JPH0494994A - Manufacture of jewelry encapsulatig card - Google Patents

Abstract

PURPOSE:To prevent manufacture defects from being generated by a method wherein a covering material or decorative material is previously manufactured, and on a card base material in which a jewelry piece is laid, these materials are laminated by hot press. CONSTITUTION:A card base material with an insertion area is manufactured, and in the insertion area of the card base material, a jewelry piece is laid. When a jewelry piece 2 is laid, it is desirable to temporarily fix the jewelry piece in an insertion area 1a by applying an adhesive. Covering materials 31, 32 are manufactured. The covering materials 31, 32 are laminated on center cores 11, 12, seal the jewelry piece 2, and fix it assuredly, and at the same time, they are transparent or semi-transparent sheets through which a content can be seen from the outside. For the combination of materials for a card base material 1 and the covering materials 31, 32, it is preferable that both parts are poly vinyl chloride resin. By placing the covering material 31, 32 on the card base material and hot-pressing, the covering materials 31, 32 are laminated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a precious metal-encapsulated card in which precious metals such as gold, silver, and platinum are encapsulated.

[Prior Art] In order to make precious metals easier to handle, it is known that they are sealed with a resin film or the like.

For example, in Japanese Utility Model Application Publication No. 64-50927, ``A laminated metal card J includes [at least one metal plate stretched into a thin plate shape and laminated sheets laminated on both sides of this metal plate]. and a pattern formed on at least the metal plate by applying pressure, heat, etc. from the surface side of the laminate layer.

[Problem to be solved by the invention]

The conventional cards mentioned above vary in size depending on the weight of the metal, making them inconvenient to handle during storage and transportation, and also making it impossible to perform mechanical processing such as verification.

Furthermore, laminating and enclosing the product in resin makes it difficult to visually determine whether it is genuine or not, and there is a possibility that fraud such as replacing the metal may occur.

In order to solve these problems, the present applicant has proposed a precious metal-encapsulated card in which a precious metal piece is embedded in the insertion portion of a card base material and a transparent covering material is laminated on the card base material.

In this precious metal-enclosed card, the covering material covers the precious metal piece and is not exposed directly to the precious metal piece, so it can be protected from fingerprints and dirt. Furthermore, regardless of the size of the enclosed precious metal piece, the overall shape is the same, making it easy to store and transport, making it easier to handle, and allowing mechanical processing such as exchange or verification. Furthermore, since the enclosed precious metal piece can be visually observed from the outside, there is a sense of security and there are various advantages such as no misunderstanding of the size of the precious metal piece.

However, since these precious metal-enclosed cards are manufactured with expensive precious metals encapsulated in them, mistakes can occur when forming information recording layers such as magnetic stripes and barcodes, and decorative layers such as printing designs and holograms. In this case, the precious metal pieces had to be taken out from the card base material, resulting in a problem of poor yield.

An object of the present invention is to solve the above-mentioned problems and provide a method for manufacturing a precious metal-filled card that does not cause manufacturing defects.

[Means for Solving the Problems] In order to solve the above problems, the method for manufacturing a precious metal encapsulated card according to the present invention includes a card base material manufacturing step of manufacturing a card base material having an insertion portion, and a step of manufacturing a card base material having an insertion portion. A precious metal piece embedding step in which a precious metal piece is embedded in the insertion portion, a covering material lamination step in which a covering material is placed on top of the card base layer and laminated by hot pressing, and a decorative material is placed on the covering material and heated. It consists of a decorative material lamination process that is transferred using a press.

Further, the method for manufacturing a precious metal-encapsulated card according to the present invention includes a card base material manufacturing step of manufacturing a card base material having an insertion portion, a precious metal piece embedding step of embedding a precious metal piece in the insertion portion of the card base material, and a precious metal piece embedding step of embedding a precious metal piece in the insertion portion of the card base material. and a step of laminating the covering material and decorative material, in which the covering material and the transfer material are placed on the base material and hot-pressed at the same time.

[Example] Hereinafter, the present invention will be described in detail with reference to the drawings and the like.

FIG. 1 is a process diagram showing a first embodiment of a method for manufacturing a precious metal-filled card according to the present invention, and FIG. 2 is a diagram showing a precious metal-filled card manufactured by the same method.

The method for manufacturing a precious metal encapsulated card according to the first embodiment includes a card base material manufacturing step 101, a precious metal piece embedding step 102, a covering material manufacturing step 103, a covering material lamination step 104,
The process includes an edge cutting process 105, a decorative material manufacturing process 106, a decorative material lamination process 107, and a punching process 108.

The card base material manufacturing step 101 is a step of manufacturing the card base material 1 having the insertion portion 1a.

The card base material 1 serves as a carrier for this card,
It has a structure in which two center cores 11 and 12 are stacked.

The card base material 1 is polyvinyl chloride resin.

Polyethylene resin, polypropylene resin, polyethylene terephthalate resin, ABS resin (acrylonitrile/
butadiene/styrene copolymer resin) AS resin (acrylonitrile/styrene copolymer resin), polysulfone resin,
Films or sheets (hereinafter simply referred to as films) made of polymer materials such as polyimide resins and acrylic resins such as polymethyl methacrylate, or inorganic organic materials such as glass fiber-embedded epoxy resins. A film made of a mixture or a metal plate made of iron, copper, aluminum, etc. can be used.

In addition, when using a film made of a polymeric material or a mixture of inorganic and organic materials, pigments and the like are kneaded to obtain the required color and density.

Here, the thickness of the center core 11.12 is approximately 0.
A 56 mm milky white polyvinyl chloride film (a film made by kneading titanium white pigment into polyvinyl chloride resin) is used. A registration mark (register mark) is printed on each center core 11, 12 so that the outer dimensions of the unit card are approximately 54 x 86 mm, and a mold MBC is printed on the center core 11 side.
Openings 11a are formed by punching, and these center cores 1
112, the insertion portion 1a is formed.

The noble metal piece embedding step 102 is a step of embedding the noble metal piece 2 into the insertion portion 1a of the card base material 1.

The precious metal piece 2 is made of precious metal such as gold, silver, platinum, palladium, and alloys thereof in any shape and weight. For example, as the precious metal piece 2, a gold bullion with a weight of 0.
5. 1. Four types of 0.2.5.5.0 grams were prepared, the thickness was 0.56 mm to match the depth of the insertion part 1a of the card base material 1, and the long and short sides of each month were prepared. The length of each side is 8,7x5.4.12,2 x 7゜6 19.
3X12.0.27.2X17mm can be used.

When embedding the noble metal piece 2, it is desirable to apply an adhesive to the insertion portion 1a and temporarily attach the noble metal piece 2.

The covering material production step 103 is a step of producing covering materials 31 and 32.

The covering material 31.32 is a transparent or translucent sheet that is laminated on the center core 11.12, seals the precious metal piece 2, securely fixes it, and is visible from the outside.

The covering materials 31 and 32 may be transparent or translucent films made of the same kind of polymer material as the card base material 1 or a mixture of inorganic and organic materials.

Furthermore, depending on the material combination of the card base material 1 and the covering material 31, 32, there may be cases where the two do not adhere well during thermocompression bonding. , 32 may be provided with an adhesive layer. Note that the adhesive layer can be formed by known means such as coating, printing, and laminate.

As for the combination of materials for the card base material 1 and the covering materials 31 and 32, polyvinyl chloride resin is preferred for both. The reason for this is that polyvinyl chloride resin has good thermocompression bonding properties and is resistant to plastic deformation. Furthermore, when embossing character information or the like onto a card, polyvinyl chloride resin is particularly preferred because of its excellent embossing suitability.

In this embodiment, the covering material 31,32 has a thickness of about 0.000 mm.
A stack of three 1 mm transparent polyvinyl chloride films was used.

Further, a sheet is used in which an information recording layer such as a magnetic stripe, 41, 42 is formed by transfer on the covering material 31, 32, and the sheet is canted to the same size as the card base material 1. These information recording layers 4142 can record information such as the quality and weight of the precious metal piece 2.

In the covering material lamination step 104, the covering material 31 is deposited on the card base material 1.
32 is placed and hot pressed, the covering material 31.
This is the process of laminating 32 layers.

In this process, the material is sandwiched between mirror-finished metal plates, such as stainless steel, at a temperature of 150°C, a pressure of 25kg, and /c+II.
, heat press under lamination conditions of 20 minutes.

Note that the card base material 1 is inserted into the insertion portion 1a of the card base material 1.
Insert the precious metal piece 2 so that its surface slightly protrudes from the surface of the card base material 1 and the precious metal piece 2, place a transparent or translucent resin film on the surfaces of the card base material 1 and the precious metal piece 2, and insert the metal plate (thermal plate) from both sides of this resin film. The covering materials 31 and 32 may be laminated by thermocompression bonding.

In other words, for the thickness of the card base material 1, the precious metal piece 2
By significantly increasing the thickness t2, the surface of the precious metal piece 2 protrudes from the surface of the card base material 1. The reason why the precious metal piece 2 is made to protrude is that when the precious metal piece 2 is equal to or submerged on the surface of the card base material 1, the covering material 31, 32
In the hot pressing process for forming the card, the edge of the through hole 1a of the card base material 1 may melt and flow into the precious metal piece 2 side, causing edge sag, or air bubbles may be mixed on the precious metal piece 2, resulting in a poor appearance. Because it will be.

As a specific example, in the case of a card with a total thickness of 0.76 mm, which is the most commonly distributed card for use in Tallerint cards, that is, the thickness of the card base material I is 0.56 mm, the covering material 31. 32 cards each having a thickness of 0.1 mm will be described. In this case, it is desirable that the precious metal piece 2 protrudes to one side by about Δt=0.005~O, (13 mm. If ΔL is 0.005 mm or less,
The advantages of this invention are not realized, and ΔL is 0.03 mm.
In the above case, air bubbles may be mixed into other parts of the card base material 1, the flatness during pressing may be poor, and slight undulations may occur on the surface of the finished card near where the precious metal pieces are encapsulated. It is.

The above explanation was about a card with a total thickness of 0.76 mm, but - the total thickness distributed for boat fishing is 0.76 mm.
Even for cards of approximately 2 mm to 5 mm, the thickness of each layer can be designed using the same concept as described above.

At this time, if the covering material 31, 32 is provided with an information recording layer, it goes without saying that the surface on which the information recording layer is provided is the outside (the surface opposite to the card base material 1). Further, a protective layer may be provided further outside the covering material 3132. This protective layer is the information recording layer 4
This is provided to improve wear resistance and slippage.

In the edge cutting step 105, the card base material l and the covering material 31.
This is a process of cutting the entire edge of 32.

The decorative material manufacturing step 106 is a step of manufacturing decorative materials 51 and 52.

The decorative material 52.52 can be formed by blank printing, pattern printing such as letters or concave shapes, or hologram embossing.

Here, a transfer sheet is produced in which a predetermined pattern is printed on PET films 51a and 52a by offset printing or silk screen printing to form printed layers 51b and 52b.

The decorative material lamination step 107 is a step in which decorative materials 51.52 are placed on the covering material 31.32 and transferred using a hot press.

In this step, the decorative material 51.52 is temporarily pasted on the laminated covering material 31.32, and then heat pressed at a temperature of about 11 O"C in the same manner as described above, and then the PET film 51a
52a is peeled off and the printed layers 51b and 52b are transferred.

The card punching step 108 is a step of punching out a unit card by MCB punching.

FIG. 3 is a process diagram showing a second embodiment of the method for manufacturing a precious metal encapsulated card according to the present invention.

In the second embodiment, the covering material 31.31 and the decorative material 5152
After producing (203, 204), they are placed in order and heat pressed once at a temperature of 110°C to simultaneously laminate the covering material 31.31 and the decorative material 51.52. (205).

In this case, when producing the card base material 1, it is necessary to apply an adhesive to the front and back surfaces of the center core 11, 12 (201).

The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the present invention.

The size, layer structure, material, etc. of the card are not particularly limited, and can be changed as appropriate depending on the system used. For example, the card base material may have an insertion portion cut into one base material.

Further, the information recording layers 41 and 42 can be formed in a position where they partially overlap the metal piece 2 with the covering material 3132 laminated thereon. By doing this, if you intentionally try to take out the precious metal piece 2, the information recording layer 41.
42 is destroyed and the precious metal piece 2 is prevented from being replaced with another low-quality metal piece.

The manufactured precious metal-embedded cards can be used for small-value precious metal transactions, as prizes, and can also be used to give a sense of luxury as credit cards for high-income earners, such as so-called gold cards.

[Effects of the Invention] As explained in detail above, according to the present invention, the covering material and the decorative material are prepared in advance and are laminated by hot pressing onto the card base material in which the precious metal pieces are embedded. By checking whether or not the card base material, cover material, and decorative materials are defective, defective products will not be sent to subsequent processes, and precious metal pieces will be removed after the card is completed because the entire card is defective. That's no longer the case.

[Brief explanation of the drawing]

FIG. 1 is a process diagram showing a first embodiment of a method for manufacturing a precious metal-filled card according to the present invention, and FIG. 2 is a diagram showing a precious metal-filled card manufactured by the same method. FIG. 3 is a process diagram showing a second embodiment of the method for manufacturing a precious metal encapsulated card according to the present invention. 101.201...Card base material production process 102.20
2...Precious metal piece embedding process 103.203...Coating material production process 104...Coating material lamination process 105...Edge cutting process 106.204...Decoration material production process 107...Decoration material lamination Process 108.206...Blanking process 05...Coating material/decorative material lamination process...Card base material 1.12...Center core...Precious metal piece 1.32...Coating material 1.42. ... Information recording layer 1.52 ... Decorative material

Claims (2)

[Claims] (1) A card base material manufacturing step of manufacturing a card base material having an insertion portion; A noble metal piece embedding step of embedding a precious metal piece in the insertion portion of the card base material; A covering material is placed on the card base material. A method for producing a precious metal encapsulated card, comprising: a step of laminating a covering material in which the decorative material is laminated by heat pressing; a step of laminating a decorative material in placing a decorative material on the covering material and transferring it by heat pressing; (2) A card base material manufacturing step of manufacturing a card base material having an insertion portion; A precious metal piece embedding step of embedding a precious metal piece in the insertion portion of the card base material; A covering material and a transfer material are placed on the card base material. A method for producing a precious metal encapsulated card, comprising: a step of laminating a covering material and a decorative material in which the material is placed and hot-pressed at the same time;