzle 37 ... Solder
39 ... Solder suction nozzle 47 ... Nozzle moving device

Claims (3)

[Claims] 1. An automatic solder repair apparatus for an electrode terminal, which repairs a solidified state of a solder joining an electrode terminal of an electronic component to an electrode on a substrate, the electrode terminal having an abnormal solidified state of the solder. Based on the position data, solder supplying means for individually supplying solder to the corresponding electrode terminals, and individually heating and supplying the solder supplied to the corresponding electrode terminals.
An automatic solder repair device for an electrode terminal, which is provided with a heating means for melting so as to refill the corresponding electrode terminal with solder. 2. An automatic solder repair apparatus for an electrode terminal, which repairs a solidified state of a solder joining an electrode terminal of an electronic component to an electrode on a substrate, the electrode terminal having an abnormal solidified state of the solder. Based on the position data, the flux supply means for individually supplying the flux to the corresponding electrode terminals, and the heating means for individually heating / melting the solder around the corresponding electrode terminals are provided. Automatic solder repair device for electrode terminals that can shape solder around electrode terminals. 3. An automatic solder repair apparatus for an electrode terminal, which repairs a solidified state of a solder joining an electrode terminal of an electronic component to an electrode on a substrate, the electrode terminal having an abnormal solidified state of the solder. By providing heating means for individually heating / melting the solder around the corresponding electrode terminal based on the position data, and solder suction means for sucking / removing the solder heated and melted by the heating means, the electrode is provided. Automatic solder repair device for electrode terminals that can remove excess solder around the terminals.