JPH0499198A - Method for electrolytically dissolving metallic nickel for nickel plating bath - Google Patents
Method for electrolytically dissolving metallic nickel for nickel plating bathInfo
- Publication number
- JPH0499198A JPH0499198A JP20750590A JP20750590A JPH0499198A JP H0499198 A JPH0499198 A JP H0499198A JP 20750590 A JP20750590 A JP 20750590A JP 20750590 A JP20750590 A JP 20750590A JP H0499198 A JPH0499198 A JP H0499198A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating bath
- anode
- metallic
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 125
- 229910052759 nickel Inorganic materials 0.000 title claims description 59
- 238000000034 method Methods 0.000 title claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 238000011978 dissolution method Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000004090 dissolution Methods 0.000 abstract description 6
- 238000002161 passivation Methods 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000003011 anion exchange membrane Substances 0.000 description 2
- 229910000008 nickel(II) carbonate Inorganic materials 0.000 description 2
- ZULUUIKRFGGGTL-UHFFFAOYSA-L nickel(ii) carbonate Chemical compound [Ni+2].[O-]C([O-])=O ZULUUIKRFGGGTL-UHFFFAOYSA-L 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- -1 plates Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、金属ニッケルの電解溶解方法、詳しくはニッ
ケルメッキ洛中の消耗したニッケル濃度を金属ニッケル
の電解溶解により向上させる方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for electrolytically dissolving metallic nickel, and more particularly to a method for improving the nickel concentration in a nickel plating solution by electrolytically dissolving metallic nickel.
［従来技術］
ニッケルメッキ又はニッケル合金メッキは各種の工業的
メツキに使用されているが、その浴組成は、゛例えば硫
酸等の酸濃度５〜３０ｇ／ｌ 。[Prior Art] Nickel plating or nickel alloy plating is used in various industrial platings, and the bath composition thereof is ``for example, an acid concentration of 5 to 30 g/l, such as sulfuric acid.
ニッケル濃度３０〜８０ｇ／ｌ 、 ｐＨ０，５〜２゜
０である。当然のことながら、メツキ浴はその使用につ
れてニッケルが消耗し、ニッケル１度が低下するため、
何らかの方法によりニッケルを補給し、浴中のニッケル
濃度を常に所望のレベルに維持する必要がある。The nickel concentration is 30-80 g/l and the pH is 0.5-2.0. Naturally, as the plating bath is used, the nickel is consumed and the nickel content decreases, so
Nickel must be replenished by some method to maintain the nickel concentration in the bath at the desired level.
ニッケルメッキ浴へのニッケルの補給としては、金属ニ
ッケルを直接これに浸漬し溶解することも考えられるが
、浴の酸濃度は比較的小さく溶解速度が小さいため実際
的ではない。洛中の酸濃度を高めることはその後に酸濃
度の調整の困難さからこれも実用的でない。It is conceivable to replenish the nickel plating bath with nickel by dipping the metal nickel directly into the bath and dissolving it, but this is not practical because the acid concentration in the bath is relatively low and the dissolution rate is slow. Increasing the acid concentration in Rakuchu is also not practical due to the difficulty of adjusting the acid concentration afterwards.
メツキ浴の酸濃度を所定レベルに維持したままニッケル
を補給する方法として、炭酸ニッケル形態にて浴に添加
することも提案されている。Adding nickel to the plating bath in the form of nickel carbonate has also been proposed as a method of replenishing nickel while maintaining the acid concentration of the plating bath at a predetermined level.
更にメツキ浴の酸濃度を変えずにニッケルを補給する別
の手段として電解溶解により金属ニッケルを浴に溶解す
る方法も考慮される。Furthermore, as another means of replenishing nickel without changing the acid concentration of the plating bath, a method of dissolving metallic nickel in the bath by electrolytic dissolution is also considered.
［発明の解決しようとする問題点］
しかしながら、前者の方法は、炭酸ニッケルは金属ニッ
ケルに比較して高価であるばかりでなく、入手経路が限
られ常時在庫量が増える等の難点がある。又、後者の方
法は、陽極のニッケルが一部不動態化してしまうため、
この方法も未だ実用化されていない。[Problems to be Solved by the Invention] However, the former method has drawbacks such as not only nickel carbonate being more expensive than metal nickel, but also the acquisition route being limited and the amount constantly in stock increasing. In addition, in the latter method, some of the nickel in the anode becomes passivated, so
This method has also not been put into practical use yet.
［問題点を解決するための手段］
本発明は、上記の如きニッケルメッキ浴中の消耗するニ
ッケルを電解方法により溶解する装置として、陽極の不
動態化等のトラブルを起すことのないニッケル金属電解
溶解装置を提供する。[Means for Solving the Problems] The present invention provides a nickel metal electrolytic device that does not cause troubles such as passivation of the anode, as an apparatus for dissolving nickel that is consumed in a nickel plating bath as described above by an electrolytic method. Provide melting equipment.
上記本発明の目的は、本発明者の研究によると、以下の
本発明により解決しうることが見い出された。According to research conducted by the present inventor, it has been found that the above object of the present invention can be achieved by the present invention as described below.
即ち、陽極として亜鉛含有金属ニッケルと陰極を有する
電解槽にニッケル金属が消耗したニッケルメッキ浴液を
供給し、電流密度１〜３０Ａ／ｄｍ”にて通電すること
によりニッケル濃度を上昇させることを特徴とするニッ
ケルメッキ浴用のニッケル金属電解方法を本発明として
提供する。That is, the nickel concentration is increased by supplying a nickel plating bath solution in which nickel metal has been depleted to an electrolytic cell having zinc-containing metal nickel as an anode and a cathode, and passing current at a current density of 1 to 30 A/dm. The present invention provides a nickel metal electrolysis method for a nickel plating bath.
本発明において、陰極を使用し、溶解すべき金属ニッケ
ルを陽極に使用した電解槽に、ニッケルと亜鉛のニッケ
ル合金のメツキ浴等からとり出した液を供給する。この
際、陽極の金属ニッケルは、陽極としての不動態化を防
止するために亜鉛を含有することが必要であり、亜鉛は
好ましくは０．００３〜８０重量％、好ましくは０．４
〜５０重量％含有せしめられる。過度に少ない亜鉛含有
はニッケルの溶解速度を上げられないため好ましくない
。金属ニッケルの形状は、溶解をしやす（するため好ま
しくは、粒状、板状、粉状にせしめ、これをチタンなど
の耐食性金属のバスケットに入れて使用するのが適切で
ある。ニッケルメッキ浴からとり出した液は、上記電解
槽の陽極と陰極間に好ましくはｌＯ〜４０ｃｍ／ｓｅｃ
、特には２０〜４００ｍ／ＳｅＣで供給する。In the present invention, a liquid taken out from a plating bath of a nickel alloy of nickel and zinc is supplied to an electrolytic cell in which a cathode is used and the metal nickel to be dissolved is used as an anode. At this time, the metal nickel of the anode needs to contain zinc in order to prevent passivation as an anode, and the zinc content is preferably 0.003 to 80% by weight, preferably 0.4% by weight.
~50% by weight. Excessively low zinc content is not preferred because the dissolution rate of nickel cannot be increased. Metallic nickel is in the form of particles, plates, or powder, which makes it easy to dissolve.It is appropriate to use this in a basket made of a corrosion-resistant metal such as titanium.From the nickel plating bath The taken out liquid is preferably placed between the anode and the cathode of the electrolytic cell at a rate of 10 to 40 cm/sec.
, especially at 20 to 400 m/SeC.
この流速を選ぶことにより、陰極上にニッケルが析出し
た場合にも、陰極上にニッケルは均一に析出し、かかる
均一に析出したニッケルは除去しやすいので好ましい。By selecting this flow rate, even if nickel is deposited on the cathode, it will be uniformly deposited on the cathode, and such uniformly deposited nickel can be easily removed, which is preferable.
上記電解槽は、必要により陽極及び陰極間を隔膜で仕切
ることができる。隔膜は、ニッケルイオンの透過を阻止
するため好ましくは陰イオン交換膜が使用できる。しか
し場合により、未溶解の金属ニッケルの微粒子の透過を
防止するため好ましくは６０メツシュ以上好ましくは１
００メツシエ以上の織布又は不織布であってもよい。織
布又は不織布の材料としては、金属炭素質、合成樹脂、
金属などの導電性のものの使用が好ましい、一方陰イオ
ン交換膜としては、強塩基性又は弱塩基性でイオン交換
容量０．２〜４ミリ当量／ｇ乾燥樹脂厚み２０〜１００
０μのものの使用が好ましい。In the electrolytic cell, the anode and cathode can be partitioned by a diaphragm, if necessary. As the diaphragm, an anion exchange membrane can preferably be used in order to prevent permeation of nickel ions. However, in some cases, in order to prevent the permeation of fine particles of undissolved metallic nickel, the mesh size is preferably 60 mesh or more, preferably 1 mesh.
It may be a woven fabric or non-woven fabric with a mesh size of 0.00 mesh or higher. Materials for woven or non-woven fabrics include metal carbonaceous materials, synthetic resins,
It is preferable to use conductive materials such as metals, while the anion exchange membrane is strongly or weakly basic and has an ion exchange capacity of 0.2 to 4 milliequivalents/g dry resin thickness of 20 to 100.
It is preferable to use one with a diameter of 0μ.
か（して電解槽にはニッケルメッキ浴液が供給され、好
ましくは、２〜ＩＯＡ／ｄｍ２．特には１〜３０Ａ／ｄ
ｍ”にて通電することにより、陽極の金属ニッケルは、
電気的に溶解され、供給したニッケルメッキ浴のｐＨ即
ちＭ濃度を変えることなく、洛中の金属ニッケルの濃度
は上昇する。(Then, a nickel plating bath solution is supplied to the electrolytic cell, preferably from 2 to IOA/dm2, particularly from 1 to 30 A/d.
By applying current at m”, the metal nickel of the anode becomes
The concentration of metallic nickel in the solution increases without changing the pH or M concentration of the supplied nickel plating bath.
しかしこのようにして長時間運転を継続した場合本発明
者の知見によると、陽極の金属ニッケルが不動態化現象
を起こし、摺電圧が急激に上昇する場合があることが判
明した。However, according to the findings of the present inventors, when the operation is continued for a long time in this manner, it has been found that the metal nickel of the anode may undergo a passivation phenomenon and the sliding voltage may rise rapidly.
上記現象が生じた場合、本発明者の研究によると通電方
向を逆にせしめ、それまでの陰極を陽極にし、陽極を陰
極にせしめて通電した場合には、極めて有効的に上記現
象が解消しうることが判明した。かかる逆通電により、
陽極の金属ニッケルの不動態化は解消する。かかる逆通
電は、逆通電時間／正通電時間が、好ましくは０．１〜
１％、特には０．１〜１０％にするのが好ましい。When the above phenomenon occurs, the inventor's research has shown that the above phenomenon can be resolved very effectively by reversing the current direction, changing the previous cathode to the anode, and changing the anode to the cathode. It turned out to be possible. Due to such reverse energization,
The passivation of the metal nickel in the anode is eliminated. In such reverse energization, the reverse energization time/forward energization time is preferably 0.1 to
It is preferably 1%, especially 0.1 to 10%.
このようにして、本発明によれば、ニッケルメツキ浴か
らとり出したニッケル濃度の低下した液は、ニッケル液
のｐＨを変えることなしに極めて有効にニッケル濃度の
向上が行なわれ、ニッケル濃度が上昇した液はニッケル
メッキ浴に循環使用される。In this way, according to the present invention, the nickel concentration of the liquid taken out from the nickel plating bath with a reduced nickel concentration is extremely effectively improved without changing the pH of the nickel liquid, and the nickel concentration increases. The solution is recycled to the nickel plating bath.
［実施例］
ニッケルメッキ浴からとり出した Ｈ２Ｓ０４０．５Ｎ
、 Ｎｉ５０４２．５Ｎを含む溶液（ｐ）Ｉ＝ １．０
）中に本発明に従って金属ニッケルを電解溶解した。電
解槽の陽極として、チタン製バスケットに入れた粒状形
状の亜鉛含有量０，４重量％の金属ニッケルｌｏｏｇを
使用し、陰極として、糸径３μ、重密度０．０７５ｇ／
ｃｃ 、厚み０．４ｍｍの炭素繊維の織布をチタン板に
縫いつけ担持した電極（水素過電圧４０ＩＩｌｖ）ヲ用
イタ。[Example] H2S040.5N taken out from a nickel plating bath
, solution containing Ni5042.5N (p) I = 1.0
) was electrolytically dissolved in accordance with the present invention. As the anode of the electrolytic cell, a granular metal nickel loog with a zinc content of 0.4% by weight placed in a titanium basket was used, and as a cathode, a thread diameter of 3μ and a weight density of 0.075g/
cc, for electrodes (hydrogen overvoltage 40IIlv) made of carbon fiber woven fabric with a thickness of 0.4mm sewn onto a titanium plate.
上記メツキ浴液は、電解槽に対し、２０ｃｍ／ｓｅｃで
供給され、電流密度（陰極板上） １５Ａ／ｄｍ”にて
通電した。その結果、陽極でのニッケル溶解は、３．２
ｇ／時間の速度で溶解した、その電流効率はほぼ１００
％であり、５時間運転したところ陰極へのニッケルの析
出は認められなかった。The above plating bath solution was supplied to the electrolytic cell at a rate of 20 cm/sec, and current was applied at a current density (on the cathode plate) of 15 A/dm. As a result, nickel dissolution at the anode was 3.2
Dissolved at a rate of g/hour, its current efficiency is approximately 100
%, and after 5 hours of operation, no nickel precipitation was observed on the cathode.
比較例１
実施例１と同様の方法で亜鉛を含有しない純ニツケル粒
子を溶解用として用い直流電流を流した。Comparative Example 1 In the same manner as in Example 1, pure nickel particles containing no zinc were used for dissolution, and direct current was applied.
その結果、電流密度１０Ａ／ｄｍ２以上ではニッケルが
不動態化し、酸素ガスが発生し、二・ンケルが溶解しな
くなった。As a result, at a current density of 10 A/dm2 or more, nickel became passivated, oxygen gas was generated, and nickel was no longer dissolved.
Claims (2)
電解槽にニッケル金属が消耗したニッケルメッキ浴液を
供給し、電流密度１〜３０Ａ／ｄｍ＾２にて通電し、ニ
ッケル濃度を上昇させることを特徴とするニッケルメッ
キ浴用ニッケル金属の電解溶解方法。(1) A nickel plating bath solution in which nickel metal has been depleted is supplied to an electrolytic cell having zinc-containing metal nickel as an anode and a cathode, and electricity is applied at a current density of 1 to 30 A/dm^2 to increase the nickel concentration. Features: Electrolytic dissolution method of nickel metal for nickel plating baths.
０ｇ／ｌ、ニッケル濃度１〜１００ｇ／ｌ、ｐＨ０〜２
である請求項（１）の方法。(2) The exhausted nickel plating bath solution has an acid concentration of 1 to 10
0g/l, nickel concentration 1-100g/l, pH 0-2
The method according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20750590A JP2881997B2 (en) | 1990-08-07 | 1990-08-07 | Method for electrolytic dissolution of nickel metal for nickel plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20750590A JP2881997B2 (en) | 1990-08-07 | 1990-08-07 | Method for electrolytic dissolution of nickel metal for nickel plating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0499198A true JPH0499198A (en) | 1992-03-31 |
| JP2881997B2 JP2881997B2 (en) | 1999-04-12 |
Family
ID=16540834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20750590A Expired - Fee Related JP2881997B2 (en) | 1990-08-07 | 1990-08-07 | Method for electrolytic dissolution of nickel metal for nickel plating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2881997B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004074555A1 (en) * | 2003-02-21 | 2004-09-02 | Mitsubishi Materials Corporation | Ni ALLOY ANODE MATERIAL FOR ELECTROLYTIC Ni PLATING |
-
1990
- 1990-08-07 JP JP20750590A patent/JP2881997B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004074555A1 (en) * | 2003-02-21 | 2004-09-02 | Mitsubishi Materials Corporation | Ni ALLOY ANODE MATERIAL FOR ELECTROLYTIC Ni PLATING |
| US7393499B2 (en) | 2003-02-21 | 2008-07-01 | Mitsubishi Materials Corporation | Ni alloy anode material for Ni electroplating |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2881997B2 (en) | 1999-04-12 |
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