JPH05102166A - Semiconductor manufacturing apparatus - Google Patents

Abstract

PURPOSE:To obtain a semiconductor manufacturing apparatus whose working accuracy inside a face is high by a method wherein the unevenness inside the face in the working operation of a semiconductor-material substrate is eliminated by partially changing the temperature of a substrate-mounting stand on which the semiconductor-material substrate is mounted. CONSTITUTION:This apparatus is constituted in the following manner: the inside of a substrate-mounting stand 2 installed inside a treatment chamber 1 is divided into a plurality of divided chambers 2a, 2b by dividing walls 4; a medium such as pure water or the like whose temperature has been controlled variously is introduced into each of them; and a temperature can be changed partially differently. Thereby, when there exists the difference in a working state between the peripheral part and the central part of a semiconductor-material substrate, the medium whose temperature is different at the peripheral part and in the central part is introduced, and the difference is eliminated by changing the temperature. Thereby, it is possible to enhance the working accuracy of the apparatus inside the face of the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for mounting and processing a semiconductor material substrate on a substrate mounting table.

[0002]

2. Description of the Related Art FIGS. 4 (a) and 4 (b) are views showing a conventional semiconductor manufacturing apparatus of this type, FIG. 4 (a) is a front view showing the overall structure, and FIG. It is the top view which expanded and showed the cross section by the CC line of (a). In FIG. 4, reference numeral 1 is a processing chamber in which a substrate mounting base 2 on which a semiconductor material substrate (not shown) is placed is installed. A temperature controller 3 controls the temperature of the board mounting base 2. Reference numeral 5 denotes a piping port provided on the substrate mounting table 2 through which a medium such as pure water is supplied to control the temperature of the substrate mounting table 2.

Next, the operation will be described. A medium such as pure water whose temperature is controlled by the temperature controller 3 is introduced from a pipe connected to a pipe port 5 provided in the substrate mounting table 2 to process the semiconductor material substrate on the substrate mounting table 2. The temperature rise is prevented and the entire surface of the substrate is kept at a constant temperature.

[0004]

Since the conventional semiconductor manufacturing apparatus is constructed as described above, a temperature difference is generated between the outer peripheral portion and the central portion of the semiconductor material substrate or in a certain portion, which causes uneven processing. Even if the surface becomes non-uniform due to a difference in state, there is a problem that it is difficult to control this.

The present invention has been made in order to solve the above problems, and it is possible to partially change the temperature of the semiconductor material substrate to improve the uniformity of the processing state, and to optimize the processing conditions. The object is to obtain a semiconductor manufacturing apparatus that can be realized.

[0006]

A semiconductor manufacturing apparatus according to the present invention divides the inside of a substrate mounting table into a required number of division chambers,
The configuration is such that media of different temperatures are introduced into the plurality of divided chambers.

[0007]

According to the present invention, the substrate mounting table is divided into a plurality of divided chambers, and mediums having different temperatures are introduced into the respective divided chambers to form the substrate mounting table having partially different temperatures. In the portion where the difference in the processing state of the material substrate is remarkable in the surface, the difference in the processing speed caused by the temperature difference cancels the original difference, so that the processing accuracy of the entire surface is improved. Also, depending on the distribution of in-plane differences due to processing,
It is possible to deal with this by changing the shape of dividing the inside of the board mounting base.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. 1 (a) to 1 (c) are views showing an embodiment of a semiconductor manufacturing apparatus of the present invention, FIG. 1 (a) is a front view showing the entire structure, and FIG. 1 (b) is FIG. 1 (a). FIG. 1C is a top view showing an enlarged cross section taken along line AA of FIG.
It is a sectional view taken along the line B. In FIG. 1, 3a and 3b
Is a temperature controller, which is provided corresponding to the number of divisions of the board mounting base 2 shown in FIG. Reference numeral 4 denotes a dividing wall for dividing the substrate mounting base 2 into peripheral chambers and central dividing chambers 2a and 2b.

In the semiconductor manufacturing apparatus configured as described above, the in-plane difference in the processed state is remarkable between the peripheral portion and the central portion, whereas the peripheral divided chamber 2b and the central divided chamber are different from each other. Since the temperature of the substrate mounting table 2 can be controlled separately by 2a, it is possible to control the processing speed according to the temperature, eliminate the in-plane difference of the semiconductor material substrate, and improve the processing accuracy.

In the above embodiment, the substrate mounting base 2 is divided into a peripheral portion and a central portion so that the difference between the peripheral portion and the central portion of the semiconductor material substrate can be made uniform. The present invention is not limited to this, and, for example, as shown in FIG.
By dividing the inside of the substrate mounting base 2 into two by the linear dividing wall 4a, it is possible to make the distribution of the semiconductor substrate material uniform in a certain direction in a plane.

Further, the in-plane machining state distribution is complicated and
When the division is not sufficient, as shown in FIG. 3, the division can be further performed by another division wall 4b to form a plurality of division chambers 2a to 2c, whereby the accuracy can be further improved. The number of divisions is not limited to that in each of the above embodiments, and the same effect can be obtained even if the number of divisions is four or more.

[0012]

As described above, according to the present invention,
By dividing the substrate mounting table on which the semiconductor material substrate is placed into the required number of dividing chambers of an appropriate shape, the temperature can be partially adjusted to different temperatures, so that the processing uniformity of the semiconductor material substrate can be improved. It has the effect of finishing with high precision.

[Brief description of drawings]

FIG. 1 is a diagram showing a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a sectional top view showing another embodiment of the substrate mounting base of the present invention.

FIG. 3 is a sectional top view showing still another embodiment of the substrate mounting base of the present invention.

FIG. 4 is a diagram showing a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 processing chamber 2 substrate mounting base 3a temperature controller 3b temperature controller 4 dividing wall 4a dividing wall 4b dividing wall 5 piping port

Continuation of the front page (51) Int.Cl. ⁵ Identification code Office reference number FI technical display location H01L 21/31 B 8518-4M

Claims (1)

[Claims] 1. In a semiconductor manufacturing apparatus, which is installed in a processing chamber and mounts and processes a semiconductor material substrate on a substrate mounting base whose temperature is controlled by a medium, the substrate mounting base is divided into a plurality of dividing chambers by dividing walls. 2. A semiconductor manufacturing apparatus, characterized in that the substrate is divided into parts, and a medium having a different temperature is introduced into each of the divided chambers to form a substrate mounting table having a partially different temperature.