JPH0495846A - Chuck for tester on characteristic of optical device and testing method using same - Google Patents
Chuck for tester on characteristic of optical device and testing method using sameInfo
- Publication number
- JPH0495846A JPH0495846A JP21413390A JP21413390A JPH0495846A JP H0495846 A JPH0495846 A JP H0495846A JP 21413390 A JP21413390 A JP 21413390A JP 21413390 A JP21413390 A JP 21413390A JP H0495846 A JPH0495846 A JP H0495846A
- Authority
- JP
- Japan
- Prior art keywords
- optical device
- socket
- holder
- chuck
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 153
- 238000012360 testing method Methods 0.000 title claims description 3
- 239000000463 material Substances 0.000 claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 14
- 238000012546 transfer Methods 0.000 claims description 34
- 238000003780 insertion Methods 0.000 claims description 10
- 230000037431 insertion Effects 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000003252 repetitive effect Effects 0.000 abstract 2
- 238000005259 measurement Methods 0.000 description 17
- 238000007689 inspection Methods 0.000 description 13
- 239000004020 conductor Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/0014—Measuring characteristics or properties thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Of Optical Devices Or Fibers (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、例えば、レーザーダイオード素子、発光ダ
イオード素子等のような光デバイスの光学的及びまたは
電気的特性を検査測定してデータを得るテスターにおい
て、検査対象となる光デバイスを支持固定する装置(以
下チャックと言う)及びそのチャックを用いたテスト方
法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a tester that obtains data by inspecting and measuring the optical and/or electrical characteristics of optical devices such as laser diode elements, light emitting diode elements, etc. The present invention relates to an apparatus (hereinafter referred to as a chuck) for supporting and fixing an optical device to be inspected, and a test method using the chuck.
(従来の技術)
従来、光デバイスの特性テスターとして、光デバイスを
治具に固定して検査測定を行うもの、及び、温度制御可
能な恒温槽に内在させた治具に光デバイスを固定して検
査測定を行うものが周知である。(Prior art) Conventionally, as a characteristic tester for optical devices, there are those that perform inspection and measurement by fixing the optical device to a jig, and those that fix the optical device to a jig that is housed in a constant temperature bath that can control the temperature. Those that perform inspection measurements are well known.
(発明が解決しようとする課題)
従来、光デバイスのように小さな素子をテスターの治具
に固定しつつ電気的特性などを検査測定する作業や、光
デバイスを治具から離脱させる作業には、細かで微妙な
操作が要求され、その完遂に多大な労力と時間がかかっ
た。(Problems to be Solved by the Invention) Conventionally, the work of inspecting and measuring the electrical characteristics of a small element such as an optical device while fixing it to a tester jig, or the work of removing an optical device from the jig, requires It required detailed and delicate operations, and it took a great deal of effort and time to complete.
また、従来の治具は光デバイスの装着固定位置温槽の温
度変位に影響を与えることによって測定の再現性が不備
であるため、光デバイスの治具への着脱を繰り返した場
合に、光デバイスを治具の同一位置に高精度で反復固定
することが困難であり、光デバイスの固定位置の微妙な
ズレが測定誤差を生じさせる要因となった。In addition, conventional jigs have poor measurement reproducibility because they affect the temperature change in the temperature bath where the optical device is fixed. It is difficult to repeatedly fix the optical device in the same position on the jig with high precision, and slight deviations in the fixing position of the optical device caused measurement errors.
一方、所望の温度に設定した恒温槽に内在する治具に光
デバイスを固定して検査測定を行う場合に、恒温槽の熱
は大部分が空気伝導によって光デバイスに伝達されるが
、空気は熱の不良導体であるため熱の伝達効率が悪く、
光デバイスの温度が恒温槽と同一の温度に達するまで時
間が掛かるので、検査測定に要する時間が長くなる憂い
があり、特に、恒温槽の設定温度を順次変化させて検査
測定を行う場合には、光デバイスの温度が、変化する設
定温度に即座に追従できないために、検査測定時間が非
常に長くかかった。On the other hand, when performing inspection and measurement by fixing an optical device to a jig within a thermostatic oven set at a desired temperature, most of the heat from the thermostatic oven is transferred to the optical device by air conduction; Because it is a poor conductor of heat, it has poor heat transfer efficiency.
Since it takes time for the temperature of the optical device to reach the same temperature as the thermostatic oven, there is a concern that the time required for inspection and measurement will be longer, especially when performing inspection and measurement by sequentially changing the set temperature of the thermostatic oven. Inspection and measurement took a very long time because the temperature of the optical device could not immediately follow the changing set temperature.
また、テスターの検査測定具が前記治具と共に恒温槽に
内在するために、恒温槽が大型化して場所を取るばかり
でなく、前記検査測定具が前記恒誤差が生じ、それを補
正しなければならない欠点があった。Furthermore, since the tester's inspection and measurement tools are housed in the thermostatic chamber together with the jig, not only does the thermostatic chamber become larger and take up more space, but the inspection and measurement instruments also suffer from constant errors that must be corrected. There were some drawbacks.
この発明は、それらの課題を解決して、簡便な操作によ
って光デバイスの着脱を行い、しかも、光デバイスの着
脱を反復して行った場合に同一の固定位置を高い精度で
確実に再現し、更に、光デバイスの温度制御を迅速かつ
正確に行うことのできる光デバイスの特性テスター用チ
ャックを提供すると共に、そのチャックを用いた光デバ
イスの迅速かつ正確なテスト方法を得ることを目的とす
る。The present invention solves these problems, allows attachment and detachment of optical devices through simple operations, and reliably reproduces the same fixing position with high precision even when the optical device is repeatedly attached and detached. Another object of the present invention is to provide a chuck for an optical device characteristic tester that can quickly and accurately control the temperature of an optical device, and to obtain a method for quickly and accurately testing an optical device using the chuck.
(課題を解決するための手段)
この発明は、前記の目的を達するために、光デバイスの
単体固定用のソケットと、そのソケット装填用のホルダ
ーと、そのホルダーに対する前記ソケットの周方向位置
決め手段と、前記ホルダ内における前記ソケットと、そ
のソケット内における前記光デバイスの軸線方向位置決
め手段と、温度制御手段とから成る光デバイスの特性テ
スター用チャックを創作した。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a socket for fixing an optical device alone, a holder for loading the socket, and circumferential positioning means for the socket with respect to the holder. The present invention has created a chuck for a characteristic tester of an optical device, which comprises the socket in the holder, means for axially positioning the optical device within the socket, and temperature control means.
前記ソケットは、前記光デバイス単体の端子が着脱可能
な深さと径とを有する所望の数の端子挿入孔を配設して
成る光デバイス固定座と、その光デバイス固定座の座面
における前記光デバイスの底部周面と接する部位に上面
を露出する熱伝達材と、前記光デバイス固定座の底部に
貫設した前記光デバイスの端子と連結可能な所望の数の
接続端子とを備える。The socket includes an optical device fixing seat, which is provided with a desired number of terminal insertion holes having a depth and diameter that allow the terminal of the optical device to be attached and detached, and a seat for the optical device on the seat surface of the optical device fixing seat. It includes a heat transfer material whose upper surface is exposed at a portion in contact with the bottom circumferential surface of the device, and a desired number of connection terminals that are connected to the terminals of the optical device and are provided through the bottom of the optical device fixing seat.
前記ホルダーには、前記熱伝達材の外面と接する部位に
第2の熱伝達材の内面を露出させ、その底面に前記接続
端子と連結可能な接続ピンを貫設する。In the holder, the inner surface of the second heat transfer material is exposed at a portion in contact with the outer surface of the heat transfer material, and a connection pin connectable to the connection terminal is provided through the bottom surface of the holder.
前記ソケットの光デバイス固定座を複数個併設して複数
の光デバイスを同時に測定検査することも可能である。It is also possible to simultaneously measure and inspect a plurality of optical devices by providing a plurality of optical device fixing seats of the socket.
前記ホルダーに対する前記ソケットの周方向位置決め手
段の一例として、前記双方の接触部の特定部位に相互に
嵌合する間材と凸材とを対設する。As an example of means for positioning the socket in the circumferential direction with respect to the holder, a spacer member and a convex member that fit into specific parts of both of the contact portions are provided facing each other.
前記ホルダー内における前記ソケットとそのソケット内
における前記光デバイスの軸線方向位置決め手段の一例
として、前記光デバイスの頭部に対向する部位に窓を設
けた蓋の一端を前記ホルダーの一端に軸支させると共に
、その蓋を閉結位で固定するために前記ボルダ−の他端
にストッパーを設ける一方、前記蓋の内面にバネを介し
て押圧材を付設し、その押圧材が前記ソケットの光デバ
イス固定座と対向する部位に孔を設け、かつ、その孔の
径を、前記光デバイスの発光部の緩挿が可能であり、そ
して、前記発光部の基部に設置Jられるフランジの挿通
が不能な大きさとする。As an example of means for axially positioning the socket in the holder and the optical device in the socket, one end of a lid provided with a window in a portion facing the head of the optical device is pivoted to one end of the holder. At the same time, a stopper is provided at the other end of the boulder to fix the lid in the closed position, and a pressing member is attached to the inner surface of the lid via a spring, and the pressing member fixes the optical device of the socket. A hole is provided in a portion facing the seat, and the diameter of the hole is large enough to allow the light emitting part of the optical device to be loosely inserted therein, and so large that the flange installed at the base of the light emitting part cannot be inserted therethrough. Satoru.
前記第2の熱伝達材を介する温度制御手段の一例として
、前記光デバイスの近傍に温度センサーを設け、前記第
2の熱伝達材にペルチエ素子の熱交換部を接触させて設
け、前記温度センサーの検出温度と設定温度との差に相
当する温度を補正させる一方、内部の熱が設定温度より
高い場合にその内部の熱を外部へ排出する放熱手段を作
動させて、チャック内を設定温度で恒温の状態に維持す
る−
前記放熱手段としては、水冷式または空冷式を設けるこ
とが可能である。As an example of temperature control means via the second heat transfer material, a temperature sensor is provided near the optical device, a heat exchange portion of a Peltier element is provided in contact with the second heat transfer material, and the temperature sensor While correcting the temperature corresponding to the difference between the detected temperature and the set temperature, if the internal heat is higher than the set temperature, a heat dissipation means that discharges the internal heat to the outside is activated to keep the inside of the chuck at the set temperature. Maintaining a constant temperature state - As the heat dissipation means, it is possible to provide a water cooling type or an air cooling type.
(作 用)
まず、光デバイスをソケットの光デバイス固定座に着座
させ、そのソケットをチャックのホルダー内に周方向の
位置決めをして装填し、その後、蓋を閉結する。(Function) First, the optical device is seated on the optical device fixing seat of the socket, the socket is circumferentially positioned and loaded into the holder of the chuck, and then the lid is closed.
蓋の閉結によって、前記ホルダー内における前記光デバ
イスの軸線方向の位置が決められる。Closing the lid determines the axial position of the optical device within the holder.
他方において、前記光デバイスの端子は、前記ソケット
に設けた接続端子を経由して、前記ホルダーの外部と電
気的に接続される。On the other hand, the terminal of the optical device is electrically connected to the outside of the holder via a connection terminal provided in the socket.
設定温度に従った恒温状態は、前記チャック内に設けた
温度センサーの検出温度との対比によってペルチエ素子
で補正し、または、放熱手段によって放熱することによ
り、生成される。A constant temperature state according to the set temperature is generated by comparing the temperature detected by a temperature sensor provided in the chuck and correcting it with a Peltier element, or by radiating heat by a heat radiating means.
かくして、前記光デバイスの光学的及びまたは電気的特
性が測定検査される。The optical and/or electrical properties of the optical device are thus measured and tested.
(実 施 例)
本発明の具体的実施例を図面に基づいて詳細に説明する
。(Example) Specific examples of the present invention will be described in detail based on the drawings.
第1図乃至第3図は、本発明による光デバイスの特性テ
スター用チャックの第1実施例として、単数素子用水冷
式チャックを示し、そのチャックは、単数の光デバイス
Dの着脱が可能なソケットlと、そのソケット1を装填
するホルダー2とを備える。1 to 3 show a water-cooled chuck for a single element as a first embodiment of the chuck for a characteristic tester of an optical device according to the present invention. 1 and a holder 2 into which the socket 1 is loaded.
ソケットlは、光デバイスDの単体が有する端子D1の
着脱が可能な深さと径とを有する所望の数(例えば4つ
)の端子挿入孔11をもった光デバイス固定座12を備
え、その光デバイス固定座12の座面における光デバイ
スDの底部周面と接する部位に熱伝達材13がその上面
を露出して設けられる一方、光デバイスDの端子DIと
連結可能な所望の数(例えば4つ)の接続端子14を光
デバイス固定座12の底部に貫設する(第1図、第3図
参照)。The socket l is provided with an optical device fixing seat 12 having a desired number (for example, four) of terminal insertion holes 11 with a depth and diameter that allow the attachment and detachment of the terminal D1 of the single optical device D, and A heat transfer material 13 is provided with its upper surface exposed at a portion of the seat surface of the device fixing seat 12 that is in contact with the bottom circumferential surface of the optical device D. Two connecting terminals 14 are inserted through the bottom of the optical device fixing seat 12 (see FIGS. 1 and 3).
ソケットlを装填するホルダー2は、ソケットlの熱伝
達材13の外面と接する部位に第2の熱伝達材21がそ
の内面を露出して設けられる一方、ホルダー2の底部に
、ソケット】の接続端子14と連結可能な接続ピン22
を貫設する(第3図参照)。The holder 2 into which the socket 1 is loaded is provided with a second heat transfer material 21 with its inner surface exposed at a portion that contacts the outer surface of the heat transfer material 13 of the socket 1, and a connection of the socket 1 to the bottom of the holder 2. Connection pin 22 connectable with terminal 14
(See Figure 3).
次に、ホルダー2に対するソケットlの周方向位置決め
手段として、ソケットlのホルダー接触部に口材15を
設けると共に、ホルダー2のソケット接触部に口材15
と嵌合する凸材23を設ける(第1図参照)。Next, as means for positioning the socket l relative to the holder 2 in the circumferential direction, a spout 15 is provided at the holder contacting part of the socket l, and a spout 15 is provided at the socket contacting part of the holder 2.
A convex member 23 is provided to fit with the holder (see Fig. 1).
なお、本実施例によるチャックのソケットlは、光デバ
イス固定座12にキープレートKを突設しているので、
光デバイスDをソケット1に着座させる時に、光デバイ
スの発光部D2の基部に設けられる基準スロット(即ち
凹部0とキープレートの凸部とを嵌合させて、ソケット
1に対する光デバイスDの周方向の位置決めをすること
が可能である(第1図参照)。In addition, since the chuck socket l according to this embodiment has a key plate K protruding from the optical device fixing seat 12,
When the optical device D is seated in the socket 1, the reference slot provided at the base of the light emitting part D2 of the optical device (i.e., the recess 0 and the convex part of the key plate are fitted together, and the circumferential direction of the optical device D with respect to the socket 1 is fitted. (See Figure 1).
更に、ホルダー2内におけるソケット1と、そのソケッ
トl内における光デバイスDの軸線方向位置決め手段と
して、光デバイスの頭部に対向する部位に窓31を設け
た蓋3の一端をホルダー2の一端に軸支させると共に、
その蓋3を閉結位で固定するストッパー35をホルダー
2の他端に設ける一方、蓋3の内面にバネ32を介して
押圧材33を付設し、その押圧材33においてソケット
1の光デバイス固定座12と対向する部位に孔34を設
け、その孔は、光デバイスDの発光部D2の緩挿が可能
であり、かつ、その発光部D2の基部に設けられるフラ
ンジD3の挿通が不能な径を有する。Further, as a means for axially positioning the socket 1 in the holder 2 and the optical device D in the socket l, one end of the lid 3, which has a window 31 in a portion facing the head of the optical device, is attached to one end of the holder 2. Along with supporting the shaft,
A stopper 35 for fixing the lid 3 in the closed position is provided at the other end of the holder 2, while a pressing member 33 is attached to the inner surface of the lid 3 via a spring 32, and the optical device of the socket 1 is fixed by the pressing member 33. A hole 34 is provided in a portion facing the seat 12, and the hole has a diameter that allows the light emitting portion D2 of the optical device D to be loosely inserted, and that does not allow insertion of the flange D3 provided at the base of the light emitting portion D2. has.
最後に、ホルダー2の第2の熱伝達材2Iを介する温度
制御手段として、まず、第2の熱伝達材21に温度セン
サー4を備え、次に、第2の熱伝達材21にペルチエ素
子5の熱交換部を接触させて設けると共に、内部の熱を
外部へ排出する水冷式の放熱手段6を設ける。その放熱
手段6は、液体の流通が可能な内部空間61に冷却液の
流入孔62及び排出孔63を接続して形成されている(
第1図、第3図参照)。Finally, as a temperature control means via the second heat transfer material 2I of the holder 2, first, the second heat transfer material 21 is equipped with a temperature sensor 4, and then the second heat transfer material 21 is equipped with a Peltier element 5. A water-cooled heat radiating means 6 is provided for discharging internal heat to the outside. The heat dissipation means 6 is formed by connecting a coolant inflow hole 62 and a coolant discharge hole 63 to an internal space 61 through which liquid can flow.
(See Figures 1 and 3).
本実施例によるチャックを用いて光デバイスを固定する
場合、まず、光デバイスDをソケット】の光デバイス固
定座】2に着座させ、そのソケット■をホルダー2内に
装填しつつ、ソケット1に設けられた回付15と、ホル
ダー2に設けられた凸材23とを嵌合させることにより
、ホルダー2に対するソケット1の周方向の位置が決め
られる。When fixing an optical device using the chuck according to the present embodiment, first, the optical device D is seated on the optical device fixing seat ] 2 of the socket ], and while the socket is loaded into the holder 2, the optical device D is mounted on the socket 1. The position of the socket 1 in the circumferential direction with respect to the holder 2 is determined by fitting the provided rotation 15 with the convex member 23 provided on the holder 2.
その後、蓋3を閉結すると、光デバイスDの発光部D2
が押圧材33の孔34を挿通して外部に露出すると共に
、押圧材33が発光部基部のフランジD3をソケット1
に圧着しつつ、ソケット1をホルダー2に圧着して、ホ
ルダー2内における光デバイスDの軸線方向の位置が決
められ、チャックが光デバイスDを機械的に固定する(
第2図、第3図参照)。After that, when the lid 3 is closed, the light emitting part D2 of the optical device D
is inserted through the hole 34 of the pressing member 33 and exposed to the outside, and the pressing member 33 connects the flange D3 at the base of the light emitting part to the socket 1.
The socket 1 is crimped onto the holder 2, and the axial position of the optical device D within the holder 2 is determined, and the chuck mechanically fixes the optical device D (
(See Figures 2 and 3).
このように、本実施例によるチャックは、光デバイスD
の位置決め固定を機械的に行うため、光デバイスDの着
脱を縁り返した場合でも、チャックが光デバイスDを同
一位置に高精度で反復固定するので、光デバイスDの固
定位置のズレ?こ起因する測定誤差を極力減少させるこ
とができる。In this way, the chuck according to this embodiment can be used as an optical device D.
Since the positioning and fixing of the optical device D is performed mechanically, even if the optical device D is attached and detached in the opposite direction, the chuck repeatedly fixes the optical device D in the same position with high precision. Measurement errors caused by this can be reduced as much as possible.
他方において、光デバイスDの端子DJは、ソケット1
の光デバイス固定座12に設けた端子挿入孔11から接
続端子14と接続ピン22を経由して、ホルダー2の外
部と電気的に接続される(第3図参照)。On the other hand, terminal DJ of optical device D is connected to socket 1
The holder 2 is electrically connected to the outside of the holder 2 through the terminal insertion hole 11 provided in the optical device fixing seat 12 via the connecting terminal 14 and the connecting pin 22 (see FIG. 3).
本実施例によるチャックは、蓋3の押圧材33に設けら
れた孔34から外部に露出する光デバイスの発光部D2
に対して、光学的検査測定具を接近あるいは接触させて
、光学的特性を検査測定することが可能であり、あるい
はまた、ソケット1の端子挿入孔11に挿入された光デ
バイスの端子DIに対して、ソケットlの接続端子14
及びホルダー2の接続ピン22を介して電気的検査測定
具を接続して、電気的特性を検査測定することが可能で
ある。The chuck according to this embodiment has a light emitting portion D2 of an optical device exposed to the outside through a hole 34 provided in a pressing member 33 of a lid 3.
It is possible to inspect and measure the optical characteristics by bringing an optical inspection measurement tool close to or in contact with the terminal DI of the optical device inserted into the terminal insertion hole 11 of the socket 1. Connecting terminal 14 of socket L
It is also possible to connect an electrical inspection and measurement tool via the connection pin 22 of the holder 2 to inspect and measure the electrical characteristics.
本実施例によるチャックを用いて所望の設定温度下にお
ける光デバイスDの光学的特性及びまたよ電気的特性を
検査測定する場合、設定温度に従った恒温状態は、第2
の熱伝達材21に設けた温度センサー4の検出温度との
対比によってペルチエ素子5で補正し、または、放熱手
段6の内部空間61に水などの冷却液を流通させて放熱
することにより生成され、その恒温状態の熱は、熱の良
導体である第2の熱伝達材21から、同じく熱の良導体
である熱伝達材13に敏速に伝導して、ソケットlの光
デバイス固定座I2において熱伝達材I3と接している
光デバイスDに効率よく、ムラなく伝達するので、温度
制御を迅速かつ正確に行うことができる。When the chuck according to this embodiment is used to inspect and measure the optical characteristics and electrical characteristics of the optical device D under a desired set temperature, the constant temperature state according to the set temperature is
It is generated by comparing the temperature detected by the temperature sensor 4 provided in the heat transfer material 21 and correcting it with the Peltier element 5, or by circulating a cooling liquid such as water through the internal space 61 of the heat radiating means 6 to radiate heat. The heat in the constant temperature state is quickly conducted from the second heat transfer material 21, which is a good conductor of heat, to the heat transfer material 13, which is also a good conductor of heat, and the heat is transferred at the optical device fixing seat I2 of the socket l. Since the temperature is efficiently and evenly transmitted to the optical device D in contact with the material I3, temperature control can be performed quickly and accurately.
従って、設定温度を順次変化させて検査測定を行う場合
においても、光デバイスDの温度が、変化する設定温度
に短時間で追従することが可能となり、検査測定時間を
短縮することができる。Therefore, even when performing inspection and measurement by sequentially changing the set temperature, the temperature of the optical device D can follow the changing set temperature in a short time, and the inspection and measurement time can be shortened.
また、本実施例によるチャックは、各種光デバイスの形
状や端子数の相異に対応するために、光デバイス固定座
12の形状や端子挿入孔11の数が異なる幾種類かのソ
ケットをあらかじめ用意しておくことが考えられるので
、形状や端子数の異なる幾種類かの光デバイスを順次検
査測定する場合に、ソケット1を各種光デバイスに対応
するものに交換してホルダー2に装填することにより迅
速に対処することが可能である。In addition, in the chuck according to this embodiment, several types of sockets with different shapes of optical device fixing seats 12 and numbers of terminal insertion holes 11 are prepared in advance in order to accommodate differences in the shape and number of terminals of various optical devices. Therefore, when sequentially inspecting and measuring several types of optical devices with different shapes and numbers of terminals, it is possible to replace the socket 1 with one compatible with the various optical devices and load it into the holder 2. It is possible to deal with it quickly.
第4図乃至第7図は、本発明による光デバイスの特性テ
スター用チャックの第2の実施例として、単数素子用空
冷式チャックを示し、そのチャックが、単数の光デバイ
スDの着脱が可能なソケットlと、そのソケット1を装
填するホルダー2を備えると共に、ホルダー2に対する
ソケット1の周方向位置決め手段として、ソケット1に
回付15を、ホルダー2に凸材23を設けることは、第
1実施例と同様である(第4図参照)。4 to 7 show an air-cooled chuck for a single element as a second embodiment of the chuck for a characteristic tester of an optical device according to the present invention, and the chuck is capable of attaching and detaching a single optical device D. In addition to providing a socket 1 and a holder 2 into which the socket 1 is loaded, providing a turn 15 on the socket 1 and a convex member 23 on the holder 2 as means for positioning the socket 1 in the circumferential direction with respect to the holder 2 is the first embodiment. This is the same as the example (see Figure 4).
次に、ホルダー2内におけるソケット1と、そのソケッ
ト1内における光デバイスDの軸線方向位置決め手段も
また、第1実施例と同様である、ただし、ホルダー2の
第2の熱伝達材21を介する温度制御手段として、第2
の熱伝達材21に温度センサー4を備えると共に、その
第2の熱伝達材21にペルチエ素子5の熱交換部を接触
させて設ける点については、第1実施例と同様であるが
、内部の熱を外部へ排出する放熱手段については、第1
実施例の水冷式と異なる空冷式の放熱手段7を設ける。Then, the socket 1 in the holder 2 and the axial positioning means of the optical device D in the socket 1 are also similar to the first embodiment, except that via the second heat transfer material 21 of the holder 2 As a temperature control means, a second
The second heat transfer material 21 is provided with the temperature sensor 4, and the heat exchange portion of the Peltier element 5 is provided in contact with the second heat transfer material 21, which is the same as in the first embodiment. Regarding the heat dissipation means for discharging heat to the outside,
An air-cooled heat dissipation means 7, which is different from the water-cooled type in the embodiment, is provided.
その放熱手段7は、ペルチエ素子5の他方の熱交換部に
接して放熱フィン71を設置し、そのフィン71に対し
て送風可能な位置に送風機72を設けると共に、送風機
72と放熱フィン71との間に送風孔73を設け、更に
、放熱フィン7Iの下流に排気孔74を設ける(第4図
、第6図参照)。The heat dissipation means 7 includes a heat dissipation fin 71 installed in contact with the other heat exchange part of the Peltier element 5, an air blower 72 installed at a position where air can be blown against the fin 71, and a connection between the blower 72 and the heat dissipation fin 71. A ventilation hole 73 is provided in between, and an exhaust hole 74 is further provided downstream of the radiation fin 7I (see FIGS. 4 and 6).
本実施例によるチャックを用いて所望の設定温度環境を
得るために、設定温度に従った恒温状態は、ホルダー2
の第2の熱伝達材21に設けた温度センサー4の検出温
度との対比によってペルチェ素子5で補正し、または、
放熱手段7の放熱フィン71に送風機72で送風して放
熱することにより、生成される。In order to obtain a desired set temperature environment using the chuck according to this embodiment, the constant temperature state according to the set temperature is
Corrected by the Peltier element 5 by comparison with the temperature detected by the temperature sensor 4 provided on the second heat transfer material 21, or
It is generated by blowing air through the heat radiation fins 71 of the heat radiation means 7 with the blower 72 to radiate heat.
なお、本実施例によるチャックの外部側面には、チャッ
クが着座するステージ(図示せず)の操作を行うための
レバーLを設ける(第5図、第7図参照)。従って、こ
のレバーLは、例えばステージの運動方向を水平方向と
垂直方向とに切り替える操作などに利用し得る。Note that a lever L for operating a stage (not shown) on which the chuck is seated is provided on the external side surface of the chuck according to this embodiment (see FIGS. 5 and 7). Therefore, this lever L can be used, for example, to switch the direction of movement of the stage between the horizontal direction and the vertical direction.
第8図乃至第10図は、本発明による光デバイスの特性
テスター用チャックの第3実施例として、複数素子用水
冷式チャックを示し、そのチャックは、複数の光デバイ
スDの着脱が可能なソケットlと、そのソケットIを装
填するホルダー2とを備える。8 to 10 show a water-cooled chuck for multiple elements as a third embodiment of the chuck for a characteristic tester of an optical device according to the present invention, and the chuck has a socket to which a plurality of optical devices D can be attached and detached. 1 and a holder 2 into which the socket I is loaded.
ソケット1は、所望の数の端子挿入孔11を有する光デ
バイス固定座12を複数備え、その複数の光デバイス固
定座12の座面における光デバイスDの底部周面と接す
る部位に熱伝達材13がその上面を露出して設けられる
(第8図、第10図参照)一方、光デバイスDの端子D
1と連結可能な所望の数の接続端子14を各光デバイス
固定座12の底部に貫設する(第9図参照)。The socket 1 includes a plurality of optical device fixing seats 12 having a desired number of terminal insertion holes 11, and a heat transfer material 13 is provided at a portion of the seating surface of the plurality of optical device fixing seats 12 that is in contact with the bottom peripheral surface of the optical device D. is provided with its upper surface exposed (see FIGS. 8 and 10), while the terminal D of the optical device D
A desired number of connection terminals 14 connectable to the optical device fixing seat 12 are provided through the bottom of each optical device fixing seat 12 (see FIG. 9).
ソケット1を装填するホルダー2は、ソケットIの熱伝
達材13の外面と接する部位に第2の熱伝達材2】がそ
の内面を露出して設けられる一方、ホルダー2の底部に
、ソケット1の接続端子14と連結可能な接続ピン22
を貫設する(第9図参照)。The holder 2 into which the socket 1 is loaded is provided with a second heat transfer material 2 with its inner surface exposed at a portion in contact with the outer surface of the heat transfer material 13 of the socket I, and a second heat transfer material 2] is provided at the bottom of the holder 2 with the inner surface exposed. Connection pin 22 connectable with connection terminal 14
(See Figure 9).
次に、ホルダー2に対するソケットlの周方向位置決め
手段として、ソケットlのホルダー接触部に、礼状に変
形した間材15を設けると共に、ホルダー2のソケット
接触部に間材15と嵌合する凸材23を設ける(第8図
、第10図参照)。Next, as means for positioning the socket l relative to the holder 2 in the circumferential direction, a spacer 15 deformed into a thank-you note is provided at the holder contact portion of the socket l, and a convex member that fits with the spacer 15 is provided at the socket contact portion of the holder 2. 23 (see FIGS. 8 and 10).
更に、ホルダー2内におけるソケット1と、そのソケッ
ト1内における光デバイスDの軸線方向位置決め手段と
して、複数の光デバイスの頭部に対向する部位に窓31
を設けた蓋3の一端をホルダー2の一端に軸支させると
共に、その蓋3を閉結位で固定するストッパー35をホ
ルダー2の他端に設ける一方、蓋3の内面にバネ32を
介して押圧材33を付設し、押圧材33においてソケッ
ト1の複数の光デバイス固定座12と対向する複数の部
位に孔34を設け、その孔は、光デバイスDの発光部D
2の緩挿が可能であり、かつ、その発光ff1D2の基
部に設けられるフランジD3の挿通が不能な径を有する
(第8図、第9図参照)。Further, as means for axially positioning the socket 1 within the holder 2 and the optical device D within the socket 1, a window 31 is provided at a portion facing the heads of the plurality of optical devices.
One end of the lid 3 provided with this is pivotally supported on one end of the holder 2, and a stopper 35 for fixing the lid 3 in the closed position is provided at the other end of the holder 2. A pressing member 33 is attached, and holes 34 are provided in a plurality of parts of the pressing member 33 facing the plurality of optical device fixing seats 12 of the socket 1, and the holes are provided with
2 can be loosely inserted, and has a diameter that makes it impossible to insert the flange D3 provided at the base of the light emitting ff1D2 (see FIGS. 8 and 9).
最後に、ホルダー2の第2の熱伝達材21を介する温度
制御手段として、まず、ソケット1の熱伝達材13に温
度センサー4を備え、次に、ホルダー2の第2の熱伝達
材21の両端部にそれぞれペルチェ素子5の熱交換部を
接触させて設けると共に、内部の熱を外部へ排出する水
冷式の放熱手段6を設ける。その放熱手段6は、液体の
流通が可能な内部空間61に冷却液の流入孔62及び排
出孔63を接続して形成されている(第8図、第9図参
照)。Finally, as a temperature control means via the second heat transfer material 21 of the holder 2, first, the heat transfer material 13 of the socket 1 is provided with a temperature sensor 4, and then the second heat transfer material 21 of the holder 2 is provided with a temperature sensor 4. The heat exchange portions of the Peltier elements 5 are provided at both ends in contact with each other, and water-cooled heat radiating means 6 for discharging internal heat to the outside is provided. The heat dissipation means 6 is formed by connecting a coolant inflow hole 62 and a coolant discharge hole 63 to an internal space 61 through which liquid can flow (see FIGS. 8 and 9).
本実施例によるチャックは、ソケットlに複数の光デバ
イス固定座12を併設しているので、−度の固定作業で
複数の光デバイスを同時に固定して検査測定することが
可能であり、多数の光デバイスを能率的に検査測定する
ことができる。Since the chuck according to this embodiment has a plurality of optical device fixing seats 12 attached to the socket l, it is possible to fix a plurality of optical devices at the same time and inspect and measure them with a one-time fixing operation. Optical devices can be efficiently inspected and measured.
また、形状や端子数の異なる幾種類かの先デバイスを同
時に固定して検査測定するために、形状の異なる幾種類
かの光デバイス固定座12をソケット1に併設すること
も考えられる。It is also conceivable to provide several types of optical device fixing seats 12 with different shapes in the socket 1 in order to simultaneously fix and inspect and measure several types of end devices with different shapes and numbers of terminals.
更に、本実施例によるチャックのソケットlは、光デバ
イス固定座12に密着する光デバイスの基部に手掛かり
を得て、光デバイスを光デバイス固定座12から容易に
離脱できるようにするために、光デバイス固定座12の
周縁に接する溝16を備えている。Furthermore, the socket l of the chuck according to the present embodiment has an optical structure that allows the optical device to be easily removed from the optical device fixing seat 12 by taking a cue from the base of the optical device that is in close contact with the optical device fixing seat 12. A groove 16 is provided in contact with the periphery of the device fixing seat 12.
なお、本発明によるチャックのホルダー2に備えられる
接続ピン22として、内蔵するバネの弾性によってソケ
ット1の接続端子14に圧着するプランジャーピンを備
えることが考えられ、そのプランジャーピンを用いれば
、ホルダー2に対するソケット1の着脱を頻繁に繰り返
した場合でも、ホルダー2のプランジャーピンがソケッ
トIの接続端子14に確実に圧着するので、電気的接続
を確実に行うことが可能となる。In addition, as the connection pin 22 provided in the holder 2 of the chuck according to the present invention, it is possible to provide a plunger pin that is crimped to the connection terminal 14 of the socket 1 by the elasticity of a built-in spring. Even when the socket 1 is repeatedly attached to and detached from the holder 2, the plunger pin of the holder 2 is reliably crimped to the connection terminal 14 of the socket I, so that the electrical connection can be made reliably.
(発明の効果)
以上詳述したように、本発明による光デバイスの特性テ
スター用チャックは、簡単な操作を行うだけで、検査測
定を行う光デバイスの周方向及び軸線方向の位置決めを
行ってチャックの定位置に確実に固定し得ると共に、固
定した光デバイスとチャックの外部とを電気的に接続し
、更に、チャックに備えた温度制御手段によって生成さ
れる、所望の設定温度に従った恒温状態の熱を、固定し
た光デバイスに迅速に、効率よく、ムラなく伝達するの
で、所望の温度環境下における光デバイスの光学的及び
または電気的特性を、迅速かつ正確7こ検査測定するこ
とができる。しかも、光デバイスのチャックへの着脱を
繰り返しても、光デバイスはチャックの同一位置に高精
度で反復固定されるので、光デバイスの固定位置のズレ
に起因する測定誤差を極力減少させて、常に正確な検査
測定を行うことができる。(Effects of the Invention) As described in detail above, the chuck for an optical device characteristic tester according to the present invention can position the optical device to be inspected and measured in the circumferential direction and the axial direction by simply performing a simple operation. can be reliably fixed in a fixed position, electrically connect the fixed optical device to the outside of the chuck, and further maintain a constant temperature state according to a desired set temperature generated by a temperature control means provided in the chuck. of heat is transferred quickly, efficiently, and evenly to a fixed optical device, so the optical and/or electrical characteristics of the optical device can be quickly and accurately inspected and measured under a desired temperature environment. . Moreover, even if the optical device is repeatedly attached to and detached from the chuck, the optical device is repeatedly fixed at the same position on the chuck with high precision, so measurement errors caused by deviations in the fixed position of the optical device are reduced as much as possible. Accurate inspection measurements can be made.
図面はこの発明の具体的実施例を示す。
第1図は、本発明による単数素子用水冷式チャックと、
そのチャックに光デバイスを挿入するソケットとを分離
して示す斜視部分断面図、
第2図は、第1図で示すチャックの蓋を閉結した状態を
示す平面図、
第3図は、第2図3−3線に沿った縦断面図、第4図は
、本発明による単数素子用空冷式チャックと、そのチャ
ックに光デバイスを挿入するソケットとを分離して示す
縦断面図、
第5図は、第4図に示すチャックの平面図であって、蓋
が開放位の状態を示し、
第6図は、蓋が閉結され、内部に光デバイスが着座した
ソケットを含む第4図のチャックを示す縦断面図、
第7図は、第6図の平面図、
第8図は、本発明による複数素子用水冷式チャックと、
そのチャックに挿入されるソケットとを分離して示す斜
視部分断面図、
第9図は、第8図のチャックにソケットを挿入した状態
を示す第10図9−9線に沿った縦断面図、第10図は
、第9図1010線に沿った一部破断平面図である。
1 、、、、、、ソケット、
11、、、、、、端子挿入孔、
12、、、、、、光デバイス固定座、
13、、、、、、熱伝達材、
14、、、、、接続端子、
15、、、、、、間材、
16.61.溝、
2、、、、、ホルダー
21、、、、、、第2の熱伝達材、
22、、、、、、接続ピン、
23、、、、、、凸材、
3゜ 、蓋、
31、、、、、窓、
32、、、、、バネ、
331.押圧材、
341.孔、
35、、、、、ストッパー
411.温度センサー
56.ペルチエ素子、
6、、、、、、水冷式放熱手段、
61、、、、 内部空間、
62、 、 、 、 、冷却液流入孔、63、、、、、
、冷却液排出孔、
7 、空冷式放熱手段、
71、、、、、’、放熱フィン、
72、、、、、、送風機、
73、、、、、送風孔、
74、、、、、、排気孔、
D 69.光デバイス、
D I 、、、、光デバイスの端子、
D2.、、、光デバイスの発光部、
D 3 、、、、光デバイスのフランジ、K1.。
6.キープレート1
111.レバーThe drawings show specific embodiments of the invention. FIG. 1 shows a water-cooled chuck for a single element according to the present invention;
FIG. 2 is a plan view showing the chuck shown in FIG. 1 with the lid closed; FIG. FIG. 4 is a vertical cross-sectional view taken along the line 3-3, FIG. 6 is a plan view of the chuck shown in FIG. 4 with the lid in an open position; FIG. 6 is a plan view of the chuck of FIG. 4 with the lid closed and including a socket in which an optical device is seated; FIG. 7 is a plan view of FIG. 6, and FIG. 8 is a water-cooled chuck for multiple elements according to the present invention,
9 is a perspective partial sectional view showing the socket inserted into the chuck separately; FIG. 9 is a vertical sectional view taken along the line 9-9 in FIG. 10 showing the socket inserted into the chuck of FIG. 8; FIG. 10 is a partially cutaway plan view taken along line 1010 in FIG. 9. FIG. 1. Socket 11. Terminal insertion hole 12. Optical device fixing seat 13. Heat transfer material 14. Connection Terminal, 15, Intermediate material, 16.61. Groove, 2, Holder 21, Second heat transfer material, 22, Connection pin, 23, Convex material, 3゜, Lid, 31, ,,,,window, 32,,,,spring, 331. Pressing material, 341. Hole 35...Stopper 411. Temperature sensor 56. Peltier element, 6, Water-cooled heat dissipation means, 61, Internal space, 62, Coolant inlet, 63,
, coolant discharge hole, 7, air-cooled heat radiating means, 71, , radiating fins, 72, , blower, 73, , ventilation hole, 74, , exhaust Hole, D 69. Optical device, D I , , Terminal of optical device, D2. , , Light emitting part of optical device, D 3 , , Flange of optical device, K1. . 6. Key plate 1 111. lever
Claims (8)
径とを有する所望の数の端子挿入 孔をもった光デバイス固定座と、その固定 座における前記光デバイスと接する熱伝達 材と、前記面定座の底部に貫設した前記光 デバイスの端子と連結可能な所望の数の接 続端子とを備えたソケットと、 前記熱伝達材と接する第2の熱伝達材と、 底面に貫設した前記接続端子と連結可能な 接続ピンとを備えた前記ソケット装填用の ホルダーと、 そのホルダーに対する前記ソケットの周 方向位置決め手段と、 前記ホルダー内における前記ソケットと、 そのソケット内における前記光デバイスの 軸線方向位置決め手段と、 前記第2の熱伝達材を介する温度制御手 段と、 から成る光デバイスの特性テスター用チャ ック。(1) an optical device fixing seat having a desired number of terminal insertion holes with a depth and diameter that allow terminals of a single optical device to be attached and detached; a heat transfer material in contact with the optical device on the fixing seat; a socket provided with a desired number of connecting terminals that can be connected to the terminals of the optical device, which are provided through the bottom of the surface mounting seat; a second heat transfer material that is in contact with the heat transfer material; a holder for loading the socket, which includes a connection pin connectable to the connection terminal; means for positioning the socket in the circumferential direction with respect to the holder; the socket in the holder; and the axial direction of the optical device in the socket. A chuck for a characteristic tester of an optical device, comprising: a positioning means; and a temperature control means via the second heat transfer material.
た請求項1記載の光デバイスの特 性テスター用チャック。(2) The chuck for an optical device characteristic tester according to claim 1, wherein the socket is provided with a plurality of optical device fixing seats.
決め手段として、 前記双方の接触部の特定部位に相互に嵌 合する凹材と凸材を対設した請求項1記載 の光デバイスの特性テスター用チャック。(3) The chuck for a characteristic tester of an optical device according to claim 1, wherein the means for positioning the socket in the circumferential direction with respect to the holder includes a concave member and a convex member that are fitted to specific portions of both of the contact portions. .
ット内における前記光デバイスの 軸線方向位置決め手段として、 前記光デバイスの頭部に対向する部位に 窓を設け、かつ、一端を前記ホルダーの一 端に軸支させた蓋と、 その蓋を閉結位で固定するために前記ホ ルダーの他端に設けたストッパーと、 前記蓋の内面にバネを介して設けた押圧 材と、 前記蓋の閉結位において前記押圧材が前 記ソケットの光デバイス固定座と対向する 部位に設けた、前記光デバイスの発光部の 緩挿が可能であり、かつ、前記発光部の基 部に設けられるフランジの挿通が不能な径 を有する孔と、 を備えた請求項1記載の光デバイスの特 性テスター用チャック。(4) As means for axially positioning the socket in the holder and the optical device in the socket, a window is provided in a portion facing the head of the optical device, and one end is pivotally supported at one end of the holder. a stopper provided at the other end of the holder for fixing the lid in the closed position; a pressing member provided on the inner surface of the lid via a spring; The pressing member is provided at a portion of the socket facing the optical device fixing seat, and has a diameter that allows the light emitting part of the optical device to be loosely inserted therein, and that does not allow insertion of a flange provided at the base of the light emitting part. The chuck for a characteristic tester of an optical device according to claim 1, comprising: a hole having a hole;
、 前記光デバイスの近傍に備えた温度セン サーと、 前記第2の熱伝達材に熱交換部を接触さ せて設け、前記温度センサーの検出温度と 設定温度との差に相当する温度を補正する ペルチエ素子と、 内部の熱を外部へ排出する放熱手段と、 から成る請求項1記載の光デバイスの特 性テスター用チャック。(5) Temperature control means via the second heat transfer material includes a temperature sensor provided near the optical device, and a heat exchange section provided in contact with the second heat transfer material, The chuck for a characteristic tester of an optical device according to claim 1, comprising: a Peltier element that corrects a temperature corresponding to the difference between the detected temperature and the set temperature; and a heat dissipation means that discharges internal heat to the outside.
させ、そのソケットをチャックの ホルダー内に周方向の位置決めをして装填 し、 蓋を閉結して、前記ホルダー内における 前記光デバイスの軸線方向の位置決めをし、前記光デバ
イスの端子を、前記ソケット に設けた接続端子を経由して、前記ホルダ ーの外部と電気的に接続させ、 前記チャック内に設けた温度センサーの 検出温度が設定温度より低い場合にペルチ エ素子で補正し、前記検出温度が前記設定 温度より高い場合に放熱手段で放熱して、 前記設定温度による恒温状態を生成して、 前記光デバイスの光学的及びまたは電気 的特性を測定検査することを特徴とする光 デバイスの特性テスト方法。(8) Seating the optical device on the optical device fixing seat of the socket, positioning and loading the socket into the holder of the chuck in the circumferential direction, closing the lid, and aligning the axis of the optical device within the holder. the terminal of the optical device is electrically connected to the outside of the holder via the connection terminal provided in the socket, and the temperature detected by the temperature sensor provided in the chuck is the set temperature. When the detected temperature is lower than the set temperature, the detected temperature is corrected by a Peltier element, and when the detected temperature is higher than the set temperature, the heat is radiated by a heat radiating means to generate a constant temperature state according to the set temperature, and the optical and/or electrical characteristics of the optical device are adjusted. A method for testing the characteristics of an optical device, characterized by measuring and inspecting the characteristics of the optical device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21413390A JPH0682089B2 (en) | 1990-08-13 | 1990-08-13 | Chuck for optical device characteristic tester and test method using the chuck |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21413390A JPH0682089B2 (en) | 1990-08-13 | 1990-08-13 | Chuck for optical device characteristic tester and test method using the chuck |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0495846A true JPH0495846A (en) | 1992-03-27 |
JPH0682089B2 JPH0682089B2 (en) | 1994-10-19 |
Family
ID=16650777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21413390A Expired - Lifetime JPH0682089B2 (en) | 1990-08-13 | 1990-08-13 | Chuck for optical device characteristic tester and test method using the chuck |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0682089B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1354764A2 (en) | 2002-04-19 | 2003-10-22 | Murakami Corporation | Vehicle mirror angle controller |
WO2005078459A1 (en) * | 2004-02-06 | 2005-08-25 | Honeywell International Inc. | Quick attachment fixture and power card for diode-based light devices |
WO2013003317A1 (en) * | 2011-06-30 | 2013-01-03 | Tyco Electronics Corporation | Light emitting diode verification system |
CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
CN110174247A (en) * | 2019-05-29 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Optical device test device |
-
1990
- 1990-08-13 JP JP21413390A patent/JPH0682089B2/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1354764A2 (en) | 2002-04-19 | 2003-10-22 | Murakami Corporation | Vehicle mirror angle controller |
WO2005078459A1 (en) * | 2004-02-06 | 2005-08-25 | Honeywell International Inc. | Quick attachment fixture and power card for diode-based light devices |
US7030642B2 (en) | 2004-02-06 | 2006-04-18 | Honeywell International Inc. | Quick attachment fixture and power card for diode-based light devices |
WO2013003317A1 (en) * | 2011-06-30 | 2013-01-03 | Tyco Electronics Corporation | Light emitting diode verification system |
CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
CN110174247A (en) * | 2019-05-29 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Optical device test device |
Also Published As
Publication number | Publication date |
---|---|
JPH0682089B2 (en) | 1994-10-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100342016B1 (en) | Semiconductor wafer holding apparatus and semiconductor wafer storage chamber | |
JP4495919B2 (en) | Planarization equipment | |
KR100221951B1 (en) | Test part of ic handler | |
JP2007525672A (en) | Equipment and method for energization test | |
KR20080042077A (en) | Vertical probe card and air cooled probe head system | |
JP2010151794A (en) | Electronic component tester | |
EP0886303A2 (en) | Apparatus for measuring pedestal temperature in a semiconductor wafer processing system | |
US20100201391A1 (en) | Apparatus and method for testing semiconductor devices | |
KR102207091B1 (en) | Test Socket Board Aging Test System and Test Socket Board Aging Test Method | |
JPH0495846A (en) | Chuck for tester on characteristic of optical device and testing method using same | |
US20120223730A1 (en) | Probe card positioning mechanism and inspection apparatus | |
KR20180121361A (en) | Carrier for electronic component test device | |
JP2004128509A (en) | Prober for testing substrate at low temperature | |
JP2002525887A (en) | Insulation plate for probe card | |
JP2010027729A (en) | Prober and semiconductor wafer testing method using the same | |
JP7529876B2 (en) | Testing device, testing method and program | |
JP5846969B2 (en) | Temperature measurement method | |
JP2013002888A (en) | Semiconductor inspection tool and semiconductor inspection apparatus | |
KR102202079B1 (en) | Temperature measuring device and method of calibrating temperature in test handler using the same | |
US20080061814A1 (en) | Electronic Component Test System | |
KR102728570B1 (en) | Micro probe system | |
JP3294174B2 (en) | Temperature measurement device for wafer holder and wafer storage chamber | |
JP6842355B2 (en) | Carrier for electronic component testing equipment | |
JP4654852B2 (en) | Electronic component testing equipment | |
JPH0943312A (en) | Test part of ic handler |