JPH0498166A - Burn-in test device and burn-in test method - Google Patents

Abstract

PURPOSE:To return an objective tested IC alone into an ordinary temperature in an actuated condition without returning a temperature within a constant temperature oven to the ordinary temperature, by providing an ordinary temperature unit outside the constant temperature oven. CONSTITUTION:A burn-in test device 1 possesses a constant temperature oven 2 and an ordinary temperature unit 4, and burn-in boards 3 which are mounted with tested ICs, are furnished, and a test is conducted by means of a test circuit. A normal burn-in test at a high or low temperature is conducted within the oven 2, and when a characteristic is tested by means of an IC tester, an objective burn-in board 3 is taken out of the oven 2, and furnished at the unit 4, and tested ICs are actuated for a while under the condition being exposed to an ordinary temperature, after the temperature of ICs becomes ordinary, they are taken out of the unit 4, and their characteristic is tested by means of the IC tester. As a result, test ICs can be made ordinary temperatured while the burn-in board taken out of the constant temperature oven is being actuated at the unit 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC burn-in test device and a burn-in test method.

[Conventional technology]

Conventionally, when performing IC burn-in tests, multiple burn-in chips are placed in a constant temperature chamber of burn-in test equipment.
The board was mounted and tested under high-temperature or low-temperature conditions. Then, after a certain period of time has elapsed, remove the target burn-in board from the thermostatic chamber and
The characteristics of C were measured individually using an IC tester.

[Problem to be solved by the invention]

The above-mentioned conventional burn-in test equipment tests multiple burn-in boards mounted in one constant temperature chamber, so one burn-in board or part of the burn-in boards is tested. When taking out the board and measuring the characteristics of the IC mounted on the board, it is necessary to return the temperature in the thermostatic chamber to room temperature before taking out the burn-in board, which has the disadvantage of reducing the efficiency of the burn-in test. .

The meaning of removing the burn-in board after bringing the temperature inside the constant temperature oven to room temperature is described below.

For example, in the failure mode of ion contamination, failure phenomena appear during high-temperature operation and are recovered by high-temperature storage (non-operation). In order to suppress recovery from this type of failure mode, it is necessary to return the temperature of the IC to room temperature while operating the IC, and then take it out from the thermostat to prevent it from being stored at high temperatures.

[Means to solve the problem]

The burn-in test device of the present invention includes a constant temperature bath in which a burn-in board carrying an IC under test is mounted and heated or cooled to a predetermined temperature, and a constant temperature bath provided outside the constant temperature bath to expose the burn-in board to room temperature. and a test circuit for electrically testing the IC under test on the burn-in board mounted on the constant temperature oven and the room temperature unit.

The burn-in test device of the present invention includes the burn-in test device described above.
A burn-in board with an IC under test mounted on it is mounted in a constant temperature chamber of a test equipment, and an electrical test is performed on the IC under test at a predetermined temperature. Transferred from the constant temperature oven to the room temperature unit, and continuing the electrical test while returning only the burn-in board mounted in the room temperature unit to room temperature while maintaining the burn-in board in the constant temperature oven at a predetermined temperature, The method is characterized in that the IC under test in which the fault has been detected is returned to room temperature while being operated.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic diagram of an embodiment of the burn-in test apparatus of the present invention. The burn-in test device 1 has a constant temperature bath 2 and a room temperature unit 4, and the IC under test is attached to them.
The burn-in board 3 equipped with this is installed, and a test is performed using a test circuit (not shown).

When performing a normal high or low temperature burn-in test in the constant temperature chamber 2 and measuring the characteristics with an IC tester, take out the target burn-in board 3 from the constant temperature chamber 2, attach it to the room temperature unit 4, and leave it for a while. The IC to be tested is operated while exposed to room temperature, and after the IC reaches room temperature, it is taken out from the room temperature unit 4 and its characteristics are measured with an IC tester.

〔Effect of the invention〕

As explained above, the present invention provides a room-temperature unit that can operate the ICs on the burn-in board at room temperature outside the constant-temperature oven. However, the IC under test can be brought to room temperature. This allows you to achieve the desired burn-in without returning the temperature inside the thermostat to room temperature.
This has the effect of allowing the board (IC under test) to return to room temperature while only operating.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram of a burn-in test device according to the present invention. 1... Burn-in test device, 2... Constant temperature chamber, 3
...Burn-in board, 4...Normal temperature unit.

Claims (1)

[Claims] 1. A constant temperature bath in which a burn-in board carrying an IC under test is mounted and heated or cooled to a predetermined temperature, and a constant temperature bath provided outside the constant temperature bath to mount the burn-in board in a state where it is exposed to room temperature. A burn-in test device comprising: a room temperature unit; and a test circuit for electrically testing an IC under test on the burn-in board mounted on the constant temperature oven and the room temperature unit. 2. A burn-in board carrying an IC under test is mounted in a constant temperature chamber of the burn-in test apparatus according to claim 1, and an electrical test is performed on the IC under test at a predetermined temperature, and a failure is detected. Only the burn-in board on which the IC is mounted is transferred from the constant temperature oven to the room temperature unit, and while the burn-in board in the oven is maintained at a predetermined temperature, only the burn-in board mounted on the room temperature unit is brought to room temperature. A burn-in test method characterized by continuing an electrical test while returning the IC to normal temperature while operating the IC under test in which the fault has been detected.