JPH0499541U - - Google Patents

Info

Publication number
JPH0499541U
JPH0499541U JP186591U JP186591U JPH0499541U JP H0499541 U JPH0499541 U JP H0499541U JP 186591 U JP186591 U JP 186591U JP 186591 U JP186591 U JP 186591U JP H0499541 U JPH0499541 U JP H0499541U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP186591U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP186591U priority Critical patent/JPH0499541U/ja
Publication of JPH0499541U publication Critical patent/JPH0499541U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)
JP186591U 1991-01-25 1991-01-25 Pending JPH0499541U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP186591U JPH0499541U (enExample) 1991-01-25 1991-01-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP186591U JPH0499541U (enExample) 1991-01-25 1991-01-25

Publications (1)

Publication Number Publication Date
JPH0499541U true JPH0499541U (enExample) 1992-08-27

Family

ID=31729546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP186591U Pending JPH0499541U (enExample) 1991-01-25 1991-01-25

Country Status (1)

Country Link
JP (1) JPH0499541U (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130933A (en) * 1980-03-18 1981-10-14 Nec Corp Wire bonding device
JPH0296342A (ja) * 1988-09-30 1990-04-09 Mitsubishi Electric Corp ワイヤボンド装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56130933A (en) * 1980-03-18 1981-10-14 Nec Corp Wire bonding device
JPH0296342A (ja) * 1988-09-30 1990-04-09 Mitsubishi Electric Corp ワイヤボンド装置

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19970212