JPH05102369A - Dust collecting unit and method for lead processing die - Google Patents

Abstract

PURPOSE:To monitor dust collecting condition to detect clogging of resin dust, resin powder and tie bar dust in a dust collecting duct or dust shoot. CONSTITUTION:A lower metal die 24 of a lead processing die 22 is provided with an exhaust port 27 witin the metal die and the lower part of the exhaust port 27 is provided with a dust collecting duct 29. Resin dust 25a and tie bar dust 26 are guided to a dust shoot 30, while a resin dust 25b to a duct hose 35, respectively. The end part of a branching pipe 36 branched from the duct hose 35 is provided with an air filter 37, while the intermediate part thereof is provided with a wind velocity monitor 38.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dust collecting unit for collecting resin and tie bar scraps generated when a lead of a resin-molded semiconductor device lead frame is formed into a predetermined shape.

[0002]

2. Description of the Related Art FIG. 2 is a front view of a dust collecting unit for a conventional die for a semiconductor device. In the figure, 1
Is a resin-molded lead frame, and 2 is a die for molding the leads of the semiconductor product 1a on the lead frame 1 into a predetermined shape by the die 4 into which the lead frame 1 is placed and which is the upper die 3. is there. During lead molding processing,
Resin scrap 5a and resin powder 5b generated from the lead frame 1
And the tie bar scraps 6 are naturally dropped from the in-mold discharge port 7 provided in the lower mold 4 into the dust collecting duct 9 and the cassute 10 mounted immediately below the press surface plate 8,
It is dropped and stored in the waste container box 12 installed on the device stand 11. Resin waste 5 stored in the waste box 12
a, the resin powder 5b, and the tie bar scraps 6
The dust in the dust receiving box 12 is removed at regular intervals depending on the storage capacity of the waste.

[0003]

The conventional dust collecting unit for the lead processing die of the semiconductor device is constructed as described above, and the resin dust, the resin powder, and the tie bar dust are collected in the dust collecting duct and the chute. Since the product is simply dropped by itself and stored, it cannot be detected when dust clogging occurs in the dust collection duct or dregs chute, and it can be used as it is without discharging the lower die. Accumulation of scraps up to the outlet may cause damage to the face of the mold, and further causes a phenomenon of burr driving into a semiconductor product. The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is resin scrap,
An object of the present invention is to provide a dust collection unit that can monitor a dust collection state by a monitor when resin dust and tie bar dust are clogged in the dust collection duct or the dust chute. Another object of the present invention is to provide a dust collecting unit having an improved dust collecting force due to the synergistic effect of down-blowing from the upper die and absorbing dust from the dust collector.

[0004]

In order to achieve these objects, a dust collection unit for a lead processing die according to the present invention is a lead processing die for lead forming a lead frame of a resin-molded semiconductor device. Resin waste or tie bar scraps generated during the lead forming process in the above, and a dust chute for collecting resin scraps and tie bar scraps, a dust collector communicating with the end of this dust chute, and a resin powder branched from the scraps. A collecting duct hose, a dust collector communicating with the end of the duct hose, a net for preventing the resin dust and tie bar dust from entering to cover the entrance of the duct hose, and a dust collecting monitor installed in the middle of the duct hose. It is equipped with. Further, the lead processing die dust collecting unit according to the present invention is provided with a down blow pipe and a high-pressure gas outlet communicating with the pipe in an upper die of the lead processing die, and a lower die. The mold is equipped with a discharge port communicating with the above-mentioned chute. Further, a dust collecting method for a lead molding die according to the present invention is a method for removing resin scraps or tie bar scraps generated during lead molding processing in a lead molding die for lead molding processing of a resin-molded lead frame of a semiconductor device. A method of collecting in a dust collecting unit, in which resin scraps and tie bar scraps are sucked into a dust chute, resin dust is sucked into a duct hose branched from the dust chute, and the air flow in the duct hose is measured. By doing so, it is possible to detect clogging in the dregs chute and the duct hose.

[0005]

In the present invention, when clogging of the dregs hose or the duct hose occurs, the air flow in the duct hose is reduced or stopped, and it is recognized by the dust collection monitor. Further, by providing high-pressure gas blowing means for down-blowing also in the lead molding die, resin dust, resin powder, and tie bar dust are forcibly discharged to the dust collecting unit side.

[0006]

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a dust collecting unit for a lead molding die of a semiconductor device according to the present invention. In the figure, when the resin-molded lead frame 21 of the semiconductor device is put into the lead processing die 22, the leads of the individual semiconductor products 21a are formed into a predetermined shape by the upper die 23 and the lower die 24. Molded. Larger resin scraps 25a or tie bar scraps 26 generated from the lead frame 21 at the time of this lead molding process are installed and fixed directly below the press surface plate 28 from the in-mold discharge port 27 drilled in the lower mold 24 and fixed. After passing through 29 and the waste chute 30, the waste is received in a waste receiving box 32 installed on the device stand 31. The waste box 32 is
The connection part with the waste chute 30 is sealed by the upper cover 32a, and the device mount 3 for the resin scrap 25a and the tie bar scrap 26 is mounted.
It is prevented from scattering to 1.

On the other hand, the fine resin powder 25b is branched at the upper portion of the dregs chute 30, and the entrance of the branched portion is sucked by the duct hose 35 covered with the net 33. The dust collector 34 installed in the device rack 31 is connected to the end of the duct hose 35. An air filter 37 is installed at the end of the branch pipe 36 branched from the duct hose 35 so as to prevent dust from entering from the outside, and a wind speed monitor 38 for measuring the flow of air is provided in the middle of the branch pipe 36. Is installed.

A blow pipe 39 for supplying air from the outside is provided inside the upper mold 23 of the lead processing mold 22, and the air is supplied to the mold discharge port 27 of the lower mold 24. To force a flow of air towards
Resin scraps 25 generated on the lead frame 21 or the structure display
The a, the resin powder 25b and the tie bar 26 are surely discharged to the dust collecting duct 29. In addition to the above effects, static electricity can also be prevented by blowing ions for static electricity prevention from the blow pipe 39 instead of air.

Next, in the above structure, the resin scrap 25a,
The flow of the resin powder 25b and the tie bar 26 and the operation of the wind speed monitor will be described. The discharged dust discharged from the mold outlet 27 of the lower mold 24 is collected by the dust collecting duct 29,
The dust is sucked downward by the duct hose 35 and the dust collector 34, but only the fine resin powder 25b is sucked into the dust collector 34 by the net 33 installed at the branch portion between the duct hose 35 and the dust chute 30. Remaining resin waste 2
5a and the tie bar waste 26 are stored in the waste box 32. On the other hand, by grasping the wind speed at which the external air flows into the dust collector 34 through the air filter 37 by the wind speed monitor 38, it is possible to detect the condition of clogging of the dregs chute 30 or the duct hose 35 and notify the outside. ..

[0010]

As described above, according to the present invention, the clogging of the dregs in the chute and the duct hose can be grasped by the wind speed monitor installed in the branch pipe, so that the clogging of the dregs can be detected early. It is possible to prevent damage to the face due to clogging of debris. In addition, since the upper mold is down blown toward the lower mold, and the dust collector collects dust inside the dust collecting duct, the burr driving phenomenon that occurs during lead molding processing can be eliminated, and therefore high quality semiconductors can be manufactured. There is an effect that can be done.

[Brief description of drawings]

FIG. 1 is a front view of a dust collecting unit for a lead molding die of a semiconductor device according to the present invention.

FIG. 2 is a front view of a dust collecting unit for a lead molding die of a conventional semiconductor device.

[Explanation of symbols]

 21 lead frame 22 lead processing mold 25a resin scrap 25b resin powder 26 tie bar scrap 27 die discharge port 30 scrap chute 33 net 35 duct hose 36 branch pipe 37 air filter 38 wind speed monitor 39 blow piping

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[Procedure amendment]

[Submission date] July 30, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Correction content]

[0002]

2. Description of the Related Art FIG. 2 is a front view of a conventional dust collecting unit for a lead processing die of a semiconductor device. In the figure, 1
The lead frame is resin-molded, 2 in a mold for molding a lead of each semiconductor product 1a on the lead frame 1 into a predetermined shape by the upper die 3 and the lower mold 4 lead frame 1 is turned is there. During the lead forming process, resin scraps 5a, resin powders 5b, and tie bar scraps 6 generated from the lead frame 1 are collected from the in-mold discharge port 7 provided in the lower mold 4 just below the press surface plate 8. In the dust duct 9 and the dust chute 10 in a state of being naturally dropped, they are dropped and stored in the dust receiving box 12 installed on the apparatus stand 11. Resin scraps 5a stored in the waste box 12
The resin powder 5b and the tie bar scraps 6 remove the scrap scraps in the scrap scrap box 12 at regular intervals depending on the storage capacity of the scrap catch box 12.

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0003

[Correction method] Change

[Correction content]

[0003]

The conventional dust collecting unit for the lead processing die of the semiconductor device is constructed as described above, and the resin dust, the resin powder, and the tie bar dust are collected in the dust collecting duct and the chute. Since the product is simply dropped by itself and stored, it cannot be detected when dust clogging occurs in the dust collection duct or dregs chute, and it can be used as it is without discharging the lower die. When scum to the outlet is accumulated, could result in damage to the cutting edge of the mold, further burr driving behavior of the semiconductor products there is a problem that occurs. The present invention has been made in view of the above-mentioned conventional problems, and an object thereof is resin scrap,
An object of the present invention is to provide a dust collection unit that can monitor a dust collection state by a monitor when resin dust and tie bar dust are clogged in the dust collection duct or the dust chute. Another object of the present invention is to provide a dust collecting unit having an improved dust collecting force due to the synergistic effect of down-blowing from the upper die and absorbing dust from the dust collector.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0005

[Correction method] Change

[Correction content]

[0005]

In the present invention, when clogging of the dregs hose or the duct hose occurs, the air flow in the duct hose is reduced or stopped, and it is recognized by the dust collection monitor. Further, by the Turkey a means balloon pressure gas down-blow in the lead forming die, resin scrap, the resin powder and tie bar scrap it is forcibly discharged to the dust collecting unit side.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0007

[Correction method] Change

[Correction content]

On the other hand, the fine resin powder 25b is branched at the upper portion of the dregs chute 30, and the entrance of the branched portion is sucked by the duct hose 35 covered with the net 33. At the end of the duct hose 35, the dust collector 34 installed in the apparatus rack base 31 are connected. An air filter 37 is installed at the end of the branch pipe 36 branched from the duct hose 35 so as to prevent dust from entering from the outside, and a wind speed monitor 38 for measuring the flow of air is provided in the middle of the branch pipe 36. Is installed.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Correction target item name] 0008

[Correction method] Change

[Correction content]

A blow pipe 39 for supplying air from the outside is provided inside the upper mold 23 of the lead processing mold 22, and the air is supplied to the mold discharge port 27 of the lower mold 24. To force a flow of air towards
Resin scrap 25 generated during processing and molding of the lead frame 21
The a, the resin powder 25b, and the tie bar scraps 26 are surely discharged to the dust collecting duct 29. In addition to the above effects, static electricity can also be prevented by blowing ions for static electricity prevention from the blow pipe 39 instead of air.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

Next, in the above structure, the resin scrap 25a,
The flow of the resin powder 25b and the tie bar scraps 26 and the operation of the wind speed monitor will be described. The discharged dust discharged from the mold outlet 27 of the lower mold 24 is collected by the dust collecting duct 2
9, the duct hose 35 and the dust collector 34 suck dust downward, but the duct hose 35 and the dust chute 30
Only the fine resin powder 25b is sucked into the dust collector 34 by the net 33 installed at the branch portion of the. The remaining resin scraps 25a and the tie bar scraps 26 are stored in the scrap receiving box 32. On the other hand, by grasping the wind speed at which the external air flows into the dust collector 34 through the air filter 37 by the wind speed monitor 38, it is possible to detect the condition of clogging of the dregs chute 30 or the duct hose 35 and notify the outside. .

[Procedure Amendment 7]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

[0010]

According to the present invention as described in the foregoing, discover Kas clogging within Kas chute and the duct hoses since to be able to grasp the wind Hayamo Nita installed in the branch pipe, the dregs clogging early can, it is possible to prevent damage to the cutting edge due to debris clogging. In addition, since the upper mold is down blown toward the lower mold, and the dust collector collects dust inside the dust collecting duct, the burr driving phenomenon that occurs during lead molding processing can be eliminated, and therefore high quality semiconductors can be manufactured. There is an effect that can be done.

Claims (3)

[Claims] 1. A dust collecting unit for collecting resin scraps or tie bar scraps generated at the time of lead molding processing with a lead processing die for lead molding processing of a resin-molded lead frame of a semiconductor device. A dust chute for collecting wastes, a dust collector communicating with the end of the dust chute, a duct hose for collecting resin powder branched from the dust chute, a dust collector communicating with the end of the duct hose, and an inlet of the duct hose. A dust collecting unit for a lead processing die, comprising: a net for preventing the resin dust and tie bar dust from entering to cover the dust; and a dust collecting monitor installed in the middle of the duct hose. 2. The dust collection unit for a lead processing die according to claim 1, wherein a down blow pipe and a high-pressure gas outlet communicating with the pipe are provided in an upper die of the lead processing die. At the same time, a dust collecting unit for a lead processing die is provided in the lower die, which is provided with an outlet communicating with the dregs chute. 3. A method of collecting resin scraps or tie bar scraps, which are generated during lead molding processing in a lead processing die for lead molding processing of a resin-molded lead frame of a semiconductor device, into a dust collecting unit. Dust is collected from the tie bar scraps on the chute, and resin dust is collected on the duct hose branched from the chute,
A dust collecting method for a lead processing die, wherein clogging in the dregs chute and in the duct hose is detected by measuring an air flow in the duct hose.