JPH0490392A - Card containing precious metal in sealed form and its manufacture - Google Patents
Card containing precious metal in sealed form and its manufactureInfo
- Publication number
- JPH0490392A JPH0490392A JP2206485A JP20648590A JPH0490392A JP H0490392 A JPH0490392 A JP H0490392A JP 2206485 A JP2206485 A JP 2206485A JP 20648590 A JP20648590 A JP 20648590A JP H0490392 A JPH0490392 A JP H0490392A
- Authority
- JP
- Japan
- Prior art keywords
- precious metal
- card base
- metal piece
- card
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010970 precious metal Substances 0.000 title claims abstract description 58
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000010410 layer Substances 0.000 claims abstract description 26
- 239000011247 coating layer Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 7
- 238000007639 printing Methods 0.000 abstract description 5
- 238000004049 embossing Methods 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 239000007787 solid Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000004800 polyvinyl chloride Substances 0.000 description 7
- 229920000915 polyvinyl chloride Polymers 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、金、銀、白金等の貴金属を封入し、その貴金
属を両側から見えるようにした貴金属封入カードとその
製造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a precious metal-encapsulated card in which precious metals such as gold, silver, platinum, etc. are encapsulated and the precious metals are visible from both sides, and a method for manufacturing the same. .
貴金属を取り扱いやすくするために、樹脂フィルムなど
で封止したものが知られている。In order to make precious metals easier to handle, it is known that they are sealed with a resin film or the like.
例えば、実開昭６４−５０９２７号「ラミネート加工さ
れた金属製カード」には、「薄板状に弓き伸ばした少な
くとも１枚の金属板と、この金属板の両側に積層したラ
ミネート層と、このラミネート層の表面側から圧力、熱
などを加えて、少なくとも前記金属板に形成された模様
と」を備えた構造が開示されている。For example, Utility Model Application Publication No. 64-50927 ``Laminated metal card'' describes ``at least one metal plate stretched into a thin plate shape, a laminate layer laminated on both sides of this metal plate, and A structure is disclosed in which a pattern is formed on at least the metal plate by applying pressure, heat, etc. from the surface side of the laminate layer.
前述した従来のカードでは、金属の重さによって、大き
さが区々になるので、保管や輸送などの取り扱いが不便
であるうえ、照合などの機械的な処理ができなかった。The conventional cards mentioned above vary in size depending on the weight of the metal, making them inconvenient to handle during storage and transportation, and also making it impossible to perform mechanical processing such as verification.
また、ラミネートして樹脂封入することが、逆に、目視
での真偽の判定をしすらくし、金属を交換するなどの不
正が行われる可能性があった。Furthermore, laminating and enclosing the product in resin makes it difficult to visually determine whether it is genuine or not, and there is a possibility that fraud such as replacing the metal may occur.
本発明の目的は、前述の課題を解決し、取り扱いが容易
であって、機械的な処理ができ、しかも、両側から目視
によりｉ認できる貴金属封入カードおよびそのようなカ
ードの製造方法を提供することである。An object of the present invention is to solve the above-mentioned problems and provide a precious metal-embedded card that is easy to handle, can be mechanically processed, and can be visually recognized from both sides, and a method for manufacturing such a card. That's true.
前記課題を解決するために、本発明による貴金属封入カ
ードは、貫通孔をもつカード基材と、前記カード基材の
貫通孔に挿入される貴金属片と、前記カード基材の両側
に積層され前記貴金属片が目視できる透明または半透明
の被覆層とから構成されている。In order to solve the above problems, a precious metal encapsulated card according to the present invention includes a card base material having a through hole, a precious metal piece inserted into the through hole of the card base material, and a precious metal piece laminated on both sides of the card base material. It consists of a transparent or semi-transparent coating layer that allows the precious metal pieces to be seen.
また、本発明による貴金属封入カードの製造方法は、カ
ード基材の挿入部に、そのカード基材の表面から貴金属
片の表面を若干突出するように挿入し、前記カード基材
および前記貴金属片の表面に透明または半透明な樹脂フ
ィルムを熱圧着することにより被覆層を形成するように
しである。Further, in the method for manufacturing a precious metal encapsulated card according to the present invention, the precious metal piece is inserted into the insertion portion of the card base material so that the surface of the precious metal piece slightly protrudes from the surface of the card base material, and the The coating layer is formed by thermally pressing a transparent or translucent resin film onto the surface.
（実施例〕
以下、図面等を参照して、実施例につき、本発明の詳細
な説明する。(Example) Hereinafter, the present invention will be described in detail with reference to the drawings and the like.
第１図、第２図は、本発明による貴金属封入カードの実
施例を示した図であって、第１図は正面図、第２図は第
１図Ａ−Ａ断面図、第３図は、本発明による貴金属封入
カードの製造方法の実施例を説明するための図である。1 and 2 are views showing an embodiment of a precious metal-encapsulated card according to the present invention, in which FIG. 1 is a front view, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. FIG. 2 is a diagram for explaining an embodiment of the method for manufacturing a precious metal encapsulated card according to the present invention.
本発明の貴金属封入カードは、カード基材１とそのカー
ド基材１を被覆する被覆層３１．３２とを熱圧着により
接着したものである。The noble metal-encapsulated card of the present invention is obtained by bonding a card base material 1 and coating layers 31 and 32 covering the card base material 1 by thermocompression bonding.
カード基材１は、このカードの担体となるものであり、
貴金属片２を挿入する貫通孔１ａが形成されている。The card base material 1 serves as a carrier for this card,
A through hole 1a into which a precious metal piece 2 is inserted is formed.
カード基材１としては、ポリ塩化ビニル樹脂。The card base material 1 is polyvinyl chloride resin.
ポリエチレン樹脂、ポリプロピレン樹脂、ポリエチレン
テレフタレート樹脂、ＡＢＳ樹脂（アクリロニトリル／
ブタジェン／スチレン共重合樹脂）ＡＳ樹脂（アクリロ
ニトリル／スチレン共重合樹脂）、ポリサルホン樹脂、
ポリカーボネイト樹脂ポリイミド系樹脂、ポリメチルメ
タクリレートに代表されるアクリル系樹脂等の高分子材
料からなるフィルム又はシート等（以下、単にフィルム
という）、あるいはガラス繊維埋め込みエポキシ樹脂に
代表される無機有機材料混合体からなるフィルム、ある
いは又、鉄、銅、アルミニウムなどの金属板なとが使用
できる。Polyethylene resin, polypropylene resin, polyethylene terephthalate resin, ABS resin (acrylonitrile/
butadiene/styrene copolymer resin) AS resin (acrylonitrile/styrene copolymer resin), polysulfone resin,
Films or sheets made of polymeric materials such as polycarbonate resins, polyimide resins, and acrylic resins such as polymethyl methacrylate (hereinafter simply referred to as films), or mixtures of inorganic and organic materials such as glass fiber-embedded epoxy resins. Alternatively, a metal plate made of iron, copper, aluminum, etc. can be used.
なお、高分子材料又は無機有機材料混合体からなるフィ
ルムを用いる場合には、顔料等を混練して、必要な色や
濃度が得られるようにする。In addition, when using a film made of a polymeric material or a mixture of inorganic and organic materials, pigments and the like are kneaded to obtain the required color and density.
この実施例では、外形寸法が約５４Ｘ８６ｍｍであって
、厚さが約０．５６ｍｍの乳白色のポリ塩化ビニルフィ
ルム（ポリ塩化ビニル樹脂にチタン白顔料を混練したフ
ィルム）からなるカード基材１を使用し、カード基材ｌ
に、後述する貴金属片２の大きさに対応した貫通孔１ａ
を形成したものである。In this example, a card base material 1 made of a milky white polyvinyl chloride film (a film made by kneading titanium white pigment into polyvinyl chloride resin) with external dimensions of approximately 54 x 86 mm and a thickness of approximately 0.56 mm is used. Card base material
A through hole 1a corresponding to the size of the precious metal piece 2 described later is formed in the hole 1a.
was formed.
貴金属片２は、金、銀、白金およびこれらの合金などの
貴金属を、任意の形状９Ｍ量にしたものである。この貴
金属片２の表面には、貴金属の純度やメーカ等の刻印が
施され、裏側には、重量等の刻印が施されている。この
カードは、このような貴金属片２の両面に施された刻印
を、外側から目視できるようにして、取引者の確認を容
易にしたものである。The precious metal piece 2 is made of a precious metal such as gold, silver, platinum, or an alloy thereof in an arbitrary shape and amount of 9M. The surface of the precious metal piece 2 is engraved with the purity of the precious metal, the manufacturer, etc., and the back side is engraved with the weight, etc. In this card, the engravings on both sides of the precious metal piece 2 are made visible from the outside, making it easy for the transaction person to confirm the transaction.
この実施例では、貴金属片２として、金の地金を重量０
．５． １．０．２．５．５．０グラムの４種類のもの
を用意し、厚さをカード基材１の貫通孔１ａの厚さより
も若干厚い０．５８ｍｍとし、各片の長辺と短辺の長さ
をそれぞれ、８．７ｘ５．４． １２．２Ｘ７．６，１
９．３Ｘ１２．０，２７．２Ｘ１７ｍｍとしたものを用
いている。In this example, the precious metal piece 2 is a gold bullion with a weight of 0.
．． 5. 1. Prepare four types of pieces weighing 0.2.5.5.0 grams, with a thickness of 0.58 mm, which is slightly thicker than the thickness of the through hole 1a of the card base material 1. The length of each side is 8.7x5.4. 12.2X7.6,1
The dimensions of 9.3 x 12.0 and 27.2 x 17 mm are used.
被覆層３１．３２は、カード基材ｌに積層され、貴金属
片２を密封して、確実に固定するとともに、外部から目
視できる透明または半透明の層である。The covering layers 31 and 32 are transparent or translucent layers that are laminated on the card base material 1, seal the precious metal piece 2, securely fix it, and are visible from the outside.
被覆層３１．３２としては、カード基材１と同種の高分
子材料又は無機有機材料混合体からなるフィルムであっ
て、透明又は半透明のものを用いることができる。As the covering layer 31, 32, a transparent or translucent film made of the same kind of polymeric material as the card base material 1 or a mixture of inorganic and organic materials can be used.
また、カード基材１と被覆層３１．３２の材料の組み合
わせによっては、両者を熱圧着する際に良好に接着しな
い場合もあるが、このような場合には、カード基材１と
被覆Ｆ［３１，３２の間に接着層を設けておけばよい。Furthermore, depending on the combination of materials for the card base material 1 and the coating layers 31 and 32, there may be cases where the two do not adhere well when thermocompression bonded. An adhesive layer may be provided between 31 and 32.
なお、その接着層はコ−ティング、印刷、ラミネートな
どの公知の手段により形成できる。Note that the adhesive layer can be formed by known means such as coating, printing, and laminating.
カード基材１と被覆層３１．３２の材料の組み合わせと
しては、両者ともにポリ塩化ビニル樹脂が好ましい。そ
の理由としては、ポリ塩化ビニル樹脂は熱圧着特性がよ
く、塑性変形しにくいためである。また、カードに対し
て、文字情報などをエンボス成形する場合は、特に、エ
ンボス適性が優れている点からもポリ塩化ビニル樹脂が
好ましい。As for the combination of materials for the card base material 1 and the covering layers 31 and 32, polyvinyl chloride resin is preferred for both. The reason for this is that polyvinyl chloride resin has good thermocompression bonding properties and is resistant to plastic deformation. Furthermore, when embossing character information or the like onto a card, polyvinyl chloride resin is particularly preferred because of its excellent embossing suitability.
この実施例では、被覆層３１．３２として、厚さ約０．
３ｍｍの透明ポリ塩化ビニルフィルムを用い、カード基
材１の両側に積層しである。In this embodiment, the covering layer 31,32 has a thickness of about 0.000 mm.
A 3 mm transparent polyvinyl chloride film was used and laminated on both sides of the card base material 1.
被覆層３１．３２の片側または両側には、磁気ストライ
プやバーコードなどの情報記録層４や、ヘタ印刷５文字
や図形などの絵柄印刷、またはホログラムのエンボスな
どにより装飾層５を形成することができる。On one or both sides of the coating layer 31, 32, an information recording layer 4 such as a magnetic stripe or a bar code, a decorative layer 5 can be formed by printing a pattern such as letters or figures, or embossing a hologram. can.
この実施例では、情報記録層４として、所定の抗磁力や
残留磁束、角形比等をもつ磁気ストライプが形成され、
貴金属片２の品質や重量などの情報を記録しである。In this embodiment, a magnetic stripe having a predetermined coercive force, residual magnetic flux, squareness ratio, etc. is formed as the information recording layer 4,
Information such as the quality and weight of the precious metal piece 2 is recorded.
次に、この貴金属封入カードの製造方法を説明する。Next, a method of manufacturing this precious metal encapsulated card will be explained.
この発明では、カード基材１の挿入部に、そのカード基
材１の表面から貴金属片２の表面を若干突出するように
挿入し、カード基材１および貴金属片２の表面に透明又
は半透明な樹脂フィルムをを置き、この樹脂フィルムの
両側から熱板によって熱圧着することによって、被覆層
３１．３２を形成した。In this invention, the surface of the precious metal piece 2 is inserted into the insertion part of the card base material 1 so that the surface of the precious metal piece 2 slightly protrudes from the surface of the card base material 1, and the surfaces of the card base material 1 and the precious metal piece 2 are transparent or translucent. The coating layers 31 and 32 were formed by placing a resin film on both sides of the resin film and thermocompression bonding using a hot plate from both sides of the resin film.
なお、このとき、被覆層３１．３２に情報記録層が設け
られている場合には、その情報記録層の設けられている
面を外側（カード基材１と反対の面）にすることは言う
までもない。At this time, if an information recording layer is provided on the covering layer 31 or 32, it goes without saying that the surface on which the information recording layer is provided is the outside (the surface opposite to the card base material 1). stomach.
また、被覆層３１．３２のさらに外側に、保護層を設け
るようにしてもよい。この保護層は、情報記録層４を耐
摩耗性や滑りを良好にするために設けられる。Further, a protective layer may be provided further outside the covering layers 31 and 32. This protective layer is provided to improve the wear resistance and slippage of the information recording layer 4.
この実施例では、第３Ａ図に示すように、カード基材１
の厚さ１．に対して、貴金属片２の厚さｔ２を若干厚く
することにより、カード基材１の表面から貴金属片２の
表面を突出するようしである。In this embodiment, as shown in FIG. 3A, the card base material 1
Thickness 1. On the other hand, by slightly increasing the thickness t2 of the precious metal piece 2, the surface of the precious metal piece 2 protrudes from the surface of the card base material 1.
このように貴金属片２を突出させる理由は、第３Ｂ図に
示すように、貴金属片２がカード基材１の表面に等しい
か、または沈んでいる場合には、被覆層３１．３２を形
成する熱プレス工程において、カード基材ｌの貫通孔１
ａの工・ノジ部が融けて貴金属片２側に流れ込みエツジ
だれＸを起こしたり、貴金属片２上に気泡Ｙが混入した
りして、見栄えが悪（なるからである。The reason why the precious metal piece 2 is made to protrude in this way is that, as shown in FIG. 3B, when the precious metal piece 2 is equal to or submerged in the surface of the card base material 1, it forms a covering layer 31, 32. In the heat press process, the through hole 1 of the card base material l
This is because the machining/notch part of a melts and flows into the precious metal piece 2 side, causing edge sagging X, and air bubbles Y getting mixed onto the precious metal piece 2, resulting in an unsightly appearance.
具体的な例として、クレジットカード用として最も一般
的に数多く流通しているトータル厚み０゜７６ｍｍのカ
ード、即ち、カード基材１の厚みが０．５６ｍｍの場合
には、被覆層３１．３２の各々の厚みが０．１ｍｍのカ
ードについて説明する。As a specific example, in the case of a card with a total thickness of 0.76 mm, which is most commonly distributed as a credit card, that is, when the thickness of the card base material 1 is 0.56 mm, the coating layer 31.32 is Cards each having a thickness of 0.1 mm will be described.
この場合には、貴金属片２を片側にΔｔ ＝ ０．００
５〜０．０３ｍｍ程度突出させることが望ましい。In this case, the precious metal piece 2 is placed on one side with Δt = 0.00
It is desirable to protrude by about 5 to 0.03 mm.
Δｔが０．００５ｍｍ以下では、この発明の利点が発現
されないし、ΔＬが０．０３ｍｍ以上では、カード基材
１の他の部分に気泡が混入したり、プレス時の平面性が
悪く、仕上がり後のカード表面において、貴金属片の封
入されている付近の表面にわずかなうねりが生ずるから
である。If Δt is less than 0.005 mm, the advantages of the present invention will not be realized, and if ΔL is more than 0.03 mm, air bubbles may be mixed into other parts of the card base material 1, the flatness during pressing may be poor, and the finished product may be This is because slight undulations occur on the surface of the card near the area where the precious metal piece is encapsulated.
以上は、トータル厚みが０．７６ｍｍのカードについて
説明したが、−船釣に流通しているトータル厚みが０．
２ ｍ ｍ〜５ｍｍ程度のカードであっても、前述と同
様な考え方により、各層の厚み設計を行うことができる
。The above explanation was about a card with a total thickness of 0.76 mm, but - the total thickness distributed for boat fishing is 0.76 mm.
Even for cards of about 2 mm to 5 mm, the thickness of each layer can be designed using the same concept as described above.
第４図は、本発明による貴金属封入カードの他の実施例
を示した図である。FIG. 4 is a diagram showing another embodiment of the precious metal encapsulated card according to the present invention.
なお、前述した実施例と同様な機能を果たす部分には、
同一の符号を付しである。Note that the parts that perform the same functions as those in the above-mentioned embodiment include:
The same reference numerals are given.
カード基材１の片側または両側に印刷その他の装飾層５
を施したのちに、被覆層３１．３２を形成してもよい。Printing or other decorative layer 5 on one or both sides of the card substrate 1
After applying, the covering layers 31 and 32 may be formed.
本発明による貴金属封入カードは、以上のように構成さ
れており、小額の貴金属の取り引きや、景品に用いたり
、また、高額所得者向けのクレジットカード、いわゆる
ゴールドカード等として高級感をもたせるのにも使用で
きる。The precious metal-embedded card according to the present invention is configured as described above, and can be used for small-value precious metal transactions or as prizes, or can be used as a credit card for high-income earners, a so-called gold card, etc. to give a sense of luxury. can also be used.
以上説明した実施例に限定されず、本発明の範囲内で種
々の変形ができる。The present invention is not limited to the embodiments described above, and various modifications can be made within the scope of the present invention.
この実施例の製造方法は、カード基材の片側のみに貴金
属片が見えるようにする場合にも適用できる。The manufacturing method of this embodiment can also be applied to the case where the precious metal piece is made visible only on one side of the card base material.
以上詳しく説明したように、本発明によれば、被覆層が
貴金属片を被覆しており、貴金属片に直接されれないの
で、指紋や汚れなどから保護することができる。As described above in detail, according to the present invention, the coating layer covers the noble metal piece and is not exposed directly to the noble metal piece, so that it can be protected from fingerprints, dirt, etc.
封入される貴金属片の大きさに係わらず、全体の形状が
同じなので、保存や輸送が容易にでき、取り扱いやす（
なるとともに、交換または照合などの機械処理が可能に
なる。Regardless of the size of the enclosed precious metal piece, the overall shape remains the same, making it easy to store and transport, and easy to handle.
At the same time, mechanical processing such as exchange or verification becomes possible.
外部から封入した貴金属片を両側から目視できるので、
安心感があるとともに、貴金属片の大きさを誤認するこ
ともない。Since the precious metal pieces sealed from the outside can be viewed from both sides,
Not only does it give you a sense of security, but it also prevents you from misunderstanding the size of the precious metal piece.
一方、請求項（２）のように、カード基材よりも貴金属
片を突出させた状態で、熱圧着して被覆層を形成すれば
、カード基材の貴金属片側への流れ込みや、貴金属片上
への気泡の混入がなくなり、品質のよい貴金属封入カー
ドが製造できる。On the other hand, as in claim (2), if the coating layer is formed by thermal compression bonding with the precious metal piece protruding beyond the card base material, the precious metal will not flow into one side of the card base material or onto the precious metal piece. This eliminates the inclusion of air bubbles, allowing the production of high-quality precious metal-filled cards.
第１図、第２図は、本発明による貴金属封入カードの実
施例を示した図であって、第１図は正面図、第２図は第
１図Ａ−Ａ断面図、第３図は、本発明による貴金属封入
カードの製造方法の実施例を説明するための図である。
第４図は、本発明による貴金属封入カードの他の実施例
を示した図である。
ｌ・・・カード基材
２・・・貴金属片
３１．３２・・・被覆層
４・・・情報記録層
５・・・装飾層
代理人 弁理士 鎌 １）久 男
十−1 and 2 are views showing an embodiment of a precious metal-encapsulated card according to the present invention, in which FIG. 1 is a front view, FIG. 2 is a sectional view taken along line A-A in FIG. 1, and FIG. FIG. 2 is a diagram for explaining an embodiment of the method for manufacturing a precious metal encapsulated card according to the present invention. FIG. 4 is a diagram showing another embodiment of the precious metal encapsulated card according to the present invention. l...Card base material 2...Precious metal piece 31.32...Coating layer 4...Information recording layer 5...Decoration layer Agent Patent attorney Sickle 1) Hisao Ju-
Claims (2)
通孔に挿入される貴金属片と、前記カード基材の両側に
積層され前記貴金属片が目視できる透明または半透明の
被覆層とから構成した貴金属封入カード。(1) A card base material having a through hole, a precious metal piece inserted into the through hole of the card base material, and a transparent or translucent coating layer laminated on both sides of the card base material so that the precious metal piece can be visually seen. A card containing precious metals.
ら貴金属片の表面を若干突出するように挿入し、前記カ
ード基材および前記貴金属片の表面に透明または半透明
な樹脂フィルムを熱圧着することにより被覆層を形成す
るように構成した貴金属封入カードの製造方法。(2) Insert the precious metal piece into the insertion portion of the card base material so that the surface of the precious metal piece slightly protrudes from the surface of the card base material, and apply a transparent or translucent resin film to the surfaces of the card base material and the precious metal piece. A method for producing a precious metal-encapsulated card in which a covering layer is formed by thermocompression bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2206485A JPH0490392A (en) | 1990-08-03 | 1990-08-03 | Card containing precious metal in sealed form and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2206485A JPH0490392A (en) | 1990-08-03 | 1990-08-03 | Card containing precious metal in sealed form and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0490392A true JPH0490392A (en) | 1992-03-24 |
Family
ID=16524156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2206485A Pending JPH0490392A (en) | 1990-08-03 | 1990-08-03 | Card containing precious metal in sealed form and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0490392A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011081563A1 (en) * | 2009-12-30 | 2011-07-07 | Aibazov Oleg Umarovich | Payment card |
| US10040308B2 (en) | 2012-03-26 | 2018-08-07 | Fine Swiss Metals Ag | Card incorporating a visible valuable object |
| US10144197B2 (en) | 2015-08-05 | 2018-12-04 | John Kent Lee | Precious metal sheet display and method of manufacturing |
| USD868888S1 (en) | 2016-03-03 | 2019-12-03 | Fine Swiss Metals Ag | Transaction card |
-
1990
- 1990-08-03 JP JP2206485A patent/JPH0490392A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011081563A1 (en) * | 2009-12-30 | 2011-07-07 | Aibazov Oleg Umarovich | Payment card |
| GB2488486A (en) * | 2009-12-30 | 2012-08-29 | Oleg Umarovich Aibazov | Payment card |
| GB2488486B (en) * | 2009-12-30 | 2013-01-09 | Oleg Umarovich Aibazov | Payment card |
| US10040308B2 (en) | 2012-03-26 | 2018-08-07 | Fine Swiss Metals Ag | Card incorporating a visible valuable object |
| US10144197B2 (en) | 2015-08-05 | 2018-12-04 | John Kent Lee | Precious metal sheet display and method of manufacturing |
| USD868888S1 (en) | 2016-03-03 | 2019-12-03 | Fine Swiss Metals Ag | Transaction card |
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